JP2007180184A - Substrate transporting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress vibration of a substrate set to a measurement position adaptive to a substrate of a different width, for effectively suppressing vibration caused on the substrate when measurement, resulting in a correct measurement result. <P>SOLUTION: A substrate transporting device 1 comprises a pair of belt conveyors 2 and 2 whose interval can be set at will according to width of a board P, and a clamp means which holds a pair of edges 10 and 10 of the board P facing each other at the measurement point for measuring a surface of the printed board P transported by the belt conveyors 2 and 2. It also comprises a vibration suppressing means which abuts with a rear surface of the printed board P set to a measurement point at measurement, for suppressing vibration of the board P, and a link mechanism 25 comprising the vibration suppressing means provided below the printed board P set to the measurement pint, and setting the vibration suppressing means to a specified position between the pair of belt conveyors 2 and 2 by interlocking with interval change of the pair of belt conveyors 2 and 2. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a substrate transport apparatus having a pair of transport means that can arbitrarily set a distance according to the width of a substrate, and more particularly to a substrate transport apparatus that positions a substrate at a measurement position in order to measure the surface of the substrate. .

  Conventionally, for example, a printed circuit board production line is provided with a measurement process for measuring a substrate surface at a predetermined position on the production line. Here, the surface side of the substrate is measured using an optical sensor or the like, and the state of solder printing (the presence or absence of defects, the height of solder, etc.) is inspected.

  In the printed circuit board production line as described above, a substrate transport apparatus having a pair of transport means that can arbitrarily set the interval according to the width of the substrate is employed.

  For example, in the printed solder inspection apparatus disclosed in Patent Document 1 below, a conveying means 102 as shown in FIGS. The conveying means 102 has a pair of rails 103 (103a, 103b) and a belt 104 (104a, 104b) arranged with a predetermined width in the Y-axis direction in FIG. One of the pair of rails 103 (103a, 103b) is a fixed rail 103a. The belt 104a is formed in an endless shape that moves on the fixed rail 103a. The other is a movable rail 103b parallel to the fixed rail 103a, and has an endless belt 104b as with the fixed rail 103a. Each belt 104a, 104b is supported at both ends by a rotating shaft 105, and conveys the printed circuit board P in the X-axis direction by the rotation of the motor 106.

  The fixed rail 103a and the movable rail 103b are provided on a Y-axis table 107 that is movable in the Y-axis direction by Y-axis moving means 108 including a plurality of support shafts extending in the Y-axis direction, a ball screw, and a motor. Further, on the Y-axis table 107, a W-axis moving unit 110 including a support shaft, a ball screw, and a motor is provided, and supports the movable rail 103b so as to be movable in the W-axis direction. As a result, the movable rail 103b moves in the Y-axis direction with respect to the fixed rail 103a, and the distance between the movable rail 103b can be varied and the width of the printed board P to be conveyed can be accommodated.

  Furthermore, the printed solder inspection apparatus 101 has an inspection unit 112 that inspects the printed circuit board P at a position above the Y-axis table 107. A laser displacement meter is used for the sensor head 120 of the inspection unit 112 to detect solder protrusions (displacement in the height direction Z) on the surface of the printed circuit board P. The sensor head 120 moves and scans the printed circuit board P in the X-axis and Y-axis directions.

Note that the printed circuit board P stopped at the inspection position is sandwiched at both ends in the longitudinal direction by a correction mechanism (not shown).
JP 2002-26512 A

  However, in the above-described transporting means 102 in Patent Document 1, it is possible to suppress vibration of the substrate P by providing a correction mechanism that clamps both ends of the printed substrate P at the inspection position. The vibration of the substrate P caused by the scanning movement of the sensor head 120 above could not be suppressed. For this reason, there is a problem that noise is added to the measurement result and correct measurement cannot be performed.

  Therefore, the present invention has been made in view of the above situation, and it is possible to set the interval between the pair of conveying means according to the width of the substrate and to suppress the vibration of the substrate set at the measurement position. Another object of the present invention is to provide a substrate transport apparatus that can effectively suppress the vibration of the substrate caused by the scanning movement of the sensor head on the substrate and obtain a correct measurement result.

Next, means for solving the above problems will be described with reference to the drawings corresponding to the embodiments.
The substrate transfer apparatus 1 according to claim 1 of the present invention includes a pair of transfer means 2 and 2 that can arbitrarily set a distance according to the width of the substrate P, and the substrate P that is transferred by the transfer means 2 and 2. In a substrate transport apparatus 1 comprising a clamping means 11 for holding a pair of opposing edges 10 and 10 of the substrate P at a measurement position in order to measure the surface,
Vibration suppression means 21 (31, 41) for contacting the back surface of the substrate P set at the measurement position at the time of measurement and suppressing the vibration of the substrate P;
The vibration suppression means 21 (31, 41) is provided, provided below the substrate P set at the measurement position, and interlocked with a change in the distance between the pair of transport means 2 and 2, thereby the pair of transports. Relative position holding means 25 (35, 51) for setting the vibration suppression means 21 (31, 41) at a predetermined position between the means 2, 2;
It is characterized by comprising.

