JP2007305938A - Electrostatic absorber - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electrostatic absorber which can be used without performing electric discharge even in various pressure environments. <P>SOLUTION: This electrostatic absorber is provided with an electrostatic absorption electrode sheet 20, a substrate 11, boosting circuits 7 and 8, and electric wiring 5 and 6 electrically connecting an electrostatic absorption electrode sheet 20 and boosting circuits 7 and 8, and the boosting circuits 7 and 8 and electric wiring 5 and 6 are internally arranged in the substrate 11, and shielded from an external pressure atmosphere. Especially, it is desired that the substrate 11 is a case body or a sealing material. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electrostatic adsorption device that can be used without discharging even in various pressure environments.

  The electrostatic adsorption device may be used in an atmosphere at a pressure lower than atmospheric pressure, and is employed as a device for fixing or transporting a semiconductor member such as a silicon wafer, for example, inside a semiconductor manufacturing device (for example, (See Patent Document 1 and Patent Document 2). Moreover, the electrostatic adsorption device may be used even under atmospheric pressure, and is employed as an adsorption pad that holds members having various planar shapes, for example (see, for example, Patent Document 3). Furthermore, the electrostatic adsorption device may be used in an atmosphere in which the pressure continuously changes between atmospheric pressure and reduced pressure. For example, an electrostatic adsorption device holds a panel plate inside a device that manufactures a liquid crystal panel by a liquid crystal dropping method. It is employed as a fixing device (see, for example, Patent Document 4 and Patent Document 5).

Such electrostatic adsorption device, by being applied to 10 ² to 10 ⁴ volts of the high voltage from the power supply, is to electrostatically adsorb the deposits on the suction surface of the device. The electrostatic adsorption device is used in a pressure-resistant container (chamber) that can be decompressed. On the other hand, a power supply device including a booster circuit that supplies a high voltage is installed outside the chamber and placed under atmospheric pressure. The electrostatic adsorption device and the power supply device are wired with a high withstand voltage cable (hereinafter simply referred to as a high voltage cable). The pressure in the chamber continuously changes as the pressure is reduced or increased from atmospheric pressure in the process of adsorbing the adherend. At this time, since the high voltage wiring portion for connecting the high voltage cable and the electrostatic adsorption device is also installed in the chamber, it is exposed to the pressure change. By the way, it is known that a glow discharge phenomenon occurs when a high voltage is applied in an atmosphere of low pressure. The range of the low pressure atmosphere that causes the glow discharge is called a Paschen region, and this region becomes wider as the voltage is higher.
Conventionally, a high-voltage wiring part installed in a chamber as described above has a glow discharge from the part if the insulation of the wiring is incomplete when the pressure around the wiring part enters the range of the Paschen area. May occur, resulting in poor adsorption. In addition, because of the long high-voltage cable that supplies high voltage from the power supply unit to the electrostatic adsorption unit, even if there is no problem at the beginning of use, the cable is damaged due to deterioration or accidents during repeated use, resulting in poor insulation. Had the problem. In addition, the fact that the wiring from the booster circuit to the high-voltage cable has to be arranged in the apparatus itself hinders the freedom of design arrangement and handling operation (hereinafter simply referred to as handling) of the electrostatic adsorption apparatus.

Japanese Patent No. 2680338 JP 2004-165198 A JP 2003-285289 A Japanese Patent Laid-Open No. 2000-0666163 Japanese Patent Laid-Open No. 2002-229044

  An object of the present invention is to provide an electrostatic adsorption device that can be used without discharging even in various pressure environments. Moreover, it aims at providing a small electrostatic attraction apparatus.

An electrostatic adsorption device according to a first aspect of the present invention includes an electrostatic adsorption electrode sheet, a base, a booster circuit, and an electrostatic wiring that electrically connects the electrostatic adsorption electrode sheet and the booster circuit. In the electroadsorption apparatus, a booster circuit and electrical wiring are provided in the base.
Moreover, it is preferable that the said board | substrate is a sealing material or a housing | casing.
The electrostatic adsorption device according to the second aspect of the present invention includes an electrostatic adsorption electrode sheet, a base, a booster circuit, and an electrical wiring that electrically connects the electrostatic adsorption electrode sheet and the booster circuit. An electrostatic adsorption device having the booster circuit and the electrical wiring shielded from an external atmosphere.

