JP2007180443A - Manufacturing method of electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component wherein the simplification of manufacturing processes is made possible, by using a process for subjecting a semiconductor component to a flip-chip bonding to a mounting substrate being present in the state of a wafer, and using a process for injecting a resin material into the space between the semiconductor component and the mounting substrate, in the manufacturing processes of a quartz oscillator. <P>SOLUTION: In the manufacturing method of an electronic component, the problem of simplifying manufacturing processes is solved by a process for preparing a wafer-form mounting substrate 30, a process for preparing a semiconductor component 7, a process for so mounting the semiconductor component 7 on the mounting substrate 30 as to integrate them with each other by fastening them to each other, and a process for dividing the integrated semiconductor component 7 and the mounting substrate 30 into individual units of the semiconductor components 7. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic component in which a semiconductor component is flip-chip mounted on a crystal oscillator or the like used in an electronic device such as a portable communication device, and a resin material is injected between the semiconductor component and a mounting substrate.

Conventionally, crystal oscillators have been used in electronic devices such as portable communication devices.

  As such a conventional crystal oscillator, for example, as shown in FIG. 5, although not shown in the drawing, a container body 23 in which a crystal resonator element is accommodated is disposed in the cavity portion 25. There is known a structure in which an electronic component element such as a semiconductor component 26 or a capacitor for controlling an oscillation output based on the vibration of the capacitor is mounted, and such a crystal oscillator is externally mounted on a mother board or the like. After mounting on the wiring board, the external terminals provided on the lower surface of the container 21 are mounted on the external wiring board by soldering to the wiring of the external wiring board.

  The container body 23 and the container 21 are usually formed of a ceramic material, and a wiring conductor is formed inside or on the surface thereof, and is manufactured by employing a conventionally known ceramic green sheet laminating method or the like.

The circuit forming surface (lower surface) of the semiconductor component 26 is provided with a temperature compensation circuit for correcting the oscillation frequency of the crystal oscillator based on the temperature compensation data created according to the temperature characteristics of the crystal resonator. The semiconductor component 26 and the container 21 are electrically and mechanically connected by solder bumps 27, and a resin 28 is deposited between them for the purpose of protecting the circuit forming surface of the semiconductor component 26.
JP 2000-138321 A

  The applicant has not found any prior art documents related to the present invention other than the prior art documents specified by the prior art document information described above by the time of filing of the present application.

  However, in the crystal oscillator having a structure in which the cavity portion 25 of the conventional crystal oscillator described above is filled with the resin 28, the semiconductor component 26 is mounted after being divided into individual pieces from the state of the wafer-like mounting substrate in the manufacturing process of the crystal oscillator. However, it is necessary to fill the resin 5, the manufacturing process is complicated, and the manufacturing process cannot be reduced.

  The present invention has been invented in view of the above-mentioned drawbacks. Therefore, the object of the present invention is to flip-chip mount a semiconductor component on a mounting substrate in the state of a wafer-shaped mounting substrate in the manufacturing process of a crystal oscillator, and to mount the semiconductor component and the semiconductor component. An object of the present invention is to provide an electronic component manufacturing method capable of simplifying the manufacturing process by adopting a manufacturing process in which a resin material is injected between substrates.

  In the method of manufacturing an electronic component according to the present invention, a step of preparing a wafer-shaped mounting substrate, a step of preparing a semiconductor component, a step of mounting, fixing and integrating the semiconductor component on the mounting substrate, and the integration The method includes a step of dividing into individual semiconductor component units based on the state of the mounting substrate and the semiconductor components.

  In the method for manufacturing an electronic component according to the present invention, the cross section of the wafer-like mounting substrate is U-shaped.

  In the electronic component manufacturing method of the present invention, the dividing means is divided into individual semiconductor component units using dicing.

  According to the method for manufacturing an electronic component of the present invention, a step of preparing a wafer-shaped mounting substrate, a step of preparing a semiconductor component, a step of mounting, fixing and integrating the semiconductor component on the mounting substrate, From the integrated mounting substrate and the state of the semiconductor component, it consists of a process of dividing into individual semiconductor component units, so that the semiconductor component is mounted and fixed in the mounting substrate state and then divided into semiconductor component units. Therefore, the process of dividing (dicing) the semiconductor components into individual pieces and the process of mounting the semiconductor components divided into individual semiconductor components on the mounting substrate can be reduced, so that the manufacturing process can be simplified.

  Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. In addition, the same code | symbol in each figure shall show the same object.

FIG. 1 is a cross-sectional view of the crystal oscillator according to the present invention, and FIG. 2 is a top view of the mounting surface of the semiconductor component 7 of the crystal oscillator of FIG. FIG. 3 is a schematic cross-sectional view showing a method for manufacturing a crystal oscillator on a wafer-like mounting board. FIG. 4 shows a state in which solder 11 is applied after the semiconductor component 7 is mounted on the wafer-like mounting board. FIG.
The crystal oscillator shown in FIG. 1 has an external terminal 10 provided on the lower surface, and the crystal resonator element 5 is accommodated on a container 20 on which a plurality of frame wall portions 13 and semiconductor components 7 are attached and mounted on the upper surface. The container body 1 is placed and fixed. Further, in the top view of the mounting surface of the semiconductor component 7 of the crystal oscillator shown in FIG. Further, the frame wall portion 13 is connected to the external terminal 10 by a via hole or the like.

