JP2007141921A - Conveying device, conveying method of electronic member, and manufacturing method of semiconductor device - Google Patents

Conveying device, conveying method of electronic member, and manufacturing method of semiconductor device Download PDF

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JP2007141921A
JP2007141921A JP2005329854A JP2005329854A JP2007141921A JP 2007141921 A JP2007141921 A JP 2007141921A JP 2005329854 A JP2005329854 A JP 2005329854A JP 2005329854 A JP2005329854 A JP 2005329854A JP 2007141921 A JP2007141921 A JP 2007141921A
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electronic member
stage
corners
semiconductor chip
suction holes
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JP4626494B2 (en
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Masanori Sato
正徳 佐藤
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Seiko Epson Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a conveying device where position precision of an electronic member can be improved when it is installed on a stage. <P>SOLUTION: The device is provided with a stage 10 on which the plate-like electronic member having a plurality of corners is placed, and a plurality of sucking holes 11 which are formed in the stage 10 and are arranged in positions corresponding to a plurality of corners. When the electronic member is a rectangular semiconductor chip 1, the sucking holes 11 are arranged in the positions corresponding to the four corners of the semiconductor chip 1. When the electronic member has a shape obtained by partially cutting the rectangular plate so that the four corners remain, the sucking holes 11 are arranged in the positions corresponding to the four corners. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、ステージ上に半導体基板等の電子部材を搬送する搬送装置、電子部材の載置方法、及び半導体装置の製造方法に関する。特に本発明は、ステージ上に載置する際の電子部材の位置精度を高くすることができる搬送装置、電子部材の載置方法、及び半導体装置の製造方法に関する。   The present invention relates to a transport device that transports an electronic member such as a semiconductor substrate onto a stage, a method for placing the electronic member, and a method for manufacturing a semiconductor device. In particular, the present invention relates to a transfer device, a method for placing an electronic member, and a method for manufacturing a semiconductor device that can increase the positional accuracy of an electronic member when placed on a stage.

図６は、従来の搬送装置が有するステージの構成を説明する為の平面図である。この搬送装置は、ステージ１１０上に電子部材１０１（例えば半導体チップ又は半導体基板）を載置する装置である。ステージ１１０には電子部材１０１を吸着するための吸着穴１１１が設けられている。吸着穴１１１は、電子部材１０１の縁と重ならないように、縁より内側に配置されている。   FIG. 6 is a plan view for explaining a configuration of a stage included in a conventional transfer apparatus. This transfer device is a device for placing an electronic member 101 (for example, a semiconductor chip or a semiconductor substrate) on a stage 110. The stage 110 is provided with a suction hole 111 for sucking the electronic member 101. The suction hole 111 is disposed inside the edge so as not to overlap the edge of the electronic member 101.

電子部材１０１は、搬送トレイ（図示せず）を用いて搬送装置のそばまで運ばれる。そして電子部材１０１は、搬送用の吸着治具（図示せず）を用いて搬送トレイから取り出されて搬送され、ステージ１１０上に載置される。ステージ１１０上に載置された電子部材１０１は、吸着穴１１１によって吸着される。   The electronic member 101 is transported to the vicinity of the transport device using a transport tray (not shown). The electronic member 101 is taken out from the transfer tray using a transfer suction jig (not shown), transferred, and placed on the stage 110. The electronic member 101 placed on the stage 110 is sucked by the suction hole 111.

電子部材１０１の搬送トレイ内での位置には、搬送時の振動等に起因したばらつきが生じる。吸着治具では電子部材１０１の位置が補正できないため、ステージ１１０上に載置された電子部材１０１の位置には、ばらつきが生じる。従来は、この位置のばらつきを機械的に修正していた（例えば特許文献１参照）。
特開平７−２１１７３３号公報（第３段落） Variations in the position of the electronic member 101 in the transport tray are caused by vibrations during transport. Since the position of the electronic member 101 cannot be corrected by the suction jig, the position of the electronic member 101 placed on the stage 110 varies. Conventionally, this variation in position has been mechanically corrected (see, for example, Patent Document 1).
Japanese Patent Laid-Open No. 7-211173 (third paragraph)

上記したように、従来はステージ上に載置された電子部材の位置のばらつきを、機械的に修正していた。このため、工程数が増加していた。また、電子部材の形状が複雑な場合、機械的に位置を修正することが困難な場合がある。
このため、ステージ上に載置する際の電子部材の位置精度を高くする必要がある。 As described above, conventionally, the variation in the position of the electronic member placed on the stage has been mechanically corrected. For this reason, the number of processes has increased. In addition, when the shape of the electronic member is complicated, it may be difficult to correct the position mechanically.
For this reason, it is necessary to increase the positional accuracy of the electronic member when placed on the stage.

