JP2007134600A - Device and method for processing substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device and a method for processing a substrate capable of preventing a processing failure of a substrate and of processing the substrate with the use of a functional water. <P>SOLUTION: Cleaning processing parts 5a to 5d are connected to a functional water producing part 410. A control part 4 includes a CPU 701 and a memory 702. An operation panel 710 is connected to the CPU 701. Operating the operation panel 710 by an operator sets a processing recipe to the CPU 701. The CPU 701 of the control part 4 controls the degree of an opening of a resistance control valve and a gaseous adjusting valve of the part 410 on the basis of the processing recipe. Adjusting the degree of the opening of the resistance control valve and the gaseous adjusting valve can adjust the concentration of a carbonated water produced by the part 410. The carbonated water produced by the part 410 is introduced to each of the parts 5a to 5d through a supply-pipe 74 for a rinse processing. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus and a substrate processing method for performing predetermined processing on a substrate.

  In order to perform various processes on various substrates such as a semiconductor substrate, a liquid crystal display substrate, a plasma display substrate, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, and a photomask substrate, It is used.

  In the substrate processing apparatus, a chemical solution is used to remove contaminants such as particles or organic substances adhering to the surface of the substrate. Thereafter, a rinsing process using pure water is performed to wash away the chemical solution on the substrate.

  However, when the rinse treatment is performed using pure water after the contaminant removal process is performed using the alkaline chemical solution, the alkaline chemical solution is diluted with pure water and is weakly alkaline (approximately ph9 to ph10). ) Is produced. When this weakly alkaline liquid is present on the substrate for a relatively long time, a phenomenon occurs in which a metal film such as aluminum formed on the substrate is damaged. Such a phenomenon is called a pH shock.

  Therefore, Patent Document 1 proposes to use carbonated water as the rinse liquid.

In this case, after the reaction product generated on the surface of the substrate is removed using an alkaline removal liquid, a rinse liquid made of carbonated water is supplied. Thereby, the alkaline component in the removal liquid is transferred to the neutral or acidic region in a short time by the acidic carbonated water, and the metal film on the substrate is prevented from being damaged by the pH shock in the weakly alkaline region. In addition, the generation of static electricity can be prevented as compared with the case where pure water is used as the rinse liquid, and the substrate can be prevented from being charged.
JP 2002-359224 A

  Here, when carbonated water is used as the rinsing liquid as described above, it is preferable that the concentration of carbonated water is high in order to more reliably prevent pH shock. This is because it can pass through the weakly alkaline region in a shorter time. However, if the carbonated water having a high concentration is continuously supplied to the substrate, the metal film on the substrate may be oxidized by the acid of the carbonated water having a high concentration. As a result, processing defects may occur on the substrate.

  An object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of processing a substrate using functional water while preventing a substrate processing failure.

  (1) A substrate processing apparatus according to a first aspect of the present invention is a functional water generating unit that generates functional water and a functional water that performs a predetermined process on the substrate and supplies the functional water generated by the functional water generating unit to the substrate A processing unit having a supply unit, a storage unit that stores a processing recipe that defines the operation procedure and operating conditions of the substrate including the concentration setting value of functional water, and a concentration setting value included in the processing recipe stored in the storage unit And a concentration adjusting means for adjusting the concentration of the functional water generated by the functional water generating means.

  In the substrate processing apparatus according to the first aspect of the invention, a processing recipe in which the operation procedure and operation conditions of the substrate including the functional water concentration set value is defined is stored in the storage means. The concentration of the functional water generated by the functional water generating unit is adjusted by the concentration adjusting unit based on the concentration setting value included in the processing recipe stored in the storage unit. The functional water generated by the functional water generating means is supplied to the substrate by the functional water supply means in the processing unit.

  In this case, since the functional water concentration is set in the processing recipe corresponding to the processing unit, it is possible to easily change the functional water concentration when changing the operation procedure or the operation condition of the processing unit.

  Moreover, since the density | concentration of the functional water supplied to a board | substrate can be adjusted to an optimal density | concentration based on a process recipe, the board | substrate process using a functional water can be performed, preventing the process defect of a board | substrate. .

  (2) The processing unit further includes a chemical solution supply unit that supplies the chemical solution to the substrate. After the chemical solution is supplied by the chemical solution supply unit, the functional water supply unit supplies the functional water generated by the functional water generation unit to the substrate. Also good.

  In this case, the concentration of the functional water can be set in the processing recipe according to the characteristics of the chemical liquid supplied from the chemical liquid supply means to the substrate. Thereby, the density | concentration of the functional water supplied from a functional water supply means can be adjusted according to the characteristic of a chemical | medical solution. As a result, the substrate treatment using the functional water can be performed while preventing the substrate from being damaged by the chemical solution or the functional water.

  (3) The functional water generating means includes a pure water supply system for supplying pure water, a gas supply system for supplying gas, pure water supplied from the pure water supply system, and gas supplied from the gas supply system. Mixing means for generating functional water by mixing, and the concentration adjusting means includes a supply amount of pure water from the pure water supply system to the mixing means and a supply amount of gas from the gas supply system to the mixing means. The concentration of the functional water may be adjusted by controlling at least one of the above.

  In this case, in the functional water generation means, the pure water supplied from the pure water supply system and the gas supplied from the gas supply system are mixed by the mixing means to generate functional water.

