JP2013215053A - Power supply device and power module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a power supply device capable of bipolar or multi voltage output which is thin, compact, light, reliable, high in performance and inexpensive, and a power module using it.SOLUTION: A power transformer 50 comprises: a primary side coil pattern and two secondary side coil patterns arranged on a multilayer printed board 30; and a core member electromagnetically coupled with the primary side and secondary side coil patterns. The core member is mounted in through holes formed in the multilayer printed board 30. The primary side coil pattern and the secondary side coil patterns are disposed on different conductor layers of the multilayer printed board 30, respectively, so as to wind about one through hole. The secondary side coil patterns have a common terminal branching from a junction of both. The common terminal and a terminal of the secondary side coil patterns form a first output circuit, and the common terminal and another terminal of the secondary side coil patterns form a second output circuit.

Description

  The present invention relates to a power supply device in which a power transformer is mounted on a printed circuit board and a power module using the same.

  For example, in the case of a power module in which a power semiconductor element such as an IGBT (Insulated Gate Bipolar Transistor) is mounted (see Patent Document 1), a plurality of power supply circuits for a plurality of control circuits for driving and controlling a plurality of power semiconductor elements In order to independently control the power semiconductor element, a plurality of insulated power supplies are required. For this reason, a single power transformer consisting of a single U-shaped core and primary and secondary coil patterns arranged on the printed circuit board is used to isolate the voltage from each winding circuit to each control circuit. Is distributed.

JP2009-213214 (FIGS. 4, 5, and 6) Japanese Patent No. 3620415 (FIG. 4) JP 2001-156252 A (FIGS. 1 and 3)

  For example, by applying a reverse bias voltage to the gate voltage for high-speed driving of the power semiconductor element and stable driving of the power semiconductor element having a low threshold voltage, the switching speed can be increased and the noise tolerance can be increased. it can. Therefore, it is necessary to add a secondary coil pattern for creating a reverse bias voltage separately from the coil pattern for outputting a positive voltage to the power transformer.

  However, when adding a coil pattern to create a reverse bias voltage on the secondary side, the coil pattern is placed on a separate wiring layer on the multilayer printed circuit board, so the number of printed circuit board layers is increased or a separate power transformer is added. It must be placed, and the cost is increased due to the increase in the base material and the manufacturing process.

  Furthermore, since the distance between the primary side coil pattern and the secondary side coil pattern becomes long, the magnetic coupling is deteriorated, and problems such as an increase in leakage inductance and a deterioration in regulation appear.

  In order to solve the above problems, an object of the present invention is a thin, small, lightweight, reliable, high-performance, low-cost power supply device capable of bipolar or multi-voltage output, and this It is providing the power module using.

In order to achieve the above object, the present invention is a power supply device in which a power transformer is mounted on a multilayer printed board in which conductor layers and electrical insulating layers are alternately laminated,
The power transformer is composed of a primary side coil pattern and at least one secondary side coil pattern disposed on a multilayer printed circuit board, and a core member electromagnetically coupled to the primary side and the secondary side coil pattern.
The core member is attached to a through hole provided in the multilayer printed board,
The primary side coil pattern and the secondary side coil pattern are respectively provided on different conductor layers of the multilayer printed circuit board so as to be wound around the through hole,
The secondary coil pattern is provided with a common terminal branched from the middle, and a first output circuit is formed by the common terminal and the first end of the secondary coil pattern. The common terminal and the secondary coil pattern A second output circuit is formed by the second end.

  According to the present invention, by configuring the primary side and secondary side coils of the power transformer with the coil pattern of the printed board, the transformer can be reduced in thickness and size and weight.

  Further, by providing a common terminal branched from the middle of the secondary coil pattern, two output circuits can be configured, so that bipolar or multi-voltage output can be easily realized.

  Also, by winding the primary side coil pattern and the secondary side coil pattern around the same through hole, both coil patterns can be arranged close to each other, so that magnetic coupling is improved and energy efficiency is improved. . Further, the coupling balance between the primary coil pattern and the two output circuits can be made uniform.