  The substrate transfer apparatus 1 according to claim 2 is characterized in that a plurality of the vibration suppressing means 31 are provided.

  The substrate transfer apparatus 1 according to claim 3 is characterized in that the predetermined position where the vibration suppressing means 21 is provided is an intermediate position between the pair of transfer means 2 and 2.

  The substrate transfer apparatus 1 according to claim 4 is characterized in that the vibration suppressing means 21 abuts against the back surface of the substrate P and applies an upward force to the substrate P.

  The substrate transfer apparatus 1 according to claim 5, wherein the vibration suppressing means 21 abuts against the back surface of the substrate P and applies an upward force to the substrate P, whereby the substrate P is deformed upward in a substantially convex shape. It is characterized by doing.

The substrate transfer apparatus 1 according to claim 6 includes a driving means 14 for moving the clamp means 11 and the relative position holding means 25 (35) upward in conjunction with each other.
By moving the clamping means 11 upward, the pair of edges 10 and 10 of the substrate P are fixed,
When the relative position holding means 25 (35) moves upward, the vibration suppressing means 21 (31) comes into contact with the back surface of the substrate P fixed by the clamping means 11.

The substrate transfer apparatus 1 according to claim 7, a first driving unit 47 for moving the clamping unit 11 upward;
A second drive means 48 for moving the vibration suppression means 41 upward in relation to the drive of the first drive means 47;
By moving the clamping means 11 upward, the pair of edges 10 and 10 of the substrate P are fixed,
The vibration suppression means 41 moves upward, and comes into contact with the back surface of the substrate P fixed by the clamp means 11.

  According to the substrate transfer apparatus of the first aspect of the present invention, the substrate is fixed by fixing the pair of edges of the substrate set at the measurement position by the clamping means, and the vibration suppressing means abutting on the back surface of the substrate. It is held at at least three places: a pair of edges and a predetermined position therebetween. Thereby, the vibration of the substrate can be reliably suppressed. In particular, it is possible to effectively suppress the vibration of the substrate caused by the scanning movement of the sensor head or the like of the measuring means on the substrate, and it is possible to prevent noise from being added to the measurement result.

  Further, since the vibration suppressing means is configured to be set at a predetermined position in conjunction with the change in the distance between the pair of conveying means, even if the distance between the pair of conveying means is changed according to the width of the substrate, the pair of conveying means The relative position of the vibration suppressing means in the width direction of the means is always kept constant. That is, the vibration suppressing means can always be brought into contact with the substrates having different widths at the relatively same position in the substrate width direction. In this case, for example, it may be configured to always contact at a half position of the width size in the width direction of the substrate, or contact at a position of 1/3 of the width size from one edge in the width direction of the substrate. It can also be configured as follows. The selection of the contact position can be arbitrarily determined according to the vibration characteristics of the substrate.

  Furthermore, according to the substrate transfer apparatus of the second aspect, the substrate is held at three or more locations, and the vibration of the substrate can be further reliably suppressed.

  According to the substrate transfer apparatus of the third aspect, it is possible to most effectively suppress the vibration of the substrate caused by the scanning movement of the sensor head on the substrate.

  Furthermore, according to the substrate transfer apparatus of the fourth aspect, the substrate is fixed and does not vibrate by applying an upward force to the substrate set at the measurement position and fixed at both end edges. As a result, it is possible to reliably suppress the vibration of the substrate.

  Further, according to the substrate transfer apparatus of the fifth aspect, the substrate is further bent by applying an upward force to the substrate set at the measurement position and having both end edges fixed to be substantially convex upward. Does not vibrate. As a result, the vibration of the substrate can be suppressed more reliably than the effect of the fourth aspect.

  Further, according to the substrate transfer apparatus of the sixth aspect, the moving direction of the clamping means and the relative position holding means (and the vibration suppressing means) is a common ascending direction, and both drive sources (drive means) are configured to be the same. It becomes possible.

  According to the substrate transfer apparatus of the seventh aspect, the driving source (first driving unit) of the clamping unit and the driving source (second driving unit) of the vibration suppressing unit are provided separately, so that each drive It becomes possible to appropriately adjust the driving speed, the driving amount, etc. for each means, and it becomes possible to easily obtain each pressing force by the clamping means and the vibration suppressing means suitable for the characteristics of the substrate. Specifically, for example, when an electronic component that is vulnerable to impact is soldered to the back surface of the substrate, the second driving means can be driven slowly at a low speed. On the contrary, when the electronic component is not soldered, the tact time of the inspection process can be shortened by driving the second driving means at a high speed.

