JP2007173647A - Electromagnetic induction component and power supply apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a small and thin electromagnetic induction component which can ensure a large number of turns per area and is excellent in heat dissipation. <P>SOLUTION: A first substrate 10 and a second substrate 20 each consisting of a semiconductor substrate are stacked. A plurality of first linear patterns 11 and second patterns 21 each made of a conductor layer are juxtaposed on one surface in the thickness direction of each of the coil substrates 10, 20. The first substrate 10 is provided with a connection 12 as a piercing conductor electrically connected to both ends of the first pattern 11, and pierces through the first substrate 10. The connection 12 is connected to the second pattern 21 by stacking the first substrate 10 and the second substrate 20, and a spiral winding is formed by the first pattern 11, the second pattern 21, and the connection 12. Grooves 13 are formed between each pairs of adjacent first patterns 11 on one surface where the first patterns 11 are formed on the first substrate 10. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electromagnetic induction component and a power supply device using the same.

  Conventionally, various thin electromagnetic induction parts called planar inductors or planar transformers have been proposed. In addition, it has been considered to use a semiconductor substrate as a substrate for electromagnetic induction components to reduce the size by using a semiconductor manufacturing process (see, for example, Patent Document 1).

In Patent Document 1, in an electromagnetic induction component that uses a semiconductor substrate to reduce the size and weight of a power source, it is considered to increase the thickness of a coil conductor in order to reduce magnetic induction type copper loss. It has a structure in which two planar coils formed with coil conductors are superposed so that the coil surfaces are electrically connected. Moreover, the structure which has arrange | positioned the magnetic thin film between the coil board | substrate and the coil conductor is described.
Japanese Patent Laid-Open No. 11-176539

  By the way, in the electromagnetic induction component described in Patent Document 1, since the coil conductor is formed in a spiral shape in one plane, there is a problem that the number of turns per area cannot be increased. Yes.

  The present invention has been made in view of the above reasons, and its purpose is to provide a small and thin electromagnetic induction component having excellent heat dissipation and a large number of turns per area and its electromagnetic induction component. It is in providing the power supply device used.

  According to the first aspect of the present invention, there is provided a first substrate which is a semiconductor substrate having a plurality of linear first patterns made of a conductive layer on one side of the front and back, and the first substrate is laminated to be conductive on one side of the front and back. And a second substrate having a plurality of linear second patterns arranged in parallel. The first substrate is electrically connected to both ends of each first pattern and penetrates through the first substrate. A connection portion that is a conductor is provided, and the first pattern and the second pattern are electrically connected via the connection portion in a state where the first substrate and the second substrate are laminated, and the first pattern is connected to the second pattern. The one surface on which the first pattern is formed on the first substrate, in which a short-circuit connection portion is formed to electrically connect one or more end portions that are spaced apart by a specified interval along the direction in which the first patterns are arranged. Between each pair of adjacent first patterns Wherein the part is formed.

  According to this configuration, since the loop-shaped electric circuit is formed by electrically connecting the two conductor layers formed by the first pattern and the second pattern at the connection portion, the turn per area You can take many. Further, since the first substrate and the second substrate are thin enough to be stacked, and the first substrate is a semiconductor substrate, the through conductor can be finely processed by the semiconductor manufacturing process, and the small size can be achieved. An electromagnetic induction component can be provided. Furthermore, since the first substrate is a semiconductor substrate, a circuit including electromagnetic induction components can be integrated on a single chip by forming other elements on the first substrate. In addition, since the groove is formed between each pair of the first patterns in the first substrate, the surface area of the first substrate is increased, and the heat dissipation is increased.

  According to a second aspect of the present invention, in the first aspect of the invention, the short-circuit connection portion electrically connects between the end portions at positions separated by two with respect to the first pattern along the direction in which the first patterns are arranged. A core member in which a winding of two circuits is formed, and a plurality of comb-tooth portions inserted into the respective groove portions and a back plate portion along the one surface of the first substrate are integrally formed by a magnetic body. It is characterized by providing.

