JP4715512B2 - Electromagnetic induction parts and power supply - Google Patents

Description

  The present invention relates to a thin electromagnetic induction component and a power supply device using the electromagnetic induction component.

  Conventionally, various thin electromagnetic induction parts called planar inductors or planar transformers have been proposed. In addition, it is also considered to use a semiconductor substrate as a coil substrate to reduce the size by using a semiconductor manufacturing process (see, for example, Patent Document 1).

In Patent Document 1, in an electromagnetic induction component that uses a semiconductor substrate to reduce the size and weight of a power source, it is considered to increase the thickness of a coil conductor in order to reduce magnetic induction type copper loss. It has a structure in which two planar coils formed with coil conductors are superposed so that the coil surfaces are electrically connected. Moreover, the structure which has arrange | positioned the magnetic thin film between the coil board | substrate and the coil conductor is described.
Japanese Patent Laid-Open No. 11-176539

  By the way, when this type of electromagnetic induction component is used for a switching power supply, it is necessary to increase the switching frequency because the electromagnetic induction component is small. Therefore, it is necessary to reduce the loss by reducing the parasitic capacitance. On the other hand, in the electromagnetic induction component described in Patent Document 1, the coil conductor is formed in a spiral shape in one plane and has a magnetic thin film parallel to the plane on which the coil conductor is formed. There is a problem that a relatively large parasitic capacitance is generated between the coil conductor and the coil conductor.

  The present invention has been made in view of the above-mentioned reasons, and an object of the present invention is to provide an electromagnetic induction component that can be formed in a small and thin shape with a small parasitic capacitance, and a power supply device using the electromagnetic induction component. It is in.

According to the first aspect of the present invention, a plurality of conductive layers spaced apart in the thickness direction of the coil substrate are formed on the coil substrate, and an electric circuit pattern formed by each conductive layer is formed between two ends of the two layers spaced apart in the thickness direction of the coil substrate. Are electrically connected by connecting conductors passing through the coil substrate, and each one of the two layers of the electric circuit pattern separated in the thickness direction of the coil substrate has a plurality of basics with a half-turn shape of one turn coil as one basic pattern. A pattern in which the pattern is continuous, a coil pattern in which a plurality of one-turn coils are connected in series is formed by electric circuit patterns on both layers, and a portion corresponding to the inside of each of the plurality of one-turn coils formed on the coil substrate A hole is formed in each of the holes, and at least a part of the core made of a magnetic material is inserted into each hole .

According to this configuration, a coil pattern in which a plurality of one-turn coils are connected in series using two conductive layers is formed, so that the number of turns in one plane is large and the density of the conductive layer per area is high. Compared to the inductive component, the parasitic capacitance or stray capacitance per area is reduced, which contributes to the reduction of loss caused by the capacitive component. In the minimum configuration, two conductive layers may be provided, and if the conductive layer is formed as a thin film, it can be thin and downsized by fine processing. Furthermore, since the core is disposed inside each one-turn coil, the inductance can be increased as compared with the case where the core is not provided. Further, when a transformer is configured, the degree of coupling between the primary side and the secondary side increases.
According to a second aspect of the present invention, in the first aspect of the invention, the core has a shape in which a leg portion projects from one surface of the back plate portion, and two cores are provided on each surface in the thickness direction of the coil substrate. Each of the back plate portions is laminated, and leg portions provided on each core are respectively inserted into a plurality of holes formed in the coil substrate.
According to this configuration, if the two cores are magnetically coupled, the magnetic efficiency can be increased by reducing magnetic flux leakage, and if the dimensions of the legs are set so as to form a gap between the two cores, It can function as a gap.

According to a third aspect of the present invention, in the first or second aspect of the present invention, the basic pattern has a shape corresponding to a half circumference of a ring, and two adjacent basic patterns in one conductive layer are arced with respect to a string. Are arranged in directions opposite to each other.

  According to this configuration, the electric circuit pattern in one conductive layer is formed in a waveform having a shape in which semicircles are alternately reversed and combined in one plane, and the other one-turn coil is adjacent to the other. Since the magnetic flux of the one-turn coil can be used, the magnetic efficiency is increased.

According to a fourth aspect of the present invention, in any one of the first to third aspects, the coil substrate is a semiconductor substrate.

