JP4674545B2 - Electromagnetic induction parts and power supply - Google Patents

Description

  The present invention relates to a thin electromagnetic induction component and a power supply device using the electromagnetic induction component.

  Conventionally, various thin electromagnetic induction parts called planar inductors or planar transformers have been proposed. In addition, it is also considered to use a semiconductor substrate as a coil substrate to reduce the size by using a semiconductor manufacturing process (see, for example, Patent Document 1).

In Patent Document 1, it is considered to use a semiconductor substrate to reduce the size and weight of the power source, and to increase the thickness of the coil conductor in order to reduce the magnetic induction type copper loss. A structure is described in which two formed planar coils are superposed so that the coil surfaces are electrically connected to each other, and a magnetic thin film is disposed between the coil substrate and the coil conductor. Yes.
Japanese Patent Laid-Open No. 11-176539

  By the way, in the electromagnetic induction component described in Patent Document 1, since the magnetic thin film is arranged so as to sandwich the coil conductor, the magnetic thin film is not magnetically coupled between the two magnetic thin films, and magnetic flux leakage occurs. Is not too expensive. Moreover, since it is a magnetic thin film, it is easy to saturate, and the current that can be passed through the coil conductor cannot be increased even though the thickness of the coil conductor is increased. That is, there is a problem that it can be used only for a power source with a small capacity.

  The present invention has been made in view of the above-mentioned reasons, and its object is not only to be able to be made small and thin, but also to a structure with high magnetic efficiency, and more magnetic than the conventional structure. An object of the present invention is to provide an electromagnetic induction component capable of increasing the body volume and having a relatively large current capacity, and to provide a power supply device using the electromagnetic induction component.

The invention according to claim 1 is a core made of a magnetic body having a lower side surface that is annular in a plan view and linear in a cross section, and is arranged on a surface excluding the lower side surface in a circumferential direction in the plan view. A core on which a plurality of upper winding patterns made of layers are formed, and a coil substrate placed in such a manner that the core contacts the lower side surface, and each pair of upper windings adjacent in the circumferential direction in plan view A coil substrate having a plurality of lower winding patterns formed of a conductive layer that electrically connects one end of the pattern and the other end of the pattern, and is formed on the upper winding pattern formed on the core and the coil substrate. The lower winding pattern is electrically connected to form a winding wound around the core, and the core is formed in a semicircular shape having a straight lower surface in a cross-sectional shape. And

According to this configuration, the core is formed in an annular shape, and the winding wound around the core is formed by the upper winding pattern formed on the core and the lower winding pattern formed on the coil substrate. The structure is the same as that of an electromagnetic induction component in which a conductor is wound around a core. In addition, by reducing the thickness of the core in the direction perpendicular to the surface of the coil substrate, the electromagnetic induction component can be thinned, and a small and thin electromagnetic induction component can be provided. Moreover, since it is the same structure as the electromagnetic induction component which wound the conducting wire around the toroidal core, the magnetic flux formed by energizing the winding passes through the core, and there is little magnetic leakage and the magnetic efficiency is increased. In addition, since the magnetic core having the upper winding pattern is mounted on the coil substrate, the core volume can be increased compared to the conventional configuration using a magnetic thin film, resulting in magnetic Saturation hardly occurs and the current capacity can be increased. That is, there is an advantage that the magnetic efficiency and current capacity per size can be made larger than those of the conventional configuration while being small and thin.

  According to a second aspect of the present invention, in the first aspect of the present invention, the coil substrate is a semiconductor substrate.

  According to this configuration, since the semiconductor substrate is used, it can be integrated into one chip together with other circuit components.

  According to a third aspect of the present invention, in the first or second aspect of the present invention, a plurality of the cores are mounted on the coil substrate, and the lower winding pattern corresponding to each core is connected to each other by a connection pattern made of a conductive layer. It is characterized by being connected.

According to this configuration, by arranging a plurality of cores on one coil substrate, unit configurations in which windings are wound around each core are arranged in an array. Moreover, since the lower winding pattern is connected by the connection pattern, the inductance can be increased by connecting the unit configurations in series, and the current capacity can be increased by connecting the unit configurations in parallel. In other words, by arranging the unit configurations in an array and connecting the unit configurations in series or in parallel according to the connection pattern or combining them appropriately, an electromagnetic induction component having a desired inductance and a desired current capacity is produced. can do.
In the invention of claim 4, in the invention of claims 1 to 3, before Symbol top winding pattern, each end portions, characterized in that it is formed so as to wrap around the lower surface.