  In this configuration, since the short-circuit connection portion is formed in the second pattern formed on the second substrate, and the end portions at positions shifted by two in the second pattern are electrically connected, the winding of two circuits Will be arranged alternately, and both windings will be arranged relatively close to each other. That is, both windings are electromagnetically coupled to form a transformer. In addition, since the distance between the electromagnetically coupled windings is short, the degree of coupling between the windings is high. In addition, since a core member having a comb tooth portion to be inserted into the groove portion and a back plate portion continuous with the comb tooth portion is provided, around the portion of the first pattern that becomes the primary winding When the magnetic field to be formed passes through the core member, the degree of coupling of the electromagnetic coupling with the portion that becomes the secondary winding in the first pattern is increased, and the degree of coupling between the primary side and the secondary side is high and the loss is reduced. Fewer transformers can be provided.

  According to a third aspect of the invention, in the first or second aspect of the invention, a core plate made of a magnetic plate is laminated between the first substrate and the second substrate, and the core plate is electrically connected to the connection portion. It is characterized by providing the connection connection part which is a through-conductor connected in general.

  According to this configuration, since at least a part of the core plate made of the magnetic material is disposed in the portion surrounded by the winding made up of the first pattern, the second pattern, and the connection portion, the electromagnetic induction component including the iron core is configured. If the inductor is used, a large inductance can be obtained. If the transformer is used, the degree of coupling is increased.

  According to a fourth aspect of the present invention, there is provided a power supply device comprising the electromagnetic induction component according to any one of the first to third aspects, a switching element, and a control circuit for controlling on / off of the switching element, The control circuit is formed on at least one of the first substrate and the second substrate.

  According to this configuration, it is possible to reduce the thickness and size of the power supply device by forming the electromagnetic induction component thin and small among the components constituting the power supply device. Further, since the first substrate is a semiconductor substrate, at least a part of the circuit components constituting the power supply device can be formed on the first substrate as needed, which contributes to further miniaturization of the power supply device. it can.

  According to the configuration of the present invention, the loop-shaped electric circuit is formed by electrically connecting the two conductor layers formed by the first pattern and the second pattern at the connection portion. There is an advantage that a large number of turns can be taken. In addition, since the thickness dimension is such that the first substrate and the second substrate are stacked, the first substrate is a semiconductor substrate, so that a small electromagnetic induction component can be provided. By forming other elements on one substrate, there is an advantage that a circuit including an electromagnetic induction component can be integrated on one chip. Furthermore, since the groove is formed between each pair of the first patterns in the first substrate, there is an advantage that the surface area of the first substrate is increased and the heat dissipation is increased.

(Embodiment 1)
In this embodiment, as shown in FIG. 1, an air-core planar inductor formed by laminating a first substrate 10 and a second substrate 20 (in the present invention, a planar type means in one plane) The term “thin” is used instead of “thin”, and is therefore synonymous with “thin inductor”. Both the first substrate 10 and the second substrate 20 are semiconductor substrates, and a silicon substrate is used here. Moreover, both the 1st board | substrate 10 and the 2nd board | substrate 20 shall be formed in the rectangular shape in planar view.

  A plurality of first patterns 11 made of a conductive layer are formed on one surface in the thickness direction on the first substrate 10, and a plurality of second patterns 21 made of a conductive layer on one surface in the thickness direction are also formed on the second substrate 20. Is formed. Both the first pattern 11 and the second pattern 21 are made of metal (preferably copper). Each first pattern 11 provided on the first substrate 10 is formed in the same shape and size, and each second pattern 21 provided on the coil substrate 20 is formed in the same shape and size. Here, an insulating layer made of an oxide film or a nitride film is formed between the first substrate 10 and the first pattern 11 and between the second substrate 20 and the second pattern 21.

  As shown in FIG. 2A, each first pattern 11 provided on the first substrate 10 is formed in a straight line parallel to one side of the first substrate 10. On the other hand, as shown in FIG. 2B, each of the second patterns 21 provided on the coil substrate 20 is short-circuited connecting portions 21a extended in a direction obliquely intersecting one side of the coil substrate 20 at the intermediate portion. And a main pattern portion 21b formed in a straight line parallel to one side of the coil substrate 20 at a portion excluding the short-circuit connection portion 21a. When the 1st board | substrate 10 and the 2nd board | substrate 20 are laminated | stacked, the short circuit connection part 21a cross | intersects between each pair of adjacent 1st patterns 11 diagonally.