  Hereinafter, a substrate transfer apparatus according to the present invention will be described in detail for each embodiment with reference to the drawings.

First, the first embodiment will be described.
FIG. 1 is a plan view showing a first embodiment of a substrate transfer apparatus according to the present invention, FIG. 2 is a view taken along line AA in FIG. 1, and FIG. 3 is an operation of a pair of transfer means constituting the embodiment. FIG. 4 (a) is a front view showing a state in which the substrate is fixed by the clamping means and the vibration suppressing means constituting the embodiment, and FIG. 4 (b) is a one-dot chain line portion in FIG. 4 (a). FIG.

  As shown in FIGS. 1 and 2, the substrate transfer apparatus according to the first embodiment includes a pair of transfer means 2, 2, a clamp means 11, a vibration suppression means 21, and a relative position holding means 25. It is configured.

  As shown in FIG. 1, the pair of conveying means 2 and 2 are arranged to face each other in the width direction W. In this example, a belt conveyor 2 is adopted as the conveying means, and the conveying belt 3 is an endless one made of an elastomer such as urethane rubber. Further, a projection 3a is provided at the center of the lower surface of the endless belt 3 (see FIG. 4B). Although not shown, the protrusions 3 a are provided at regular intervals along the longitudinal direction of the endless belt 3.

  The belt conveyor 2 is substantially configured by an endless belt 3 wound around pulleys (not shown) provided at both ends in the longitudinal direction of a frame 4 formed extending in the transport direction X. Further, a drive motor 5 for driving the pulley is provided at either one of the both ends of the frame 4. A drive pulley (not shown) is connected to the drive motor 5. Then, the drive motor 5 drives the drive pulley, and the pulley at one end of the frame 4 is interlocked to drive the endless belt 3 in the transport direction X. As shown in FIG. 2, guide rails 7 and 7 are provided on the inner side surfaces 6 and 6, which are side surfaces of the pair of belt conveyors 2 and 2, respectively, to guide the travel of the endless belt 3. Further, a substantially bowl-shaped upper guide 8 is provided on the upper portion of the guide rail 7.

  The space | interval of the width direction W of a pair of belt conveyors 2 and 2 can be arbitrarily set according to the printed circuit board P of a different width size. In this case, one of the pair of belt conveyors 2 and 2 is not moved as the fixed-side conveyor 2a and the other is moved in the width direction W as the movable-side conveyor 2b because of the balance with the front-stage and rear-stage apparatuses.

  As shown in FIG. 1, the fixed conveyor 2a is provided with a stopper pin 9 for stopping a substrate P, which will be described later, at a measurement position. The stopper pin 9 is connected to an air cylinder or the like at the rear end portion so that the stopper pin 9 can move forward and backward in the width direction W, and the tip portion protrudes from the inner side surface 6 of the fixed conveyor 2a in the width direction W. Is set to the measurement position.

  The above-described board P conveyed by the pair of belt conveyors 2 and 2 is a printed board on which solder is printed on both the front and back surfaces or electronic components are mounted. Are placed on the endless belts 3 and 3 of the respective belt conveyors 2 and 2.

  Moreover, the position of the printed circuit board P shown in FIG. 1 is a measurement position for measuring the surface of the printed circuit board P provided on the conveyance line which consists of the board | substrate conveyance apparatus 1 of this example. At this measurement position, the printed circuit board P and the endless belt 3 that has transported the circuit board P are operatively separated, and the printed circuit board P stops at this position regardless of the traveling operation of the endless belt 3. .

  Further, a measurement unit (not shown) for measuring the surface of the printed circuit board P with an optical sensor or the like is provided above the measurement position. The measuring means is provided with a sensor head, and moves and scans in the X-axis direction, which is the transport direction X, and the Y-axis direction orthogonal to the X-axis direction (transport direction X) in the transport plane. Measurement results such as three-dimensional data of the printed circuit board P thus obtained are output to a processing means (not shown), and, for example, the volume of solder printed on the surface of the printed circuit board P is inspected.

  As shown in FIG. 2, the clamp means 11 has a substantially rectangular clamp plate 12 whose longitudinal direction is slightly longer than the maximum length of the printed circuit board P that can be accepted at least at the measurement position. The clamp plate 12 is disposed so as to face the inner side surface 6 of the belt conveyor 2, and is provided so as to be movable in the vertical direction along the inner side surface 6. (See FIG. 4 (b)). The lower part of the clamp plate 12 is connected to driving means 14 such as an air cylinder that transmits a driving force in the vertical direction.

