JP2007157886A - Surface processing fixture - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a surface processing fixture which can be used even in a vacuum apparatus, and which can easily be transferred. <P>SOLUTION: An induction coil 104 causing AC current by electromagnetic induction with an AC magnetic field supplied from a conveyance container, and a film capacitor 103 charged by current supplied from the induction coil 104 through a rectifier circuit 105, are arranged in space formed inside by an upper case 101 and a lower case 102. Voltage of the film capacitor 103 is applied to an electrode pattern 109 through a control circuit 106 and a boosting circuit 107. Thus, a substrate 200 is polarized and it is adsorbed by electrostatic attraction. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a surface treatment jig.

In recent years, in the processing of a substrate such as a semiconductor wafer, thinning of the substrate and element formation on both surfaces of the substrate are actively performed.
However, when the substrate is thinned, it is difficult to handle the substrate. Further, when elements are formed on both surfaces of the substrate, it is necessary to avoid the back surface of the processing surface from coming into contact with the processing stage.

For these problems, a method is used in which a protective sheet is attached to the substrate to reinforce the thin substrate and prevent the elements on the back surface from coming into contact with the processing stage or the like and being damaged.
Such a protective sheet is generally devised such that it can be easily peeled off from the substrate by applying ultraviolet rays or heat. However, since the protective sheet is an organic material, it is difficult to cope with all semiconductor processes, for example. Therefore, it was necessary to reapply the protective sheet many times during a series of manufacturing processes, and a large amount of waste was generated. Further, although it is easy to peel off from the substrate, it is necessary to pay close attention to the bonding, and it is necessary to inspect whether the adhesive remains after peeling. Furthermore, when the step shape is formed on the back surface of the substrate, it is difficult to attach the protective sheet.

  Then, the surface treatment jig | tool which can be affixed on a back surface using vacuum suction as disclosed by patent document 1 is proposed. However, since such a jig is adsorbed to the substrate by a negative pressure, the adsorbing force cannot be maintained in the vacuum apparatus. Therefore, it cannot be used in a manufacturing process including vacuum processing.

JP 2005-126815 A

  An object of the present invention is to obtain a surface treatment jig for protecting the back surface of a substrate that can be used in a vacuum apparatus and can be easily transferred.

The surface treatment jig of the present invention includes a current supply unit that generates a current without receiving an external current supply, a charge holding unit that is charged by a current supplied from the current supply unit, and the charge holding unit. And an insulating layer that covers the electrode pattern, and the substrate to be processed is adsorbed by electrostatic attraction between the electrode pattern and the electrode pattern.
This makes it possible to supply current with the surface treatment jig alone, and it is not necessary to provide a power supply cord or the like to the surface treatment jig, so the substrate to be processed can be transferred with the surface treatment jig attached. Can be done easily.

  In particular, when transferring the substrate to be processed into a vacuum apparatus, it is inconvenient if a cord or the like is attached because the vacuum apparatus is sealed, but according to the present invention, processing is performed with the surface mounted on the surface treatment jig. The target substrate can be placed in a vacuum apparatus.

  As described above, since the surface treatment jig can be attached throughout the manufacturing process of the substrate to be processed, it is possible to prevent an increase in man-hours due to the attachment / detachment of the surface treatment jig and to reduce the amount of waste. .

  Further, by providing the charge holding portion, it is possible to hold the voltage enough to maintain the attractive force for about several tens of seconds to several minutes without supplying current. This makes it possible to maintain the suction force during the transfer of the surface treatment jig from the carrier for conveyance to a processing apparatus such as a vacuum apparatus.

  In addition, the current supply unit can be, for example, an induction coil, and can thereby generate a current by electromagnetic induction by an alternating magnetic field applied from the outside. That is, it is possible to maintain the suction force of the surface treatment jig simply by supplying an AC magnetic field from a carrier for transportation.

The surface treatment jig of the present invention includes a terminal that receives a current supply from the outside, a charge holding unit that is charged by a current supplied through the terminal, and an electrode pattern that receives a power supply from the charge holding unit. And an insulating layer covering the electrode pattern, and the substrate to be processed is adsorbed via the insulating layer by electrostatic attraction between the electrode pattern and the electrode pattern.
As a result, it is possible to hold the voltage enough to maintain the suction force for several tens of seconds to several minutes in the charge holding unit, so the surface treatment jig can be transferred from the carrier for transportation to the processing device such as a vacuum device. It is possible to maintain the adsorption force.