  The first substrate 10 is provided with a connecting portion 12 made of a through conductor that is electrically connected to each end portion of the first pattern 11 and penetrates the first substrate 10. That is, in the first substrate 10, two connection portions 12 correspond to each first pattern 11. In order to prevent the connection portion 12 from being electrically connected to the first substrate 10, an insulating layer made of an oxide film or a nitride film is formed on the inner peripheral surface of the through hole in which the connection portion 12 is provided in the first substrate 10.

  In the present embodiment, a configuration in which the first substrate 10 is placed on the surface of the second substrate 20 on which the second pattern 21 is formed is employed, so that the connection portion 12 is provided only on the first substrate 10. As shown, the second substrate 20 is also provided with a connection portion, and the first substrate 10 and the second substrate 20 are stacked so that the first pattern 11 and the second pattern 21 are disposed on opposite sides. It may be adopted.

  By the way, the short-circuit connection portion 21a formed in the second pattern 21 is formed so as to connect ends (main patterns 21b) of two adjacent second patterns 21 in the direction in which the second patterns 21 are arranged. Yes. For example, focusing on the second and third second patterns 21 from the bottom in FIG. 2B in the direction in which the second patterns 21 are arranged, the left end of the second second pattern 21 and the third pattern The right end portion of the second pattern 21 continues through the short-circuit connection portion 21a.

  Therefore, when the first substrate 10 and the second substrate 20 are stacked by performing alignment so that the connection portion 12 provided on the first substrate 10 is in a positional relationship to be electrically connected to the second pattern 21, The 1 pattern 11 and the 2nd pattern 21 are electrically connected via the connection part 12, and the electrical circuit of 1 circuit is formed. That is, the left end portion of the first pattern 11 that is the first from the bottom in FIG. 2A is the second end from the bottom in FIG. 2A through the second pattern 21 that is the first from the bottom in FIG. In the same manner, the first patterns 11 are sequentially connected via the second pattern 21. With such a connection relationship, one circuit winding composed of the first pattern 11, the second pattern 21, and the connection portion 12 is formed.

  When the first substrate 10 and the second substrate 20 are joined, the surface of the first substrate 10 where the first pattern 11 is not formed and the surface of the second substrate 20 where the second pattern 21 is formed are contacted. The first substrate 10 and the second substrate 20 are stacked and bonded so that the connection portion 12 provided on the first substrate 10 is electrically connected to the second pattern 21. Here, the connecting portion 12 and the second pattern 21 of the first substrate 10 are bonded to each other by forming bumps on the connecting portion 12 or using solder. Further, the first substrate 10 and the second substrate 20 may be bonded by a technique such as anodic bonding.

  In the example described above, an example in which a short-circuit connection portion 21 a is formed in the middle portion of the second pattern 21 to connect the two adjacent first patterns 11 by the second pattern 21 has been described. In addition, it is possible to form the entire second pattern 21 in a straight line extending in a direction intersecting the first pattern 11 in plan view, and use the entire second pattern 21 as the short-circuit connection portion 21a. is there. Even if this configuration is adopted, if the first pattern 11 and the second pattern 21 are connected by the connecting portion 12 to form one electric circuit, the electric circuit becomes spiral and functions as a winding.

  By the way, in this embodiment, the groove part 13 is formed between the adjacent 1st patterns 11 in the surface which is the one surface of the thickness direction of the 1st board | substrate 10, and forms the 1st pattern 11, respectively. The groove 13 is formed over the entire length of the first substrate 10 in the extending direction of the first pattern 11. Therefore, both ends of the groove 13 are opened to both side surfaces of the first substrate 10.