  The electrostatic adsorption device of the present invention is not applied under the pressure of the Paschen region because the electrical wiring that electrically connects the electrostatic adsorption electrode sheet and the booster circuit does not come into contact with the surrounding atmosphere. In this case, it is difficult to cause dielectric breakdown due to glow discharge. In addition, since the electrical wiring is short, a small electrostatic attraction device can be obtained, and the electrostatic attraction device can be handled freely. Therefore, in the design of the manufacturing apparatus and the actual manufacturing process, it is possible to expect ripple effects such as free installation and arrangement of various peripheral devices that require the electrostatic adsorption device.

Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a schematic cross-sectional view of an example of the electrostatic adsorption device of the present invention. In FIG. 1, a first electrode 2 and a second electrode 3 are provided on the surface of an insulating layer 1 made of an insulating material, and the surfaces of these electrodes are covered with an insulating thin film 4. An electrostatic chucking electrode sheet 20 serving as a suction surface is formed. In this electrostatic adsorption device, the first electrode 2 and the second electrode 3 are formed of conductive portions formed in a pattern. The first electrode 2 and the second electrode 3 are connected to the first booster circuit 7 and the second booster circuit 8 by the first electric wiring 5 and the second electric wiring 6, respectively. The first booster circuit 7 and the second booster circuit 8 are supplied with a primary supply voltage from a power source (not shown) through lead wires 9 and 10. The supply voltage on the primary side is preferable because a short circuit due to discharge between the lead wire 9 and the lead wire 10 can be prevented by supplying the supply voltage at a voltage lower than the glow start voltage (voltage not exceeding the Paschen region). Even if the supply voltage on the primary side is lower than the flow start voltage, the secondary side in the first electric wiring 5 and the second electric wiring 6 boosted by the first boosting circuit 7 and the second boosting circuit 8 is used. Although the supply voltage is higher than the glow start voltage, since the first electric wiring 5 and the second electric wiring 6 are sealed by the base 11 as described below, no glow discharge is generated and the adsorption failure is prevented. Can do.
The first electrical wiring 5, the second electrical wiring 6, the first booster circuit 7 and the second booster circuit 8 are sealed by the base 11 and are installed in the base 11 and shielded from the external atmosphere. ing. The electrostatic adsorption device in FIG. 1 is a bipolar electrostatic adsorption device in which a negative voltage is supplied from the lead wire 9 and a positive voltage is supplied from the lead wire 10.

FIG. 2 is a schematic cross-sectional view of another example of the electrostatic adsorption device of the present invention. This electrostatic chucking device is the electrostatic chucking device having the structure shown in FIG. In FIG. 2, the first electrical wiring 5, the second electrical wiring 6, the first booster circuit 7 and the second booster circuit 8 are installed in the space of the base 11 made of a housing having a space inside, The structure is shielded from the outside atmosphere.
1 and 2, the electrostatic adsorption electrode sheet 20 is composed of the insulating layer 1, the first electrode 2, the second electrode 3, and the insulating thin film 4, but the electrostatic adsorption electrode sheet is insulated. It is good also as a structure which consists of the insulating layer 1, the 1st electrode 2, and the 2nd electrode 3 except the conductive thin film 4. FIG. For example, the insulating layer 1 may be an adsorption surface, and the first electrode 2 and second electrode 3 surface sides provided on the insulating layer 1 may be bonded to the base 11 using an adhesive or the like.

Next, components constituting the electrostatic adsorption device of the present invention will be described.
As an insulating material constituting the insulating layer in the electrostatic adsorption electrode sheet, the material, hardness and size are not limited at all, such as ceramics, plastic film and glass epoxy substrate. Among these, plastic films such as polyimide, polyethylene terephthalate, polyethylene naphthalate, aramid, olefin, polyether sulfone, polyether ketone, and polytetrafluoroethylene are preferable. In particular, a polyimide film having high heat resistance can be preferably used because leakage current does not increase even at high temperatures and electromigration is extremely small. The insulating layer may be a laminate of two or more of the above materials.