  According to this configuration, since the semiconductor substrate is used, it can be integrated into one chip together with other circuit components.

According to a fifth aspect of the present invention, in the invention according to any one of the first to fourth aspects, an electric circuit pattern having three or more layers is formed on the coil substrate.

  In this configuration, an inductor having a large inductance or a transformer can be formed depending on how the three-layer electric circuit pattern is connected. If an electric circuit pattern is provided in an even number of four or more layers, an insulating transformer can be configured.

  A sixth aspect of the present invention is a power supply apparatus comprising the electromagnetic induction component according to any one of the first to fifth aspects, a switching element, and a control circuit for controlling on / off of the switching element. And

  According to this configuration, since the electromagnetic induction component formed small and thin is used, the power supply device can be miniaturized and thinned.

According to a seventh aspect of the present invention, in the sixth aspect of the present invention, the coil substrate is stacked on a mounting substrate on which circuit components other than the electromagnetic induction component are mounted, and a connection portion including a through conductor penetrating the front and back of the coil substrate The coil substrate and the mounting substrate are electrically connected.

  According to this configuration, when the power supply device is configured, the mounting substrate for mounting the circuit components excluding the electromagnetic induction component is provided separately from the coil substrate forming the electromagnetic induction component. Can be manufactured in different processes, and electromagnetic induction components can be separately inspected. In addition, the electromagnetic induction component and other circuit components are thermally separated to facilitate thermal design. Moreover, since the coil substrate for forming the electromagnetic induction component is stacked on the mounting substrate on which other circuit components are mounted, the electromagnetic induction component can be mounted on the mounting substrate together with the other circuit components. Furthermore, since the coil substrate and the mounting substrate are connected by a connecting portion made of a through conductor, the coil substrate and the mounting substrate are arranged in one projection plane, and the area occupied by the power supply device is reduced. Can do.

According to the configuration of the present invention, a coil pattern in which a plurality of one-turn coils are connected in series using two conductive layers is formed, so that the number of turns in one plane is large and the density of the conductive layer per area is low. Compared to a high electromagnetic induction component, there is an advantage that the parasitic capacitance or stray capacitance per area is reduced, which contributes to the reduction of loss caused by the capacitive component. In the minimum configuration, two conductive layers may be provided, and if the conductive layer is formed as a thin film, there is an advantage that it is thin and can be miniaturized by fine processing. Furthermore, since the core is disposed inside each one-turn coil, the inductance can be increased as compared with the case where the core is not provided. Further, when a transformer is configured, the degree of coupling between the primary side and the secondary side increases.

  In the present embodiment, as an electromagnetic induction component, as shown in FIGS. 1 and 2, an inductor in which electric circuit patterns 12 a and 12 b made of a thin conductive layer are formed on each surface in the thickness direction of the coil substrate 10 is illustrated. As the material for the conductive layer, copper having good electrical conductivity is desirable, but aluminum may be used.

  As the coil substrate 10, a magnetic substrate such as a glass substrate or ferrite can be used, but in this embodiment, a silicon substrate which is a semiconductor substrate is used. When a silicon substrate is used, the electric circuit patterns 12a and 12b and the coil substrate 10 are insulated by an oxide film or a nitride film. The electric circuit pattern 12a formed on one surface in the thickness direction of the coil substrate 10 has a shape corresponding to a half circumference of the ring (that is, a semicircular shape) as a basic pattern, and a plurality of basic pattern strings are arranged in a straight line. The two adjacent basic patterns are arranged so that the arcs are opposite to each other with respect to the strings, and the adjacent basic patterns are continuously formed to form one electric circuit. In other words, the electric circuit pattern 12a has a meandering shape by connecting semicircular arcs.

  The electric circuit pattern 12b formed on the other surface in the thickness direction of the coil substrate 10 has the same shape, but is arranged so as to form one circular ring by combining with the basic pattern forming the electric circuit pattern 12a. That is, as shown in FIG. 3, in a plan view, the basic pattern strings in the electric circuit pattern 12b are arranged on a straight line in which the basic pattern strings in the electric circuit pattern 12a are arranged, and the arcs and electric circuits of the basic pattern in the electric circuit pattern 12a. The arcs of the basic patterns in the pattern 12b are arranged so as to be opposite to each other.