The charge holding part may be a film capacitor, for example. By using a film capacitor, the apparatus can be reduced in weight and size.
A battery or the like can also be used for the charge holding portion.
The surface treatment jig of the present invention can be applied to various semiconductor processes, crystal oscillators, and micromachines in general.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
Embodiment 1 FIG.
FIG. 1 is a cross-sectional view of a surface treatment jig 100 using electrostatic force according to Embodiment 1 of the present invention. Upper case 101, lower case 102, film capacitor (charge holding unit) 103, induction coil (current supply unit) 104, rectifier circuit 105, control circuit 106, booster circuit 107, conducting electrode 108, electrode pattern 109, insulating layer 110 It has.

  The upper case 101 and the lower case 102 are formed of a material suitable for process conditions such as glass and ceramic. When the upper case 101 and the lower case 102 are combined, a space is formed therein, and the film capacitor 103, the induction coil 104, the rectifier circuit 105, the control circuit 106, and the booster circuit 107 are accommodated in the space. As the rectifier circuit 105, the control circuit 106, and the booster circuit 107, a general circuit using a diode, a transistor, or the like can be used.

  An electrode pattern 109 is provided on the upper case 101 and is connected to a circuit inside the case through a conductive electrode 108 embedded in the upper case 101. An insulating layer 110 is provided on the electrode pattern 109. The electrode pattern 109 is a bipolar electrode pattern as shown in FIG.

  The lower case 102 is provided with a spiral induction coil 104 as shown in FIG. An alternating current is generated in the induction coil 104 by an alternating magnetic field supplied from the outside. The alternating current generated in the induction coil 104 is supplied to the film capacitor 103 via the rectifier circuit 105 and charges the film capacitor 103.

  The film capacitor 103 is suitable for weight reduction and downsizing, but since only a voltage of about several tens of volts can be obtained at most, the film capacitor 103 is boosted to several hundred to 1 kV through the control circuit 106 and the booster circuit 107, and the conductive electrode 108 is obtained. Is supplied to the electrode pattern 109. Here, in order for the surface treatment jig 100 to attract the substrate, a voltage of several hundred to 1 kV is generally required.

The principle of suction between the surface treatment jig 100 and the substrate (substrate to be processed) 200 will be described.
The substrate 200 is installed on the insulating layer 110. When a voltage is applied to the electrode pattern 109, the substrate 200 on the insulating layer 110 is polarized as shown in FIG. 3, and the surface treatment jig 100 and the substrate 200 constitute a capacitor. Adsorbed by

  Here, the surface treatment jig 100 and the substrate 200 are insulated by the insulating layer 110, and the adsorption force should be maintained unless discharge occurs, but in reality, charge leakage due to high voltage can be avoided. Absent. For this reason, when the surface treatment jig 100 is separated from an AC magnetic field supplied from an external device such as a carrier for conveyance, the adsorption force of the substrate 200 disappears in a short time.

Therefore, during the transfer and processing of the substrate 200 with the surface treatment jig 100 attached, it is necessary to always store it in a dedicated container or the like that generates an alternating magnetic field.
FIG. 4 is a view showing a container 300 for storing a processed substrate with a surface treatment jig attached thereto. As shown in the figure, the container 300 includes an AC power supply 301, a plurality of induction coils 302, and a substrate storage unit 303 provided between the induction coils 302.

The substrate 200 attached to the surface treatment jig 100 is installed in the substrate housing 303 so that the spiral surface of the induction coil 104 and the spiral surface of the induction coil 302 are parallel to each other.
When an alternating current from the alternating current power supply 301 is supplied to the induction coil 302, an alternating magnetic field in a direction perpendicular to the spiral surface of the induction coil 104 is generated in the substrate housing 303, and an alternating current is generated in the induction coil 104.

  As described above, according to the first embodiment, the surface treatment jig 100 is provided with the induction coil 104 and the film capacitor 103 charged by the alternating current supplied from the induction coil 104. By applying a voltage to the electrode pattern 109, the substrate 200 is polarized and attracted by electrostatic attraction, so that the attracting force of the surface treatment jig 100 can be obtained simply by supplying an AC magnetic field from an external container or the like. Can be maintained. For this reason, since it is not necessary to provide a power supply cord or the like on the surface treatment jig 100, the substrate 200 can be easily transferred with the surface treatment jig 100 attached.

