JP2007173646A - Electromagnetic induction component and power supply apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electromagnetic induction component which has the large number of turns per area and is small and thin. <P>SOLUTION: A pair of coil substrates 10, 20 each consisting of a semiconductor substrate are stacked. A plurality of linear patterns 11, 21 each made of a conductive layer are juxtaposed on one surface in the thickness direction of each of the coil substrates 10, 20. The coil substrates 10, 20 include connections 12, 22 as piercing conductors electrically connected to both ends of the linear patterns 11, 21 and piercing through the coil substrates 10, 20, respectively. The linear pattern 21 provided on the coil substrate 20 electrically connects the adjacent two linear patterns 11 provided on the coil substrate 10 via the connections 12, 22, and the linear patterns 11, 21 and the connections 12, 22 form a spiral winding. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electromagnetic induction component and a power supply device using the same.

  Conventionally, various thin electromagnetic induction parts called planar inductors or planar transformers have been proposed. In addition, it has been considered to use a semiconductor substrate as a substrate for electromagnetic induction components to reduce the size by using a semiconductor manufacturing process (see, for example, Patent Document 1).

In Patent Document 1, in an electromagnetic induction component that uses a semiconductor substrate to reduce the size and weight of a power source, it is considered to increase the thickness of a coil conductor in order to reduce magnetic induction type copper loss. It has a structure in which two planar coils formed with coil conductors are superposed so that the coil surfaces are electrically connected. Moreover, the structure which has arrange | positioned the magnetic thin film between the coil board | substrate and the coil conductor is described.
Japanese Patent Laid-Open No. 11-176539

  By the way, in the electromagnetic induction component described in Patent Document 1, since the coil conductor is formed in a spiral shape in one plane, there is a problem that the number of turns per area cannot be increased. Yes.

  The present invention has been made in view of the above-mentioned reasons, and its purpose is not only to be small and thin, but also to an electromagnetic induction component capable of taking a large number of turns per area and its An object of the present invention is to provide a power supply device using electromagnetic induction components.

  The invention of claim 1 is a semiconductor substrate comprising a pair of coil substrates in which a plurality of linear patterns made of conductive layers are arranged in parallel on one side of the front and back, and each coil substrate is provided at each end of each linear pattern. It is provided with a connecting portion which is a through conductor that is electrically connected and penetrates the coil substrate, and both the coil substrates are arranged on the opposite surface side in the thickness direction and electrically connected to each other. One end and the other end of two adjacent linear patterns in the linear pattern formed on one coil substrate are stacked via the linear pattern formed on the other coil substrate. The windings are formed by connecting them together.

  According to this configuration, since the loop-shaped electric circuit is formed by electrically connecting the two conductor layers formed by the linear pattern at the connection portion, the number of turns per area can be increased. Can do. In addition, it is thin enough to have a pair of coil substrates stacked, and since the coil substrate is a semiconductor substrate, through conductors can be finely processed by the semiconductor manufacturing process, and a small electromagnetic induction component is provided. can do. Furthermore, since both the coil substrates are laminated so that the surfaces on which the linear patterns are formed on the respective coil substrates are opposite to each other, the electric circuit length per turn can be increased. In addition, since the coil substrate is a semiconductor substrate, a circuit including electromagnetic induction components can be integrated into one chip by forming other elements on the coil substrate.

  The invention of claim 2 is a semiconductor substrate comprising a pair of coil substrates in which a plurality of linear patterns made of conductive layers are arranged in parallel on one side of the front and back, and each coil substrate is provided at each end of each linear pattern. It is provided with a connecting portion which is a through conductor that is electrically connected and penetrates the coil substrate, and both the coil substrates are arranged on the opposite surface side in the thickness direction and electrically connected to each other. The linear pattern formed on one of the coil substrates is provided with a short-circuit connection portion that electrically connects the other two or more spaced apart end portions along the direction in which the coils are arranged. A number of windings corresponding to the interval are formed by electrically connecting the linear patterns of the substrate.

  According to this configuration, the same effect as that of the invention of claim 1 can be obtained, and the short-circuit connection portion is formed in the linear pattern formed on one of the two coil substrates, and two or more ends separated by a predetermined interval. Since the parts are electrically connected, the windings with different electrical paths are arranged cyclically, and the windings with different electrical paths are arranged relatively close to each other so that a plurality of windings can be connected. It will be electromagnetically coupled. That is, a transformer having a plurality of electromagnetically coupled windings can be configured, and the degree of coupling between the windings is increased because the distances between the windings to be electromagnetically coupled are short.