According to a fifth aspect of the present invention, in the first to fourth aspects of the invention, a primary winding and a secondary winding are formed by the upper winding pattern and the lower winding pattern.

  According to this configuration, since the primary winding and the secondary winding are formed in one core, it can be used as a transformer. Here, the primary winding and the secondary winding may adopt either an insulating type or a non-insulating type (that is, an autotransformer).

A sixth aspect of the present invention is a power supply device comprising the electromagnetic induction component according to any one of the first to fifth aspects and a switching element, and is stored in the electromagnetic induction component from a DC power source when the switching element is on. The electromagnetic energy is taken out as an output when the switching element is turned off.

  According to this configuration, the inductor in the chopper circuit can be made small and thin, and as a result, the power supply device using the chopper circuit can be made small and thin.

A seventh aspect of the present invention is a power supply apparatus in which a series circuit of a primary winding of an electromagnetic induction component and a switching element according to a fifth aspect is connected to a DC power source, and the secondary winding is turned on and off by the switching element. It is characterized by taking out the output.

  According to this configuration, it is possible to reduce the size and thickness of a switching power supply that uses a transformer for output.

According to an eighth aspect of the present invention, in the invention of the sixth or seventh aspect , the coil substrate is stacked on a mounting substrate on which circuit components other than the electromagnetic induction component are mounted, and the through conductor penetrates the front and back of the coil substrate. The coil substrate and the mounting substrate are electrically connected by a connecting portion.

According to this arrangement, the coil substrate for mounting the circuit components other than the electromagnetic induction part because as a mounting substrate provided separately from the coil substrates mounted with electromagnetic induction part when configuring the power supply, an electromagnetic induction component and other The circuit component can be manufactured in a different process, and the electromagnetic induction component can be separately inspected. In addition, the electromagnetic induction component and other circuit components are thermally separated to facilitate thermal design. In addition, since the coil substrate on which the electromagnetic induction component is formed is stacked on the mounting substrate on which other circuit components are mounted, the electromagnetic induction component can be mounted on the mounting substrate together with other circuit components. Furthermore, since the coil substrate and the mounting substrate are connected by the connecting portion made of the through conductor, the circuit component and the core provided on the mounting substrate can be provided on opposite surfaces, and the occupied area of the power supply device can be reduced. Can do.

According to the configuration of the present invention, since the configuration is the same as that of an electromagnetic induction component in which a conducting wire is wound around a toroidal core, the magnetic flux formed by energizing the winding passes through the core, and there is little magnetic leakage and magnetic efficiency is reduced. It has the advantage of being expensive. In addition, since the magnetic core having the upper winding pattern is placed on the coil substrate, the volume of the core can be increased compared to the magnetic thin film, and the magnetic saturation is less likely to occur in the core. It has the advantage that it can be taken large.

(Embodiment 1)
In the present embodiment, as an electromagnetic induction component , an inductor in which a winding is wound around a core made of a magnetic material is illustrated. As shown in FIGS. 1 and 2, the inductor of this embodiment has a configuration in which a core 11 made of a magnetic material such as ferrite is placed on a coil substrate 10. The core 11 is formed in an annular shape in plan view, and is formed in a semicircular shape in cross section. Accordingly, a lower side surface 11 a that is straight in cross section is formed on one surface of the core 11, and the lower side surface 11 a abuts on the coil substrate 10. That is, the surface of the core 11 that faces the coil substrate 10 is referred to as a lower side surface 11a. An upper winding pattern 12a made of a conductive layer is formed on the surface of the core 11 excluding the lower side surface 11a. A plurality of upper winding patterns 12a are arranged in the circumferential direction of the core 11 (circular direction of the ring) so as to extend over the inner and outer circumferences of the ring, and are formed so that both ends thereof are aligned with the lower side surface 11a. The The upper winding pattern 12a is formed by a thin film forming method. You may form so that the both ends of the upper winding pattern 12a may wrap around to the lower surface 11a, respectively. In addition, it is desirable that the core 11 is formed in an annular shape in a plan view.