  By arranging the electric circuit patterns 12a and 12b on each surface in the thickness direction of the coil substrate 10 as described above, a coil pattern 11 is formed in which one turn coil is connected in series by both electric circuit patterns 12a and 12b in a plan view. Will be. Both electric circuit patterns 12a and 12b are electrically connected by a connection conductor 13 passing through the inside of the coil substrate 10 at one end so as to form one electric circuit. In addition, in the example shown in FIG. 1, the coil pattern 11 is formed by the two-layer electric circuit patterns 12a and 12b. Therefore, a lead pattern 11a for connecting to other components is provided at the other end of each electric circuit pattern 12a and 12b. It is formed.

  By the way, in the above-described configuration, since a plurality of air-core one-turn coils are connected in series, the inductance is relatively small. Therefore, as shown in FIG. 4, a hole 10a is formed in a portion corresponding to the inside of each one-turn coil in the coil substrate 10, and a core 14 made of a magnetic material such as ferrite is filled in the hole 10a. is there. The magnetic material that forms the core 14 is one that has fluidity when filled into the hole 10a and then hardens. As this type of magnetic material, there is a compound material in which ferrite powder is dispersed in a synthetic resin material (so-called fluid ferrite powder).

  Also, as shown in FIG. 5, two cores 14 having a shape in which a plurality of leg portions 14b protrude from one surface of a back plate portion 14a laminated on the coil substrate 10 are provided, and one core 14 is attached to the back plate. The leg 14b is inserted into the hole 10a so that the portion 14a overlaps one surface of the coil substrate 10, and the leg 14b is inserted into the hole so that the other core 14 overlaps the other surface of the coil substrate 10. You may insert in the part 10a. The pitch of the adjacent legs 14b in one core 14 is set to be twice the pitch of the holes 10a, and the legs of one core 14 in a state where the two cores 14 are mounted on the coil substrate 10. If the tip of 14b is in contact with the back plate portion 14a of the other core 14, both cores 14 can be magnetically coupled, and magnetic efficiency is increased by reducing magnetic flux leakage. Moreover, the pitch of the leg part 14b may be made to correspond to the pitch of the hole part 10a, and the front end surfaces of the leg part 14b may face each other inside the hole part 10a. In addition, if the dimension of the leg part 14b is set so that a gap may be formed between both the cores 14, it can function as a leakage gap.

  In the example described above, the coil pattern 11 of one circuit is formed by using the two-layer electric circuit patterns 12a and 12b. However, if the three or more electric circuit patterns 12a and 12b are formed, the number of turns increases. Inductance can be increased. When three or more layers of electric circuit patterns 12a and 12b are formed, the electric circuit patterns 12a and 12b are electrically connected using the connection conductor 13 that does not penetrate the coil substrate 10. For example, when the coil substrate 10 is formed of a multilayer wiring board instead of a semiconductor substrate, via hole plating can be used for the connection conductor 13.

  Further, as shown in FIG. 6, if two or more coil patterns 11 are formed on one coil substrate 10, and the coil patterns 11 of each circuit are arranged close enough to be electromagnetically coupled, they can be used as a transformer. Can do. When used as a transformer, increasing the degree of coupling between the coil patterns 11 by the core 14 increases the magnetic efficiency. In each of the above-described examples, the electric circuit patterns 12a and 12b are formed on the surface of the coil substrate 10. However, the electric circuit patterns 12a and 12b may be embedded in the coil substrate 10 as shown in FIG. .

  In the case of functioning as a transformer, as shown in FIG. 7, if the circuit pattern 12 a serving as the primary winding and the circuit pattern 12 b serving as the secondary winding are alternately arranged in the thickness direction of the coil substrate 10, The degree of coupling between the secondary winding and the secondary winding can be increased.

  In the configuration example described above, the basic pattern is a semicircular arc. However, a shape obtained by halving a polygon (such as a quadrangle, a hexagon, or an octagon) may be used as the basic pattern. In addition, the cross-sectional shape of the core 14 is assumed to be circular in the above example, but may be a polygon (rectangle, hexagon, octagon, etc.).

  In the above-described embodiment, since the coil substrate 10 is a semiconductor substrate, other elements can be formed on the coil substrate 10, and a circuit including an electromagnetic induction component can be integrated. However, when the electromagnetic induction component is used as a component of a power supply device such as a switching power supply, a large current flows through the winding, so that the electromagnetic induction component becomes a heat generating component and the switching element also becomes a heat generating component. In order to increase the heat dissipation efficiency, it is desirable to separate the electromagnetic induction component from other heat generating components.