  The concentration of the functional water is such that at least one of the supply amount of pure water from the pure water supply system to the mixing means and the supply amount of gas from the gas supply system to the mixing means is controlled by the concentration adjusting means. Adjusted. That is, the concentration of functional water is adjusted by controlling only the supply amount of pure water, only the supply amount of gas, or both the supply amount of pure water and the supply amount of gas. Thereby, the density | concentration of functional water can be adjusted with a simple structure.

  (4) The mixing means may comprise a hollow fiber membrane module. In this case, functional water having a stable concentration can be generated with a simple configuration.

  (5) The functional water may be carbonated water containing carbon dioxide. In this case, carbonated water has an oxidizing action and conductivity. Thereby, since the density | concentration of carbonated water can be adjusted appropriately, the oxidation of the board | substrate by the acid in carbonated water can be adjusted appropriately. As a result, it is possible to prevent the substrate from being damaged by the functional water.

  (6) The processing unit further includes an alkali supply means for supplying an alkaline liquid to the substrate, and after supplying the alkaline liquid by the alkali supply means, the functional water supply means generates the functional water generated by the functional water generation means. The concentration adjusting means supplies the functional water so that the concentration at the end of the carbonated water supply by the functional water supply means is lower than the concentration at the start of carbonated water supply by the functional water supply means. You may adjust the density.

  In this case, after an alkaline liquid (for example, a cleaning solution containing ammonia hydrogen peroxide solution or a polymer removing solution containing organic alkali) is supplied to the substrate in advance, a high concentration carbonated water is first added to suppress pH shock. Supplied on the substrate. Thereafter, in order to suppress oxidation of the metal film, the concentration of carbonated water supplied on the substrate is adjusted to be low. Thereby, both suppression of corrosion of the metal film due to pH shock and suppression of oxidation of the metal film due to the acid in the carbonated water can be realized at the same time. As a result, it is possible to reliably prevent the metal film on the substrate from being damaged by the alkaline liquid and the functional water.

  (7) The functional water may be ozone water containing ozone. In this case, ozone water has a strong oxidizing power. Thereby, organic contaminants attached to the substrate can be removed.

  In addition, since the concentration of ozone water supplied to the substrate can be adjusted appropriately, organic contaminants attached to the substrate can be removed while preventing the substrate from being oxidized by oxygen radicals in the ozone water.

  (8) The concentration adjusting means adjusts the concentration of the functional water so that the concentration at the end of the supply of ozone water by the functional water supply means is lower than the concentration at the start of the supply of ozone water by the functional water supply means. May be.

  In this case, first, after removing organic contaminants attached to the substrate with high-concentration ozone water, the oxidation of the metal film due to oxygen radicals can be suppressed with low-concentration ozone water. Therefore, both good organic substance removal and suppression of oxidation of the metal film can be realized simultaneously.

  (9) The functional water may be hydrogen water containing hydrogen. In this case, it is possible to obtain the effects of preventing the reattachment of the removed contaminants to the substrate, removing the natural oxide film on the substrate, preventing the oxidation of the substrate, and preventing the formation of a watermark (water droplet trace) on the substrate. it can.

  (10) A substrate processing method according to a second aspect of the present invention includes a storage step for storing a processing recipe for defining a processing procedure and processing conditions for a substrate including a concentration setting value for functional water, and a processing recipe stored in the storage step. A functional water generating step for generating functional water whose concentration is adjusted based on the concentration setting value included, and a functional water supplying step for supplying the functional water generated in the functional water generating step to the substrate are provided.

  In the substrate processing method according to the second aspect of the present invention, a processing recipe in which the operation procedure and operation conditions of the substrate including the functional water concentration set value is stored. Functional water whose concentration is adjusted based on the concentration setting value included in the stored processing recipe is generated, and this functional water is supplied to the substrate to process the substrate.

  In this case, since the functional water concentration is set in the processing recipe corresponding to the processing unit, it is possible to easily change the functional water concentration when changing the operation procedure or the operation condition of the processing unit.

  Moreover, since the density | concentration of the functional water supplied to a board | substrate can be adjusted to an optimal density | concentration based on a process recipe, the board | substrate process using a functional water can be performed, preventing the process defect of a board | substrate. .

  According to the present invention, since the functional water concentration is set in the processing recipe corresponding to the processing unit, it is possible to easily change the functional water concentration when changing the operation procedure or operating condition of the processing unit.

  Moreover, since the density | concentration of the functional water supplied to a board | substrate can be adjusted to an optimal density | concentration based on a process recipe, the board | substrate process using a functional water can be performed, preventing the process defect of a board | substrate. .

  Hereinafter, a substrate processing apparatus according to an embodiment of the present invention will be described with reference to the drawings.

  In the following description, a substrate refers to a semiconductor wafer, a glass substrate for a liquid crystal display device, a glass substrate for a PDP (plasma display panel), a glass substrate for a photomask, a substrate for an optical disk, and the like.

  Functional water refers to water having a predetermined function such as oxidation and reduction, and includes, for example, carbonated water, ozone water, hydrogen water (reduced water), electrolytic ion water, magnetic water, and the like.

(1) Configuration of Substrate Processing Apparatus FIG. 1 is a plan view of a substrate processing apparatus according to an embodiment of the present invention. As shown in FIG. 1, the substrate processing apparatus 100 has processing areas A and B, and a transfer area C between the processing areas A and B.

  In the processing area A, a control unit 4, fluid box units 2a and 2b, and cleaning processing units 5a and 5b are arranged.