  Although an insulating material such as glass epoxy can be used for the coil substrate 10, a silicon substrate which is a semiconductor substrate is used in this embodiment. A plurality of lower winding patterns 12b made of a conductive layer are formed on the surface of the coil substrate 10 on which the core 11 is placed. As shown in FIG. 3, the lower winding pattern 12b is formed corresponding to a region where the core 11 is placed, and in the circumferential direction of the core 11 when the core 11 is placed on the lower winding pattern 12b. One end portion (inner end portion) and the other end portion (outer end portion) of each pair of adjacent upper winding patterns 12a are electrically connected to each other. Accordingly, when the upper winding pattern 12a formed on the core 11 and the lower winding pattern 12b formed on the coil substrate 10 are aligned so that they are electrically connected to each other, and the core 11 is placed on and coupled to the coil substrate 10, A pair of upper winding patterns 12a adjacent in the circumferential direction of the core 11 are connected via a lower winding pattern 12b to form one circuit winding wound around the core 11.

  That is, one lower winding pattern 12b provided on the coil substrate 10 is connected to one upper winding pattern 12a formed on the core 11, and the upper winding pattern 12a is adjacent to the lower winding pattern 12b. Each upper winding pattern 12a is sequentially connected by the connection relationship of being connected to the pattern 12b, and as a result, one circuit winding is formed. Further, the end of the winding is connected to a lead pattern 12c formed on the coil substrate 10, and is connected to another circuit through the lead pattern 12c. Here, the upper winding pattern 12a and the lower winding pattern 12b are made of metal such as copper or aluminum, and the upper winding pattern 12a and the lower winding pattern 12b are joined by joining the upper winding pattern 12a and the lower winding pattern 12b. The core 11 is fixed to the coil substrate 10 simultaneously with the electrical connection with the line pattern 12b. The upper winding pattern 12a and the lower winding pattern 12b are usually joined using a joining material such as solder. However, when the upper winding pattern 12a is wrapped around the lower side surface 11a, the upper winding pattern 12a is bumped to the upper winding pattern 12a. And may be joined to the lower winding pattern 12b.

  In the example described above, one circuit winding is formed for one core 11, but if two or more windings are formed for one core 11, as shown in FIG. Can be used as In order to form a winding of two or more circuits, the lower winding pattern 12b may be divided into a plurality of types of patterns in the circumferential direction of the core 11, and the shape of the lower winding pattern 12b is not changed with respect to the upper winding pattern 12a. It is possible to provide one circuit winding and two or more windings simply by changing the above. In the illustrated example, a lower winding pattern 12b is shown when forming a two-circuit winding including a primary winding n1 and a secondary winding n2. Further, in the present embodiment, the cross-sectional shape of the core 11 is a semicircular shape as shown in FIG. 2, but it may be formed in a rectangular shape with chamfered corners as shown in FIG.

(Embodiment 2)
Embodiment 1 shows an example in which one core 11 is provided on the coil substrate 10. However, since one core 11 is very small, the inductance is small, and the upper winding pattern 12a and the lower winding pattern 12b are thin. Cannot be taken large. In order to increase the inductance, a plurality of cores 11 may be provided and the windings may be connected in series. To increase the current capacity, a plurality of cores 11 may be provided and the windings may be connected in parallel.

  In this embodiment, as shown in FIG. 6, a plurality of cores 11 are arranged in an array on the coil substrate 10, and a lower winding pattern 12b formed corresponding to each core 11 is used as a lead pattern 12c (see FIG. 6). 1) to each other by a connection pattern 12d. The connection relationship by the connection pattern 12d is appropriately selected. That is, there are a case where the windings are connected in series, a case where the windings are connected in parallel, and a case where both series connection and parallel connection are used together, and these three kinds of cases are selected according to the connection pattern 12d. can do. As described above, series connection is employed to increase the inductance, and parallel connection is employed to increase the current capacity. When increasing both the inductance and the current capacity, a series connection and a parallel connection are used together. Other configurations are the same as those of the first embodiment.

  By the way, in Embodiment 1 and Embodiment 2, since the coil substrate 10 is a semiconductor substrate, other elements can be formed on the coil substrate 10, and a circuit including electromagnetic induction components can be integrated. It is. However, when the electromagnetic induction component as in the first and second embodiments is used as a component of a power supply device such as a switching power supply, a large current flows through the winding, so that the electromagnetic induction component becomes a heat generating component. The switching element also becomes a heat generating component. In order to increase the heat dissipation efficiency, it is desirable to separate the electromagnetic induction component from other heat generating components.