  According to a third aspect of the invention, in the first or second aspect of the invention, a core plate made of a magnetic plate is laminated between the pair of coil substrates, and the core plate electrically connects the connection portions. It is characterized by comprising a connecting connection part which is a through conductor.

  According to this configuration, since at least a part of the core plate made of the magnetic material is disposed in the portion surrounded by the winding made up of the linear pattern and the connection portion, the electromagnetic induction component including the iron core can be configured. If an inductor is used, a large inductance can be obtained, and if a transformer is used, the degree of coupling is high.

  According to a fourth aspect of the present invention, in the first or second aspect of the present invention, a recess is formed in a portion excluding the connection portion on each facing surface of the pair of coil substrates.

  According to this configuration, by forming the recesses on the opposing surfaces of the coil substrate, it is possible to remove a portion that is not related to the holding of the connection portion, the coil substrate is reduced in weight and the coil substrate has a high resistance. become. That is, the possibility that the linear pattern is short-circuited through the coil substrate is reduced, and the probability of occurrence of a layer short can be reduced.

  The invention according to claim 5 is the invention according to claim 4, characterized in that a core member made of a magnetic material is filled in the space formed by the recess.

  According to this configuration, since the core member made of a magnetic material is disposed in a portion surrounded by the winding made up of the linear pattern and the connecting portion, an electromagnetic induction component containing an iron core can be formed. Thus, a large inductance can be obtained, and a transformer has a high degree of coupling.

  According to a sixth aspect of the present invention, in any of the first to fifth aspects of the present invention, a pair of yoke plates formed of magnetic plates are disposed so as to sandwich a laminate of the pair of coil substrates from both sides. It is characterized by comprising.

  According to this configuration, since the winding formed by the linear pattern and the connection portion is sandwiched between the pair of magnetic yoke plates, the magnetic field generated around the winding can be passed through the yoke plate, If an inductor is used, a large inductance can be obtained, and if a transformer is used, the degree of coupling is increased.

  A seventh aspect of the present invention is a power supply device comprising the electromagnetic induction component according to any one of the first to sixth aspects, a switching element, and a control circuit for controlling on / off of the switching element. The control circuit is formed on at least one of the pair of coil substrates.

  According to this configuration, it is possible to reduce the thickness and size of the power supply device by forming the electromagnetic induction component thin and small among the components constituting the power supply device. Further, since the coil substrate is a semiconductor substrate, at least a part of the circuit components constituting the power supply device can be formed on the coil substrate as necessary, which can contribute to further miniaturization of the power supply device.

  According to the configuration of the present invention, since the loop-shaped electric circuit is formed by electrically connecting the two conductor layers formed by the linear pattern at the connection portion, the number of turns per area is increased. There is an advantage that you can. In addition, since both the coil substrates are laminated so that the surfaces on which the linear patterns are formed on the respective coil substrates are opposite to each other, the electric circuit length per turn can be increased. Further, since the thickness dimension is such that a pair of coil substrates are stacked, the coil substrate is thin, and since the coil substrate is a semiconductor substrate, there is an advantage that a small electromagnetic induction component can be provided. In addition, since the coil substrate is a semiconductor substrate, there is an advantage that a circuit including an electromagnetic induction component can be integrated into one chip by forming other elements on the coil substrate.

(Embodiment 1)
In the present embodiment, as shown in FIG. 1, an air-core planar inductor formed by laminating two coil substrates 10 and 20 (in the present invention, planar does not mean within one plane). The term “thin” means the same as “thin inductor”. The two coil substrates 10 and 20 are both semiconductor substrates, and here, a silicon substrate is used. The coil substrates 10 and 20 are both formed in a rectangular shape in plan view.

  Each of the coil substrates 10 and 20 is formed with a plurality of linear patterns 11 and 21 each made of a conductive layer on one surface in the thickness direction. Each of the linear patterns 11 and 21 is formed of metal (preferably copper). Each linear pattern 11 provided on the coil substrate 10 is formed in the same shape and size, and each linear pattern 21 provided on the coil substrate 20 is formed in the same shape and size. Here, an insulating layer made of an oxide film or a nitride film is formed between the linear patterns 11 and 21 on the surfaces of the coil substrates 10 and 20.