  1 are pipes, joints, valves, and flow meters for supplying chemical liquids and rinse liquids to the cleaning processing units 5a and 5b and for disposal (drainage) from the cleaning processing units 5a and 5b, respectively. Storing fluid related equipment such as regulators. The associated fluid-related devices such as a pump, a temperature controller, and a processing liquid storage tank are accommodated in a chemical liquid cabinet (not shown) provided at a position adjacent to the substrate processing apparatus 100.

  In the cleaning processing units 5a and 5b, a cleaning process using a chemical solution (hereinafter referred to as a chemical process) and a cleaning process using a rinse liquid (hereinafter referred to as a rinse process) are performed.

  In the processing region B, fluid box portions 2c and 2d and cleaning processing portions 5c and 5d are arranged. Each of the fluid box portions 2c and 2d and the cleaning processing portions 5c and 5d has the same configuration as the fluid box portions 2a and 2b and the cleaning processing portions 5a and 5b. In addition, the cleaning processing units 5c and 5d perform a chemical solution process and a rinsing process on the substrate W in the same manner as the cleaning processing units 5a and 5b. In the present embodiment, in the cleaning treatment units 5a to 5d, an alkaline chemical solution is used, and carbonated water of functional water is used as the rinse solution.

  Hereinafter, the cleaning processing units 5a, 5b, 5c, and 5d are collectively referred to as processing units. In the transfer area C, a substrate transfer robot CR is provided.

  An indexer ID for carrying in and out the substrate W is arranged on one end side of the processing areas A and B, and the indexer robot IR is provided inside the indexer ID. The carrier 1 that stores the substrate W is placed on the indexer ID.

  The indexer robot IR with the indexer ID moves in the direction of the arrow U, takes out the substrate W from the carrier 1 and passes it to the substrate transport robot CR, and conversely receives the substrate W subjected to a series of processing from the substrate transport robot CR. Return to carrier 1.

  The substrate transfer robot CR transfers the substrate W delivered from the indexer robot IR to the designated processing unit, or transfers the substrate W received from the processing unit to another processing unit or the indexer robot IR.

  In the present embodiment, after the chemical processing and the rinsing processing are performed on the substrate W in any of the cleaning processing units 5a to 5d, the substrate W is unloaded from the cleaning processing units 5a to 5d by the substrate transport robot CR, and the indexer It is carried into the carrier 1 via the robot IR.

  The control unit 4 includes a computer including a CPU (Central Processing Unit) and the like. The operation of each processing unit in the processing areas A and B, the operation of the substrate transfer robot CR in the transfer area C, and the operation of the indexer robot IR of the indexer ID. To control. On the side wall of the control unit 4, an operation panel 710 is provided for an operator to set a processing recipe that defines the operation procedure and operation conditions of the substrate processing apparatus 100. Details will be described later.

  Moreover, in the substrate processing apparatus 100, the functional water generating part 410 is provided so as to be adjacent to the indexer ID. A chemical supply source 310 is provided so as to be adjacent to one end side of the processing areas A and B.

(2) Configuration of Cleaning Processing Unit FIG. 2 is a view for explaining the configuration of the cleaning processing units 5a to 5d of the substrate processing apparatus 100 according to the embodiment of the present invention.

  As shown in FIG. 2, the cleaning processing units 5 a to 5 d include a spin chuck 21 for holding the substrate W horizontally and rotating the substrate W around a vertical rotation axis passing through the center of the substrate W.

  The spin chuck 21 is fixed to the upper end of the rotation shaft 25 rotated by the chuck rotation drive mechanism 36. The spin chuck 21 is formed with an intake path (not shown). By exhausting the intake path with the substrate W placed on the spin chuck 21, the lower surface of the substrate W is placed on the lower surface of the spin chuck 21. The substrate W can be held in a horizontal posture.

  A motor 60 is provided outside the spin chuck 21. A rotation shaft 61 is connected to the motor 60. An arm 62 is connected to the rotation shaft 61 so as to extend in the horizontal direction, and a chemical solution processing nozzle 50 is provided at the tip of the arm 62.

  The rotation shaft 61 is rotated by the motor 60 and the arm 62 is rotated, so that the chemical processing nozzle 50 moves between the upper side and the outer side of the substrate W held by the spin chuck 21.

  A chemical treatment supply pipe 63 is provided so as to pass through the motor 60, the rotation shaft 61 and the arm 62. The chemical treatment supply pipe 63 is connected to a chemical supply source 310. An open / close valve 65 is inserted in the chemical liquid supply pipe 63.

  A chemical solution is supplied from the chemical solution supply source 310 through the chemical solution supply pipe 63 to the chemical solution processing nozzles 50 of the cleaning processing units 5a to 5d. Thereby, the chemical solution can be supplied to the surface of the substrate W.

  A motor 71 is provided outside the spin chuck 21. A rotation shaft 72 is connected to the motor 71. In addition, an arm 73 is connected to the rotation shaft 72 so as to extend in the horizontal direction, and a rinse processing nozzle 70 is provided at the tip of the arm 73.

  The rotation shaft 72 is rotated by the motor 71 and the arm 73 is rotated, so that the rinsing nozzle 70 moves above the substrate W held by the spin chuck 21.

  A rinse treatment supply pipe 74 is provided so as to pass through the motor 71, the rotation shaft 72, and the arm 73. The rinse treatment supply pipe 74 is connected to the functional water generator 410. An opening / closing valve 75 is inserted in the rinsing treatment supply pipe 74.

  The rinse liquid is supplied from the functional water generator 410 through the rinse treatment supply pipe 74 to the rinse treatment nozzles 70 of the cleaning treatment units 5a to 5d. Thereby, the rinse liquid can be supplied to the surface of the substrate W.