  The thickness of the insulating layer is not limited in any way, but considering the availability and ease of handling, a thickness of 3 to 300 μm is preferable, and a plastic film with a thickness of 25 to 150 μm is particularly preferable. is there. If the thickness of the insulating layer is less than 3 μm, the insulation is insufficient, and dielectric breakdown is likely to occur at a voltage of several thousand volts, which is not preferable. When a film thinner than 3 μm is used, two or more films may be laminated and used. On the other hand, when the thickness is larger than 300 μm, the adsorption force tends to decrease, which is not preferable. When two or more of the above films are laminated, the total thickness including the thickness of the laminating adhesive may be designed so as not to exceed 300 μm.

  A first electrode and a second electrode are provided on one surface of the insulating layer, and these electrodes are formed of a conductive portion in which conductive portions as shown in FIG. 3 are formed in a comb-like pattern. The shape and area of such an electrode are optimized by the object to be adsorbed and the surrounding atmosphere. As an example, when the object to be adsorbed is a rectangular glass plate having a thickness of 0.7 mm, a bipolar electrode such as an opposing comb-like electrode as shown in FIG. When the object to be adsorbed has the same shape as that described above and is conductive or a semiconductor, a unipolar electrode having the electrode 12 as shown in FIG. 4 can be used in a low-temperature plasma atmosphere in the decompression chamber. As another example, when the object to be adsorbed is a 12-inch silicon wafer having a thickness of 0.5 mm, a bipolar electrode as shown in FIG. 5 can be used in an atmospheric atmosphere at normal pressure or reduced pressure. In this case, a unipolar electrode having the electrode 12 as shown in FIG. 6 can be used. The present invention is not limited to these electrode examples, and specifications such as the shape, layer configuration, area, groove / hole processing, etc. of the electrode for electrostatic attraction can be freely designed.

  The electrodes can be formed by depositing, sticking, applying, or the like, various metal foils, conductive films, conductive pastes, and the like. The material and thickness are not limited at all, but the film thickness is preferably as long as it is within a range that can ensure conductivity over a long period of time. The thickness is 150 μm or less, especially 35 μm or less of a metal foil or Metal thin films are preferred. A thickness greater than 150 μm is not preferable because it is difficult to produce a pattern.

  In order to ensure insulation against the object to be adsorbed and the substrate, the electrode is covered with an insulating thin film. In order to prevent the discharge from occurring, the edge of the electrode is preferably sealed with an insulating thin film so as not to be exposed to the outside.

  Suitable materials for the insulating thin film are the same as those described above, ceramic materials such as aluminum oxide compounds and zirconia oxide compounds, organic polymer materials such as polyimide, and inorganic materials such as silicone compounds. Examples thereof include electrically insulating materials such as polymer materials.

  The thickness of the insulating thin film provided on the electrode is set in the range of 3 to 300 μm. If the distance from the object to be adsorbed to the electrode layer is smaller than 3 μm, the mechanical strength is insufficient, so that the durability is not achieved. Although it is more desirable to set it in the range of 25 to 150 μm, in actual use, it may be appropriately determined depending on the function desired as the electrostatic adsorption device and the characteristics of the material to be used. Note that the insulating thin film can be either a single layer structure or a laminated structure of a plurality of materials. In the case of a laminated structure, a conductive material may be provided as long as insulation is ensured.

  In the present invention, the insulating thin film, the electrode and the insulating layer may be laminated by an appropriate method, for example, it may be attached via an adhesive layer. As the adhesive constituting the adhesive layer, an insulating adhesive is preferable, but in order to ensure high insulation reliability, epoxy resin, phenol resin, diallyl phthalate resin, thermoplastic polyimide resin, maleimide resin, silicone An adhesive composed of a resin or the like is preferable. These resins may be used alone or in combination of two or more. Further, various elastomers such as NBR may be blended in order to impart flexibility, and various inorganic fillers including metal powder and alumina may be dispersed in order to improve thermal conductivity. It is also effective to add a coupling agent in order to improve the adhesive properties. The adhesive may be in the form of liquid or solid. In addition, since it does not require high insulation unless it is a part that is in contact with the electrode, there is no limitation in selecting an adhesive or the like, and a conductive adhesive or the like may be used in some cases. . The thickness of the adhesive layer is preferably thinner as long as the interlayer adhesion can be secured. Specifically, it is 100 μm or less, more preferably 1 to 50 μm.