  As shown in FIG. 1, the vibration suppression means 21 is a long member formed in a predetermined length along the transport direction X, and is an intermediate position in the width direction W between the pair of belt conveyors 2 and 2. And is disposed below the measurement position. In the first embodiment, the length of the vibration suppressing means 21 is substantially the same as the length of the clamp plate 12 in the longitudinal direction, and is formed slightly longer than the maximum length of the printed circuit board P that is acceptable at the measurement position. . In addition, since the vibration suppression means 21 can suppress the vibration of the board | substrate P even if the whole surface does not necessarily contact | abut with respect to the printed circuit board P, for example, a cylindrical member etc. are longitudinally arranged on the upper surface of the vibration suppression means 21. A configuration may be employed in which the cylindrical members are arranged in parallel at regular intervals, and the upper surface of each columnar member may be in contact with the printed circuit board P. Further, the vibration suppressing means 21 is rotatably connected to an end portion 27b of a link arm 27 that constitutes a relative position holding means 25 described later, in the conveyance surface. The vibration suppression means 21 is set below the back surface of the printed board P that has been transported to the measurement position at the initial position. The vibration suppressing member 21 is preferably provided with an elastic body for suppressing vibration such as rubber or sponge.

  Moreover, as shown in FIG. 2, the vibration suppression means 21 can be adjusted in height or removed by an adjusting member 22 such as a bolt provided in the lower part. As a result, it is possible to obtain a suitable pressing force by adjusting the height according to the characteristics of the substrate P carrying the vibration suppressing means 21, or to replace it with an optimal material.

  As shown in FIG. 1, between the pair of belt conveyors 2 and 2, the vibration suppression means 21 is maintained at a relatively constant position in the width direction W in conjunction with the change in the interval between the conveyors 2 and 2. A link mechanism 25 which is the above-described relative position holding means is provided.

  The link mechanism 25 is substantially constituted by a base portion 26 and a link arm 27 and includes the vibration suppressing means 21. The base portion 26 is provided along the transport direction X on the further inner side of the inner side surfaces 6 and 6 of the pair of belt conveyors 2 and 2. One end portion 27a of two link arms 27 is connected to the base portion 26 so as to be rotatable in the transport surface. These link arms 27 are arranged in parallel in the longitudinal direction of the base part 26. In the first embodiment, the two link arms 27, 27 of the fixed conveyor 2a and the two link arms 27, 27 of the movable conveyor 2b are one link arm 27 each. However, the present invention is not limited to this, and the link arm 27 can be arranged in an arbitrary arrangement state, and the number thereof is not limited to two (four in total). Further, as described above, the other end portion 27b of the link arm 27 is connected to the conveyance surface so as to be rotatable along the longitudinal direction of the vibration suppressing means 21.

  The link mechanism 25 (including vibration suppression means 21) is driven in the upward direction by the driving means 14. Since the clamp plate 12 of the clamp means 11 and the link mechanism 25 are connected downward, the clamp plate 12, the vibration suppressing means 21, and the link mechanism 25 are driven simultaneously by the drive in the upward direction by the drive means 14.

  As shown in FIG. 3, even if a pair of belt conveyors 2 and 2 convey the printed circuit board P of a different width | variety by the movable side conveyor 2b approaching / separating toward the fixed side conveyor 2a. The interval between the movable conveyor 2b and the fixed conveyor 2a can be set according to the width size of the board P, and the vibration suppression means 21 is always set to the intermediate position in the width direction W of the printed board P stopped at the measurement position. become.

  Next, the operation of the clamping means and the vibration suppressing means when fixing the printed board stopped at the measurement position in the board conveying apparatus according to the first embodiment will be described with reference to FIG.

  As shown in FIG. 4A, as soon as the printed circuit board P conveyed to the measurement position is stopped by the stopper pin 9, the drive means 14 is driven to push up the clamp plate 12 of the clamp means 11 in the upward direction. At the same time, the vibration suppressing means 21 is pushed up together with the link mechanism 25 in the upward direction. As a result, as shown in FIG. 4B, the pair of edges 10 and 10 of the printed circuit board P are sandwiched and fixed vertically between the upper end portion 13 of the clamp plate 12 and the upper guide 8 of the guide rail 7, The intermediate position in the width direction W of the printed circuit board P is pushed up by the vibration suppressing means 21. At this time, it is preferable that the vibration suppression means 21 abuts on the back surface with a pressing force that is curved so that the printed circuit board P is slightly convex upward.

  According to the first embodiment, the pair of edges 10 and 10 of the printed circuit board P set at the measurement position are fixed by the clamp unit 11, and the vibration suppression unit 21 is arranged in the width direction W on the back surface of the substrate P. The printed circuit board P is held at the three positions of the pair of end edges 10 and 10 and the intermediate position in the width direction W. Thereby, the vibration of the printed circuit board P set at the measurement position can be reliably suppressed. In particular, it is possible to suppress vibration of the substrate P that occurs when the sensor head of the measuring means during measurement scans and moves on the printed circuit board P in the X-axis and Y-axis directions.