  When supplying the chemical solution onto the substrate W, the chemical processing nozzle 50 moves to a processing position above the center of the substrate, and when supplying the rinse liquid to the surface of the substrate W, the chemical processing nozzle 50 is attached to the outside of the spin chuck 21. Is evacuated to the standby position.

  Further, the rinsing nozzle 70 is retracted to a standby position outside the spin chuck 21 when supplying the chemical liquid onto the substrate W, and when supplying the rinsing liquid onto the substrate W, the rinsing processing nozzle 70 is retracted. Move to the processing position above the center.

  The substrate W held on the spin chuck 21 is accommodated in the processing cup 23. A cylindrical partition wall 33 is provided inside the processing cup 23. Further, a drainage space 31 for draining the processing liquid used for processing the substrate W is formed so as to surround the periphery of the spin chuck 21. Furthermore, a circulating liquid space 32 for collecting the processing liquid used for processing the substrate W is formed between the processing cup 23 and the partition wall 33 so as to surround the drainage space 31.

  A waste pipe 34 is connected to the drainage space 31 to guide the processing liquid to a disposal device (not shown). A recovery pipe 35 for guiding the processing liquid to the chemical liquid supply source 310 is connected to the circulating liquid space 32.

  A guard 24 for preventing the processing liquid from the substrate W from splashing outward is provided above the processing cup 23. The guard 24 has a rotationally symmetric shape with respect to the rotation shaft 25. On the inner surface of the upper end of the guard 24, a drainage guide groove 41 having a square cross section is formed in an annular shape.

  Further, a recovery liquid guide portion 42 having an inclined surface that is inclined outward and downward is formed on the inner surface of the lower end portion of the guard 24. A partition wall storage groove 43 for receiving the partition wall 33 of the processing cup 23 is formed in the vicinity of the upper end of the recovered liquid guide portion 42.

  The guard 24 is provided with a guard raising / lowering drive mechanism (not shown) constituted by a ball screw mechanism or the like. The guard raising / lowering drive mechanism includes a guard 24, a recovery position where the recovery liquid guide 42 is opposed to the outer peripheral end surface of the substrate W held by the spin chuck 21, and the substrate W where the drainage guide groove 41 is held by the spin chuck 21. The liquid is moved up and down with respect to the drainage position facing the outer peripheral end face. When the guard 24 is in the recovery position, the processing liquid splashed outward from the substrate W is guided to the circulating liquid space 32 by the recovery liquid guide 42 and returned to the chemical supply source 310 through the recovery pipe 35.

  In the present embodiment, the chemical liquid used for the chemical liquid treatment is returned to the chemical liquid supply source 310 through the recovery pipe 35 and reused. Therefore, the manufacturing cost of the substrate W can be reduced by reusing a chemical liquid that is more expensive than the rinsing liquid. On the other hand, when the guard 24 is at the drainage position, the processing liquid splashed outward from the substrate W is guided to the drainage space 31 by the drainage guide groove 41 and drained through the waste pipe 34. With the above configuration, the processing liquid is drained and collected.

(3) Operation of Cleaning Processing Unit Next, the operation of the cleaning processing units 5a to 5d will be described with reference to FIG. In addition, operation | movement of each component of the cleaning process parts 5a-5d demonstrated below is controlled by the control part 4 shown in FIG.

  First, when the substrate W is carried in, the guard 24 is lowered and the substrate transport robot CR places the substrate W on the spin chuck 21. The substrate W placed on the spin chuck 21 is attracted and held by the spin chuck 21.

  Next, the guard 24 moves up to the recovery position described above, and the chemical solution processing nozzle 50 moves from the standby position to a processing position above the center of the substrate W. Thereafter, the rotating shaft 25 rotates, and the substrate W held on the spin chuck 21 rotates with this rotation. Thereafter, the chemical liquid is discharged from the chemical liquid processing nozzle 50 onto the upper surface of the substrate W. Thereby, the chemical | medical solution process of the board | substrate W is performed. After the chemical liquid processing of the substrate W is completed, the chemical liquid processing nozzle 50 moves to the standby position.

  Next, the guard 24 is raised to the above-described waste liquid position, and the rinse processing nozzle 70 is moved above the center of the substrate W. Next, a rinse liquid is discharged from the rinse processing nozzle 70. Thereby, the chemical solution on the substrate W is washed away.

  Next, the supply of the rinsing liquid is stopped, and the rotational speed of the rotary shaft 25 is increased. Thereby, a large centrifugal force acts on the rinse liquid on the substrate W, and the rinse liquid is removed from the substrate W.

  Next, the rinse processing nozzle 70 is retracted to a predetermined position, and the rotation of the rotary shaft 25 is stopped. Thereafter, the guard 24 is lowered and the substrate transport robot CR in FIG. 1 carries the substrate W out of the cleaning processing units 5a to 5d. Thereby, the processing operation in the cleaning processing units 5a to 5d is completed.

  Note that the position of the guard 24 during the chemical treatment and the rinsing treatment of the substrate W may be changed as appropriate according to the necessity of collecting the treatment liquid or waste liquid.

(4) Details of Functional Water Generation Unit Generally, when the substrate W is rinsed with pure water after the substrate W is chemically treated with an alkaline chemical, the alkaline chemical is It is diluted with pure water to produce a mixed solution in a weakly alkaline region (approximately ph9 to ph10). As a result, a pH shock occurs in which a metal film such as aluminum on the substrate W is damaged.