本発明は上記のような事情を考慮してなされたものであり、その目的は、ステージ上に載置する際の電子部材の位置精度を高くすることができる搬送装置、電子部材の載置方法、及び半導体装置の製造方法を提供することにある。   The present invention has been made in consideration of the above-described circumstances, and an object of the present invention is to provide a transport device and a method for placing an electronic member that can increase the positional accuracy of the electronic member when placed on a stage. And a method of manufacturing a semiconductor device.

上記課題を解決するため、本発明に係る搬送装置は、複数の角部を有する板状の電子部材を載置するステージと、
前記ステージに設けられ、前記複数の角部それぞれに対応する位置に配置された複数の吸着穴とを具備する。 In order to solve the above problems, a transport apparatus according to the present invention includes a stage on which a plate-shaped electronic member having a plurality of corners is placed;
A plurality of suction holes provided on the stage and arranged at positions corresponding to the plurality of corners, respectively;

この搬送装置によれば、前記ステージ上に載置された前記電子部材にはセルフアライメント効果が生じ、前記電子部材は、前記複数の角それぞれが、対応する前記吸着穴上に位置した状態で位置決めされる。従って、前記ステージ上に載置する際の前記電子部材の位置精度が向上する。   According to this transfer apparatus, the electronic member placed on the stage has a self-alignment effect, and the electronic member is positioned in a state where each of the plurality of corners is positioned on the corresponding suction hole. Is done. Therefore, the positional accuracy of the electronic member when placed on the stage is improved.

前記電子部材が略長方形の半導体基板又は半導体チップである場合、前記吸着穴は、前記半導体基板の４つの角部それぞれに対応する位置に配置されている。前記電子部材、例えば水晶発振子が、長方形又は正方形の板を、４つの角部が残るように部分的に切り欠いた形状を有している場合、前記吸着穴は、前記４つの角部それぞれに対応する位置に配置されている。   When the electronic member is a substantially rectangular semiconductor substrate or semiconductor chip, the suction holes are disposed at positions corresponding to the four corners of the semiconductor substrate. When the electronic member, for example, the crystal oscillator has a shape in which a rectangular or square plate is partially cut out so that the four corners remain, the suction holes are respectively connected to the four corners. It is arranged at a position corresponding to.

本発明に係る搬送装置は、電子部材を載置するステージと、
前記ステージに設けられ、前記電子部材の互いに対向する端部それぞれに対応する位置に配置された複数の吸着穴とを具備する。 A transport apparatus according to the present invention includes a stage on which an electronic member is placed,
And a plurality of suction holes provided on the stage and arranged at positions corresponding to the mutually opposing ends of the electronic member.

本発明に係る電子部材の載置方法は、複数の角部を有する電子部材が載置されるステージに、前記複数の角部それぞれに対応する位置に配置された吸着穴を設けておき、
前記ステージ上に前記電子部材を載置して、かつ前記吸着穴で前記電子部材を吸着することにより、前記複数の角部それぞれを、該角部に対応する吸着穴上に位置させるものである。 In the electronic member mounting method according to the present invention, a suction hole disposed at a position corresponding to each of the plurality of corners is provided on a stage on which the electronic member having the plurality of corners is mounted,
By placing the electronic member on the stage and sucking the electronic member with the suction hole, each of the plurality of corner portions is positioned on the suction hole corresponding to the corner portion. .

本発明に係る他の電子部材の載置方法は、電子部材が載置されるステージに、前記電子部材の互いに対向する端部それぞれに対応する位置に配置された吸着穴を設けておき、
前記ステージ上に前記電子部材を載置して、かつ前記吸着穴で前記電子部材を吸着することにより、前記互いに対向する端部それぞれを、該端部に対応する吸着穴上に位置させるものである。 In another electronic member mounting method according to the present invention, a suction hole is provided on the stage on which the electronic member is mounted at positions corresponding to the mutually opposing ends of the electronic member,
By placing the electronic member on the stage and sucking the electronic member by the suction hole, each of the end portions facing each other is positioned on the suction hole corresponding to the end portion. is there.