  As shown in FIG. 2A, each linear pattern 11 provided on the coil substrate 10 is formed in a straight line parallel to one side of the coil substrate 10. On the other hand, as shown in FIG. 2B, each linear pattern 21 provided on the coil substrate 20 includes a short-circuit connection portion 21a extended in a direction obliquely intersecting one side of the coil substrate 20 at the intermediate portion. And a main pattern portion 21b formed in a straight line parallel to one side of the coil substrate 20 at a portion excluding the short-circuit connection portion 21a. The short-circuit connection portion 21a obliquely crosses between each pair of adjacent coil patterns 11 when the two coil substrates 10 and 20 are stacked.

  Each of the coil substrates 10 and 20 is provided with connection portions 12 and 22 made of through conductors that are electrically connected to the respective one end portions of the linear patterns 11 and 21 and pass through the coil substrates 10 and 20. . That is, two connection portions 12 and 22 correspond to each of the linear patterns 11 and 21 in each of the coil substrates 10 and 20. In order to prevent the connection parts 12 and 22 from being electrically connected to the coil substrates 10 and 20, the inner peripheral surfaces of the through holes in which the connection parts 12 and 22 are provided in the coil substrates 10 and 20 are insulated by an oxide film or a nitride film. A layer is formed.

  By the way, the short circuit connection part 21a formed in the linear pattern 21 is formed so that the edge part of the two linear patterns 21 adjacent in the direction where the linear pattern 21 is located may be couple | bonded. For example, paying attention to the second and third linear patterns 21 from the end (below FIG. 2B) in the direction in which the linear patterns 21 are arranged, the left end portion of the second linear pattern 21 The right end portion of the third linear pattern 21 continues through the short-circuit connection portion 21a.

  Therefore, when the coil substrates 10 and 20 are stacked by positioning so that the connection portions 12 and 22 provided on the coil substrates 10 and 20 are electrically connected to each other, the linear pattern 11 and The linear pattern 21 is electrically connected via the connecting portions 12 and 22 to form a circuit of one circuit. That is, the left end of the first linear pattern 11 from the bottom in FIG. 2A is the second bottom from the bottom in FIG. 2A via the first linear pattern 21 from the bottom in FIG. The linear patterns 11 are connected to the right end of the linear pattern 11, and the linear patterns 11 are sequentially connected via the linear pattern 21 in the same manner. With such a connection relationship, one circuit winding composed of the linear patterns 11 and 21 and the connection portions 12 and 22 is formed. In addition, since the connecting portions 12 and 22 are electrically connected to each other, the linear patterns 11 and 21 provided on the coil substrates 10 and 20 are disposed on the opposite sides of the coil substrates 10 and 20. become.

  Note that when the coil substrates 10 and 20 are coupled, the surfaces on which the linear patterns 11 and 21 are not formed on both the coil substrates 10 and 20 are brought into contact with each other, and the connection portions provided on the coil substrates 10 and 20 are provided. The coil substrates 10 and 20 are laminated and joined so that the terminals 12 and 22 are electrically connected to each other. Here, the connection parts 12 and 22 of both the coil substrates 10 and 20 are joined by forming bumps or using solder. Further, the coil substrate 10 and the coil substrate 20 may be bonded by a technique such as anodic bonding.

  In the above-described example, the short-circuit connection portion 21 a is formed in the middle portion of the linear pattern 21, thereby showing an example in which the two linear patterns 11 adjacent to each other are connected by the linear pattern 21. It is also possible to form the entire linear pattern 21 in a straight line extending in a direction intersecting the linear pattern 11 in a plan view, and the shape of the linear pattern 11 and the linear pattern 21 It is also possible to replace. In any case, when the linear pattern 11 and the linear pattern 21 are connected by the connecting portions 12 and 22 to form one electric circuit, the electric circuit becomes a spiral and functions as a winding.

  In the configuration example described above, there is no magnetic body around the winding, so it functions as an air-core inductor, but by arranging a magnetic body such as ferrite in the vicinity of the winding in various forms, Inductance can be increased.

  As a technique for disposing a magnetic material in the vicinity of the winding, as shown in FIG. 3, the magnetic material plate such as a ferrite plate is formed on both sides in the thickness direction of the laminated body in which the coil substrate 10 and the coil substrate 20 are laminated. A yoke plate 13 can be employed. If the yoke plate 13 is disposed, the inductance can be increased by passing a magnetic flux through the yoke plate 13 as in the case where the coil substrate 20 is formed of a magnetic material.

  Further, as shown in FIG. 4, a technique of sandwiching a core plate 14 made of a magnetic plate such as a ferrite plate between the coil substrate 10 and the coil substrate 20 can be employed. However, in this configuration, for the electrical connection between the connection portion 12 and the connection portion 22, it is necessary to provide the connecting connection portion 15 that is a through conductor on the core plate 14. The connection connection portion 15 is formed at a position that coincides with the connection portions 12 and 22 when the coil substrate 10, the coil substrate 20, and the core plate 14 are laminated.