  Although the structure mentioned above is an air core coil, inductance can be enlarged by arrange | positioning a magnetic body. For example, as shown in FIG. 3, a configuration in which a core plate 14 made of a magnetic plate such as a ferrite plate is sandwiched between the first substrate 10 and the second substrate 20 may be employed. However, in this configuration, for the electrical connection between the connection portion 12 and the second pattern 21, it is necessary to provide the connecting connection portion 15 that is a through conductor on the core plate 14. When the first substrate 10, the second substrate 20, and the core plate 14 are stacked, the connection connection portion 15 is formed at a position that coincides with the end portions of the connection portion 12 and the second pattern 21.

  According to this configuration, the first pattern 11 and the second pattern 21 are connected via the connection portion 12 and the connection connection portion 15, and one electric circuit is provided as in the configuration described with reference to FIGS. 1 and 2. As a winding can be formed. In the configuration using the core plate 14, the thickness dimension increases by the thickness dimension of the core plate 14, but in addition to the effect of providing a magnetic body in the vicinity of the winding, the winding within the same area Since the total extension becomes longer, the inductance can be increased.

  Further, in the present embodiment, since the first substrate 10 and the second substrate 20 are semiconductor substrates, it is possible to form other elements on the first substrate 10 and the second substrate 20, The provided circuit can be integrated. Further, the second substrate 20 is not necessarily a semiconductor substrate, and a glass substrate or a printed substrate may be used.

  In the configuration of the present embodiment described above, a large number of groove portions 13 are formed in the first substrate 10, so that the surface area of the first substrate 10 is increased, and an electromagnetic induction component having excellent heat dissipation can be provided. . In the present invention, the first substrate 10 is formed of a semiconductor substrate. However, as an application example, the first substrate 10 may be a magnetic substrate.

(Embodiment 2)
In the first embodiment, a planar inductor having one circuit winding is illustrated as an electromagnetic induction component. However, if the second pattern 21 formed on the second substrate 20 is changed, a planar transformer having two circuit windings is illustrated. Can be configured. That is, in the case of forming one circuit winding, the two first patterns 11 adjacent in the arrangement direction are short-circuited by the short-circuit connection portion 21 a provided in the second pattern 21. In the case of forming a line, the short-circuit connection portion 21a is formed so that the first pattern 11 is short-circuited at intervals of two or more in the arrangement direction.

  In the configuration example shown in FIG. 4, the first pattern 11 formed on the first substrate 10 as shown in FIG. 4A has the same shape as that of the first embodiment shown in FIG. The second pattern 21 formed in FIG. 4 is different from the first embodiment shown in FIG. 2B as shown in FIG. That is, in the first embodiment, the short-circuit connection portion 21a is formed so as to electrically connect two adjacent first patterns 11, but in the present embodiment, the first patterns 11 separated by two are electrically connected. The short circuit connection portion 21a is formed so as to be connected.

  For example, in the example shown in FIG. 4, the left end portion of the first pattern 11 that is first from the bottom in FIG. 4A passes through the second pattern 21 that is first from the bottom in FIG. a) The first pattern 11 is connected to the right end of the third first pattern 11 from the bottom, and the first patterns 11 are sequentially connected via the second pattern 21 in the same manner. With such a connection relationship, the odd-numbered first pattern 11 from the bottom and the even-numbered first pattern 11 from the bottom are separate circuits, and two windings are formed. In addition, the first pattern 11 and the second pattern 21 forming the windings of each circuit are alternately arranged, so that the windings are close to each other so that they are coupled by electromagnetic coupling, resulting in a transformer. Can function.

  In the above configuration example, the second patterns 21 do not intersect with each other, but as shown in FIG. 5, the short-circuit connection portions 21a may be three-dimensionally intersected with each other in the second pattern 21 forming different windings (in broken lines). The portion shown is embedded in the second substrate 20).

  In this configuration, for example, the winding of one circuit is short-circuited so that the left end portion of the second pattern 21 first from the bottom and the right end portion of the second pattern 21 third from the bottom are electrically connected. When the connecting portion 21a is formed, the right end of the second pattern 21 that is second from the bottom and the left end of the second pattern 21 that is fourth from the bottom are electrically connected to the winding of the other circuit. As a result, the short-circuit connection portion 21a is formed. Here, in the illustrated example, the latter short-circuit connection portion 21 a is embedded in the second substrate 20.