  There are no restrictions on the method of laminating with adhesive, but in order to ensure ease of handling and thickness accuracy after lamination, a solid adhesive is applied to the peelable film at a predetermined thickness at room temperature. It is desirable to transfer and use a so-called dry film. Moreover, you may use the plastic film with an adhesive agent by which the normal temperature solid adhesive agent was apply | coated to the single side | surface or both surfaces beforehand. Furthermore, for example, a structure in which a copper foil is directly laminated on one or both sides of a polyimide film may be used, and an electrode may be provided on the polyimide film without using an adhesive or the like.

In the electrostatic adsorption device of the present invention, the electrostatic adsorption electrode sheet is formed on a substrate. At that time, a booster circuit and electrical wiring for electrically connecting the electrostatic chuck electrode sheet and the booster circuit are provided in the base.
As a method of installing a booster circuit and electrical wiring in the base, for example, in an electrostatic adsorption device as shown in FIG. 1, after the electrodes of the electrostatic adsorption electrode sheet and the booster circuit are connected by electrical wiring, the booster circuit An example is a method in which a circuit is bonded to an electrostatic adsorption electrode sheet, and a lead wire for supplying a voltage to the booster circuit is exposed to the outside and is sealed and filled with an insulating sealing material. The insulating sealing material is composed of epoxy resin, phenol resin, diallyl phthalate resin, thermoplastic polyimide resin, maleimide resin, silicone resin, etc. in order to ensure high insulation reliability. It may be used in a mixture of two or more. Further, various elastomers including NBR may be blended in order to impart flexibility.

Further, as another method of installing the booster circuit and the electrical wiring in the base, for example, in the electrostatic adsorption device as shown in FIG. 2, the booster circuit and the electrical circuit are mounted on a casing made of a member whose outer surface is electrically insulating. What is necessary is just to incorporate the electrical wiring which electrically connects this electrostatic adsorption electrode sheet | seat and a booster circuit, and should just expose the lead wire which supplies a voltage to a booster circuit outside. Examples of the casing made of a member whose outer surface is electrically insulating include a casing made of a resin such as an epoxy resin or a phenol resin, or a casing coated with an insulating surface on a metal surface made of aluminum or stainless steel. .
As described above, since the electrostatic adsorption device of the present invention has the booster circuit and the electrical wiring for electrically connecting the electrostatic adsorption electrode sheet and the booster circuit in the base, the high voltage of the electrostatic adsorption device Since the wiring part of this is not in contact with the surrounding atmosphere where the pressure fluctuates, it is difficult to cause a discharge.

  The configuration necessary for operating the electrostatic chucking device can be divided into four parts: a power supply unit, a control system unit, a booster circuit, and an electrostatic chucking electrode sheet. The power supply unit is a part that receives AC or DC electricity supplied from the outside and adjusts the current, voltage, and frequency to a steady state that can be controlled. The control system unit is a unit that generates an electrical signal by changing the current, voltage, and frequency while controlling the operation related to a series of electrostatic adsorption. Switches for manually operating electrical signals, instruments for sensing and displaying operating conditions, communication systems for remote monitoring and control, software and hardware for automatic control belong to the control system section.

Booster circuit is a device that amplifies and electrostatic attraction may become 10 ² to 10 ⁴ volts high converted into a voltage (boost) the voltage of the electrical signals from the control system unit. The booster circuit has a required circuit configuration depending on whether the output voltage is direct current or alternating current, or a combination of both. In the case of AC, the output of the transformer can be used as it is, and the simplest configuration is obtained. In the case of direct current, a rectifier circuit consisting of a diode and a capacitor is added. In the case of a superposition type of alternating current and direct current, a superposition circuit including a diode and a capacitor for generating a boosted alternating current and a rectified direct current is added, and the most complicated configuration is obtained. In order to adsorb and desorb the object to be adsorbed to the adsorption plate at a desired timing, it is preferable that the output voltage waveform of the output signal of the booster circuit can be changed by a signal from the control system unit. The operation of signals from these control systems may be performed in a non-contact manner by communicating by radio, light, ultrasonic waves, etc. from the outside of the electrostatic adsorption device. In this case, the antenna or detector for communication is statically operated. Provided inside the electroadsorption device, a control signal may be received, demodulated and shaped into a desired signal.