  Therefore, a mounting substrate 13 on which components other than electromagnetic induction components among components constituting a circuit such as a power supply device are mounted may be provided, and the mounting substrate 13 and the coil substrate 10 may be laminated. When a semiconductor substrate is used as the mounting substrate 13, a component such as a switching element may be formed on the mounting substrate 13. In this case, the coil substrate 10 and the mounting substrate 13 are bonded using a technique such as anodic bonding. Is possible. A printed circuit board can also be used as the mounting substrate 13. When using a printed circuit board, it is desirable to use surface mount components.

  The coil substrate 10 and the mounting substrate 13 are bonded to the surface of the coil substrate 10 where the core 11 is not mounted and the surface of the mounting substrate 13 where no component is mounted or formed. Therefore, for electrical connection between the coil substrate 10 and the mounting substrate 13, as shown in FIG. 7, connection portions 14 a and 14 b that are through conductors that penetrate the coil substrate 10 and the mounting substrate 13 are used. Here, connection portions 14 a and 14 b are formed on the coil substrate 10 and the mounting substrate 13, respectively, and the connection portions 14 a and 14 b are joined to each other so that the coil substrate 10 and the mounting substrate 13 are electrically connected simultaneously. Mechanical coupling may be performed.

  By the way, as a power supply device configured using the electromagnetic induction component shown in the first and second embodiments, there are a chopper circuit such as a step-down type, a step-up type and a polarity inversion type, and a DC such as a flyback type and a forward type. -DC converters are widely known. The chopper circuit uses the electromagnetic energy stored in the inductor, so an inductor is used, and the DC-DC converter uses a transformer.

FIG. 8 shows a basic configuration of a step-down chopper circuit as an example. In this configuration, a series circuit of a switching element (such as a MOSFET) Q1 , an inductor L, and a smoothing capacitor C1 is connected between both ends of a DC power source (not shown) obtained by rectifying a commercial power source with a diode bridge, It has a configuration in which a circulating diode D1 is connected in parallel to a series circuit of an inductor L and a smoothing capacitor C1 . The on / off state of the switching element Q1 is controlled by the control circuit CN1 .

Although this type of chopper circuit is well known, its operation will be briefly explained. During the ON period of the switching element Q1 , the smoothing capacitor C1 is charged from the DC power source through the inductor L, and electromagnetic energy is accumulated in the inductor L during this period. The Further, the electromagnetic energy accumulated in the inductor L flows through a loop circuit passing through the smoothing capacitor C1 and the diode D1 during the OFF period of the switching element Q1, and a charging current flows through the smoothing capacitor C1. The output of this power supply device is taken out from both ends of the smoothing capacitor C1.

  When the above-described power supply apparatus is configured, if the planar inductor described in the first and second embodiments is used as the inductor L, a small and thin power supply apparatus can be configured. Here, since the planar inductor is very small, the electromagnetic energy that can be stored is relatively small. Therefore, it is desirable that the on / off frequency (that is, the switching frequency) of the switching element Q1 is a high frequency of about 100 kHz to several MHz.

  In the case of configuring such a power supply device, if the switching element Q1, the diode D1, and the control circuit CN1 are formed on the coil substrate 10 which is a semiconductor substrate to form an integrated circuit, only the smoothing capacitor C1 is externally attached. Thus, it is possible to configure a power supply device. When the mounting substrate 13 is a semiconductor substrate, these elements may be formed on the mounting substrate 13. Moreover, by using the inductor L described above for the power supply device, the inductor L, which is a large component among the components of the power supply device, can be reduced in size. In addition, by integrating the inductor L together with the switching element Q1, the inductor L can be provided in the vicinity of the switching element Q1, and as a result, the parasitic capacitance that becomes a problem when the switching element Q1 is turned on and off at a high frequency. The impact can be reduced.

  The same applies to the case of configuring a DC-DC converter. In a DC-DC converter having a typical configuration, a switching element Q2 is connected in series to a primary winding n1 of a transformer T as shown in FIG. Since a series circuit of a rectifying diode D2 and a smoothing capacitor C2 is connected to the secondary winding n2 of T, and the on / off of the switching element Q2 is controlled by the control circuit CN2, the switching element Q2 is connected to the coil substrate 10 which is a semiconductor substrate. Q2, the diode D2, the control circuit CN2, and the like can be integrated. Even when the transformer T is configured, when the mounting substrate 13 made of a semiconductor substrate is used, these elements may be formed on the mounting substrate 13.