  In this arrangement, the short-circuit connecting portions 21a of different circuits cross each other. One of the short-circuit connection portions 21 a that are three-dimensionally crossed is formed on the surface of the second substrate 20, and the other is embedded in the second substrate 20. That is, the short-circuit connection portion 21a is realized by multilayer wiring. It is also possible to form three or more windings by selecting the first pattern 11 to be coupled by the short-circuit connection portion 21a.

  The modification in the first embodiment can also be applied to the case where a plurality of circuit windings are provided to function as a transformer as in the present embodiment. That is, the core plate 14 made of a magnetic material is disposed between the first substrate 10 and the second substrate 20, or circuit elements are formed on the first substrate 10 and the second substrate 20 to form an integrated circuit. Is possible. Other configurations and functions are the same as those of the first embodiment.

(Embodiment 3)
This embodiment can be applied to the case where two circuit windings are formed in the second embodiment, and the degree of coupling between the primary winding and the secondary winding in the planar transformer as shown in FIG. The core member 16 made of a magnetic material such as ferrite is added to increase the thickness. The core member 16 includes a large number of comb-tooth portions 16a inserted into the respective groove portions 13, and the back plate portion 16b and the comb-tooth portions 16a along one surface forming the first pattern 10 on the first substrate 10 are provided. Are formed in a continuous and integrated manner.

  By using such a core member 16, the primary winding and the secondary winding that are arranged adjacent to each other in the first substrate 10 are magnetically coupled via the core member 16, and as a result, the primary winding. The degree of coupling between the wire and the secondary winding increases. Other configurations and functions are the same as those of the second embodiment.

  By the way, the electromagnetic induction components shown in the first embodiment, the second embodiment, and the third embodiment can be used when configuring a power supply device or the like. As power supply devices, there are widely known chopper circuits such as a step-down type, a step-up type, and a polarity inversion type, and DC-DC converters such as a flyback type and a forward type. The chopper circuit uses the electromagnetic energy stored in the inductor, so an inductor is used, and the DC-DC converter uses a transformer.

  FIG. 7 shows a basic configuration of a step-down chopper circuit as an example. In this configuration, a series circuit of a switching element (such as a MOSFET) Q, an inductor L, and a smoothing capacitor C is connected between both ends of a DC power supply (not shown) obtained by rectifying a commercial power supply using a diode bridge, A series circuit of an inductor L and a smoothing capacitor C has a configuration in which a circulating diode D is connected in parallel. The on / off state of the switching element Q is controlled by the control circuit CN.

  Although this type of chopper circuit is well known, its operation will be briefly described. During the ON period of the switching element Q, the smoothing capacitor C is charged from the DC power source through the inductor L, and electromagnetic energy is accumulated in the inductor L during this period. The Further, the electromagnetic energy accumulated in the inductor L flows through a loop circuit passing through the smoothing capacitor C and the diode D in the OFF period of the switching element Q, and a charging current flows through the smoothing capacitor C. The output of this power supply device is taken out from both ends of the smoothing capacitor C.

  When the above-described power supply apparatus is configured, if the planar inductor described in the first embodiment is employed as the inductor L, a small and thin power supply apparatus can be configured. Here, since the planar inductor is very small, the electromagnetic energy that can be stored is relatively small. Therefore, it is desirable that the on / off frequency (that is, the switching frequency) of the switching element Q is a high frequency of about 100 kHz to several MHz.

  In the case of configuring such a power supply device, if a switching element Q, a diode D, and a control circuit CN are formed on a semiconductor substrate constituting the inductor L to form an integrated circuit, only a smoothing capacitor C is externally attached. Thus, it is possible to configure a power supply device. Moreover, by using the inductor L described above for the power supply device, the inductor L, which is a large component among the components of the power supply device, can be reduced in size. In addition, by integrating the inductor L together with the switching element Q, the inductor L can be provided in the vicinity of the switching element Q. As a result, the parasitic capacitance that becomes a problem when the switching element Q is turned on and off at a high frequency can be provided. The impact can be reduced.