  According to this configuration, the linear pattern 11 and the linear pattern 21 are connected via the connection portions 12 and 22 and the connection connection portion 15, and one line is provided as in the configuration described with reference to FIGS. 1 and 2. Winding as an electric circuit can be formed. In the configuration using the core plate 14, the thickness dimension increases by the thickness dimension of the core plate 14, but in addition to the effect of providing a magnetic body in the vicinity of the winding, the winding within the same area Since the total extension becomes longer, the inductance can be increased.

  As shown in FIG. 3, the configuration in which the yoke plates 13 are arranged on both sides of the laminate made up of the coil substrate 10 and the coil substrate 20 has a core plate 14 interposed between the coil substrate 10 and the coil substrate 20. It is possible to use together with the structure to do. In the present invention, the coil substrates 10 and 20 are formed of a semiconductor substrate. However, as an application example, at least one of the coil substrates 10 and 20 can be a magnetic substrate.

(Embodiment 2)
In the first embodiment, it is assumed that both the coil substrates 10 and 20 are plate-shaped with a uniform thickness. However, in the present embodiment, as shown in FIG. An example is shown in which the recesses 16 and 26 are formed in portions other than the connection portions 12 and 22 on the surface where the 11 and 21 are not formed. The portion where the recesses 16 and 26 are actually formed is a region between the connecting portions 12 and 22 arranged in two rows and is a portion on the back side of the linear patterns 11 and 21. Further, the recesses 16 and 26 are formed in the coil substrates 10 and 20 in a groove shape over the entire length in the direction orthogonal to the linear patterns 11 and 21.

  By forming the coil substrates 10 and 20 in such a shape, the coil substrates 10 and 20 have a high resistance by removing portions that are not necessary for forming the windings in the coil substrates 10 and 20, thereby increasing the linear pattern. The possibility that 11 and 21 are short-circuited through the coil substrates 10 and 20 is reduced. That is, the probability of occurrence of a layer short is reduced. Moreover, while the coil boards 10 and 20 are reduced in weight and the surface area of the coil boards 10 and 20 is increased, an improvement in heat dissipation can be expected.

  In the present embodiment, when a magnetic material is used in combination, as shown in FIG. 6, the recesses 16 and 26 are filled with a core member 17 made of a magnetic material. If the configuration of FIG. 6 is adopted, a magnetic body can be arranged in the winding as in the configuration in which the core plate 14 shown in FIG. 4 is provided, so that the inductance can be increased and the coil substrate 10, Since the core member 17 is provided within the total thickness dimension of 20, an increase in the overall thickness dimension can be prevented. The configuration of FIG. 6 can be used in combination with the configuration using the yoke plate 13 shown in FIG. Other configurations are the same as those of the first embodiment.

  In the first and second embodiments, since the coil substrates 10 and 20 are semiconductor substrates, other elements can be formed on the coil substrates 10 and 20, and a circuit including electromagnetic induction components is integrated into an integrated circuit. Is possible.

(Embodiment 3)
In the first embodiment and the second embodiment, the planar inductor having one circuit winding is illustrated as the electromagnetic induction component. However, if the linear pattern 21 formed on the coil substrate 20 is changed, two circuit windings are provided. A planar transformer can be configured. That is, in the case of forming one circuit winding, the two linear patterns 11 adjacent in the arrangement direction are short-circuited by the short-circuit connection portion 21a provided in the linear pattern 21, but two or more circuits are wound. When forming a line, the short circuit connection part 21a is formed so that the linear pattern 11 may be short-circuited at intervals of two or more in the arrangement direction.

  In the configuration example shown in FIG. 7, the linear pattern 11 formed on the coil substrate 10 as shown in FIG. 7A has the same shape as that of the first embodiment shown in FIG. The linear pattern 21 is different from the first embodiment shown in FIG. 2B as shown in FIG. 7B. That is, in the first embodiment, the short-circuit connection portion 21a is formed so as to electrically connect two adjacent linear patterns 11, but in this embodiment, two linear patterns 11 separated from each other are electrically connected. The short circuit connection portion 21a is formed so as to be connected.