In the present invention, the basic structure is to hermetically seal the high voltage portion composed of the electrical wiring and the booster circuit electrically connecting the electrostatic adsorption electrode sheet and the booster circuit in the base, It is also possible to provide a voltage control circuit, a memory circuit, a communication circuit that transmits and receives signals to the outside, an antenna, and the like. It is also possible to use a small battery as a DC power source. In particular, these electrostatic adsorption electrode sheets, power supplies, circuits, etc. can be used as a single unit if they are placed in a small space by concentrating them on one or a small number of insulating substrates and installed inside the substrate of the electrostatic adsorption device. A compact electrostatic attraction apparatus that can be provided. Depending on the shape and process of the object to be adsorbed, a plurality of these electrostatic adsorption devices may be arranged or used in conjunction with each other. If necessary, the outside of the electrostatic adsorption device can be covered with a structure, or a heat radiating device such as a cooling fin or a cooling fan, an electromagnetic shielding material, a magnetic shielding material, or the like can be attached freely.
In addition, the electrical wiring for electrically connecting the electrostatic adsorption electrode sheet and the booster circuit may be a lead wire such as a copper wire or a circuit wiring made of copper or solder.

  Hereinafter, the best mode for carrying out the present invention will be described based on examples, but the present invention is not limited to these examples.

A polyimide film in which a single-pole solid pattern as shown in FIG. 4 having a rectangular size of 76 mm × 36 mm was formed on one surface of a glass epoxy substrate having a thickness of 80 mm × 40 mm × 0.7 mm was bonded with an adhesive. Next, a DC booster circuit was installed on the other surface of the glass epoxy substrate, and the monopolar solid pattern and the DC booster circuit were connected by lead-free solder through a through hole of the glass epoxy substrate to form an electrical wiring. Further, while pulling out the lead wire on the primary side of the booster circuit, the booster circuit, the electrical wiring and the metal wiring part exposed to the through hole part were sealed with phenol resin to obtain the electrostatic adsorption device of the present invention.
A DC control electric signal was applied from the outside to the lead wire of this electrostatic adsorption device at a voltage lower than the glow start voltage to adsorb the aluminum plate. As a result, the adsorption force of the electrostatic adsorption device to the aluminum plate is sufficient in a normal pressure environment (1013 hPa), a reduced pressure environment (0.1 Pa), and an environment where pressure is continuously reduced from the normal pressure environment to the reduced pressure environment. Had. In addition, no discharge occurred in all the above environments.

A polyimide film in which a single-pole solid pattern as shown in FIG. 4 having a rectangular size of 76 mm × 36 mm was formed on one surface of a glass epoxy substrate having a thickness of 80 mm × 40 mm × 0.7 mm was bonded with an adhesive. Next, an AC booster circuit was installed on the other surface of the glass epoxy substrate, and the monopolar solid pattern and the AC booster circuit were connected by lead-free solder through a through hole of the glass epoxy substrate to form an electrical wiring. Further, while pulling out the lead wire on the primary side of the booster circuit, the booster circuit, the electrical wiring and the metal wiring part exposed to the through hole part were sealed with phenol resin to obtain the electrostatic adsorption device of the present invention.
An AC control electric signal was applied from the outside to the lead wire of this electrostatic adsorption device at a voltage lower than the glow start voltage to adsorb the aluminum plate. As a result, the adsorption force of the electrostatic adsorption device to the aluminum plate is sufficient in a normal pressure environment (1013 hPa), a reduced pressure environment (0.1 Pa), and an environment where pressure is continuously reduced from the normal pressure environment to the reduced pressure environment. Had. In addition, no discharge occurred in all the above environments.