  The same applies to the case of configuring a DC-DC converter. In a DC-DC converter having a typical configuration, a switching element is connected in series to the primary winding of the transformer and the secondary winding of the transformer is used for rectification. Since the series circuit of the diode and the smoothing capacitor is connected and the on / off of the switching element is controlled by the control circuit, the switching element, the diode, the control circuit, etc. can be integrated on the semiconductor substrate constituting the transformer.

  An example of a wiring system using the above-described small power supply device is shown in FIG. In the illustrated wiring system, a wiring device called a gate device 4 is housed in a switch box 3 that is embedded in an appropriate place in a building. The gate device 4 is connected to the power line Lp and the information line Li, which are wired in advance in the wall. Although one switch box 3 and one gate device 4 may be provided, the case where a plurality of switch boxes 3 and gate devices 4 are provided will be described below. In the illustrated example, a basic module 1 having a gateway function including a router and a hub, and a wiring board 5 including a main breaker MB and a branch breaker BB are used.

  A plurality of systems (three systems in the illustrated example) of information lines Li are connected to the basic module 1, and each information line Li is connected to an external Internet network NT as a gateway. The basic module 1 not only branches the information line Li into a plurality of systems and connects the information line Li to the Internet network NT, but also has a function of monitoring the operation state of each functional module 2 described later through the information line Li. . The main breaker MB is connected to the commercial power supply AC, and the power line Lp is connected to the branch breaker BB. In the illustrated example, the branch breaker BB is representatively shown as one system, but usually a plurality of branch breakers BB are provided.

  In the example shown in FIG. 8, the function module 2 has a load control as a main function such as an outlet or a switch, and a function module 2 as a function whose main function is information exchange such as a speaker or a display. Yes. In the configuration of this embodiment, even when load control is the main function, the amount of power used by the load connected to the outlet, the number of times the switch is operated, and the like are monitored as information via the information line Li. Is possible.

  The gate devices 4 of each system are connected by a feed line of a power line Lp and an information line Li. One of the gate devices 4 of each system is connected to the wiring board 5 via the power line Lp and the information line Li. That is, the gate devices 4 of each system are connected in parallel to the power line Lp and connected in parallel to the information line Li.

  The gate device 4 includes a connection port 6 (see FIG. 9) including a connector connected to the power line Lp and the information line Li. Therefore, a power path for supplying power to the functional module 2 and an information path for communicating with the functional module 2 can be obtained simply by connecting a connector of the functional module 2 described later to the connection port 6 of the gate device 4. It can be secured at the same time. Moreover, since the gate device 4 is only connected in parallel to the power line Lp and the information line Li, the functional module 2 can be connected to any gate device 4. That is, since the functional module 2 can be freely arranged within the range where the gate device 4 is arranged, it is possible to provide a wiring system having a high degree of freedom in layout and excellent workability.

  As the switch box 3, for example, a switch box 3 to which a mounting frame 9 (see FIG. 9) defined in the JIS standard (C 8375) can be attached is used. The mounting frame 9 shown in the figure is called a series type, and three embedded wiring devices that are standardized as one module of a large-angle continuous switch in the JIS standard (C 8304) can be attached.

  As shown in FIG. 9, the attachment frame 9 includes a rectangular window hole 9 a for attaching an instrument penetrating front and back at the center. In order to attach the wiring device to be attached to the mounting frame 9, the front part of the wiring device is inserted from the rear of the window hole 9a, and the wiring device is attached to the device locking portions provided on the left and right frame pieces 9b. The to-be-latched part provided in the both right and left sides is combined. In the illustrated example, a claw is provided as a locked portion in the wiring device, and a gap is provided as a device locking portion in the frame piece 9b of the mounting frame 9. However, there is a configuration in which a hole is provided as a locked portion in the wiring device and a claw is provided as a device locking portion in the frame piece 9b of the mounting frame 9. 9 d of insertion holes are penetrated by the upper and lower frame pieces 9c of the attachment frame 9. As shown in FIG. In order to attach the mounting frame 9 to the switch box 3, a screw receiver (not shown) is provided in the switch box 3 by inserting a mounting screw (not shown) from the front into the insertion hole 9 d in a state where a wiring device is mounted on the mounting frame 9. ).