It is a schematic perspective view which shows an example of the power supply device which concerns on this invention. It is a circuit diagram which shows an example of the power supply device which concerns on this invention. FIG. 2 is a plan view illustrating an example of a layout of a primary side coil pattern of a power transformer illustrated in FIG. 1. It is a top view which shows an example of the layout of a secondary side coil pattern. It is sectional drawing of the power transformer along the AA line of FIG. It is a circuit diagram which shows the example which comprised the secondary side circuit as a bipolar rectifier circuit. It is a circuit diagram which shows the example which comprised the secondary side circuit as a rectifier circuit of a multi voltage output. It is a top view which shows the other example of the layout of a secondary side coil pattern. It is a top view which shows the further another example of the layout of a secondary side coil pattern. FIG. 10 is a circuit diagram illustrating an example of a power supply device to which the layout of FIG. 9 can be applied. 10 is a secondary circuit when the power transformer shown in FIG. 9 is applied to the power supply device of FIG. It is a top view which shows the further another example of the layout of a secondary side coil pattern. FIG. 13A is a plan view showing another example of the layout of the primary coil pattern, and FIG. 13B is a plan view showing still another example of the layout of the secondary coil pattern. It is sectional drawing of the power transformer along the BB line of Drawing 13 (a) (b). It is a disassembled perspective view which shows an example of the power module which concerns on this invention.

Embodiment 1 FIG.
FIG. 1 is a schematic perspective view showing an example of a power supply device according to the present invention. The power supply device includes a multilayer printed circuit board 30 in which conductor layers and electrical insulating layers are alternately stacked, and a power transformer 50 mounted on the multilayer printed circuit board 30. Although two power transformers 50 are illustrated in FIG. 1, one or three or more power transformers 50 may be mounted.

  The multilayer printed circuit board 30 is provided with a primary side circuit P and a secondary side circuit S on both sides of the power transformer 50. The primary winding and the secondary winding of the power transformer 50 are formed as a coil pattern on the conductor layer of the multilayer printed board. The primary circuit P is provided with a drive circuit 36 connected to the primary coil pattern of the power transformer 50. For example, various circuit elements such as an oscillation circuit 37, a MOSFET 38, and a bypass capacitor 39 are mounted. The secondary side circuit S is provided with a rectification output circuit 41 connected to the secondary side coil pattern of the power transformer 50, and various circuit elements such as a rectification diode 42 and a smoothing capacitor 43 are mounted thereon. The primary side circuit P and the secondary side circuit S are electrically insulated by the power transformer 50. The drive circuit 36 is connected to an external power source (not shown).

  FIG. 2 is a circuit diagram showing an example of a power supply device according to the present invention. Between the positive line connected to the positive electrode Vin + of the external power source and the negative line connected to the negative electrode Vin− of the external power source, a bypass capacitor 39, an oscillation circuit 37, a MOSFET 38, and primary coils of the power transformers 50 are provided. The multi-stage parallel circuit of the pattern 51 is connected. In the present embodiment, the power transformers 50 are connected in parallel, but may be connected in series or mixed in series and parallel.

  An individual rectification output circuit 41 is connected to the secondary coil patterns 52 and 53 of each power transformer 50. Each rectifier output circuit 41 includes a rectifier diode 42 and a smoothing capacitor 43.

  The oscillation circuit 37 generates a pulse having a predetermined cycle and a predetermined duty ratio. The MOSFET 38 switches the current flowing through the primary coil pattern 51 of each power transformer 50 in a pulsed manner in accordance with the pulse from the oscillation circuit 37. The same voltage as the external power supply voltage is applied to the primary coil pattern 51 of each power transformer 50, and each power transformer 50 corresponds to the winding ratio between the primary coil pattern 51 and the secondary coil patterns 52 and 53. The voltage is converted to a voltage and supplied to each rectification output circuit 41. The DC voltage obtained by each rectification output circuit 41 is supplied to the outside. The bypass capacitor 39 prevents pulsed current from leaking out as noise.