  In FIG. 1, a container body 1 includes, for example, a substrate 2 made of a ceramic material such as glass-ceramic and alumina ceramic, a seal ring 3 made of a metal such as 42 alloy, Kovar, phosphor bronze, and the same metal as the seal ring 3 The container body 1 is configured by attaching the seal ring 3 to the upper surface of the substrate 2 and placing and fixing the lid body 4 on the upper surface of the substrate 2. A crystal resonator element 5 is mounted on the upper surface of the substrate 2 positioned.

  In addition, the container body 1 is hermetically sealed by housing the crystal resonator element 5 inside the space, specifically, a space surrounded by the upper surface of the substrate 2, the inner surface of the seal ring 3, and the lower surface of the lid body 4. For this purpose, a pair of electrode pads connected to the vibration electrode of the crystal resonator element 5 is connected to the upper surface of the substrate 2, and a frame wall portion 13 on the insulating base 6 described later is connected to the lower surface of the substrate 2. A plurality of bonding electrodes are provided, and these pads and electrodes are electrically connected to each other through wiring patterns on the substrate surface and via holes embedded in the substrate. Yes.

  On the other hand, the crystal resonator element 5 accommodated in the container body 1 is formed by adhering and forming a pair of vibration electrodes on both main surfaces of a crystal piece cut along a predetermined crystal axis. Is applied to the quartz piece via a pair of vibrating electrodes, thickness shear vibration is caused at a predetermined frequency.

  Here, if the lid body 4 of the container body 1 is connected to the ground terminal via the wiring conductor 8 of the container body 1 or the wiring conductor 9 of the insulating base 6, the lid body 4 made of metal serves as a reference when used. Since the shield function is provided by being connected to the electric potential, the crystal resonator element 5 and the semiconductor component 7 can be well protected from unnecessary electric action from the outside. Therefore, the lid 4 of the container body 1 is preferably connected to the ground terminal via the wiring conductor 8 of the container body 1 and the wiring conductor 9 of the insulating base 6.

  The container 20 to which the above-described container body 1 is attached has a substantially rectangular shape, and is made of the same substrate material as the container body 1, for example, an insulating material made of a ceramic material such as glass-ceramic or alumina ceramic. The insulating base 6 and a frame wall portion 13 made of the same material as the insulating substrate 6 are formed in two directions in the short side direction of the insulating base 6.

  As shown in FIGS. 1 and 2, the insulating base 6 has four external terminals 10 formed at the four corners on the lower surface of the insulating base 6, and the four corners of the frame wall 13 on the upper surface of the insulating base 6. Solder 11 is provided on the upper surface of the part.

  The four external terminals 10 provided on the lower surface of the insulating base 6 function as terminals for connecting the crystal oscillator to an external wiring board such as a mother board, and the crystal oscillator is mounted on the external wiring board. At this time, the circuit wiring of the external wiring board is electrically connected via a conductive bonding material such as solder.

  Further, the plurality of frame wall portions 13 provided on the upper surface of the insulating base 6 ensure a predetermined interval necessary for disposing the semiconductor component 7 between the insulating base 6 and the container body 1. On the other hand, the wiring conductor 9 of the insulating base 6 is connected to the wiring conductor 8 of the container body 1.

  Further, although not shown, the frame wall portion 13 is formed with a plurality of write control terminals provided on the side surface of the frame wall portion 13, and the write control terminals connect the wiring conductor 9 of the insulating base 6. And electrically connected to an electrode pad (not shown) of the semiconductor component 7.

  Further, a plurality of electrode pads (not shown) are provided in the central region of the insulating base 6 described above, and electrode pads (not shown) of the semiconductor component 7 and solder bumps are provided on these electrode pads (not shown). The semiconductor component 7 is attached to a predetermined position on the insulating base 6 by being electrically and mechanically connected via 12.

  The semiconductor component 7 has, on its circuit formation surface (lower surface), a temperature sensing element for detecting the ambient temperature state, a memory for storing temperature compensation data for compensating the temperature characteristics of the crystal resonator element 5, and temperature compensation in the memory. A temperature compensation circuit that corrects the vibration characteristics of the crystal resonator element 5 according to temperature changes based on the data, an oscillation circuit that is connected to the previous temperature compensation circuit and generates a predetermined oscillation output, and the like are provided. The oscillation output generated by the circuit is output to the outside and then used as a reference signal such as a clock signal.

  A resin 14 made of an epoxy resin or the like is interposed between the semiconductor component 7 and the insulating base 6 described above, and this resin 14 covers the entire lower surface and part of the side surface of the semiconductor component 7. It is attached.