  For example, in the example shown in FIG. 7, the left end portion of the first linear pattern 11 from the bottom in FIG. 7A passes through the first linear pattern 21 from the bottom in FIG. a) It is connected to the right end portion of the third linear pattern 11 from the bottom, and each linear pattern 11 is sequentially connected via the linear pattern 21 in the same manner. With such a connection relationship, the odd-numbered linear pattern 11 from the bottom and the even-numbered linear pattern 11 from the bottom are separate circuits, and two windings are formed. In addition, the linear patterns 11 and 21 forming the windings of each circuit are alternately arranged, so that the windings are close to each other so that they can be coupled by electromagnetic coupling and consequently function as a transformer. it can.

  In the example described above, in the linear pattern 21, the two linear patterns separated by the linear pattern 21 are formed by forming the short-circuit connection portion 21 a that does not intersect with each other and three-dimensionally intersect with the linear pattern 11. 11, the entire linear pattern 21 is formed in a straight line in plan view, and the entire linear pattern 21 is used as the short-circuit connection portion 21 d or linear. It is also possible to form a short-circuit connection portion that three-dimensionally intersects with the linear pattern 21 in the pattern 11.

  In the above configuration example, the linear patterns 21 do not intersect with each other, but as shown in FIG. 8, the short-circuit connection portions 21a may intersect with each other in the linear patterns 21 forming different windings. (A portion indicated by a broken line is embedded in the coil substrate 20).

  In this configuration, for example, the winding of one circuit is short-circuited so that the left end of the first linear pattern 21 from the bottom and the right end of the third linear pattern 21 from the bottom are electrically connected. When the connecting portion 21a is formed, the right end of the second linear pattern 21 from the bottom and the left end of the fourth linear pattern 21 from the bottom are electrically connected to the winding of the other circuit. As a result, the short-circuit connection portion 21a is formed. Here, in the illustrated example, the latter short-circuit connection portion 21 a is embedded in the coil substrate 20.

  In this arrangement, the short-circuit connecting portions 21a of different circuits cross each other. One of the short-circuit connecting portions 21a to be three-dimensionally crossed is formed on the surface of the coil substrate 20, and the other is embedded in the coil substrate 20. That is, the short-circuit connection portion 21a is realized by multilayer wiring. Even when this configuration is adopted, the linear pattern 11 and the linear pattern 21 can be interchanged. It is also possible to form three or more windings by selecting the linear pattern 11 to be coupled by the short-circuit connection portion 21a.

  Various modifications of the first and second embodiments can be applied to the case where a plurality of circuit windings are provided to function as a transformer as in the present embodiment. That is, it is possible to appropriately arrange magnetic materials, form the recesses 16 and 26 in the coil substrates 10 and 20, or form circuit elements in the coil substrates 10 and 20 to form an integrated circuit.

  By the way, the electromagnetic induction component shown in Embodiments 1 and 2 can be used when configuring a power supply device or the like. As power supply devices, there are widely known chopper circuits such as a step-down type, a step-up type, and a polarity inversion type, and DC-DC converters such as a flyback type and a forward type. The chopper circuit uses the electromagnetic energy stored in the inductor, so an inductor is used, and the DC-DC converter uses a transformer.

  FIG. 9 shows a basic configuration of a step-down chopper circuit as an example. In this configuration, a series circuit of a switching element (such as a MOSFET) Q, an inductor L, and a smoothing capacitor C is connected between both ends of a DC power supply (not shown) obtained by rectifying a commercial power supply using a diode bridge, A series circuit of an inductor L and a smoothing capacitor C has a configuration in which a circulating diode D is connected in parallel. The on / off state of the switching element Q is controlled by the control circuit CN.

  Although this type of chopper circuit is well known, its operation will be briefly described. During the ON period of the switching element Q, the smoothing capacitor C is charged from the DC power source through the inductor L, and electromagnetic energy is accumulated in the inductor L during this period. The Further, the electromagnetic energy accumulated in the inductor L flows through a loop circuit passing through the smoothing capacitor C and the diode D in the OFF period of the switching element Q, and a charging current flows through the smoothing capacitor C. The output of this power supply device is taken out from both ends of the smoothing capacitor C.

  When the above-described power supply apparatus is configured, if the planar inductor described in the first and second embodiments is used as the inductor L, a small and thin power supply apparatus can be configured. Here, since the planar inductor is very small, the electromagnetic energy that can be stored is relatively small. Therefore, it is desirable that the on / off frequency (that is, the switching frequency) of the switching element Q is a high frequency of about 100 kHz to several MHz.