本発明に係る他の電子部材の載置方法は、長方形の半導体基板又は半導体チップが載置されるステージに、前記半導体基板又は半導体チップの４つの角部それぞれに対応する位置に配置された吸着穴を設けておき、
前記ステージ上に前記半導体基板又は半導体チップを載置して、かつ前記吸着穴で前記半導体基板又は半導体チップを吸着することにより、前記４つの角部それぞれを該角部に対応する吸着穴上に配置させ、
その後前記半導体基板又は半導体チップを処理するものである。 According to another electronic member mounting method of the present invention, a suction is provided on a stage on which a rectangular semiconductor substrate or semiconductor chip is mounted at positions corresponding to the four corners of the semiconductor substrate or semiconductor chip. Make a hole,
By placing the semiconductor substrate or semiconductor chip on the stage and sucking the semiconductor substrate or semiconductor chip with the suction holes, each of the four corners is placed on the suction holes corresponding to the corners. Arrange,
Thereafter, the semiconductor substrate or the semiconductor chip is processed.

発明を実施するための形態BEST MODE FOR CARRYING OUT THE INVENTION

以下、図面を参照して本発明の実施形態について説明する。図１は、本発明の第１の実施形態に係る搬送装置の構成を説明する為の概略図である。本搬送装置は、半導体チップをＴＣＰ（tape carrier package）技術で実装する装置の一部である、吸着治具２０及びステージ１０を有している。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic view for explaining the configuration of a transport apparatus according to the first embodiment of the present invention. The present transport device includes a suction jig 20 and a stage 10 which are a part of a device for mounting a semiconductor chip using a TCP (tape carrier package) technology.

本搬送装置で搬送される半導体チップ１は、搬送トレイ２を用いて搬送装置のそばまで搬送される。このとき、搬送トレイ２と半導体チップ１の間には遊びがあるため、搬送トレイ２内における半導体チップ１の位置には、搬送時の振動等に起因したばらつきが生じる。   The semiconductor chip 1 transported by the transport device is transported to the side of the transport device using the transport tray 2. At this time, since there is play between the transport tray 2 and the semiconductor chip 1, the position of the semiconductor chip 1 in the transport tray 2 varies due to vibration or the like during transport.

搬送装置のそばまで搬送された半導体チップ１は、搬送装置が有する搬送用の吸着治具２０によって搬送トレイ２から取り出される。吸着治具２０には吸着穴２１が設けられている。半導体チップ１は、吸着穴２１に吸着されることにより、搬送トレイ２から取り出される。吸着治具２０に吸着された状態において、半導体チップ１の位置は、ばらついたままである。   The semiconductor chip 1 transported to the vicinity of the transport device is taken out from the transport tray 2 by the transport suction jig 20 included in the transport device. A suction hole 21 is provided in the suction jig 20. The semiconductor chip 1 is taken out from the transport tray 2 by being sucked into the suction holes 21. In the state of being sucked by the suction jig 20, the position of the semiconductor chip 1 remains varied.

その後、半導体チップ１は、吸着治具２０によってステージ１０上まで搬送され、その後吸着治具２０から離れる。これにより、半導体チップ１はステージ１０上に載置される。ステージ１０には複数の吸着穴１１が設けられている。吸着穴１１は排気手段（図示せず）に接続されている。吸着穴１１に吸着されることにより、半導体チップ１は位置決めされる。その後、半導体チップ１には実装処理が行われる。   Thereafter, the semiconductor chip 1 is transported to the stage 10 by the suction jig 20 and then leaves the suction jig 20. Thereby, the semiconductor chip 1 is placed on the stage 10. The stage 10 is provided with a plurality of suction holes 11. The suction hole 11 is connected to an exhaust means (not shown). The semiconductor chip 1 is positioned by being sucked into the suction holes 11. Thereafter, a mounting process is performed on the semiconductor chip 1.

図２は、吸着穴１１の位置を説明する為のステージ１０の平面図である。吸着穴１１は、略長方形の半導体チップ１が有する４つの角それぞれに対応する位置に設けられている。このため、半導体チップ１は、４つの角それぞれが、対応する吸着穴１１上に位置した状態で位置決めされる。   FIG. 2 is a plan view of the stage 10 for explaining the position of the suction hole 11. The suction holes 11 are provided at positions corresponding to the four corners of the substantially rectangular semiconductor chip 1. For this reason, the semiconductor chip 1 is positioned in a state where each of the four corners is positioned on the corresponding suction hole 11.