Adheres a polyimide film with a comb-like bipolar electrode pattern as shown in Fig. 3 having a rectangular size of 76 mm x 36 mm and a pitch of 2 mm on one side of a glass epoxy substrate 80 mm x 40 mm x 0.7 mm thick It stuck together with the agent. Next, a DC boost circuit was installed on the other surface of the glass epoxy substrate, and the bipolar electrode pattern and the DC boost circuit were connected by lead-free solder through a through hole of the glass epoxy substrate to form an electrical wiring. Further, while pulling out the lead wire on the primary side of the booster circuit, the booster circuit, the electrical wiring and the metal wiring part exposed to the through hole part were sealed with phenol resin to obtain the electrostatic adsorption device of the present invention.
A DC control electric signal was applied from the outside to the lead wire of this electrostatic adsorption device at a voltage lower than the glow start voltage to adsorb the aluminum plate. As a result, the adsorption force of the electrostatic adsorption device to the aluminum plate is sufficient in a normal pressure environment (1013 hPa), a reduced pressure environment (0.1 Pa), and an environment where pressure is continuously reduced from the normal pressure environment to the reduced pressure environment. Had. In addition, no discharge occurred in all the above environments.

Adheres a polyimide film with a comb-like bipolar electrode pattern as shown in Fig. 3 having a rectangular size of 76 mm x 36 mm and a pitch of 2 mm on one side of a glass epoxy substrate 80 mm x 40 mm x 0.7 mm thick It stuck together with the agent. Next, an AC booster circuit was installed on the other surface of the glass epoxy substrate, and the bipolar electrode pattern and the AC booster circuit were connected by lead-free solder through a through hole of the glass epoxy substrate to form an electrical wiring. Further, while pulling out the lead wire on the primary side of the booster circuit, the booster circuit, the electrical wiring and the metal wiring part exposed to the through hole part were sealed with phenol resin to obtain the electrostatic adsorption device of the present invention.
An AC control electric signal was applied from the outside to the lead wire of this electrostatic adsorption device at a voltage lower than the glow start voltage to adsorb the aluminum plate. As a result, the adsorption force of the electrostatic adsorption device to the aluminum plate is sufficient in a normal pressure environment (1013 hPa), a reduced pressure environment (0.1 Pa), and an environment where pressure is continuously reduced from the normal pressure environment to the reduced pressure environment. Had. In addition, no discharge occurred in all the above environments.

A 120 mm × 180 mm × 50 mm thick rectangular polyetheretherketone polyimide film having a 100 mm × 160 mm rectangular monopolar solid pattern formed on the surface of a casing having a space inside is formed. Bonded with an adhesive. Next, a DC booster circuit was installed inside the casing, and the monopolar solid pattern and the DC booster circuit were connected by lead wires through holes provided in the casing to form electrical wiring. Further, the lead wire on the primary side of the booster circuit is pulled out from the hole of the housing, and the inside and outside of the housing are held using an O-ring and an epoxy-based vacuum sealing adhesive (super back seal). An electrostatic adsorption device of the invention was obtained.
A DC control electric signal was applied from the outside to the lead wire of the electrostatic adsorption device at a voltage lower than the glow start voltage to adsorb the glass plate. As a result, the adsorptive power of the electrostatic adsorption device to the glass plate is sufficient in a normal pressure environment (1013 hPa), a reduced pressure environment (0.1 Pa), and an environment where pressure is continuously reduced from the normal pressure environment to the reduced pressure environment. Had. In addition, no discharge occurred in all the above environments.

A 120 mm × 180 mm × 50 mm thick rectangular polyetheretherketone polyimide film having a 100 mm × 160 mm rectangular monopolar solid pattern formed on the surface of a casing having a space inside is formed. Bonded with an adhesive. Next, an AC booster circuit was installed inside the casing, and the monopolar solid pattern and the AC booster circuit were connected by a lead wire through a hole provided in the casing to form an electrical wiring. Further, the lead wire on the primary side of the booster circuit is pulled out from the hole of the housing, and the inside and outside of the housing are held using an O-ring and an epoxy-based vacuum sealing adhesive (super back seal). An electrostatic adsorption device of the invention was obtained.
An AC control electric signal was applied from the outside to the lead wire of the electrostatic adsorption device at a voltage lower than the glow start voltage to adsorb the glass plate. As a result, the adsorptive power of the electrostatic adsorption device to the glass plate is sufficient in a normal pressure environment (1013 hPa), a reduced pressure environment (0.1 Pa), and an environment where pressure is continuously reduced from the normal pressure environment to the reduced pressure environment. Had. In addition, no discharge occurred in all the above environments.