  In the case of configuring such a power supply device, if a switching element Q, a diode D, and a control circuit CN are formed on a semiconductor substrate constituting the inductor L to form an integrated circuit, only a smoothing capacitor C is externally attached. Thus, it is possible to configure a power supply device. Moreover, by using the inductor L described above for the power supply device, the inductor L, which is a large component among the components of the power supply device, can be reduced in size. In addition, by integrating the inductor L together with the switching element Q, the inductor L can be provided in the vicinity of the switching element Q. As a result, the parasitic capacitance that becomes a problem when the switching element Q is turned on and off at a high frequency can be provided. The impact can be reduced.

  The same applies to the case of configuring a DC-DC converter. In a DC-DC converter having a typical configuration, a switching element is connected in series to the primary winding of the transformer and the secondary winding of the transformer is used for rectification. Since the series circuit of the diode and the smoothing capacitor is connected and the on / off of the switching element is controlled by the control circuit, the switching element, the diode, the control circuit, etc. can be integrated on the semiconductor substrate constituting the transformer.

  An example of a wiring system using the above-described small power supply device is shown in FIG. In the illustrated wiring system, a wiring device called a gate device 4 is housed in a switch box 3 that is embedded in an appropriate place in a building. The gate device 4 is connected to the power line Lp and the information line Li, which are wired in advance in the wall. Although one switch box 3 and one gate device 4 may be provided, the case where a plurality of switch boxes 3 and gate devices 4 are provided will be described below. In the illustrated example, a basic module 1 having a gateway function including a router and a hub, and a wiring board 5 including a main breaker MB and a branch breaker BB are used.

  A plurality of systems (three systems in the illustrated example) of information lines Li are connected to the basic module 1, and each information line Li is connected to an external Internet network NT as a gateway. The basic module 1 not only branches the information line Li into a plurality of systems and connects the information line Li to the Internet network NT, but also has a function of monitoring the operation state of each functional module 2 described later through the information line Li. . The main breaker MB is connected to the commercial power supply AC, and the power line Lp is connected to the branch breaker BB. In the illustrated example, the branch breaker BB is representatively shown as one system, but usually a plurality of branch breakers BB are provided.

  In the example shown in FIG. 10, the function module 2 is a module that has load control as a main function such as an outlet or a switch, and a module that has information transfer as a main function such as a speaker or a display. Yes. In the configuration of this embodiment, even when load control is the main function, the amount of power used by the load connected to the outlet, the number of times the switch is operated, and the like are monitored as information via the information line Li. Is possible.

  The gate devices 4 of each system are connected by a feed line of a power line Lp and an information line Li. One of the gate devices 4 of each system is connected to the wiring board 5 via the power line Lp and the information line Li. That is, the gate devices 4 of each system are connected in parallel to the power line Lp and connected in parallel to the information line Li.

  The gate device 4 includes a connection port 6 (see FIG. 11) formed of a connector connected to the power line Lp and the information line Li. Therefore, a power path for supplying power to the functional module 2 and an information path for communicating with the functional module 2 can be obtained simply by connecting a connector of the functional module 2 described later to the connection port 6 of the gate device 4. It can be secured at the same time. Moreover, since the gate device 4 is only connected in parallel to the power line Lp and the information line Li, the functional module 2 can be connected to any gate device 4. That is, since the functional module 2 can be freely arranged within the range where the gate device 4 is arranged, it is possible to provide a wiring system having a high degree of freedom in layout and excellent workability.

  As the switch box 3, for example, a switch box 3 to which a mounting frame 9 (see FIG. 11) defined in JIS standard (C 8375) can be attached is used. The mounting frame 9 shown in the figure is called a series type, and three embedded wiring devices that are standardized as one module of a large-angle continuous switch in the JIS standard (C 8304) can be attached.

  As shown in FIG. 11, the attachment frame 9 includes a rectangular window hole 9 a for attaching an instrument penetrating front and back in the center. In order to attach the wiring device to be attached to the mounting frame 9, the front part of the wiring device is inserted from the rear of the window hole 9a, and the wiring device is attached to the device locking portions provided on the left and right frame pieces 9b. The to-be-latched part provided in the both right and left sides is combined. In the illustrated example, a claw is provided as a locked portion in the wiring device, and a gap is provided as a device locking portion in the frame piece 9b of the mounting frame 9. However, there is a configuration in which a hole is provided as a locked portion in the wiring device and a claw is provided as a device locking portion in the frame piece 9b of the mounting frame 9. 9 d of insertion holes are penetrated by the upper and lower frame pieces 9c of the attachment frame 9. As shown in FIG. In order to attach the mounting frame 9 to the switch box 3, a screw receiver (not shown) is provided in the switch box 3 by inserting a mounting screw (not shown) from the front into the insertion hole 9 d in a state where a wiring device is mounted on the mounting frame 9. ).