このように、本実施形態によれば、ステージ１０が有する吸着穴１１を、半導体チップ１が有する４つの角それぞれに対応する位置に配置したため、半導体チップ１にはセルフアライメント効果が生じる。このため半導体チップ１は、４つの角それぞれが、対応する吸着穴１１上に位置した状態で位置決めされる。   As described above, according to the present embodiment, the suction holes 11 of the stage 10 are arranged at positions corresponding to the four corners of the semiconductor chip 1, so that the semiconductor chip 1 has a self-alignment effect. For this reason, the semiconductor chip 1 is positioned in a state where each of the four corners is positioned on the corresponding suction hole 11.

従って、ステージ１０に載置する際の半導体チップ１の位置精度が向上し、機械的な位置修正作業を行う必要がなくなる。この効果は、半導体チップ１が小型であり、搬送トレイ２内での位置のばらつきが大きくなる場合に顕著になる。   Therefore, the positional accuracy of the semiconductor chip 1 when placed on the stage 10 is improved, and there is no need to perform a mechanical position correcting operation. This effect becomes prominent when the semiconductor chip 1 is small and the position variation in the transport tray 2 becomes large.

図３は、本発明の第２の実施形態に係る搬送装置の構成を説明する為の平面図である。本図は第１の実施形態における図２に相当する図である。本実施形態に係る搬送装置は、吸着穴１１の配置を除いて、第１の実施形態に係る搬送装置と同一の構成である。以下、第１の実施形態と同一の構成については説明を省略する。   FIG. 3 is a plan view for explaining the configuration of the transport apparatus according to the second embodiment of the present invention. This figure corresponds to FIG. 2 in the first embodiment. The transport apparatus according to the present embodiment has the same configuration as the transport apparatus according to the first embodiment except for the arrangement of the suction holes 11. Hereinafter, the description of the same configuration as that of the first embodiment is omitted.

本実施形態において半導体チップ１の幅は１ｍｍ以下である。このため、吸着穴１１は、半導体チップ１の両端部それぞれに対応した位置に、合計２つ配置されている。
本実施形態によっても、第１の実施形態と同一の効果を得ることができる。 In the present embodiment, the width of the semiconductor chip 1 is 1 mm or less. For this reason, a total of two suction holes 11 are arranged at positions corresponding to both ends of the semiconductor chip 1.
Also according to this embodiment, the same effect as that of the first embodiment can be obtained.

図４は、本発明の第３の実施形態に係る搬送装置の構成を説明する為の平面図である。本図は第１の実施形態における図２に相当する図である。本実施形態に係る搬送装置は、吸着穴１１の配置を除いて、第１の実施形態に係る搬送装置と同一の構成である。以下、第１の実施形態と同一の構成については説明を省略する。   FIG. 4 is a plan view for explaining the configuration of the transport apparatus according to the third embodiment of the present invention. This figure corresponds to FIG. 2 in the first embodiment. The transport apparatus according to the present embodiment has the same configuration as the transport apparatus according to the first embodiment except for the arrangement of the suction holes 11. Hereinafter, the description of the same configuration as that of the first embodiment is omitted.

本実施形態において吸着穴１１は、半導体チップ１の互いに対向する２つの辺（図中上下に延伸する２つの辺）それぞれに対応した位置に配置されている。
このため、本実施形態によれば、半導体チップ１の位置精度は、図中横方向において向上する。 In the present embodiment, the suction holes 11 are arranged at positions corresponding to two opposite sides of the semiconductor chip 1 (two sides extending vertically in the figure).
For this reason, according to this embodiment, the positional accuracy of the semiconductor chip 1 is improved in the horizontal direction in the figure.

図５は、本発明の第４の実施形態に係る搬送装置の構成を説明する為の平面図である。本実施形態に係る搬送装置は、半導体チップ１ではなく水晶振動子３をＴＣＰ実装する装置の一部である点、及び吸着穴１１の配置を除いて、第１の実施形態と同一の構成である。以下、第１の実施形態と同一の構成については説明を省略する。   FIG. 5 is a plan view for explaining the configuration of the transport apparatus according to the fourth embodiment of the present invention. The transport device according to the present embodiment has the same configuration as that of the first embodiment except that it is a part of a device for TCP mounting the crystal resonator 3 instead of the semiconductor chip 1 and the arrangement of the suction holes 11. is there. Hereinafter, the description of the same configuration as that of the first embodiment is omitted.