  When the mounting frame 9 is attached to the wall panel, a mounting hole is provided in the wall panel, and a tightening screw inserted into the insertion hole 9d is screwed into a member called a clamp (not shown), The tightening screw may be tightened so that the peripheral portion of the mounting hole penetrating the panel is sandwiched between the mounting frame 9 and the sandwiching bracket. Alternatively, the attachment frame 9 can be attached to the wall by screwing a wood screw into the wall material through the attachment frame 9.

  In the present embodiment, the power line Lp and the information line Li connected to the distribution box 1 or another switch box 3 are introduced from the upper part of each switch box 3, and the switch box 3 located at the end of each system is excluded. From the lower part of each switch box 3, a power line Lp and an information line Li, which are feed wirings to other switch boxes 3, are derived. Further, by attaching the attachment frame 9 to which the gate device 4 is attached to each switch box 3, the gate device 4 is accommodated in each switch box 3 as described above. Here, since the power line Lp and the information line Li are connected to the gate device 4, in order to prevent the power line Lp and the information line Li from being mixed with each other, the power line Lp and the information line Li are connected to the switch box 3. It is desirable to provide the inlet and the outlet separately.

  The gate device 4 incorporates a terminal having a so-called quick-connection terminal structure that connects wires using the spring force of a leaf spring, and inserts the wire into a wire insertion opening that opens at the back of the device. Thus, a configuration is adopted in which the electric wire is mechanically held and electrically connected. Two pairs of wire insertion openings are provided for the power line Lp and the information line Li. Each pair is used to connect feed wires. Electrically connected to the power path connection port 6a provided with a contact portion electrically connected to the terminal to which the power line Lp is connected and the terminal to which the information line Li is connected on the front surface of the body of the gate device 4 An information path connection port 6b provided with a connected contact portion is arranged.

  The power path connection port 6 a and the information path connection port 6 b are modularized as one connection port 6. In each gate device 4 in the wiring system, each power path connection port 6a and each information path connection port 6b have the same specifications (such as the arrangement of contact portions and the size of the connection port). The positional relationship of the information path connection port 6b is unified. A connection body 7 provided on the back surface of the functional module 2 is detachably coupled to the connection port 6. That is, the connection body 7 of the functional module 2 includes a power path connection body 7a that is detachably coupled to the power path connection port 6a and an information path connection body 7b that is detachably coupled to the information path connection port 6b. A modular connection body 7 is provided. In a state where the connection body 7 of the functional module 2 is connected to the connection port 6 of the gate device 4, the functional module 2 covers the front surface of the gate device 4. Here, the connection port 6 and the connection body 7 constitute a connector.

  As shown in FIG. 10, the functional module 2 is a basic functional module 2a that can be used alone by connecting only one to the gate device 4, and in a plane along the wall surface with respect to the basic functional module 2a. There is an extended function module 2b that is arranged and used in combination with the basic function module 2a to expand the function of the basic function module 2a. The extension function module 2a can be connected not only to one basic function module 2a but also to a plurality of extension function modules 2a.

  In the following description, regardless of whether the basic function module 2a is used alone or the extended function module 2b is combined with the basic function module 2a, both cases will be described as the function module 2.

  As shown in FIGS. 11 and 12, the functional module 2 includes a flat housing 8a made of synthetic resin. That is, a thin projection that has a small projecting dimension from the wall surface when attached to the gate device 4 and can be allocated to a functional unit having various functions such as display, notification, and operation exposed on the front surface side of the housing 8a. Is formed. A connection body 7 is provided on the rear surface of the housing 8a. When the connection body 7 is coupled to the connection port 6 of the gate device 4, the functional module 2 is electrically connected to the power line Lp and the information line Li. Mounting holes 8c are opened in the upper and lower portions of the housing 8a, and mounting screws (not shown) are inserted into the mounting holes 8c from the front side of the housing 8a with the housing 8a coupled to the gate device 4. Then, by screwing a mounting screw into the mounting screw hole 10e of the mounting frame 9, the functional module 2 is mechanically fixed to the mounting frame 9, and as a result, the coupling strength of the functional module 2 to the gate device 4 is increased. Can be increased. A decorative cover 8b is detachably attached to the front surface of the housing 8a, and the head of the mounting screw is hidden when the decorative cover 8b is mounted on the housing 8a.