  FIG. 3 is a plan view showing an example of the layout of the primary coil pattern 51 of the power transformer 50 shown in FIG. FIG. 4 is a plan view showing an example of the layout of the secondary coil patterns 52 and 53. FIG. 5 is a cross-sectional view of the power transformer 50 taken along the line AA of FIG.

  As shown in FIG. 5, the multilayer printed circuit board 30 is laminated in the order of an electrical insulation layer, a conductor layer MA, an electrical insulation layer, a conductor layer MB, and an electrical insulation layer from top to bottom. The power transformer 50 includes a primary side coil pattern 51 disposed on the conductor layer MA of the multilayer printed circuit board 30, secondary side coil patterns 52 and 53 disposed on the conductor layer MB of the multilayer printed circuit board 30, and a primary side coil pattern. 51 and secondary coil patterns 52 and 53 and a core member 71 electromagnetically coupled.

  For example, the core member 71 is previously divided into two E-shaped divided cores, and the multilayer printed board 30 has three through holes 31 corresponding to the E-shaped divided cores. When each divided core is mounted in the through hole 31 from both sides of the substrate 30, a core member 71 in which the divided cores are integrated is completed.

  As shown in FIG. 3, the primary coil pattern 51 is formed in the conductor layer MA so as to surround the central through hole 31. The outer end of the primary coil pattern 51 is drawn out as a terminal PA. The inner end of the primary coil pattern 51 is drawn out as a terminal PB through another conductor layer through the through hole 32.

  As shown in FIG. 4, the secondary coil pattern 52 is formed in the conductor layer MB so as to surround the central through hole 31. The inner end of the secondary coil pattern 52 is drawn out as a terminal SA through another conductor layer through the through hole 32. The outer end of the secondary coil pattern 52 is drawn out as a common terminal SC. The secondary coil pattern 53 branches off from the connection point 34 at the outer end of the secondary coil pattern 52, and the outer periphery of the secondary coil pattern 52 is centered on the same through hole 31 as the secondary coil pattern 52. It is wound so as to surround it. The outer end of the secondary coil pattern 53 is drawn out as a terminal SB. Thus, the first output circuit is formed by the terminal SA and the common terminal SC of the secondary coil pattern 52. A second output circuit is formed by the terminal SB and the common terminal SC of the secondary coil pattern 53.

  The core member 71 constitutes a closed magnetic circuit that passes through the two through holes 31. Therefore, when a current flows through the primary coil pattern 51, a magnetic field is generated by electromagnetic induction, and the generated magnetic field passes through the core member 71 and generates a current in the secondary coil patterns 52 and 53.

  Thereby, the secondary side coil patterns 52 and 53 can be wound around the same through hole 31 and disposed in the common conductor layer MB. Therefore, the secondary side circuit S of the secondary side coil patterns 52 and 53 can be configured as, for example, a bipolar rectifier circuit as shown in FIG. Two outputs, positive and negative, with SC as the ground potential can be obtained. In this case, a reverse bias voltage can be applied to the gate voltage if it is used as a gate power source for IGBTs, MOSFETs, etc., realizing a power supply device effective for high-speed driving and power semiconductors with low threshold voltages. it can. As an alternative, the secondary side circuit S of the secondary side coil patterns 52 and 53 can be configured as a rectifier circuit of a multi-voltage output as shown in FIG. A positive two output voltage with the ground potential as the output is obtained.