  In addition, the vibration suppression means 21 is set at an intermediate position in the width direction W of the printed circuit board P in conjunction with the change in the distance between the pair of belt conveyors 2 and 2, so that the pair of belts according to the width size of the printed circuit board P. Even if the interval between the conveyors 2 and 2 is changed, the relative position of the vibration suppressing means 21 in the width direction W of the pair of belt conveyors 2 and 2 is always maintained constant. That is, the vibration suppressing means 21 can always be brought into contact with the intermediate position in the width direction W of the board P even for the printed boards P having different widths.

  Further, the vibration suppression means 21 is set at an intermediate position in the width direction W of the printed circuit board P, whereby the vibration of the circuit board P caused by the sensor head scanning and moving on the printed circuit board P in the X-axis and Y-axis directions. Can be more effectively suppressed.

  In addition, vibration of the printed circuit board P can be reliably suppressed by the vibration suppressing means 21 coming into contact with the back surface of the circuit board P with a pressing force such that the printed circuit board P is curved slightly upward.

  Furthermore, the vibration suppression means 21 is lifted in conjunction with the clamping operation caused by the movement of the clamp plate 12 in the upward direction, and is brought into contact with the back surface of the printed circuit board P, so that the clamp means 11 and the vibration suppression means 21 are driven. It is possible to configure the sources as the same. Thereby, the apparatus 1 structure can be simplified.

Next, a second embodiment will be described.
FIG. 5 is a plan view showing a second embodiment of the substrate transfer apparatus according to the present invention, FIG. 6 is a view taken along arrow BB in FIG. 5, and FIG. 7 is an operation of a pair of transfer means constituting the embodiment. FIG.
Note that, in the second embodiment described below, the same reference numerals are given to the same or identical portions as those in the first embodiment described above, and the description thereof is omitted.

  As shown in FIGS. 5 and 6, the substrate transfer apparatus of the second embodiment is substantially composed of a pair of transfer means 2, 2, a clamp means 11, a vibration suppression means 31, and a relative position holding means 35. It is configured.

  As shown in FIG. 5, the vibration suppression means 31, 31 are a pair of long members formed in a predetermined length along the transport direction X, and the width direction between the pair of belt conveyors 2, 2. It is set at an equidistant position of W and is disposed below the measurement position. The length of the vibration suppressing means 31 is substantially the same as the length of the clamp plate 12 in the longitudinal direction. That is, it is formed slightly longer than the maximum length of the printed circuit board P that is allowable at the measurement position. In addition, the vibration suppression means 31 has a configuration in which, for example, a columnar member or the like is arranged in parallel on the upper surface of the vibration suppression means 31 at regular intervals along the longitudinal direction as in the first embodiment described above. Also good. Further, the vibration suppressing means 31 is rotatably connected to a midway position of a link arm 27 that constitutes a relative position holding means 35 described later. The vibration suppression means 31 is below the back surface of the printed circuit board P that has been transported to the measurement position at the initial position. The vibration suppressing member 31 is preferably provided with an elastic body for suppressing vibration such as rubber or sponge.

  As shown in FIG. 5, between the pair of belt conveyors 2 and 2, the vibration suppressing means 31 and 31 are maintained at a relatively constant position in the width direction W in conjunction with a change in the interval between the conveyors 2 and 2. A link mechanism 35 is provided as the above-described relative position holding means.

  The link mechanism 35 is substantially constituted by a base portion 26 and a link arm 27 and includes the pair of vibration suppressing means 31 and 31. The base portion 26 is provided along the transport direction X on the further inner side of the inner side surfaces 6 and 6 of the pair of belt conveyors 2 and 2. The other end 27b of the link arm 27 is rotatably connected in the transport surface side by side in the longitudinal direction of the connecting member 36 set at an intermediate position in the width direction W. The connecting member 36 is a member formed to have a length substantially equal to that of the vibration suppressing means 31.

  As shown in FIG. 7, even if a pair of belt conveyors 2 and 2 convey the printed circuit board P of a different width | variety by the movable side conveyor 2b approaching / isolating toward the fixed side conveyor 2a. The interval between the movable conveyor 2b and the fixed conveyor 2a can be set according to the width size of the board P, and the vibration suppression means 31 is always at the same relative position in the width direction W of the printed board P stopped at the measurement position. Will be set.

  Next, the operation of the clamping means and the vibration suppressing means when fixing the printed circuit board stopped at the measurement position in the substrate transfer apparatus according to the second embodiment will be described.