  Therefore, as shown in FIG. 8, among components constituting a circuit such as a power supply device, a mounting substrate 15 for mounting components excluding electromagnetic induction components is provided, and the mounting substrate 15 and the coil substrate 10 are laminated. Also good. When a semiconductor substrate is used as the mounting substrate 15, a component such as a switching element may be formed on the mounting substrate 15. In this case, the coil substrate 10 and the mounting substrate 15 are bonded using a technique such as anodic bonding. Is possible. A printed circuit board can also be used as the mounting substrate 15. When using a printed circuit board, it is desirable to use surface mount components.

  In this case, the coil substrate 10 is bonded to the surface of the mounting substrate 15 where no component is mounted or formed. For electrical connection between the coil substrate 10 and the mounting substrate 15, connection portions 16 a and 16 b that are through conductors that penetrate the coil substrate 10 and the mounting substrate 15 are used. Here, connecting portions 16a and 16b are respectively formed on the coil substrate 10 and the mounting substrate 15, and the connecting portions 16a and 16b are joined to each other so that the coil substrate 10 and the mounting substrate 15 are electrically connected at the same time. Mechanical coupling may be performed. Further, in the illustrated example, the electric circuit pattern 12b provided on the surface of the coil substrate 10 facing the mounting substrate 15 is embedded in the coil substrate 10, and the electric circuit pattern 12a provided on the surface of the coil substrate 10 opposite to the mounting substrate 15 Is formed on the surface of the coil substrate 10.

  By the way, as a power supply device configured using the above-described electromagnetic induction component, a step-down type, a step-up type, a polarity inversion type chopper circuit, and a flyback type, forward type DC-DC converter are widely known. ing. The chopper circuit uses the electromagnetic energy stored in the inductor, so an inductor is used, and the DC-DC converter uses a transformer.

  FIG. 9 shows a basic configuration of a step-down chopper circuit as an example. In this configuration, a series circuit of a switching element (such as a MOSFET) Q1, an inductor L, and a smoothing capacitor C1 is connected between both ends of a DC power supply (not shown) obtained by rectifying a commercial power supply with a diode bridge, It has a configuration in which a circulating diode D1 is connected in parallel to a series circuit of an inductor L and a smoothing capacitor C1. The on / off state of the switching element Q1 is controlled by the control circuit CN1.

  Although this type of chopper circuit is well known, its operation will be briefly described. The smoothing capacitor C1 is charged from the DC power source through the inductor L during the ON period of the switching element Q1, and electromagnetic energy is accumulated in the inductor L during this period. The Further, the electromagnetic energy accumulated in the inductor L flows through a loop circuit passing through the smoothing capacitor C1 and the diode D1 during the OFF period of the switching element Q1, and a charging current flows through the smoothing capacitor C1. The output of this power supply device is taken out from both ends of the smoothing capacitor C1.

  When the above-described power supply apparatus is configured, if the above-described inductor is employed as the inductor L, a small and thin power supply apparatus can be configured. Here, since the inductor is very small, the electromagnetic energy that can be stored is relatively small. Therefore, it is desirable that the on / off frequency (that is, the switching frequency) of the switching element Q1 is a high frequency of about 100 kHz to several MHz.

  In the case of configuring such a power supply device, if the switching element Q1, the diode D1, and the control circuit CN1 are formed on the coil substrate 10 which is a semiconductor substrate to form an integrated circuit, only the smoothing capacitor C1 is externally attached. Thus, it is possible to configure a power supply device. When the mounting substrate 15 is a semiconductor substrate, these elements may be formed on the mounting substrate 15. Moreover, by using the inductor L described above for the power supply device, the inductor L, which is a large component among the components of the power supply device, can be reduced in size. In addition, by integrating the inductor L together with the switching element Q1, the inductor L can be provided in the vicinity of the switching element Q1, and as a result, the parasitic capacitance that becomes a problem when the switching element Q1 is turned on and off at a high frequency. The impact can be reduced.