  In addition, when the rinsing process of the substrate W is performed with pure water, the metal film on the substrate W may be damaged when the substrate W is charged.

Therefore, in the present embodiment, carbonated water (CO ₂ water) is used as the rinse liquid. Carbonated water is one of functional waters and has an oxidizing action and conductivity. By using carbonated water as the rinsing liquid, it is possible to prevent pH shock and charging of the substrate W. Carbonated water is generated in the functional water generator 410.

  FIG. 3 is a diagram for explaining a configuration example of the functional water generation unit 410.

  As shown in FIG. 3, the functional water generation unit 410 includes a gas-liquid mixing module 200. As the gas-liquid mixing module 200, for example, a hollow fiber membrane module having a structure in which a plurality of hollow fiber membranes having gas permeability is bundled is used. A liquid inlet 200 a of the gas-liquid mixing module 200 is connected to a rinsing treatment supply pipe 74 via a pipe 201. A resistance control valve 203 is inserted in the pipe 201. Furthermore, a drain pipe 200c for discharging the liquid in the gas-liquid mixing module 200 when the gas-liquid mixing module 200 is exchanged is connected to the bottom of the gas-liquid mixing module 200. A drain valve 200d is inserted in the middle of 200c.

A carbon dioxide supply pipe 204 is connected to the gas inlet 200 b of the gas-liquid mixing module 200. A gas adjustment valve 205 is inserted in the carbon dioxide supply pipe 204. Carbon dioxide (CO ₂ ) is supplied to the carbon dioxide supply pipe 204. A fluid outlet 200 c of the gas-liquid mixing module 200 is connected to a rinsing treatment supply pipe 74 via a pipe 202.

In the functional water generation unit 410, pure water is supplied to the rinsing treatment supply pipe 74, and a part of the supplied pure water is guided to the gas-liquid mixing module 200. Carbon dioxide (CO ₂ ) supplied from the carbon dioxide supply pipe 204 in the gas-liquid mixing module 200 is dissolved in pure water. Thereby, carbonated water is generated. The generated carbonated water is mixed with pure water flowing through the rinsing treatment supply pipe 74.

  By adjusting the opening degree of the resistance control valve 203, the flow rate of pure water led to the gas-liquid mixing module 200 from the rinse treatment supply pipe 74 through the pipe 201 is adjusted. The flow rate of carbon dioxide supplied to the gas-liquid mixing module 200 is adjusted by adjusting the opening of the gas adjustment valve 205.

  Therefore, by adjusting the opening degree of the resistance control valve 203 and the opening degree of the gas adjustment valve 205, the concentration of carbonated water generated by the functional water generation unit 410 can be adjusted.

  In the present embodiment, the opening degree of the resistance control valve 203 and the gas adjustment valve 205 of the functional water generation unit 410 is adjusted according to the type of chemical used for the chemical treatment of the substrate W. Adjustment of the opening degree of the resistance control valve 203 and the gas adjustment valve 205 is performed by the control unit 4 of FIG. Details will be described later.

(5) Control System of Substrate Processing Apparatus Details of the control system of the substrate processing apparatus 100 in FIG. 1 will be described. FIG. 4 is a block diagram for explaining a control system of the substrate processing apparatus 100.

  As shown in FIG. 4, cleaning processing units 5 a to 5 d are connected to the functional water generation unit 410 via open / close valves 75, respectively.

  The control unit 4 includes, for example, a CPU 701 and a memory 702. The control unit 4 may be a microcomputer.

  An operation panel 710 is connected to the CPU 701 of the control unit 4. When the operator operates the operation panel 710, a processing recipe described later is set in the CPU 701. The set processing recipe is stored in the memory 702 by the CPU 701.

  Based on the processing recipe stored in the memory 702, the CPU 701 of the control unit 4 controls the opening and closing of the open / close valves 75 corresponding to the cleaning processing units 5a to 5d, and the resistance control valve 203 and the gas of the functional water generating unit 410. The opening degree of the adjustment valve 205 (see FIG. 3) is controlled.

  The rinse liquid (carbonated water) generated by the functional water generation unit 410 is guided to each of the cleaning processing units 5a to 5d through the rinse treatment supply pipe 74.

  In addition, the CPU 701 of the control unit 4 is connected to the components of the cleaning processing units 5a to 5d and the fluid box units 2a to 2d (not shown), and the operations of these components are stored in the memory 702. Control based on the processing recipe.

(6) Control Based on Processing Recipe FIG. 5 and FIG. 6 are diagrams for explaining the processing recipe. In the present embodiment, the processing recipe includes at least the operation procedure and operation conditions of the substrate processing apparatus 100.

  FIG. 5 shows a part of the processing recipe of the cleaning processing units 5a to 5d in a table format. 5A shows a processing recipe of the cleaning processing unit 5a, FIG. 5B shows a processing recipe of the cleaning processing unit 5b, FIG. 5C shows a processing recipe of the cleaning processing unit 5c, and FIG. 5 (d) shows a processing recipe of the cleaning processing unit 5d.

  In the processing recipe of FIG. 5, as the operation procedure and operation conditions of the substrate processing apparatus 100, the type of processing liquid, the time, and the concentration of carbonated water in each processing step of chemical processing, rinsing processing, and drying processing are set.

  According to Fig.5 (a), in the washing | cleaning process part 5a, a chemical | medical solution process is performed in the period for 10 to 60 seconds, the rinse process is performed in the period for 70 to 120 seconds, and the drying process is performed in the period for 120 to 140 seconds.