  3 to 5, the primary side coil pattern 51 and the secondary side coil patterns 52 and 53 can be arranged at a closer distance and can be coupled at the same distance. Therefore, the primary side coil pattern 51 and the secondary side coil pattern The coupling balance of the patterns 52 and 53 can be made equal, and the output balance of the secondary coil patterns 52 and 53 can be made equivalent. In addition, a plurality of stable voltage outputs can be easily obtained without increasing the number of power transformers. Further, since the winding is constituted by the pattern coil of the printed circuit board, manufacturing variation is reduced. Furthermore, since a plurality of outputs can be obtained with one core, the number of parts can be reduced, and a highly reliable power transformer can be manufactured at low cost. Further, when a plurality of power supply circuits are required, the mounting area can be significantly reduced.

  The primary coil pattern 51 may be disposed on the outermost layer of the multilayer printed circuit board 30, but is preferably disposed on the inner layer of the multilayer printed circuit board 30. As a result, the electrical insulating layer is interposed not only between the primary coil pattern 51 and the secondary coil patterns 52 and 53 but also between the core member 71, so that not only the dielectric breakdown voltage between the coils but also between the core and the coil. High withstand voltage can be secured. Similarly, the secondary coil patterns 52 and 53 may be arranged in the outermost layer of the multilayer printed board 30, but are preferably arranged in the inner layer of the multilayer printed board 30. Thereby, the withstand voltage between the coils and the withstand voltage between the core and the coil can be further improved.

  FIG. 8 is a plan view showing another example of the layout of the secondary coil patterns 52 and 53. A lead wire 33 is provided at the connection point 34 of the secondary coil patterns 52 and 53 through the through hole 32. With such a configuration, it is possible to increase the number of windings of the secondary coil pattern 53 on the outside.

  FIG. 9 is a plan view showing still another example of the layout of the secondary coil patterns 52 and 53. Here, the secondary side coil pattern 53 of the multilayer printed circuit board 30 branches from the connection point 34 at the outer end of the secondary side coil pattern 52, and the secondary side in the direction opposite to the secondary side coil pattern 52. The coil pattern 52 is wound so as to surround the outer periphery.

  FIG. 10 is a circuit diagram showing an example of a power supply device to which the layout of FIG. 9 can be applied. Between a positive line connected to the positive electrode Vin + of the external power supply and a negative line connected to the negative electrode Vin− of the external power supply, a series circuit of bypass capacitors 39a and 39b, oscillation circuits 37a and 37b, and MOSFETs 38a and 38b. Connected to the series circuit. The first terminal of the multistage parallel circuit of the primary side coil pattern 51 of each power transformer 50 is connected to the connection point of the MOSFETs 38a and 38b, and the second terminal of the multistage parallel circuit is connected to the connection point of the bypass capacitors 39a and 39b. The

  An individual rectification output circuit 41 is connected to the secondary coil patterns 52 and 53 of each power transformer 50. Each rectifier output circuit 41 includes a rectifier diode 42 and a smoothing capacitor 43. The oscillation circuits 37a and 37b have a predetermined cycle and a predetermined duty ratio, and generate pulses having opposite phases. The MOSFETs 38a and 38b are alternately switched according to the antiphase pulses from the oscillation circuits 37a and 37b, and the current flowing through the primary coil pattern 51 of each power transformer 50 is switched in a pulse shape. The voltage divided by the bypass capacitors 39a and 39b is applied to the primary side coil pattern 51 of each power transformer 50 as a positive and negative voltage by alternating switching of the MOSFETs 38a and 38b. Each power transformer 50 converts the voltage into a voltage corresponding to the winding ratio between the primary side coil pattern 51 and the secondary side coil patterns 52 and 53, and supplies the voltage to each rectification output circuit 41. Positive and negative DC voltages obtained by the rectification output circuits 41 are supplied to the outside. The bypass capacitor 39 prevents pulsed current from leaking out as noise.

  FIG. 11 is a secondary circuit when the power transformer shown in FIG. 9 is applied to the power supply device of FIG. Since the secondary side coil patterns 52 and 53 are wound in opposite directions, the DC bias of the core member 71 can be prevented even when a positive / negative pulse voltage of both polarities is applied to the power transformer. FIG. 11 shows the case where the secondary side circuit S of the secondary side coil patterns 52 and 53 is configured as a bipolar rectifier circuit as in FIG. 6, but as in FIG. It is also possible to configure as a rectifier circuit. Further, similarly to FIG. 8, the number of windings of the secondary coil pattern 53 on the outside can be increased by providing the lead wire 33 through the through hole 32.