A rectangular electrode of size 100 mm × 160 mm on a surface of a casing made of polyetheretherketone having a rectangular parallelepiped shape with a thickness of 120 mm × 180 mm × 50 mm, and a comb-like bipolar electrode as shown in FIG. The polyimide film on which the pattern was formed was bonded with an adhesive. Next, a DC boosting circuit was installed inside the casing, and the bipolar electrode pattern and the DC boosting circuit were connected by a lead wire through a hole provided in the casing to form an electrical wiring. Further, the lead wire on the primary side of the booster circuit is pulled out from the hole of the housing, and the inside and outside of the housing are held using an O-ring and an epoxy-based vacuum sealing adhesive (super back seal). An electrostatic adsorption device of the invention was obtained.
A DC control electric signal was applied from the outside to the lead wire of the electrostatic adsorption device at a voltage lower than the glow start voltage to adsorb the glass plate. As a result, the adsorptive power of the electrostatic adsorption device to the glass plate is sufficient in a normal pressure environment (1013 hPa), a reduced pressure environment (0.1 Pa), and an environment where pressure is continuously reduced from the normal pressure environment to the reduced pressure environment. Had. In addition, no discharge occurred in all the above environments.

A rectangular electrode of size 100 mm × 160 mm on a surface of a casing made of polyetheretherketone having a rectangular parallelepiped shape with a thickness of 120 mm × 180 mm × 50 mm, and a comb-like bipolar electrode as shown in FIG. The polyimide film on which the pattern was formed was bonded with an adhesive. Next, an AC booster circuit was installed inside the casing, and the bipolar electrode pattern and the AC booster circuit were connected by a lead wire through a hole provided in the casing to form an electrical wiring. Further, the lead wire on the primary side of the booster circuit is pulled out from the hole of the housing, and the inside and outside of the housing are held using an O-ring and an epoxy-based vacuum sealing adhesive (super back seal). An electrostatic adsorption device of the invention was obtained.
An AC control electric signal was applied from the outside to the lead wire of the electrostatic adsorption device at a voltage lower than the glow start voltage to adsorb the glass plate. As a result, the adsorptive power of the electrostatic adsorption device to the glass plate is sufficient in a normal pressure environment (1013 hPa), a reduced pressure environment (0.1 Pa), and an environment where pressure is continuously reduced from the normal pressure environment to the reduced pressure environment. Had. In addition, no discharge occurred in all the above environments.

It is typical sectional drawing of an example of the electrostatic attraction apparatus of this invention. It is typical sectional drawing of another example of the electrostatic attraction apparatus of this invention. It is a schematic diagram of an example of an electrode pattern. It is a schematic diagram of another example of an electrode pattern. It is a schematic diagram of another example of an electrode pattern. It is a schematic diagram of another example of an electrode pattern.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Insulation layer 2 1st electrode 3 2nd electrode 4 Insulating thin film 5 1st electric wiring 6 2nd electric wiring 7 1st voltage booster circuit 8 2nd voltage booster circuit 9, 10 Lead wire

Claims (5)

  An electrostatic chucking device comprising an electrostatic chucking electrode sheet, a base, a booster circuit, and electrical wiring for electrically connecting the electrostatic chucking electrode sheet and the booster circuit, the booster circuit and An electrostatic chucking device comprising an electrical wiring.   2. The electrostatic attraction apparatus according to claim 1, wherein the base is a sealing material.   2. The electrostatic attraction apparatus according to claim 1, wherein the base is a casing.   2. The electrostatic attraction apparatus according to claim 1, wherein the supply voltage on the primary side is supplied at a voltage lower than the glow start voltage.   An electrostatic adsorption device having an electrostatic adsorption electrode sheet, a base, a booster circuit, and an electrical wiring for electrically connecting the electrostatic adsorption electrode sheet and the booster circuit, wherein the booster circuit and the electrical wiring are An electrostatic adsorption device characterized by being shielded from an external atmosphere.

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