  As soon as the printed circuit board P conveyed to the measurement position is stopped by the stopper pin 9, the drive means 14 is driven to push up the clamp plate 12 of the clamp means 11 in the upward direction, and at the same time, the vibration suppression means 31 together with the link mechanism 35. , 31 are pushed upward. As a result, the pair of edges 10, 10 of the printed circuit board P are sandwiched and fixed between the upper end portion 13 of the clamp plate 12 and the upper guide 8 of the guide rail 7, and the edges of the printed circuit board P in the width direction W are fixed. Positions that are equidistant from 10 and 10 are pushed up by the vibration suppression means 31. At this time, it is preferable that the vibration suppression means 31 is in contact with the back surface with a pressing force that is curved so that the printed circuit board P is slightly convex upward.

  According to the second embodiment, the pair of edges 10 and 10 of the printed board P set at the measurement position are fixed by the clamp plate 12, and the pair of vibration suppressing means 31 and 31 is provided on the back surface of the board P. The printed circuit board P is brought into contact with a position at a distance from the end edges 10 and 10 in the width direction W, and the printed circuit board P is held at a total of four places including the pair of end edges 10 and 10 in the width direction W. Thereby, the vibration of the printed circuit board P can be suppressed more reliably than in the first embodiment described above. And it becomes possible to suppress more effectively the vibration of the board | substrate P which arises when the sensor head of the measurement means at the time of a measurement scans on the printed circuit board P to a X-axis and a Y-axis direction.

  In addition, the vibration suppression means 31, 31 is set at the relatively same position in the width direction W of the substrate P in conjunction with the change in the distance between the pair of belt conveyors 2, 2, thereby reducing the width size of the printed circuit board P. Accordingly, even if the distance between the pair of belt conveyors 2 and 2 is changed, the relative position of the vibration suppressing means 21 in the width direction W of the pair of belt conveyors 2 and 2 is always maintained constant. That is, the vibration suppressing means 31 can be brought into contact with the printed board P having different widths at the same position in the width direction W of the board P.

  Furthermore, by providing a plurality of vibration suppression means 31, it becomes possible to more reliably suppress the vibration of the substrate than in the first embodiment described above.

  Further, the vibration suppressing means 31 and 31 are brought into contact with the back surface of the substrate P with a pressing force such that the printed circuit board P is slightly convex upward, as in the above-described first embodiment. The vibration of P can be reliably suppressed.

  Further, the first embodiment described above is configured such that the vibration suppressing means 31 and 31 are lifted in contact with the back surface of the printed circuit board P in conjunction with the clamping operation by the movement of the clamp plate 12 in the upward direction. Similarly to the above, it is possible to configure the clamp means 11 and the vibration suppression means 31, 31 to have the same drive source.

Next, a third embodiment will be described.
FIG. 8 is a plan view showing a third embodiment of the substrate transfer apparatus according to the present invention, FIG. 9 is a view taken along the line CC in FIG. 8, and FIGS. 10 (a) and 10 (b) constitute the same embodiment. FIG. 11 is a plan view showing the operation of a pair of conveying means constituting the embodiment. FIG.
Note that in the third embodiment described below, the same reference numerals are given to the same or identical portions as those in the first and second embodiments described above, and the description thereof is omitted.

  As shown in FIGS. 8 and 9, the substrate transfer apparatus according to the third embodiment includes a pair of transfer means 2, 2, a clamp means 11, a vibration suppression means 41, and a relative position holding means 51. It is configured.

  As shown in FIG. 8, the vibration suppressing means 41 is a long member formed in a predetermined length along the conveyance direction X, and is an intermediate position in the width direction W between the pair of belt conveyors 2 and 2. And is disposed below the measurement position. In addition, the length of the vibration suppression means 41 is substantially equal to the length of the clamp plate 12 in the longitudinal direction. That is, it is formed slightly longer than the maximum length of the printed circuit board P that is allowable at the measurement position. Note that, as in the first and second embodiments described above, for example, a columnar member or the like is provided in parallel on the upper surface of the vibration suppression unit 41 at regular intervals along the longitudinal direction. A configuration may be adopted.

  Further, insertion portions 42 and 42 are provided at lower portions of both ends in the longitudinal direction (conveying direction X) of the vibration suppressing means 41, and support shafts 52 and 52 constituting a relative position holding means 51 described later are inserted. Further, a screw hole 43 and a nut body 44 are provided in the lower portion of the vibration suppressing means 41 in the vicinity of the center in the longitudinal direction X, and are screwed into a ball screw 53 and a movable screw 55 described later. The vibration suppression means 41 is set below the back surface of the printed circuit board P that has been transported to the measurement position at the initial position. The vibration suppressing member 41 is preferably provided with an elastic body for suppressing vibration such as rubber or sponge.

  As shown in FIG. 9, the vibration suppressing means 41 can be adjusted in height or removed by an adjusting member 46 provided in the lower part. Accordingly, it is possible to obtain a suitable pressing force by adjusting the height according to the characteristics of the substrate P carrying the vibration suppressing means 41, or to replace it with an optimal material.