  In addition, since the projected area of the pattern of the multilayer printed circuit board 30 can be increased by designing the pattern widths of the secondary coil patterns 52 and 53 to be wide, for example, a multilayer printed circuit board can be used as a power module power source. When 30 is used in an overlapping manner, it can function as a shield plate that shields radiation noise radiated from a power semiconductor element through which a large current flows. Therefore, the shield plate can be omitted or the amount of shield plate to be used can be reduced.

Embodiment 2. FIG.
FIG. 12 is a plan view showing still another example of the layout of the secondary coil patterns 52 and 53. The secondary coil patterns 52 and 53 are wound around the central through hole 31 as two parallel patterns. The starting ends of the secondary coil patterns 52 and 53 are connected in common, and a lead wire 33 is provided through the through hole 32, and is drawn out as a common terminal SC. One of the parallel patterns functions as the secondary coil pattern 52, and the outer end thereof is drawn out as a terminal SA. The other of the parallel patterns functions as a secondary coil pattern 53, and an outer end thereof is drawn out as a terminal SB. Thus, the first output circuit is formed by the terminal SA and the common terminal SC of the secondary coil pattern 52. A second output circuit is formed by the terminal SB and the common terminal SC of the secondary coil pattern 53. The first and second output circuits thus obtained can be configured as bipolar rectifier circuits as in FIG. 6, or can be configured as multi-voltage output rectifier circuits as in FIG. Is possible.

  With such a configuration, the same effects as those of the second embodiment can be obtained, and the number of windings of the secondary coil patterns 52 and 53 is the same, so that a power supply device with high reliability and high component mounting density on the board can be obtained. realizable.

  Further, FIG. 12 shows the case where two parallel patterns are used, but it is also possible to configure a rectifier circuit of a multi-voltage output using three or more parallel patterns.

Embodiment 3 FIG.
13A is a plan view showing another example of the layout of the primary side coil pattern 51, and FIG. 13B is a plan view showing still another example of the layout of the secondary side coil patterns 52 and 53. As shown in FIG. FIG. FIG. 14 is a cross-sectional view of the power transformer 50 taken along line BB in FIGS. 13 (a) and 13 (b).

  As shown in FIG. 14, the multilayer printed circuit board 30 is laminated in the order of an electrical insulation layer, a conductor layer MA, an electrical insulation layer, a conductor layer MB, and an electrical insulation layer from top to bottom. The power transformer 50 includes a primary side coil pattern 51 disposed on the conductor layer MA of the multilayer printed circuit board 30, secondary side coil patterns 52 and 53 disposed on the conductor layer MB of the multilayer printed circuit board 30, and a primary side coil pattern. 51 and secondary coil patterns 52 and 53 and a core member 71 electromagnetically coupled.

  In the present embodiment, the core member 71 is pre-divided into, for example, a U-shaped divided core, and two through holes 31 are formed in the multilayer printed circuit board 30 corresponding to the U-shaped divided core. When each divided core is mounted in the through hole 31 from both sides of the multilayer printed board 30, an annular core member 71 in which the divided cores are integrated is completed.

  As shown in FIG. 13A, most of the primary coil pattern 51 is formed in the conductor layer MA, and in the first rotation direction (for example, clockwise) so as to surround the left through hole 31. ) And a coil pattern 51b wound in a second rotation direction (for example, counterclockwise) opposite to the first rotation direction so as to surround the right through hole 31; Are connected in series. The outer end of the coil pattern 51a is drawn out as a terminal PA. The inner end of the coil pattern 51a is connected to the outer end of the coil pattern 51b through the through hole 32 and the jumper wire. The inner end of the coil pattern 51b is drawn out as a terminal PB through a through hole and a jumper wire.