  As is clear from the above-described configuration, power is supplied to the functional module 2 from the commercial power supply AC through the power line Lp. Therefore, in order to generate a power source for the operation of the internal circuit of the functional module 2, the internal circuit from the commercial power supply AC is generated. There is a need for a power supply device that generates a DC voltage for use in the operation. Further, since the housing 8a is flat and small, a thin and small power supply device that can be housed in the housing 8a is required. Therefore, the power supply apparatus using the planar inductor described in the first and second embodiments and the planar transformer described in the third embodiment is a power supply apparatus suitable for use in this type of functional module 2.

  When the function module 2 includes not only the basic function module 2a but also the extended function module 2b, the power supply device also supplies power to the extended function module 2b. The power supply from the basic function module 2a to the extended function module 2b uses alternating current. Further, in the basic function module 2a and the extended function module 2b, AC-DC conversion is performed to supply DC power to the internal circuit. Therefore, the basic function module 2a and the extended function module 2b are each provided with a power supply device. Also in the power supply device provided in the extended function module 2b, a thin and small power supply that can be housed in the housing of the extended function module 2b by using the planar inductors of the first and second embodiments and the planar transformer of the third embodiment. A device can be configured.

It is a disassembled perspective view which shows Embodiment 1 of this invention. FIG. 4A is a top view of the first substrate, and FIG. 4B is a top view of the second substrate. It is sectional drawing which shows the other structural example same as the above. Embodiment 2 of this invention is shown, (a) is a top view of a 1st board | substrate, (b) is a top view of a 2nd board | substrate. It is a top view of the 2nd board | substrate which shows the other structural example same as the above. It is a disassembled perspective view which shows Embodiment 3 of this invention. It is a circuit diagram which shows the structural example of the power supply device using an electromagnetic induction component. It is a lineblock diagram showing the whole wiring system composition using electromagnetic induction parts. It is a front view of the state which attached the functional module to the attachment frame. It is a block diagram which shows the other structural example of a functional module. It is a perspective view which shows a gate apparatus and a functional module. It is a disassembled perspective view which shows a functional module.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Basic module 2 Functional module 10 1st board | substrate 11 1st pattern 12 Connection part 13 Groove part 14 Core board 15 Connection connection part 16 Core member 16a Comb tooth part 16b Back board part 20 2nd board | substrate 21 2nd pattern 21a Short-circuit connection part CN Control circuit Li Information line Lp Power line Q Switching element

Claims (4)

  A first substrate having a plurality of linear first patterns made of a conductive layer on one surface of a semiconductor substrate, and a plurality of wires made of a conductive layer on the front and back surfaces of the first substrate laminated. The first substrate includes a connecting portion that is a through conductor that is electrically connected to both ends of each first pattern and penetrates the first substrate. In the state where the first substrate and the second substrate are stacked, the first pattern and the second pattern are electrically connected via the connection portion, and the second pattern is along the direction in which the first pattern is arranged. The first pattern is formed with a short-circuit connection portion that electrically connects one or more end portions separated by a specified interval, and each pair of adjacent ones on the first surface on which the first pattern is formed on the first substrate. Grooves are formed between the first patterns. Electromagnetic induction part, characterized in that.   The short-circuit connection portion forms two circuit windings by electrically connecting two ends of the first pattern along the direction in which the first patterns are arranged, thereby forming two circuit windings. 2. The electromagnetic induction according to claim 1, further comprising: a core member in which a plurality of comb-tooth portions respectively inserted into the first substrate and a back plate portion along the one surface of the first substrate are integrally formed of a magnetic material. parts.   A core plate made of a magnetic material plate is laminated between the first substrate and the second substrate, and the core plate includes a connection portion that is a through conductor electrically connected to the connection portion. The electromagnetic induction component according to claim 1 or 2.   A power supply device comprising the electromagnetic induction component according to claim 1, a switching element, and a control circuit that controls on / off of the switching element, wherein the switching element and the control circuit are the first substrate. And a second substrate formed on at least one of the power supply devices.

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