  The same applies to the case of configuring a DC-DC converter. In a typical DC-DC converter, a switching element is connected in series to a primary winding of a transformer, and a rectifying diode is connected to a secondary winding of the transformer. And a series circuit of a smoothing capacitor are connected, and on / off of the switching element is controlled by a control circuit. A switching element, a dard, a control circuit, and the like can be integrated into a coil substrate that is a semiconductor substrate. Even when the transformer is configured, when a mounting substrate made of a semiconductor substrate is used, these elements may be formed on the mounting substrate.

  An example of a wiring system using the above-described small power supply device is shown in FIG. In the illustrated wiring system, a wiring device called a gate device 4 is housed in a switch box 3 that is embedded in an appropriate place in a building. The gate device 4 is connected to the power line Lp and the information line Li, which are wired in advance in the wall. Although one switch box 3 and one gate device 4 may be provided, the case where a plurality of switch boxes 3 and gate devices 4 are provided will be described below. In the illustrated example, a basic module 1 having a gateway function including a router and a hub, and a wiring board 5 including a main breaker MB and a branch breaker BB are used.

  A plurality of systems (three systems in the illustrated example) of information lines Li are connected to the basic module 1, and each information line Li is connected to an external Internet network NT as a gateway. The basic module 1 not only branches the information line Li into a plurality of systems and connects the information line Li to the Internet network NT, but also has a function of monitoring the operation state of each functional module 2 described later through the information line Li. . The main breaker MB is connected to the commercial power supply AC, and the power line Lp is connected to the branch breaker BB. In the illustrated example, the branch breaker BB is representatively shown as one system, but usually a plurality of branch breakers BB are provided.

  In the example shown in FIG. 10, the function module 2 is a module that has load control as a main function such as an outlet or a switch, and a module that has information transfer as a main function such as a speaker or a display. Yes. In the configuration of this embodiment, even when load control is the main function, the amount of power used by the load connected to the outlet, the number of times the switch is operated, and the like are monitored as information via the information line Li. Is possible.

  The gate devices 4 of each system are connected by a feed line of a power line Lp and an information line Li. One of the gate devices 4 of each system is connected to the wiring board 5 via the power line Lp and the information line Li. That is, the gate devices 4 of each system are connected in parallel to the power line Lp and connected in parallel to the information line Li.

  The gate device 4 includes a connection port 6 (see FIG. 11) formed of a connector connected to the power line Lp and the information line Li. Therefore, a power path for supplying power to the functional module 2 and an information path for communicating with the functional module 2 can be obtained simply by connecting a connector of the functional module 2 described later to the connection port 6 of the gate device 4. It can be secured at the same time. Moreover, since the gate device 4 is only connected in parallel to the power line Lp and the information line Li, the functional module 2 can be connected to any gate device 4. That is, since the functional module 2 can be freely arranged within the range where the gate device 4 is arranged, it is possible to provide a wiring system having a high degree of freedom in layout and excellent workability.

  As the switch box 3, for example, a switch box 3 to which a mounting frame 9 (see FIG. 11) defined in JIS standard (C 8375) can be attached is used. The mounting frame 9 shown in the figure is called a series type, and three embedded wiring devices that are standardized as one module of a large-angle continuous switch in the JIS standard (C 8304) can be attached.

  As shown in FIG. 11, the attachment frame 9 includes a rectangular window hole 9 a for attaching an instrument penetrating front and back in the center. In order to attach the wiring device to be attached to the mounting frame 9, the front part of the wiring device is inserted from the rear of the window hole 9a, and the wiring device is attached to the device locking portions provided on the left and right frame pieces 9b. The to-be-latched part provided in the both right and left sides is combined. In the illustrated example, a claw is provided as a locked portion in the wiring device, and a gap is provided as a device locking portion in the frame piece 9b of the mounting frame 9. However, there is a configuration in which a hole is provided as a locked portion in the wiring device and a claw is provided as a device locking portion in the frame piece 9b of the mounting frame 9. 9 d of insertion holes are penetrated by the upper and lower frame pieces 9c of the attachment frame 9. As shown in FIG. In order to attach the mounting frame 9 to the switch box 3, a screw receiver (not shown) is provided in the switch box 3 by inserting a mounting screw (not shown) from the front into the insertion hole 9 d in a state where a wiring device is mounted on the mounting frame 9. ).