  As shown in FIG. 13B, most of the left secondary coil pattern 52 is formed in the conductor layer MB and surrounds the left through hole 31 as in FIG. Are wound in a first rotation direction (for example, clockwise). The inner end of the secondary coil pattern 52 is drawn out as a terminal SA through another conductor layer through the through hole 32. The outer end of the secondary coil pattern 52 is drawn out as a common terminal SC. The secondary side coil pattern 53 branches from the connection point 34 at the outer end of the secondary side coil pattern 52, and the secondary side in the second rotation direction (for example, counterclockwise) opposite to the first rotation direction. The coil pattern 52 is wound so as to surround the outer periphery. The outer end of the secondary coil pattern 53 is drawn out as a terminal SB. Thus, a first output circuit is formed by the terminal SA and the common terminal SC of the left secondary coil pattern 52. Further, a second output circuit is formed by the terminal SB and the common terminal SC of the left secondary coil pattern 53.

  The secondary coil pattern 52 on the right side has the same pattern shape as that on the left side, and most of the secondary side coil pattern 52 is formed in the conductor layer MB as shown in FIG. Similarly, it is wound in the first rotation direction (for example, clockwise) so as to surround the left through hole 31. The inner end of the secondary coil pattern 52 is drawn out as a terminal SA through another conductor layer through the through hole 32. The outer end of the secondary coil pattern 52 is drawn out as a common terminal SC. The secondary side coil pattern 53 branches from the connection point 34 at the outer end of the secondary side coil pattern 52, and the secondary side in the second rotation direction (for example, counterclockwise) opposite to the first rotation direction. The coil pattern 52 is wound so as to surround the outer periphery. The outer end of the secondary coil pattern 53 is drawn out as a terminal SB. Thus, the third output circuit is formed by the terminal SA and the common terminal SC of the right secondary coil pattern 52. The fourth output circuit is formed by the terminal SB and the common terminal SC of the right secondary coil pattern 53.

  In such a configuration, the primary side coil pattern 51 is configured such that the coil patterns 51a and 51a divided into two around the two through holes 31 are connected in series with each other in reverse, so that radiation noise from a power semiconductor or the like is generated. When the primary coil patterns that are opposite to each other pass through, the noise current of the coil pattern flows in a direction that cancels out, so that the noise tolerance can be increased. In the secondary side circuit, four output circuits can be formed in the same conductor layer MB of the multilayer printed board 30.

Embodiment 4 FIG.
FIG. 15 is an exploded perspective view showing an example of a power module according to the present invention. The power module includes a base substrate 4, a multilayer printed circuit board 30, a case member 20, and the like.

  The base substrate 4 has a wiring pattern formed on an electrical insulating layer having excellent heat dissipation performance, and is composed of, for example, an aluminum substrate or a ceramic substrate. On the base substrate 4, a plurality of power semiconductor elements, for example, an IGBT (Insulated Gate Bipolar Transistor) 5, a plurality of diodes 6, and a plurality of connection terminals 13 are mounted. The base substrate 4 is usually mounted on an external heat sink (not shown).

  The case member 20 is provided so as to surround the base substrate 4 in order to hold the base substrate 4 and the multilayer printed board 30 at a predetermined interval.

  The multilayer printed circuit board 30 is equipped with a plurality of IGBT drive circuits for individually driving the IGBTs 5 and a plurality of drive power supply circuits for individually supplying power to each drive circuit. As shown, various circuit elements such as an oscillation circuit 37, a MOSFET 38, a bypass capacitor 39, a rectification output circuit 41, a drive circuit 36, a transistor 45, and a power transformer 50 are mounted.

  A large number of connection terminals 13 are erected on the base substrate 4, and the wiring pattern of the base substrate 4 and the wiring pattern of the multilayer printed circuit board 30 are electrically connected in a state where the multilayer printed circuit board 30 is housed in the case member 20. Used for.