  An example of a wiring system using the above-described small power supply device is shown in FIG. In the illustrated wiring system, a wiring device called a gate device 4 is housed in a switch box 3 that is embedded in an appropriate place in a building. The gate device 4 is connected to the power line Lp and the information line Li, which are wired in advance in the wall. Although one switch box 3 and one gate device 4 may be provided, the case where a plurality of switch boxes 3 and gate devices 4 are provided will be described below. In the illustrated example, a basic module 1 having a gateway function including a router and a hub, and a wiring board 5 including a main breaker MB and a branch breaker BB are used.

  A plurality of systems (three systems in the illustrated example) of information lines Li are connected to the basic module 1, and each information line Li is connected to an external Internet network NT as a gateway. The basic module 1 not only branches the information line Li into a plurality of systems and connects the information line Li to the Internet network NT, but also has a function of monitoring the operation state of each functional module 2 described later through the information line Li. . The main breaker MB is connected to the commercial power supply AC, and the power line Lp is connected to the branch breaker BB. In the illustrated example, the branch breaker BB is representatively shown as one system, but usually a plurality of branch breakers BB are provided.

  In the example shown in FIG. 10, the function module 2 is a module that has load control as a main function such as an outlet or a switch, and a module that has information transfer as a main function such as a speaker or a display. Yes. In the configuration of this embodiment, even when load control is the main function, the amount of power used by the load connected to the outlet, the number of times the switch is operated, and the like are monitored as information via the information line Li. Is possible.

  The gate devices 4 of each system are connected by a feed line of a power line Lp and an information line Li. One of the gate devices 4 of each system is connected to the wiring board 5 via the power line Lp and the information line Li. That is, the gate devices 4 of each system are connected in parallel to the power line Lp and connected in parallel to the information line Li.

  The gate device 4 includes a connection port 6 (see FIG. 11) formed of a connector connected to the power line Lp and the information line Li. Therefore, a power path for supplying power to the functional module 2 and an information path for communicating with the functional module 2 can be obtained simply by connecting a connector of the functional module 2 described later to the connection port 6 of the gate device 4. It can be secured at the same time. Moreover, since the gate device 4 is only connected in parallel to the power line Lp and the information line Li, the functional module 2 can be connected to any gate device 4. That is, since the functional module 2 can be freely arranged within the range where the gate device 4 is arranged, it is possible to provide a wiring system having a high degree of freedom in layout and excellent workability.

  As the switch box 3, for example, a switch box 3 to which a mounting frame 9 (see FIG. 11) defined in JIS standard (C 8375) can be attached is used. The mounting frame 9 shown in the figure is called a series type, and three embedded wiring devices that are standardized as one module of a large-angle continuous switch in the JIS standard (C 8304) can be attached.

  As shown in FIG. 11, the attachment frame 9 includes a rectangular window hole 9 a for attaching an instrument penetrating front and back in the center. In order to attach the wiring device to be attached to the mounting frame 9, the front part of the wiring device is inserted from the rear of the window hole 9a, and the wiring device is attached to the device locking portions provided on the left and right frame pieces 9b. The to-be-latched part provided in the both right and left sides is combined. In the illustrated example, a claw is provided as a locked portion in the wiring device, and a gap is provided as a device locking portion in the frame piece 9b of the mounting frame 9. However, there is a configuration in which a hole is provided as a locked portion in the wiring device and a claw is provided as a device locking portion in the frame piece 9b of the mounting frame 9. 9 d of insertion holes are penetrated by the upper and lower frame pieces 9c of the attachment frame 9. As shown in FIG. In order to attach the mounting frame 9 to the switch box 3, a screw receiver (not shown) is provided in the switch box 3 by inserting a mounting screw (not shown) from the front into the insertion hole 9 d in a state where a wiring device is mounted on the mounting frame 9. ).