  When the mounting frame 9 is attached to the wall panel, a mounting hole is provided in the wall panel, and a tightening screw inserted into the insertion hole 9d is screwed into a member called a clamp (not shown), The tightening screw may be tightened so that the peripheral portion of the mounting hole penetrating the panel is sandwiched between the mounting frame 9 and the sandwiching bracket. Alternatively, the attachment frame 9 can be attached to the wall by screwing a wood screw into the wall material through the attachment frame 9.

  In the present embodiment, the power line Lp and the information line Li connected to the distribution box 1 or another switch box 3 are introduced from the upper part of each switch box 3, and the switch box 3 located at the end of each system is excluded. From the lower part of each switch box 3, a power line Lp and an information line Li, which are feed wirings to other switch boxes 3, are derived. Further, by attaching the attachment frame 9 to which the gate device 4 is attached to each switch box 3, the gate device 4 is accommodated in each switch box 3 as described above. Here, since the power line Lp and the information line Li are connected to the gate device 4, in order to prevent the power line Lp and the information line Li from being mixed with each other, the power line Lp and the information line Li are connected to the switch box 3. It is desirable to provide the inlet and the outlet separately.

  The gate device 4 incorporates a terminal having a so-called quick-connection terminal structure that connects wires using the spring force of a leaf spring, and inserts the wire into a wire insertion opening that opens at the back of the device. Thus, a configuration is adopted in which the electric wire is mechanically held and electrically connected. Two pairs of wire insertion openings are provided for the power line Lp and the information line Li. Each pair is used to connect feed wires. Electrically connected to the power path connection port 6a provided with a contact portion electrically connected to the terminal to which the power line Lp is connected and the terminal to which the information line Li is connected on the front surface of the body of the gate device 4 An information path connection port 6b provided with a connected contact portion is arranged.

  The power path connection port 6 a and the information path connection port 6 b are modularized as one connection port 6. In each gate device 4 in the wiring system, each power path connection port 6a and each information path connection port 6b have the same specifications (such as the arrangement of contact portions and the size of the connection port). The positional relationship of the information path connection port 6b is unified. A connection body 7 provided on the back surface of the functional module 2 is detachably coupled to the connection port 6. That is, the connection body 7 of the functional module 2 includes a power path connection body 7a that is detachably coupled to the power path connection port 6a and an information path connection body 7b that is detachably coupled to the information path connection port 6b. A modular connection body 7 is provided. In a state where the connection body 7 of the functional module 2 is connected to the connection port 6 of the gate device 4, the functional module 2 covers the front surface of the gate device 4. Here, the connection port 6 and the connection body 7 constitute a connector.

  As shown in FIG. 12, the functional module 2 has a basic function module 2a that can be used alone by being connected to the gate device 4 alone, and a plane along the wall surface of the basic function module 2a. There is an extended function module 2b that is arranged and used in combination with the basic function module 2a to expand the function of the basic function module 2a. The extension function module 2a can be connected not only to one basic function module 2a but also to a plurality of extension function modules 2a.

  In the following description, regardless of whether the basic function module 2a is used alone or the extended function module 2b is combined with the basic function module 2a, both cases will be described as the function module 2.

  As shown in FIGS. 13 and 14, the functional module 2 includes a flat housing 8a made of synthetic resin. That is, a thin projection that has a small projecting dimension from the wall surface when attached to the gate device 4 and can be allocated to a functional unit having various functions such as display, notification, and operation exposed on the front surface side of the housing 8a. Is formed. A connection body 7 is provided on the rear surface of the housing 8a. When the connection body 7 is coupled to the connection port 6 of the gate device 4, the functional module 2 is electrically connected to the power line Lp and the information line Li. Mounting holes 8c are opened in the upper and lower portions of the housing 8a, and mounting screws (not shown) are inserted into the mounting holes 8c from the front side of the housing 8a with the housing 8a coupled to the gate device 4. Then, by screwing a mounting screw into the mounting screw hole 10e of the mounting frame 9, the functional module 2 is mechanically fixed to the mounting frame 9, and as a result, the coupling strength of the functional module 2 to the gate device 4 is increased. Can be increased. A decorative cover 8b is detachably attached to the front surface of the housing 8a, and the head of the mounting screw is hidden when the decorative cover 8b is mounted on the housing 8a.