  As shown in FIG. 9, a first driving means 47 such as an air cylinder that transmits a driving force in the vertical direction is provided below the clamp plate 12. The first driving means 47 moves the clamp plate 12 in the vertical direction, similarly to the driving means 14 of the first and second embodiments described above. Further, a second driving means 48 such as an air cylinder for transmitting a driving force in the vertical direction is provided below the vibration suppressing means 41 in the same manner as the first driving means 47. The second driving unit 48 is driven in association with the driving of the first driving unit 47. At this time, for example, the second driving unit 48 starts driving at the same time as the first driving unit 47 or after a predetermined time delay, or the driving speed is set lower than that of the first driving unit 47. Thus, it is possible to prevent an accident that the vibration suppressing means 41 comes into contact with the back surface of the substrate P prior to the fixing of the pair of edges 10 and 10 of the printed circuit board P by the clamp plate 12.

  As shown in FIG. 8, between the pair of belt conveyors 2 and 2, the vibration suppression means 41 is maintained at a relatively constant position in the width direction W in conjunction with the change in the interval between the conveyors 2 and 2. Relative position holding means 51 is provided.

  The relative position holding means 51 is substantially constituted by the support shafts 52 and 52, the ball screws 53 and 53, and the movable screw 55, and includes the vibration suppressing means 41. The support shafts 52 and 52 are provided in the vicinity of both ends in the transport direction X of the measurement position, and are provided so as to connect the pair of belt conveyors so as to be movable in the width direction W. Further, the ball screws 53 and 53 are provided between the support shafts 52 and 52 along the width direction W like the support shaft 52. A restriction plate 54 is provided at one end of the support shafts 52 and 52 and the ball screws 53 and 53 in the width direction W to prevent the movable side conveyor 2b from being detached when moving in the width direction W. Further, the other ends of the support shafts 52 and 52 and the ball screws 53 and 53 are fixed to the frame 4 of the fixed side conveyor 2a.

  Further, a substantially cylindrical movable screw 55 is attached to one of the ball screws 53 and 53. As shown in FIGS. 10A and 10B, a male screw is formed on the outer peripheral surface of the movable screw 55 to be screwed with the nut body 44, and is screwed with the ball screw 53 on the inner peripheral surface. A female screw is formed. Here, the pitch of the male screw formed on the outer peripheral surface of the movable screw 55 is halved with respect to the pitch of the ball screw 53. In this way, by setting the pitch of the outer peripheral surface of the movable screw 55 to ½ of the pitch of the inner peripheral surface, the vibration suppressing means 41 always moves at a movement amount that is half the movement amount of the movable conveyor 2a. Thereby, when the movable conveyor 2a moves in the width direction W, the vibration suppressing means 41 can always be set at an intermediate position in the width direction W.

  As shown in FIG. 11, even if a pair of belt conveyors 2 and 2 convey the printed circuit board P of a different width | variety by the movable side conveyor 2b approaching / separating toward the fixed side conveyor 2a. The interval between the movable conveyor 2b and the fixed conveyor 2a can be set according to the width size of the board P, and the vibration suppression means 41 is always set to the intermediate position in the width direction W of the printed board P stopped at the measurement position. become.

  Next, the operation of the clamping means and the vibration suppressing means when fixing the stopped printed circuit board at the measurement position in the substrate transfer apparatus according to the third embodiment will be described.

  Immediately after the printed circuit board P conveyed to the measurement position is stopped by the stopper pin 9, the drive means 14 is driven to push the clamp plate 12 of the clamp means 11 in the upward direction, or at the same time or after a predetermined time delay, the vibration suppression means. 41 is pushed upward. As a result, the pair of edges 10, 10 of the printed circuit board P are sandwiched and fixed between the upper end portion 13 of the clamp plate 12 and the upper guide 8 of the guide rail 7, and the intermediate position of the printed circuit board P in the width direction W is fixed. Is pushed up by the vibration suppressing means 41. At this time, it is preferable that the vibration suppression means 41 is in contact with the back surface with a pressing force that is curved so that the printed circuit board P is slightly convex upward.

  According to the third embodiment, as in the first embodiment described above, the pair of edges 10 and 10 of the printed board P set at the measurement position are fixed by the clamp plate 12 and vibrated. When the restraining means 41 abuts on the intermediate position in the width direction W on the back surface of the substrate P, the printed circuit board P is held at the three positions of the pair of edges 10 and 10 and the intermediate position in the width direction W. Thereby, the vibration of the printed circuit board P set at the measurement position can be reliably suppressed. In particular, it is possible to suppress vibration of the substrate P that occurs when the sensor head of the measuring means during measurement scans and moves on the printed circuit board P in the X-axis and Y-axis directions.