  When the mounting frame 9 is attached to the wall panel, a mounting hole is provided in the wall panel, and a tightening screw inserted into the insertion hole 9d is screwed into a member called a clamp (not shown), The tightening screw may be tightened so that the peripheral portion of the mounting hole penetrating the panel is sandwiched between the mounting frame 9 and the sandwiching bracket. Alternatively, the attachment frame 9 can be attached to the wall by screwing a wood screw into the wall material through the attachment frame 9.

  In the present embodiment, the power line Lp and the information line Li connected to the distribution box 1 or another switch box 3 are introduced from the upper part of each switch box 3, and the switch box 3 located at the end of each system is excluded. From the lower part of each switch box 3, a power line Lp and an information line Li, which are feed wirings to other switch boxes 3, are derived. Further, by attaching the attachment frame 9 to which the gate device 4 is attached to each switch box 3, the gate device 4 is accommodated in each switch box 3 as described above. Here, since the power line Lp and the information line Li are connected to the gate device 4, in order to prevent the power line Lp and the information line Li from being mixed with each other, the power line Lp and the information line Li are connected to the switch box 3. It is desirable to provide the inlet and the outlet separately.

  The gate device 4 incorporates a terminal having a so-called quick-connection terminal structure that connects wires using the spring force of a leaf spring, and inserts the wire into a wire insertion opening that opens at the back of the device. Thus, a configuration is adopted in which the electric wire is mechanically held and electrically connected. Two pairs of wire insertion openings are provided for the power line Lp and the information line Li. Each pair is used to connect feed wires. Electrically connected to the power path connection port 6a provided with a contact portion electrically connected to the terminal to which the power line Lp is connected and the terminal to which the information line Li is connected on the front surface of the body of the gate device 4 An information path connection port 6b provided with a connected contact portion is arranged.

  The power path connection port 6 a and the information path connection port 6 b are modularized as a single connection port 6. In each gate device 4 in the wiring system, each power path connection port 6a and each information path connection port 6b have the same specifications (contact portion arrangement, connection port size, etc.). The positional relationship of the information path connection port 6b is unified. A connection body 7 provided on the back surface of the functional module 2 is detachably coupled to the connection port 6. That is, the connection body 7 of the functional module 2 includes a power path connection body 7a that is detachably coupled to the power path connection port 6a and an information path connection body 7b that is detachably coupled to the information path connection port 6b. A modular connection body 7 is provided. In a state where the connection body 7 of the functional module 2 is connected to the connection port 6 of the gate device 4, the functional module 2 covers the front surface of the gate device 4. Here, the connection port 6 and the connection body 7 constitute a connector.

  As shown in FIG. 12, the functional module 2 has a basic function module 2a that can be used alone by being connected to the gate device 4 alone, and a plane along the wall surface of the basic function module 2a. There is an extended function module 2b that is arranged and used in combination with the basic function module 2a to expand the function of the basic function module 2a. The extension function module 2a can be connected not only to one basic function module 2a but also to a plurality of extension function modules 2a.

  In the following description, regardless of whether the basic function module 2a is used alone or the extended function module 2b is combined with the basic function module 2a, both cases will be described as the function module 2.

  As shown in FIGS. 13 and 14, the functional module 2 includes a flat housing 8a made of synthetic resin. That is, a thin projection that has a small projecting dimension from the wall surface when attached to the gate device 4 and can be allocated to a functional unit having various functions such as display, notification, and operation exposed on the front surface side of the housing 8a. Is formed. A connection body 7 is provided on the rear surface of the housing 8a. When the connection body 7 is coupled to the connection port 6 of the gate device 4, the functional module 2 is electrically connected to the power line Lp and the information line Li. Mounting holes 8c are opened in the upper and lower portions of the housing 8a, and mounting screws (not shown) are inserted into the mounting holes 8c from the front side of the housing 8a with the housing 8a coupled to the gate device 4. Then, by screwing a mounting screw into the mounting screw hole 10e of the mounting frame 9, the functional module 2 is mechanically fixed to the mounting frame 9, and as a result, the coupling strength of the functional module 2 to the gate device 4 is increased. Can be increased. A decorative cover 8b is detachably attached to the front surface of the housing 8a, and the head of the mounting screw is hidden when the decorative cover 8b is mounted on the housing 8a.

