JP2007141821A - 半導体装置およびその作製方法 - Google Patents

半導体装置およびその作製方法 Download PDF

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Publication number
JP2007141821A
JP2007141821A JP2006281161A JP2006281161A JP2007141821A JP 2007141821 A JP2007141821 A JP 2007141821A JP 2006281161 A JP2006281161 A JP 2006281161A JP 2006281161 A JP2006281161 A JP 2006281161A JP 2007141821 A JP2007141821 A JP 2007141821A
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Prior art keywords
light
electrode
substrate
partition wall
film
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JP2006281161A
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Japanese (ja)
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JP2007141821A5 (https=
Inventor
Hideaki Kuwabara
秀明 桑原
Hideto Onuma
英人 大沼
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Priority to JP2006281161A priority Critical patent/JP2007141821A/ja
Publication of JP2007141821A publication Critical patent/JP2007141821A/ja
Publication of JP2007141821A5 publication Critical patent/JP2007141821A5/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
JP2006281161A 2005-10-17 2006-10-16 半導体装置およびその作製方法 Withdrawn JP2007141821A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006281161A JP2007141821A (ja) 2005-10-17 2006-10-16 半導体装置およびその作製方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005302315 2005-10-17
JP2006281161A JP2007141821A (ja) 2005-10-17 2006-10-16 半導体装置およびその作製方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011184321A Division JP2011233545A (ja) 2005-10-17 2011-08-26 発光装置及び電子機器

Publications (2)

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JP2007141821A true JP2007141821A (ja) 2007-06-07
JP2007141821A5 JP2007141821A5 (https=) 2009-12-03

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JP2006281161A Withdrawn JP2007141821A (ja) 2005-10-17 2006-10-16 半導体装置およびその作製方法

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JP (1) JP2007141821A (https=)

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008004382A (ja) * 2006-06-22 2008-01-10 Rohm Co Ltd 有機ｅｌディスプレイ
JP2008300087A (ja) * 2007-05-30 2008-12-11 Nippon Seiki Co Ltd 有機ｅｌパネル
WO2009119815A1 (ja) * 2008-03-28 2009-10-01 富士電機ホールディングス株式会社 色変換フィルタ
EP2193546A1 (en) * 2007-09-25 2010-06-09 E. I. du Pont de Nemours and Company Backplane structures for solution processed electronic devices
JP2011034884A (ja) * 2009-08-04 2011-02-17 Toshiba Mobile Display Co Ltd 有機ｅｌ装置
JP2011249301A (ja) * 2010-05-28 2011-12-08 Samsung Mobile Display Co Ltd 有機発光表示装置およびその製造方法
WO2012053402A1 (ja) * 2010-10-19 2012-04-26 シャープ株式会社 蒸着装置、蒸着方法、並びに、有機エレクトロルミネッセンス表示装置の製造方法
KR20140017435A (ko) 2012-08-01 2014-02-11 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
US9087964B2 (en) 2012-10-17 2015-07-21 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device
US9093404B2 (en) 2012-12-21 2015-07-28 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device and method for manufacturing the same
US9209355B2 (en) 2013-03-08 2015-12-08 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device
US9231042B2 (en) 2013-02-12 2016-01-05 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device
WO2016129114A1 (ja) * 2015-02-13 2016-08-18 パイオニア株式会社 発光装置及び発光装置の製造方法
JP2016213483A (ja) * 2010-09-10 2016-12-15 株式会社半導体エネルギー研究所 半導体装置
US9728693B2 (en) 2012-10-17 2017-08-08 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device comprising partition including overhang portion
KR101781090B1 (ko) * 2010-09-20 2017-09-25 엘지디스플레이 주식회사 유기전계발광표시장치 및 그 제조방법
JP2018129306A (ja) * 2010-06-25 2018-08-16 株式会社半導体エネルギー研究所 半導体装置
WO2019244350A1 (ja) * 2018-06-22 2019-12-26 シャープ株式会社 表示装置及びその製造方法
WO2020039555A1 (ja) * 2018-08-23 2020-02-27 シャープ株式会社 表示装置
CN113379290A (zh) * 2021-06-24 2021-09-10 东风柳州汽车有限公司 零件分工路线的生成方法、装置、设备及存储介质
JP2021185423A (ja) * 2013-07-10 2021-12-09 株式会社半導体エネルギー研究所 表示装置
CN114975743A (zh) * 2021-02-22 2022-08-30 欣兴电子股份有限公司 发光二极管封装结构及其制作方法与显示装置的制作方法
JP2024023508A (ja) * 2004-09-29 2024-02-21 株式会社半導体エネルギー研究所 表示装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000195675A (ja) * 1998-12-24 2000-07-14 Toppan Printing Co Ltd 有機エレクトロルミネッセンス表示素子用基板および有機エレクトロルミネッセンス表示素子
JP2002324666A (ja) * 2001-02-22 2002-11-08 Semiconductor Energy Lab Co Ltd 表示装置及びその作製方法
JP2003317971A (ja) * 2002-04-26 2003-11-07 Semiconductor Energy Lab Co Ltd 発光装置およびその作製方法
JP2004165067A (ja) * 2002-11-14 2004-06-10 Sanyo Electric Co Ltd 有機電界発光パネル
JP2005322564A (ja) * 2004-05-11 2005-11-17 Sony Corp 表示装置の製造方法および表示装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000195675A (ja) * 1998-12-24 2000-07-14 Toppan Printing Co Ltd 有機エレクトロルミネッセンス表示素子用基板および有機エレクトロルミネッセンス表示素子
JP2002324666A (ja) * 2001-02-22 2002-11-08 Semiconductor Energy Lab Co Ltd 表示装置及びその作製方法
JP2003317971A (ja) * 2002-04-26 2003-11-07 Semiconductor Energy Lab Co Ltd 発光装置およびその作製方法
JP2004165067A (ja) * 2002-11-14 2004-06-10 Sanyo Electric Co Ltd 有機電界発光パネル
JP2005322564A (ja) * 2004-05-11 2005-11-17 Sony Corp 表示装置の製造方法および表示装置