  As is clear from the above-described configuration, power is supplied to the functional module 2 from the commercial power supply AC through the power line Lp. Therefore, in order to generate a power source for the operation of the internal circuit of the functional module 2, the internal circuit from the commercial power supply AC is generated. There is a need for a power supply device that generates a DC voltage for use in the operation. Further, since the housing 8a is flat and small, a thin and small power supply device that can be housed in the housing 8a is required. Therefore, the power supply apparatus using the planar inductor described in the first and second embodiments and the planar transformer described in the third embodiment is a power supply apparatus suitable for use in this type of functional module 2.

  When the function module 2 includes not only the basic function module 2a but also the extended function module 2b, the power supply device also supplies power to the extended function module 2b. The power supply from the basic function module 2a to the extended function module 2b uses alternating current. Further, in the basic function module 2a and the extended function module 2b, AC-DC conversion is performed to supply DC power to the internal circuit. Therefore, the basic function module 2a and the extended function module 2b are each provided with a power supply device. Also in the power supply device provided in the extended function module 2b, a thin and small power supply that can be housed in the housing of the extended function module 2b by using the planar inductors of the first and second embodiments and the planar transformer of the third embodiment. A device can be configured.

It is a side view which shows Embodiment 1 of this invention. (A) is a top view same as the above, (b) is a bottom view same as the above. It is sectional drawing which shows the other structural example same as the above. It is sectional drawing which shows another structural example same as the above. It is a disassembled perspective view which shows Embodiment 2 of this invention. It is sectional drawing which shows the other structural example same as the above. (A) is a top view same as the above, (b) is a bottom view same as the above. It is a bottom view in still another configuration example. It is a circuit diagram which shows the structural example of the power supply device using an electromagnetic induction component. It is a lineblock diagram showing the whole wiring system composition using electromagnetic induction parts. It is a front view of the state which attached the functional module to the attachment frame. It is a block diagram which shows the other structural example of a functional module. It is a perspective view which shows a gate apparatus and a functional module. It is a disassembled perspective view which shows a functional module.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Basic module 2 Function module 10 Coil board | substrate 11 Linear pattern 12 Connection part 13 Yoke board 14 Core board 15 Connection connection part 16 Recess 17 Core member 20 Coil board | substrate 21 Linear pattern 21a Short-circuit connection part 22 Connection part CN Control circuit Li Information line Lp Power line Q Switching element

Claims (7)

  A semiconductor substrate comprising a pair of coil substrates in which a plurality of linear patterns made of conductive layers are arranged in parallel on one side of the front and back, and each coil substrate is electrically connected to both ends of each linear pattern, respectively. One coil substrate having a connecting portion that is a through conductor penetrating through the two coil substrates, wherein the two coil substrates are arranged in such a manner that the linear pattern is disposed on the opposite side in the thickness direction and the connecting portions are electrically connected to each other. One of two adjacent linear patterns in the linear pattern formed on the other and the other other end are connected to each other via a linear pattern formed on the other coil substrate. An electromagnetic induction component comprising a wire.   A semiconductor substrate comprising a pair of coil substrates in which a plurality of linear patterns made of conductive layers are arranged in parallel on one side of the front and back, and each coil substrate is electrically connected to both ends of each linear pattern, respectively. One coil substrate having a connecting portion that is a through conductor penetrating through the two coil substrates, wherein the two coil substrates are arranged in such a manner that the linear pattern is disposed on the opposite side in the thickness direction and the connecting portions are electrically connected to each other. The linear pattern formed in the circuit board includes a short-circuit connection portion that electrically connects the other two or more spaced apart ends along the direction in which the linear patterns are arranged. The electromagnetic induction component is characterized in that a number of windings corresponding to the interval are formed by being connected to each other.   The core board which consists of a magnetic board is laminated | stacked between a pair of said coil boards, and a core board is provided with the connection connection part which is a penetration conductor which electrically connects the said connection parts. The electromagnetic induction component according to claim 2.   3. The electromagnetic induction component according to claim 1, wherein a recess is formed in a portion of the opposing surfaces of the pair of coil substrates excluding the connection portion.   The electromagnetic induction component according to claim 4, wherein the space formed by the recess is filled with a core member made of a magnetic material.   6. A pair of yoke plates formed by magnetic plates in a form sandwiching a laminated body of the pair of coil substrates from both sides, are arranged according to any one of claims 1 to 5. Electromagnetic induction parts.   A power supply device comprising the electromagnetic induction component according to any one of claims 1 to 6, a switching element, and a control circuit for controlling on / off of the switching element, wherein the switching element and the control circuit are a pair of the A power supply device formed on at least one of coil substrates.

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