  In particular, when the substrate 200 is transferred into the vacuum apparatus, it is inconvenient if a cord or the like is attached because the vacuum apparatus is sealed. However, if the surface treatment jig 100 according to the first embodiment is used, the surface treatment The substrate 200 can be placed in the vacuum apparatus while being mounted on the jig 100.

  Thus, since the surface treatment jig 100 can be attached throughout the manufacturing process of the substrate 200, an increase in man-hours due to the attachment / detachment of the surface treatment jig 100 can be prevented, and the amount of waste can be reduced. it can.

  Further, by providing the film capacitor 103, it is possible to supply a voltage that can maintain the attractive force for several tens of seconds to several minutes without supplying an AC magnetic field from the outside. This makes it possible to maintain the suction force during the transfer of the surface treatment jig 100 from the moving carrier or the like into a processing apparatus such as a vacuum apparatus.

  The surface treatment jig 100 can be applied to various semiconductor processes, crystal oscillators, and micromachines in general.

  In the first embodiment, the film capacitor 103 is charged using the alternating current generated in the induction coil 104 by electromagnetic induction. However, the means for supplying the current to the film capacitor 103 is not limited to this, for example, for surface treatment A solar cell may be provided in the jig 100 to supply current.

Embodiment 2. FIG.
FIG. 5 is a cross-sectional view of a surface treatment jig 400 according to Embodiment 2 of the present invention. In the second embodiment, a terminal 401 is provided outside the surface treatment jig 400 so that the film capacitor 103 can be charged by supplying current directly from the outside.

  FIG. 6 is a view showing a container 500 for storing a processed substrate to which a surface treatment jig according to the second embodiment is attached. As shown in the figure, the container 500 includes a DC power source 501, a plurality of terminals 502, and a plurality of substrate storage units 503.

The substrate 200 attached to the surface treatment jig 400 is installed in the substrate storage portion 503 with the terminal 401 in contact with the terminal 502.
The current from the DC power source 501 is supplied to the film capacitor 103 via the terminal 502 and the terminal 401, and the film capacitor 103 is charged.

According to the second embodiment, since the terminal 401 is further provided on the surface treatment jig 400, it is possible to charge the film capacitor 103 by an electric current supplied from the outside.
The surface treatment jig 400 may be configured to charge the film capacitor 103 only by an external current via the terminal 401 without providing the induction coil 104.

1 is a cross-sectional view of a surface treatment jig according to Embodiment 1 of the present invention. 2A is a view of the electrode pattern of the surface treatment jig according to the first embodiment as viewed from the direction A in FIG. 1, and FIG. 2B is a view of the induction coil as viewed from the direction A in FIG. It is. FIG. 3 is a diagram for explaining the adsorption principle of the surface treatment jig and the substrate according to the first embodiment. FIG. 4 is a diagram illustrating an example of a container for storing a processed substrate on which a surface treatment jig according to Embodiment 1 is attached. FIG. 5 is a cross-sectional view of a surface treatment jig according to Embodiment 2 of the present invention. FIG. 6 is a view showing another example of a container for storing a processed substrate to which a surface treatment jig according to the second embodiment is attached.

Explanation of symbols

100, 400 Surface treatment jig, 101 Upper case, 102 Lower case, 103 Film capacitor, 104 Inductive coil, 105 Rectifier circuit, 106 Control circuit, 107 Booster circuit, 108 Conductive electrode, 109 Electrode pattern, 110 Insulating layer, 200 substrate, 300, 500 container, 301 AC power source, 302 induction coil, 303, 503 substrate storage unit, 401 terminal, 501 DC power source, 502 terminal

Claims (4)

A current supply unit for generating a current without receiving an external current supply;
A charge holding unit charged by a current supplied from the current supply unit;
An electrode pattern that receives power from the charge holding unit;
An insulating layer covering the electrode pattern;
A surface treatment jig for adsorbing a substrate to be processed by electrostatic attraction between the electrode pattern and the insulating layer.   The surface treatment jig according to claim 1, wherein the current supply unit is an induction coil, and generates current by electromagnetic induction by an alternating magnetic field applied from outside. A terminal for receiving a current supply from the outside;
A charge holding unit that is charged by a current supplied through the terminal;
An electrode pattern that receives power from the charge holding unit;
An insulating layer covering the electrode pattern;
A surface treatment jig for adsorbing a substrate to be processed by electrostatic attraction between the electrode pattern and the insulating layer. The surface treatment jig according to claim 1, wherein the charge holding portion is a film capacitor.

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