  When the mounting frame 9 is attached to the wall panel, a mounting hole is provided in the wall panel, and a tightening screw inserted into the insertion hole 9d is screwed into a member called a clamp (not shown), The tightening screw may be tightened so that the peripheral portion of the mounting hole penetrating the panel is sandwiched between the mounting frame 9 and the sandwiching bracket. Alternatively, the attachment frame 9 can be attached to the wall by screwing a wood screw into the wall material through the attachment frame 9.

  In the present embodiment, the power line Lp and the information line Li connected to the distribution box 1 or another switch box 3 are introduced from the upper part of each switch box 3, and the switch box 3 located at the end of each system is excluded. From the lower part of each switch box 3, a power line Lp and an information line Li, which are feed wirings to other switch boxes 3, are derived. Further, by attaching the attachment frame 9 to which the gate device 4 is attached to each switch box 3, the gate device 4 is accommodated in each switch box 3 as described above. Here, since the power line Lp and the information line Li are connected to the gate device 4, in order to prevent the power line Lp and the information line Li from being mixed with each other, the power line Lp and the information line Li are connected to the switch box 3. It is desirable to provide the inlet and the outlet separately.

  The gate device 4 incorporates a terminal having a so-called quick-connection terminal structure that connects wires using the spring force of a leaf spring, and inserts the wire into a wire insertion opening that opens at the back of the device. Thus, a configuration is adopted in which the electric wire is mechanically held and electrically connected. Two pairs of wire insertion openings are provided for the power line Lp and the information line Li. Each pair is used to connect feed wires. Electrically connected to the power path connection port 6a provided with a contact portion electrically connected to the terminal to which the power line Lp is connected and the terminal to which the information line Li is connected on the front surface of the body of the gate device 4 An information path connection port 6b provided with a connected contact portion is arranged.

  The power path connection port 6 a and the information path connection port 6 b are modularized as a single connection port 6. In each gate device 4 in the wiring system, each power path connection port 6a and each information path connection port 6b have the same specifications (contact portion arrangement, connection port size, etc.). The positional relationship of the information path connection port 6b is unified. A connection body 7 provided on the back surface of the functional module 2 is detachably coupled to the connection port 6. That is, the connection body 7 of the functional module 2 includes a power path connection body 7a that is detachably coupled to the power path connection port 6a and an information path connection body 7b that is detachably coupled to the information path connection port 6b. A modular connection body 7 is provided. In a state where the connection body 7 of the functional module 2 is connected to the connection port 6 of the gate device 4, the functional module 2 covers the front surface of the gate device 4. Here, the connection port 6 and the connection body 7 constitute a connector.

  As shown in FIG. 12, the functional module 2 has a basic function module 2a that can be used alone by being connected to the gate device 4 alone, and a plane along the wall surface of the basic function module 2a. There is an extended function module 2b that is arranged and used in combination with the basic function module 2a to expand the function of the basic function module 2a. The extension function module 2a can be connected not only to one basic function module 2a but also to a plurality of extension function modules 2a.

  In the following description, regardless of whether the basic function module 2a is used alone or the extended function module 2b is combined with the basic function module 2a, both cases will be described as the function module 2.

  As shown in FIGS. 13 and 14, the functional module 2 includes a flat housing 8a made of synthetic resin. That is, a thin projection that has a small projecting dimension from the wall surface when attached to the gate device 4 and can be allocated to a functional unit having various functions such as display, notification, and operation exposed on the front surface side of the housing 8a. Is formed. A connection body 7 is provided on the rear surface of the housing 8a. When the connection body 7 is coupled to the connection port 6 of the gate device 4, the functional module 2 is electrically connected to the power line Lp and the information line Li. Mounting holes 8c are opened in the upper and lower portions of the housing 8a, and mounting screws (not shown) are inserted into the mounting holes 8c from the front side of the housing 8a with the housing 8a coupled to the gate device 4. Then, by screwing a mounting screw into the mounting screw hole 10e of the mounting frame 9, the functional module 2 is mechanically fixed to the mounting frame 9, and as a result, the coupling strength of the functional module 2 to the gate device 4 is increased. Can be increased. A decorative cover 8b is detachably attached to the front surface of the housing 8a, and the head of the mounting screw is hidden when the decorative cover 8b is mounted on the housing 8a.