  Here, as shown in FIGS. 2 to 4, the characteristic manufacturing process of the crystal oscillator of the present invention is a process of first preparing a wafer-like mounting substrate 30 and a process of preparing semiconductor components 7 connected in a row. Next, the step of mounting, fixing and integrating the semiconductor component 7 connected to the mounting substrate 30, and the resin 14 made of epoxy resin or the like is injected and solidified between the connected semiconductor component 7 and the insulating base 6. It is characterized by comprising a process and a process of dividing (dicing) into individual semiconductor component 7 units from the state of the semiconductor components 7 connected in a row with the integrated mounting substrate 30 thereafter. As a result, the semiconductor components 7 connected in a row are mounted and fixed in the state of the wafer-like mounting substrate 30 and then divided into individual semiconductor components 7 so that the semiconductor components 7 are divided into individual pieces (dicing). Therefore, it is possible to reduce the number of processes and the process of mounting the semiconductor components divided into the individual semiconductor component 7 units on the wafer-like mounting substrate 30, so that the manufacturing process can be greatly simplified.

  A cross-sectional view taken along the line XX ′ shown in the top view of the crystal oscillator of FIG. 2 focusing on the mounting surface of the semiconductor component 7 is shown on the lower side of FIG. The semiconductor component 7 is mounted on a substrate having a U-shaped cross-section formed with 13, and is integrated by a container body 1 in which the crystal resonator element 5 is housed in the upper part of the frame wall portion 13. Therefore, a substrate on which the semiconductor component 7 obtained by the mounting substrate 30 shown in FIG. 4 is mounted and fixed is used.

  FIG. 4 is a plan view of a substrate divided into individual semiconductor component units from a state in which the semiconductor component 7 which is a feature of the present invention is mounted and the semiconductor component 7 is mounted and fixed and integrated on the mounting substrate 30. Here, as described in the state of a plan view, the mounting substrate 30 in which the frame wall portions 13 are formed on both sides of the insulating base 6 is continuously formed in a matrix form in a state of being divided into pieces after division. 4 are arranged on the mounting substrate 30 in a state where the semiconductor components 7 before being separated into pieces in the left-right direction in FIG. 4 are continuously formed, and one row thereof is arranged in a plurality of rows in the vertical direction on the paper surface. Yes.

  In this state, the abandoned area shown in the figure is deleted, and the continuous semiconductor parts 7 are mounted on the mounting substrate 30 in a horizontal row, and further divided into individual pieces by dicing the divided parts (dotted line ▼ mark part). Then, the container 1 containing the crystal resonator element 5 shown in FIG. 3 is mounted on and integrated with the separated mounting substrate 30 to obtain a piezoelectric oscillator. In the above-described embodiment, the container body 1 containing the crystal resonator element 5 is mounted in a state where the semiconductor component 7 is separated into pieces. However, on the mounting substrate 30 on which the semiconductor components 7 continuous in a matrix are mounted. In addition, the same effect can be obtained even if the container body 1 in which the crystal resonator elements 5 are housed is mounted in a matrix and then separated into individual pieces.

  In addition, this invention is not limited to the above-mentioned embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.

  For example, in the above-described embodiment, the resin 14 made of epoxy resin or the like is interposed between the semiconductor component 7 and the insulating base 6, and this resin 14 is a part of the entire lower surface and side surface of the semiconductor component 7. However, the present invention is not limited to this, and a manufacturing process in which the resin 14 is not injected between the semiconductor component 7 and the insulating substrate 6 may be used. Needless to say, this case is also included in the technical scope of the present invention.

1 is a schematic cross-sectional view of a crystal oscillator according to an embodiment of the present invention. It is a schematic top view which shows the state which mounted the semiconductor component and the solder bump in the container which comprises the crystal oscillator concerning embodiment of this invention. It is a schematic sectional drawing which shows the manufacturing method of the crystal oscillator concerning embodiment of this invention. 1 is a schematic top view showing a state in which a semiconductor component is mounted on a wafer-like mounting substrate according to an embodiment of the present invention. It is a schematic sectional drawing of the conventional crystal oscillator.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Container body 2 ... Board | substrate 3 ... Seal ring 4 ... Lid body 5 ... Quartz vibration element 6 ... Insulating base | substrate 7 ... Semiconductor component 8 ... Container body Wiring conductor 9 ... Wiring conductor of insulating substrate 10 ... External terminal 11 ... Solder 12 ... Solder bump 13 ... Frame wall 14 ... Resin 15 ... First space 16 ... 2nd space part 20 ... Container 30 ... Mounting board

Claims (3)

A step of preparing a wafer-like mounting substrate; a step of preparing a semiconductor component; a step of mounting, fixing and integrating the semiconductor component on the mounting substrate; and a state of the integrated mounting substrate and the semiconductor component The manufacturing method of the electronic component characterized by comprising the process of dividing | segmenting into each semiconductor component unit. 2. The method of manufacturing an electronic component according to claim 1, wherein a cross section of the wafer-like mounting substrate is U-shaped. 2. The method of manufacturing an electronic component according to claim 1, wherein the dividing means is cut into individual semiconductor component units using dicing.

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