  Further, the vibration suppressing means 41 is set at an intermediate position in the width direction W of the board P in conjunction with the change in the distance between the pair of belt conveyors 2 and 2, so that the pair of belt conveyors according to the width size of the printed board P. Even if the interval between 2 and 2 is changed, the relative position of the vibration suppressing means 41 in the width direction W of the pair of belt conveyors 2 and 2 is always kept constant. That is, the vibration suppressing means 41 can always be brought into contact with an intermediate position in the width direction W of the substrate P even for the substrates P having different widths.

  Furthermore, the vibration suppression means 41 is set at an intermediate position in the width direction W of the printed circuit board P, whereby the vibration of the circuit board P caused by the sensor head scanning and moving on the printed circuit board P in the X-axis and Y-axis directions. Can be more effectively suppressed.

  Further, vibration of the printed circuit board P can be reliably suppressed by the vibration suppressing means 41 coming into contact with the back surface of the circuit board P with a pressing force such that the printed circuit board P is slightly convex upward.

  Further, by providing the first driving means 47 for moving the clamp plate 12 and the second driving means 48 for moving the vibration suppressing means 41, the driving speed and the driving amount can be set for each of the driving means 47 and 48. It is possible to adjust appropriately.

It is a top view which shows 1st Embodiment of the board | substrate conveyance apparatus by this invention. It is an AA arrow line view in FIG. It is a top view which shows operation | movement of a pair of conveyance means which comprises the embodiment. (A) It is a front view which shows the state which the clamp means and vibration suppression means which comprise the embodiment fixed the board | substrate. (B) It is an enlarged view of the dashed-dotted line part in (a). It is a top view which shows 2nd Embodiment of the board | substrate conveyance apparatus by this invention. It is a BB arrow line view in FIG. It is a top view which shows operation | movement of a pair of conveyance means which comprises the embodiment. It is a top view which shows 3rd Embodiment of the board | substrate conveyance apparatus by this invention. It is CC arrow line view in FIG. (A) It is a schematic sectional drawing which shows operation | movement of the principal part of the relative position holding means which comprises the embodiment. (B) It is a schematic sectional drawing which shows operation | movement of the principal part of the relative position holding means which comprises the embodiment. It is a top view which shows operation | movement of a pair of conveyance means which comprises the embodiment. It is a front view which shows the conventional printed solder test | inspection apparatus (a conveyance means is included). It is a top view which shows the conventional printed solder test | inspection apparatus (a conveyance means is included).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Board | substrate conveyance apparatus 2 ... Belt conveyor as a conveyance means 10 ... Board edge 11 ... Clamp means 14 ... Drive means 21, 31.41 ... Vibration suppression means 25, 35.51 ... Relative position holding means 47 ... 1st Driving means 48 ... second driving means P ... printed circuit board (substrate)

Claims (7)

A pair of transfer means (2, 2) capable of arbitrarily setting the interval according to the width of the substrate (P), and the substrate facing the substrate at a measurement position for measuring the surface of the substrate transferred by the transfer means In the substrate transfer device (1), comprising a clamp means (11) for holding a pair of edges (10, 10),
Vibration suppression means (21, 31, 41) for contacting the back surface of the substrate set at the measurement position at the time of measurement and suppressing the vibration of the substrate;
The vibration suppression unit is provided below the substrate set at the measurement position, and the vibration suppression is performed at a predetermined position between the pair of transport units by interlocking with a change in the distance between the pair of transport units. Relative position holding means (25, 35, 51) for setting means;
A substrate transfer apparatus comprising:   2. The substrate transfer apparatus according to claim 1, wherein a plurality of said vibration suppression means (31) are provided.   The substrate transfer apparatus according to claim 1, wherein the predetermined position where the vibration suppression means (21) is provided is an intermediate position between the pair of transfer means (2, 2).   The substrate transfer apparatus according to claim 1, wherein the vibration suppressing means (21) applies an upward force to the substrate by contacting the back surface of the substrate (P).   The said vibration suppression means (21) contacts the back surface of the said board | substrate (P), and applies the upward force to the said board | substrate, The said board | substrate deform | transforms into a substantially convex shape upwards, The board | substrate conveyance apparatus of description. Drive means (14) for moving the clamp means (11) and the relative position holding means (25, 35) in an interlocking manner;
The clamp means moves upward to fix the pair of edges (10, 10) of the substrate (P),
2. The substrate transfer apparatus according to claim 1, wherein the vibration restraining means (21, 31) comes into contact with a back surface of the substrate fixed by the clamping means as the relative position holding means moves upward. 3. . First driving means (47) for moving the clamping means (11) upward;
Second driving means (48) for moving the vibration suppression means (41) upward in relation to driving of the first driving means,
The clamp means moves upward to fix the pair of edges (10, 10) of the substrate (P),
The substrate transfer apparatus according to claim 1, wherein the vibration suppressing unit moves upward to come into contact with the back surface of the substrate fixed by the clamping unit.

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