水晶振動子３は、長方形又は正方形の水晶の板を、少なくとも４つの角部が残るように切り欠いた形状を有している。詳細には、水晶振動子３は、正方形状部材３ａ，３ｂ，３ｃを有している。正方形状部材３ａは、元となった正方形の４つの角部それぞれに位置しており、正方形状部材３ｂは、元となった正方形の中心部に位置している。正方形状部材３ｃは、元となった正方形が有する互いに対向する２つの辺それぞれの中央部に位置している。   The crystal unit 3 has a shape in which a rectangular or square crystal plate is cut out so that at least four corners remain. Specifically, the crystal unit 3 includes square members 3a, 3b, and 3c. The square member 3a is located at each of the four corners of the original square, and the square member 3b is located at the center of the original square. The square-shaped member 3c is located at the center of each of two opposite sides of the original square.

４つの正方形状部材３ａは、２つのＴ字状部材３ｅで部材３ｂに接続されている。詳細には、Ｔ字状部材３ｅは、水平部分の両端それぞれに正方形状部材３ａが接続されており、垂直部分の下端に正方形状部材３ｂが接続されている。また２つの正方形状部材３ｃは、それぞれ線状部材３ｄで正方形状部材３ｂに接続されている。   The four square members 3a are connected to the member 3b by two T-shaped members 3e. Specifically, in the T-shaped member 3e, the square member 3a is connected to both ends of the horizontal portion, and the square member 3b is connected to the lower end of the vertical portion. The two square members 3c are each connected to the square member 3b by a linear member 3d.

吸着穴１１は、４つの正方形状部材３ａそれぞれに対応する位置に設けられている。
このため、本実施形態によれば、水晶振動子３が複雑な形状を有していても、第１の実施形態と同様の効果を得ることができる。 The suction holes 11 are provided at positions corresponding to the four square members 3a.
For this reason, according to this embodiment, even if the crystal unit 3 has a complicated shape, the same effect as that of the first embodiment can be obtained.

尚、本発明は上述した実施形態に限定されるものではなく、本発明の主旨を逸脱しない範囲内で種々変更して実施することが可能である。例えば第１〜第３の実施形態において、搬送装置は、半導体装置を処理する装置の一部であってもよい。この場合、搬送装置が搬送する電子部材は半導体基板となる。   Note that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention. For example, in the first to third embodiments, the transfer device may be a part of a device that processes a semiconductor device. In this case, the electronic member carried by the carrying device is a semiconductor substrate.

第１の実施形態に係る搬送装置の構成を説明する為の概略図。Schematic for demonstrating the structure of the conveying apparatus which concerns on 1st Embodiment. 吸着穴１１の位置を説明する為のステージ１０の平面図。The top view of the stage 10 for demonstrating the position of the suction hole 11. FIG. 第２の実施形態に係る搬送装置の構成を説明する為の平面図The top view for demonstrating the structure of the conveying apparatus which concerns on 2nd Embodiment. 第３の実施形態に係る搬送装置の構成を説明する為の平面図。The top view for demonstrating the structure of the conveying apparatus which concerns on 3rd Embodiment. 第４の実施形態に係る搬送装置の構成を説明する為の平面図。The top view for demonstrating the structure of the conveying apparatus which concerns on 4th Embodiment. 従来の搬送装置が有するステージの構成を説明する為の平面図。The top view for demonstrating the structure of the stage which the conventional conveying apparatus has.

符号の説明Explanation of symbols

１…半導体チップ、２…搬送トレイ、３…水晶振動子、３ａ〜３ｃ…正方形状部材、３ｄ…正方形状部材、３ｅ…Ｔ字状部材、１０，１１０…ステージ、１１，１１１…吸着穴、２０…吸着治具、２１…吸着穴、１０１…電子部材 DESCRIPTION OF SYMBOLS 1 ... Semiconductor chip, 2 ... Conveyance tray, 3 ... Crystal oscillator, 3a-3c ... Square-shaped member, 3d ... Square-shaped member, 3e ... T-shaped member, 10, 110 ... Stage, 11, 111 ... Suction hole, 20 ... Suction jig, 21 ... Suction hole, 101 ... Electronic member

Claims (8)