  As is clear from the above-described configuration, power is supplied to the functional module 2 from the commercial power supply AC through the power line Lp. Therefore, in order to generate a power source for the operation of the internal circuit of the functional module 2, the internal circuit from the commercial power supply AC is generated. There is a need for a power supply device that generates a DC voltage for use in the operation. Further, since the housing 8a is flat and small, a thin and small power supply device that can be housed in the housing 8a is required. Therefore, the power supply apparatus using the planar inductor described in the first and second embodiments and the planar transformer described in the third embodiment is a power supply apparatus suitable for use in this type of functional module 2.

  When the function module 2 includes not only the basic function module 2a but also the extended function module 2b, the power supply device also supplies power to the extended function module 2b. The power supply from the basic function module 2a to the extended function module 2b uses alternating current. Further, in the basic function module 2a and the extended function module 2b, AC-DC conversion is performed to supply DC power to the internal circuit. Therefore, the basic function module 2a and the extended function module 2b are each provided with a power supply device. Also in the power supply device provided in the extended function module 2b, by using the electromagnetic induction component described in the first and second embodiments, a thin and small power supply device that can be housed in the housing of the extended function module 2b can be configured. it can.

It is a disassembled perspective view which shows Embodiment 1 of this invention. It is sectional drawing same as the above. It is a top view which shows the coil board | substrate used for the same as the above. It is a top view which shows the coil board | substrate in the case of using for a transformer same as the above. It is sectional drawing which shows the other example of the core used for the same as the above. It is a disassembled perspective view which shows Embodiment 2 of this invention. It is sectional drawing same as the above. It is a circuit diagram which shows the structural example of the power supply device using an electromagnetic induction component. It is a circuit diagram which shows the other structural example of the power supply device using an electromagnetic induction component. It is a lineblock diagram showing the whole wiring system composition using electromagnetic induction parts. It is a front view of the state which attached the functional module to the attachment frame. It is a block diagram which shows the other structural example of a functional module. It is a perspective view which shows a gate apparatus and a functional module. It is a disassembled perspective view which shows a functional module.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Basic module 2 Function module 10 Coil board | substrate 11 Core 12a Upper winding pattern 12b Lower winding pattern 13 Mounting board 14a, 14b Connection part CN1, CN2 Control circuit L Inductor Li Information line Lp Power line n1 Primary winding n2 Secondary winding Q1 , Q2 switching element T transformer

Claims (8)

A core made of a magnetic body having a lower surface that is annular in a plan view and has a straight line in cross section, and a plurality of upper windings made of conductive layers arranged in a circumferential direction in a plan view on the surface excluding the lower surface A core on which a line pattern is formed, and a coil substrate placed in such a manner that the core abuts the lower surface, and one end and the other of each pair of upper winding patterns adjacent in the circumferential direction in plan view A coil substrate having a plurality of lower winding patterns formed of a conductive layer that electrically connects the other end of the coil, and an upper winding pattern formed on the core and a lower winding pattern formed on the coil substrate. An electromagnetic induction component, wherein a winding wound around a core is formed by being electrically connected , and the core is formed in a semicircular shape having a straight lower surface in a cross-sectional shape .   The electromagnetic induction component according to claim 1, wherein the coil substrate is a semiconductor substrate.   The plurality of cores are mounted on the coil substrate, and the lower winding pattern corresponding to each core is connected to each other by a connection pattern made of a conductive layer. Electromagnetic induction parts.   The electromagnetic induction component according to any one of claims 1 to 3, wherein each of the upper winding patterns is formed so that both end portions thereof wrap around the lower side surface. The electromagnetic induction component according to any one of claims 1 to 4, wherein a primary winding and a secondary winding are formed by the upper winding pattern and the lower winding pattern. A power supply device comprising the electromagnetic induction component according to any one of claims 1 to 5 and a switching element, wherein the electromagnetic energy stored in the electromagnetic induction component from the DC power supply when the switching element is turned on is switched to the switching element. A power supply device which is extracted as an output when the power is off. 6. A power supply device in which a series circuit of a primary winding of an electromagnetic induction component and a switching element according to claim 5 is connected to a DC power supply, wherein an output is taken out from the secondary winding by turning on and off the switching element. Power supply. The coil substrate is laminated on a mounting substrate on which circuit components other than the electromagnetic induction component are mounted, and the coil substrate and the mounting substrate are electrically connected by a connecting portion made of a through conductor penetrating the front and back of the coil substrate. The power supply device according to claim 6 or 7, wherein the power supply device is provided.

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