  A number of module terminals 21 are arranged on the case member 20 and are used for electrical connection with an external circuit.

  FIG. 15 shows a state in which the multilayer printed board 30 is removed upward in order to explain the internal structure, but the actual multilayer printed board 30 is housed inside the case member 20 and is also a base board. A resin sealing material 25 is injected into the internal space between the multilayer printed circuit board 30 and the upper surface side of the multilayer printed circuit board 30, and the entire module is mold-sealed.

  By adopting the power supply device according to the present invention described in the first to third embodiments as the power transformer 50 of the power module, the power module can be reduced in size and thickness.

  In addition, since the multi-layer printed circuit board 30 adopts a high heat resistance specification and uses the power transformer 50, it is a configuration that does not require a soldering location, so that no defects due to solder cracks occur, and even in a high temperature module Can be used.

4 base substrate, 5 IGBT, 6 diode, 13 connection terminal,
20 case member, 21 module terminal, 25 resin sealing material, 30 multilayer printed circuit board, 31 through hole, 32 through hole,
33 leader line, 34 connection point, 36 drive circuit,
37 Oscillator, 38 MOSFET, 39 Bypass capacitor,
41 rectifier output circuit, 42 rectifier diode, 43 smoothing capacitor 45 transistor, 50 power transformer, 51 primary coil pattern,
52, 53 Secondary coil pattern, 71 Core member,
MA, MB conductor layer, P primary side circuit, PA, PB terminal,
S Secondary circuit, SA, SB terminal, SC common terminal.

Claims (4)

A power supply device in which a power transformer is mounted on a multilayer printed board in which conductor layers and electrical insulating layers are alternately laminated,
The power transformer is composed of a primary side coil pattern and at least one secondary side coil pattern disposed on a multilayer printed circuit board, and a core member electromagnetically coupled to the primary side and the secondary side coil pattern.
The core member is attached to a through hole provided in the multilayer printed board,
The primary side coil pattern and the secondary side coil pattern are respectively provided on different conductor layers of the multilayer printed circuit board so as to be wound around the through hole,
The secondary coil pattern is provided with a common terminal branched from the middle, and a first output circuit is formed by the common terminal and the first end of the secondary coil pattern. The common terminal and the secondary coil pattern A second output circuit is formed by the second end of the power supply device. Two parallel patterns are wound around the through hole,
A common terminal is provided by commonly connecting the start ends of the parallel pattern, a first output circuit is formed by the common terminal and one of the parallel patterns, and a second output circuit is formed by the common terminal and the other of the parallel patterns. The power supply device according to claim 1, wherein: The core member is an annular core member attached to first and second through holes provided in the multilayer printed board,
A first primary coil pattern and a first secondary coil pattern are respectively provided on different conductor layers of the multilayer printed circuit board so as to be wound around the first through hole;
The first secondary coil pattern is provided with a first common terminal branched from the middle, and a first output circuit is formed by the first common terminal and the first end of the first secondary coil pattern, A second output circuit is formed by one common terminal and the second end of the first secondary coil pattern;
A second primary coil pattern and a second secondary coil pattern are respectively provided on different conductor layers of the multilayer printed circuit board so as to be wound around the second through hole;
The second secondary coil pattern is provided with a second common terminal branched from the middle, and a third output circuit is formed by the second common terminal and the first end of the second secondary coil pattern, A fourth output circuit is formed by the second common terminal and the second end of the second secondary coil pattern;
The first primary coil pattern is wound around the first through hole in the first rotation direction,
The second primary coil pattern is wound around the second through hole in a second rotation direction opposite to the first rotation direction,
The power supply device according to claim 1, wherein the first primary coil pattern and the second primary coil pattern are connected in series with each other. A plurality of power semiconductor elements;
A plurality of element driving circuits for driving each power semiconductor element;
A power module comprising: the power supply device according to claim 1 for supplying power to each element driving circuit.

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