複数の角部を有する板状の電子部材を載置するステージと、
前記ステージに設けられ、前記複数の角部それぞれに対応する位置に配置された複数の吸着穴と、
を具備する搬送装置。 A stage on which a plate-shaped electronic member having a plurality of corners is placed;
A plurality of suction holes provided in the stage and arranged at positions corresponding to the plurality of corners;
A conveying apparatus comprising: 前記電子部材は略長方形の半導体基板又は半導体チップであり、
前記吸着穴は、前記半導体基板の４つの角部それぞれに対応する位置に配置されている請求項１に記載の搬送装置。 The electronic member is a substantially rectangular semiconductor substrate or semiconductor chip,
The transfer device according to claim 1, wherein the suction hole is disposed at a position corresponding to each of four corners of the semiconductor substrate. 前記電子部材は、長方形又は正方形の板を、４つの角部が残るように部分的に切り欠いた形状を有しており、
前記吸着穴は、前記４つの角部それぞれに対応する位置に配置されている請求項１に記載の搬送装置。 The electronic member has a shape in which a rectangular or square plate is partially cut out so that four corners remain,
The conveying device according to claim 1, wherein the suction hole is disposed at a position corresponding to each of the four corners. 前記電子部材は水晶発振子である請求項１又は３に記載の搬送装置。   The transport apparatus according to claim 1, wherein the electronic member is a crystal oscillator. 電子部材を載置するステージと、
前記ステージに設けられ、前記電子部材の互いに対向する端部それぞれに対応する位置に配置された複数の吸着穴と、
を具備する搬送装置。 A stage on which an electronic member is placed;
A plurality of suction holes provided on the stage and arranged at positions corresponding to the mutually opposing ends of the electronic member;
A conveying apparatus comprising: 複数の角部を有する電子部材が載置されるステージに、前記複数の角部それぞれに対応する位置に配置された吸着穴を設けておき、
前記ステージ上に前記電子部材を載置して、かつ前記吸着穴で前記電子部材を吸着することにより、前記複数の角部それぞれを、該角部に対応する吸着穴上に位置させる電子部材の載置方法。 A stage on which an electronic member having a plurality of corners is placed has suction holes arranged at positions corresponding to the plurality of corners,
An electronic member that places each of the plurality of corners on a suction hole corresponding to the corner by placing the electronic member on the stage and sucking the electronic member by the suction hole. Placement method. 電子部材が載置されるステージに、前記電子部材の互いに対向する端部それぞれに対応する位置に配置された吸着穴を設けておき、
前記ステージ上に前記電子部材を載置して、かつ前記吸着穴で前記電子部材を吸着することにより、前記互いに対向する端部それぞれを、該端部に対応する吸着穴上に位置させる電子部材の載置方法。 The stage on which the electronic member is placed has suction holes arranged at positions corresponding to the opposite ends of the electronic member,
An electronic member that places the electronic members on the stage and that adsorbs the electronic members through the suction holes, thereby positioning the opposing ends on the suction holes corresponding to the ends. Mounting method. 長方形の半導体基板又は半導体チップが載置されるステージに、前記半導体基板又は半導体チップの４つの角部それぞれに対応する位置に配置された吸着穴を設けておき、
前記ステージ上に前記半導体基板又は半導体チップを載置して、かつ前記吸着穴で前記半導体基板又は半導体チップを吸着することにより、前記４つの角部それぞれを該角部に対応する吸着穴上に配置させ、
その後前記半導体基板又は半導体チップを処理する、半導体装置の製造方法。
On the stage on which the rectangular semiconductor substrate or semiconductor chip is placed, suction holes arranged at positions corresponding to the four corners of the semiconductor substrate or semiconductor chip are provided,
By placing the semiconductor substrate or semiconductor chip on the stage and sucking the semiconductor substrate or semiconductor chip with the suction holes, each of the four corners is placed on the suction holes corresponding to the corners. Arrange,
A method for manufacturing a semiconductor device, wherein the semiconductor substrate or the semiconductor chip is then processed.
JP2005329854A 2005-11-15 2005-11-15 Electronic member placement method Expired - Fee Related JP4626494B2 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06260409A (en) * 1993-03-03 1994-09-16 Dainippon Screen Mfg Co Ltd Heat-treating device
JP2000286185A (en) * 1999-03-31 2000-10-13 Nec Kansai Ltd Spin chuck
JP2001242631A (en) * 2000-02-28 2001-09-07 Marugo Giken:Kk Exposure device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06260409A (en) * 1993-03-03 1994-09-16 Dainippon Screen Mfg Co Ltd Heat-treating device
JP2000286185A (en) * 1999-03-31 2000-10-13 Nec Kansai Ltd Spin chuck
JP2001242631A (en) * 2000-02-28 2001-09-07 Marugo Giken:Kk Exposure device

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