  As is clear from the above-described configuration, power is supplied to the functional module 2 from the commercial power supply AC through the power line Lp. Therefore, in order to generate a power source for the operation of the internal circuit of the functional module 2, the internal circuit from the commercial power supply AC is generated. There is a need for a power supply device that generates a DC voltage for use in the operation. Further, since the housing 8a is flat and small, a thin and small power supply device that can be housed in the housing 8a is required. Therefore, the power supply apparatus using the planar inductor described in the first and second embodiments and the planar transformer described in the third embodiment is a power supply apparatus suitable for use in this type of functional module 2.

  When the function module 2 includes not only the basic function module 2a but also the extended function module 2b, the power supply device also supplies power to the extended function module 2b. The power supply from the basic function module 2a to the extended function module 2b uses alternating current. Further, in the basic function module 2a and the extended function module 2b, AC-DC conversion is performed to supply DC power to the internal circuit. Therefore, the basic function module 2a and the extended function module 2b are each provided with a power supply device. Also in the power supply device provided in the extended function module 2b, by using the electromagnetic induction component described in the first and second embodiments, a thin and small power supply device that can be housed in the housing of the extended function module 2b can be configured. it can.

It is a perspective view which shows embodiment of this invention. It is sectional drawing same as the above. It is a top view same as the above. It is sectional drawing which shows an example at the time of providing a core in the same as the above. It is sectional drawing which shows the other example at the time of providing a core in the same as the above. It is sectional drawing which shows the structural example of a transformer same as the above. It is sectional drawing which shows the other structural example of a transformer in the same as the above. It is sectional drawing which shows the structural example of the power supply device using an electromagnetic induction component. It is a circuit diagram which shows the structural example of the power supply device using an electromagnetic induction component. It is a lineblock diagram showing the whole wiring system composition using electromagnetic induction parts. It is a front view of the state which attached the functional module to the attachment frame. It is a block diagram which shows the other structural example of a functional module. It is a perspective view which shows a gate apparatus and a functional module. It is a disassembled perspective view which shows a functional module.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Basic module 2 Functional module 10 Coil board | substrate 10a Hole part 11 Coil pattern 12a, 12b Electric circuit pattern 13 Connection conductor 14 Core 15 Mounting board 16a, 16b Connection part CN1 Control circuit L Inductor Li Information line Lp Power line Q1 Switching element

Claims (7)

A plurality of conductive layers spaced apart in the thickness direction of the coil substrate are formed on the coil substrate, and the electric circuit pattern formed by each conductive layer is a connection in which one end of two layers separated in the thickness direction of the coil substrate passes through the inside of the coil substrate. Each one of the two layers of electric circuit patterns that are electrically connected by a conductor and spaced apart in the thickness direction of the coil substrate has a shape in which a plurality of basic patterns are continuous with a half-turn shape of a one-turn coil as one basic pattern. A coil pattern in which a plurality of one-turn coils are connected in series is formed by the electric circuit patterns of both layers, and a hole is formed in a portion corresponding to the inside of each of the plurality of one-turn coils formed on the coil substrate. An electromagnetic induction component , wherein at least a part of a core made of a magnetic material is inserted into each hole .   The core has a shape in which a leg portion protrudes from one surface of the back plate portion, and the back plate portions of the two cores are respectively laminated on each surface in the thickness direction of the coil substrate, and formed on the coil substrate. The electromagnetic induction component according to claim 1, wherein legs provided in each core are respectively inserted into the plurality of holes. 2. The basic pattern according to claim 1, wherein the basic pattern has a shape corresponding to a half circumference of a ring, and two adjacent basic patterns in one conductive layer have arcs arranged in opposite directions with respect to the string. The electromagnetic induction component according to claim 2. The electromagnetic induction component according to claim 1, wherein the coil substrate is a semiconductor substrate . 5. The electromagnetic induction component according to claim 1, wherein an electric circuit pattern having three or more layers is formed on the coil substrate .   6. A power supply apparatus comprising: the electromagnetic induction component according to claim 1; a switching element; and a control circuit that controls on / off of the switching element.   The coil substrate is laminated on a mounting substrate on which circuit components other than the electromagnetic induction component are mounted, and the coil substrate and the mounting substrate are electrically connected by a connecting portion made of a through conductor penetrating the front and back of the coil substrate. The power supply device according to claim 6.

Images