  The treatment liquid used for the chemical treatment is a chemical MA. The concentration of carbonated water during this period is 0.10 ppm. The treatment liquid used for the rinse treatment is carbonated water, and the concentration of carbonated water is 1.00 ppm. The concentration of carbonated water during the drying process is 0.10 ppm.

  According to FIG.5 (b), in the washing | cleaning process part 5b, a chemical | medical solution process is performed in the period of 30-80 sec, the rinse process is performed in the period of 90-140 sec, and the drying process is performed in the period of 140-160 sec.

  The treatment liquid used for the chemical treatment is a chemical MA. The concentration of carbonated water during this period is 0.10 ppm. The treatment liquid used for the rinse treatment is carbonated water, and the concentration of carbonated water is 1.00 ppm. The concentration of carbonated water during the drying process is 0.10 ppm.

  According to FIG.5 (c), in the washing | cleaning process part 5c, a chemical | medical solution process is performed in the period of 100-150 seconds, the rinse process is performed in the period of 160-210 seconds, and the drying process is performed in the period of 190-210 seconds.

  The processing liquid used for the chemical processing is the chemical MB. The concentration of carbonated water during this period is 0.10 ppm. The treatment liquid used for the rinse treatment is carbonated water, and the concentration of carbonated water is 10.00 ppm. The concentration of carbonated water during the drying process is 0.10 ppm.

  According to FIG.5 (d), in the washing | cleaning process part 5d, a chemical | medical solution process is performed in the period of 120-170 sec, the rinse process is performed in the period of 180-230 sec, and the drying process is performed in the period of 210-230 sec.

  The processing liquid used for the chemical processing is the chemical MB. The concentration of carbonated water during this period is 0.10 ppm. The treatment liquid used for the rinse treatment is carbonated water, and the concentration of carbonated water is 10.00 ppm. The concentration of carbonated water during the drying process is 0.10 ppm.

  Thus, chemical | medical solution MA is used for the chemical | medical solution process of the washing | cleaning process parts 5a and 5b, and the density | concentration of the carbonated water used for the subsequent rinse process is set to 1.00 ppm. The chemical solution MB is used for the chemical treatment of the cleaning treatment units 5c and 5d, and the concentration of carbonated water used for the subsequent rinsing treatment is set to 10.00 ppm.

  In the processing recipes of FIGS. 5A to 5D, the carbonated water concentration is set to 0.10 ppm during the period in which the rinsing process is not performed. This is because, in the functional water generation unit 410 in FIG. 3, it is necessary to continue supplying carbon dioxide at a constant flow rate to the gas-liquid mixing module 200 in order to prevent the pure water from leaking from the gas-liquid mixing module 200. It is. During this period, since the on-off valve 75 of FIGS. 2 and 4 is closed, carbonated water is not discharged from the rinsing nozzle 70.

  FIG. 6 shows the processing in the cleaning processing units 5a to 5d according to the processing recipe of FIG. 5 in time series.

  The control unit 4 in FIG. 4 follows the processing recipes in FIGS. 5A to 5D, the timing of the MVI loading of the substrate W into the cleaning processing units 5a to 5d, the timing of the chemical treatment CS of the substrate W, the substrate W The timing of the rinsing process RI, the timing of the drying process DR of the substrate W, the timing of the unloading MVO of the substrate W, and the concentration of carbonated water are controlled.

  Here, the chargeability is different between the substrate W after the chemical treatment CS with the chemical solution MA and the substrate W after the chemical treatment CS with the chemical solution MB. In this case, the chargeability of the substrate W after the chemical treatment CS with the chemical solution MB is higher than the chargeability of the substrate W after the chemical treatment CS with the chemical solution MA. For this reason, it is necessary to set the concentration of carbonated water supplied to the substrate W after the chemical treatment CS with the chemical solution MB high.

  On the other hand, if the concentration of carbonated water supplied to the substrate W is too high, the metal film on the substrate W may be oxidized by the acid in the carbonated water.

  Therefore, the concentration of carbonated water supplied to the substrate W needs to be optimally set for each of the substrate W after the chemical treatment CS using the chemical solution MA and the substrate W after the chemical treatment CS using the chemical solution MB. There is.

  Therefore, in this example, the concentration of carbonated water during the period in which the rinsing process RI is performed in the cleaning processing units 5a and 5b is set to 1.00 ppm, and the carbonated water in the period in which the rinsing process RI is performed in the cleaning processing units 5c and 5d. Is set to 10.00 ppm.

  Thus, during the rinse treatment RI in the cleaning processing units 5a and 5b, by setting the concentration of carbonated water low, the substrate having low chargeability can be prevented while preventing the metal film on the substrate W from being oxidized by the acid in the carbonated water. Charging of W can be sufficiently prevented. Further, at the time of the rinse treatment RI in the cleaning processing units 5c and 5d, the concentration of carbonated water is set high within a range in which the metal film on the substrate W is not oxidized, so that the metal film on the substrate W is oxidized by the acid in the carbonated water. While preventing, charging of the substrate W having high chargeability can be sufficiently prevented.