Cited By (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024023508A (ja) * 2004-09-29 2024-02-21 株式会社半導体エネルギー研究所 表示装置
JP2008004382A (ja) * 2006-06-22 2008-01-10 Rohm Co Ltd 有機ｅｌディスプレイ
JP2008300087A (ja) * 2007-05-30 2008-12-11 Nippon Seiki Co Ltd 有機ｅｌパネル
EP2193546A1 (en) * 2007-09-25 2010-06-09 E. I. du Pont de Nemours and Company Backplane structures for solution processed electronic devices
JP2011504278A (ja) * 2007-09-25 2011-02-03 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 溶液処理された電子デバイス用のバックプレーン構造体
WO2009119815A1 (ja) * 2008-03-28 2009-10-01 富士電機ホールディングス株式会社 色変換フィルタ
JP2011034884A (ja) * 2009-08-04 2011-02-17 Toshiba Mobile Display Co Ltd 有機ｅｌ装置
JP2011249301A (ja) * 2010-05-28 2011-12-08 Samsung Mobile Display Co Ltd 有機発光表示装置およびその製造方法
US8795018B2 (en) 2010-05-28 2014-08-05 Samsung Display Co., Ltd. Organic light emitting diode display and method for manufacturing the same
KR102079684B1 (ko) 2010-06-25 2020-02-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치의 제작 방법
KR20190104981A (ko) * 2010-06-25 2019-09-11 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치의 제작 방법
JP2019033087A (ja) * 2010-06-25 2019-02-28 株式会社半導体エネルギー研究所 半導体装置
JP2018129306A (ja) * 2010-06-25 2018-08-16 株式会社半導体エネルギー研究所 半導体装置
JP2016213483A (ja) * 2010-09-10 2016-12-15 株式会社半導体エネルギー研究所 半導体装置
KR101781090B1 (ko) * 2010-09-20 2017-09-25 엘지디스플레이 주식회사 유기전계발광표시장치 및 그 제조방법
JP5298244B2 (ja) * 2010-10-19 2013-09-25 シャープ株式会社 蒸着装置
WO2012053402A1 (ja) * 2010-10-19 2012-04-26 シャープ株式会社 蒸着装置、蒸着方法、並びに、有機エレクトロルミネッセンス表示装置の製造方法
JP2013239441A (ja) * 2010-10-19 2013-11-28 Sharp Corp 蒸着装置、蒸着方法、並びに、有機エレクトロルミネッセンス表示装置の製造方法
US9741932B2 (en) 2010-10-19 2017-08-22 Sharp Kabushiki Kaisha Vapor deposition method and method for producing an organic electroluminescence display device
US8981638B2 (en) 2012-08-01 2015-03-17 Semiconductor Energy Laboratory Co., Ltd. Display device including a partition having a stacked structure
US9356082B2 (en) 2012-08-01 2016-05-31 Semiconductor Energy Laboratory Co., Ltd. Display device
KR20140017435A (ko) 2012-08-01 2014-02-11 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
US9728693B2 (en) 2012-10-17 2017-08-08 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device comprising partition including overhang portion
US9087964B2 (en) 2012-10-17 2015-07-21 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device
US9093404B2 (en) 2012-12-21 2015-07-28 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device and method for manufacturing the same
US9231042B2 (en) 2013-02-12 2016-01-05 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device
US9209355B2 (en) 2013-03-08 2015-12-08 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device
JP2021185423A (ja) * 2013-07-10 2021-12-09 株式会社半導体エネルギー研究所 表示装置
US11869453B2 (en) 2013-07-10 2024-01-09 Semiconductor Energy Laboratory Co., Ltd. Display device comprising semiconductor layer having LDD regions
WO2016129114A1 (ja) * 2015-02-13 2016-08-18 パイオニア株式会社 発光装置及び発光装置の製造方法
WO2019244350A1 (ja) * 2018-06-22 2019-12-26 シャープ株式会社 表示装置及びその製造方法
WO2020039555A1 (ja) * 2018-08-23 2020-02-27 シャープ株式会社 表示装置
CN114975743A (zh) * 2021-02-22 2022-08-30 欣兴电子股份有限公司 发光二极管封装结构及其制作方法与显示装置的制作方法
CN114975743B (zh) * 2021-02-22 2025-01-28 欣兴电子股份有限公司 发光二极管封装结构及其制作方法与显示装置的制作方法
CN113379290A (zh) * 2021-06-24 2021-09-10 东风柳州汽车有限公司 零件分工路线的生成方法、装置、设备及存储介质

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