  In addition, after the control part 4 changes the opening degree of the resistance control valve 203 and the gas adjustment valve 205 until the density | concentration of the carbonated water produced | generated by the functional water production | generation part 410 is stabilized to the density | concentration set to the process recipe. It takes a certain amount of time. Therefore, it is preferable that the control unit 4 changes the opening degrees of the resistance control valve 203 and the gas adjustment valve 205 before the start timing of the rinsing process RI. In this case, in consideration of the above time, the timing at which the control unit 4 actually changes the opening degree of the resistance control valve 203 and the gas adjustment valve 205 may be set in the processing recipe of the cleaning processing units 5a to 5d. The opening degree of the resistance control valve 203 and the gas adjustment valve 205 may be changed by the control unit 4 a predetermined time before the start timing of the rinse process RI set in the process recipe.

(7) Effects of the present embodiment In the substrate processing apparatus 100 according to the present embodiment, the concentration of carbonated water used for the rinsing process depends on the chargeability of the substrate W after the chemical processing in each of the cleaning processing units 5a to 5d. Accordingly, the processing recipe is set so as to be optimal. In accordance with such a processing recipe, the chemical processing, rinsing and drying of the substrate W are performed in the cleaning processing units 5a to 5d, and the concentration of carbonated water used for the rinsing of the substrate W is adjusted according to the processing recipe. The Accordingly, carbonated water having an optimal concentration is supplied to the substrate W in the cleaning processing units 5a to 5d. As a result, it is possible to sufficiently prevent the substrate W from being charged while preventing the metal film on the substrate W from being oxidized by the acid in the carbonated water.

(8) Other embodiments (8-1)
In the example shown in FIGS. 5 and 6, the concentration of carbonated water was constant during the rinsing process of the substrate W in each of the cleaning units 5 a to 5 d, but in each of the cleaning units 5 a to 5 d. You may change the density | concentration of carbonated water within the period of a rinse process. Hereinafter, specific examples will be described with reference to FIGS.

  7 and 8 are diagrams for explaining another example of the processing recipe. Here, in order to clarify the difference from the processing recipe of FIG. 5, the processing recipe of the cleaning processing unit 5a corresponding to FIG. 5A will be described.

  FIG. 7 shows a part of the processing recipe of the cleaning processing unit 5a in a table format. FIG. 8 shows the processing based on the processing recipe of FIG. 7 in time series.

  The processing recipe of FIG. 7 is different from the processing recipe of FIG. 5A in the following points.

  According to FIG. 7, the concentration of carbonated water during the period of 70 to 90 sec is 1.00 ppm and the concentration of carbonated water during the period of 90 to 120 sec is gradually increased from 1.00 ppm to 0.10 ppm. To drop.

  In this case, by setting the carbonated water concentration to 1.00 ppm at the start of the rinsing process RI, it is possible to sufficiently prevent the substrate W having low chargeability from being charged. Further, as the rinsing process RI is approached, the concentration of the carbonated water is set to gradually decrease from 1.00 ppm to 0.10 ppm, thereby further oxidizing the metal film on the substrate W by the acid in the carbonated water. It can be effectively prevented.

  By using the same processing recipe as in FIGS. 7 and 8 for the cleaning processing units 5b to 5c, the same effect can be obtained in the cleaning processing units 5b to 5c. However, the processing recipes of the cleaning processing units 5a to 5d are set so that the timing of the rinsing process RI in the cleaning processing units 5a to 5d does not overlap in the same period.

  In this way, in each of the cleaning processing units 5a to 5d, by changing the concentration of carbonated water within the period of the rinse treatment RI, the oxidation of the metal film on the substrate W by the acid in the carbonated water is more effectively prevented. However, charging of the substrate W can be sufficiently prevented.

(8-2)
In the above embodiment, the concentration of carbonated water used for the rinsing process is set according to the degree of chargeability of the substrate W after the chemical process. However, the present invention is not limited thereto, and the carbonic acid is selected according to the alkali strength of the chemical used for the chemical process. The concentration of water may be set.

  In this case, when the alkali strength of the chemical solution is high, the concentration of carbonated water used for the rinsing process is set high, and when the alkali strength of the chemical solution is low, the concentration of carbonated water used for the rinsing process is set low. In that case, the pH during mixing of the chemical solution and the rinsing liquid can be controlled to an appropriate value according to the alkali strength of the chemical solution remaining on the substrate W during the rinsing process, and the weakly alkaline region can be passed in a short time.

  Thereby, the occurrence of a pH shock can be sufficiently prevented while preventing the metal film on the substrate W from being oxidized.

  Further, the concentration of carbonated water used for the rinsing process may be set according to other conditions such as the type of the metal film on the substrate W.

(8-3)
In the above embodiment, carbonated water is used as the rinsing liquid, but not limited to this, other functional water may be used as the rinsing liquid. Examples of other functional water include hydrogen water in which pure water and hydrogen gas are mixed.

  When hydrogen water is used as the rinsing liquid, the contaminants removed by the chemical treatment are prevented from reattaching to the substrate W, the natural oxide film on the substrate W is removed, the substrate W is oxidized, and the substrate W is The effect of preventing the formation of watermarks (water droplet marks) on the surface is obtained. The hydrogen water is used for a rinsing process after a CMP (Chemical Mechanical Polishing) of a wiring pattern formed on the substrate W or the like.

  Even when hydrogen water is used as the rinsing liquid, the concentration of hydrogen water supplied to the substrate W is set in the processing recipe as in the case of using carbonated water, and the control unit 4 sets the functional water generation unit 410 based on the concentration. Control. Thereby, the damage to the substrate W can be prevented, the removed contaminants can be prevented from reattaching to the substrate W, the natural oxide film on the substrate W can be removed, the substrate W can be prevented from being oxidized, and the water on the substrate W can be prevented. Effects such as prevention of formation of marks (water droplet traces) can be obtained.

  Moreover, you may use electrolytic ion water, magnetic water, etc. as other functional water. Also in this case, as in the case of using carbonated water, the concentration of the functional water supplied to the substrate W is set in the processing recipe, and the control unit 4 controls the functional water generation unit 410 based on that.

(8-4)
In the above embodiment, the control unit 4 controls the concentration of the functional water supplied to the substrate W for the rinsing process based on the concentration set in the process recipe. However, for other processes such as a chemical process, The concentration of functional water supplied to the substrate W may be set in the processing recipe. Also in this case, the control unit 4 controls the functional water generation unit 410 based on the processing recipe.

Examples of functional water used for other treatment include ozone water (O ₃ water) obtained by mixing pure water and ozone (O ₃ ). Since ozone water contains oxygen radicals in the liquid, it has a strong oxidizing power and is used for removing organic contaminants adhering to the substrate W.

  Even when ozone water is used, the concentration of ozone water supplied to the substrate W is set in the processing recipe, and the control unit 4 controls the functional water generation unit 410 based on the concentration, as in the above embodiment. Thereby, organic contaminants adhering to the substrate W can be sufficiently removed while preventing oxidation of the metal film on the substrate W by oxygen radicals in ozone water.

  In addition, when supplying ozone water to the substrate W, the concentration of the ozone water is decreased as the supply is approached, thereby more effectively preventing oxidation of the metal film on the substrate W by oxygen radicals in the ozone water. Can do.

  In addition, when using ozone water, you may use the functional water production | generation part 510 shown, for example in FIG. 9 instead of the functional water production | generation part 410 of FIG.

  The functional water generator 510 has the same configuration as the functional water generator 410 of FIG. 4 except for the following points. The functional water generator 510 includes an ozone mixing tank 550, and an ozone supply pipe 204a to which ozone is supplied is connected to the ozone mixing tank 550. A gas adjustment valve 205 is inserted in the ozone supply pipe 204a. The pipes 201 and 202 are inserted into the ozone mixing tank 550.

In the functional water generator 510, a portion of the pure water supplied to the rinsing treatment supply pipe 74 is guided to the ozone mixing tank 550. Ozone (O ₃ ) is introduced into the pure water introduced into the ozone mixing tank 550 by bubbling. Thereby, ozone water is produced | generated. The generated ozone water is mixed with pure water flowing through the rinsing treatment supply pipe 74.

  By adjusting the opening degree of the resistance control valve 203, the flow rate of pure water led from the rinse treatment supply pipe 74 to the ozone mixing tank 550 through the pipe 201 is adjusted. The flow rate of ozone supplied to the ozone mixing tank 550 is adjusted by adjusting the opening degree of the gas adjustment valve 205.

  In the functional water generator 510, the concentration of ozone water can be adjusted by adjusting the opening degree of the resistance control valve 203 and the gas adjustment valve 205.

(8-5)
In the above embodiment, the case where an alkaline chemical solution is used has been described. However, when a functional water other than carbonated water such as hydrogen water, electrolytic ion water, magnetic water, or ozone water is used as a rinse solution, Other chemicals may be used. Examples of other chemicals are shown below.

  A solution containing ammonium fluoride for removing the polymer formed on the surface of the substrate W, for example, a mixed solution containing ammonium fluoride and phosphoric acid, can be used as the chemical solution.

  Also, an alkaline solution such as TMAH (tetramethylammonium hydroxide) or an acidic solution such as butyl acetate for developing the substrate W can be used as the chemical solution.

  Furthermore, a sulfuric acid / hydrogen peroxide solution for stripping the resist formed on the surface of the substrate W can be used as the chemical solution.

  Further, BHF (buffered hydrofluoric acid: mixed solution containing ammonium fluoride and hydrofluoric acid), DHF (dilute hydrofluoric acid), hydrofluoric acid, hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, acetic acid for etching or cleaning the surface of the substrate W An aqueous solution of oxalic acid, ammonia, citric acid, aqueous hydrogen peroxide or TMAH, or a mixed solution thereof can be used as the chemical solution.

  Furthermore, a solution containing ammonia or hydrogen peroxide can also be used as a chemical solution.

(9) Correspondence between each component of claims and each part of embodiment In the above embodiment, gas-liquid mixing module 200, pipes 201 and 202, carbon dioxide supply pipe 204, ozone mixing tank 550 and ozone supply pipe 204a is equivalent to the functional water generating means, the rinsing nozzle 70 and the rinsing treatment supply pipe 74 are equivalent to the functional water supply means, the cleaning treatment units 5a to 5d are equivalent to the treatment units, and the memory 702 is the storage means. The resistance control valve 203, the gas adjustment valve 205 and the CPU 701 correspond to the concentration control means, the chemical treatment nozzle 50 and the chemical treatment supply pipe 63 correspond to the chemical supply means and the alkali supply means, and the pipe 201 is pure. It corresponds to the water supply system, the carbon dioxide supply pipe 204 and the ozone supply pipe 204a correspond to the gas supply system, and the gas-liquid mixing module 200 and The ozone mixing tank 550 corresponds to a mixing unit.

  The present invention can be used for processing various substrates.

1 is a plan view of a substrate processing apparatus according to an embodiment of the present invention. It is a figure for demonstrating the structure of the cleaning process part of the substrate processing apparatus which concerns on one embodiment of this invention. It is a figure for demonstrating the structural example of a functional water production | generation part. It is a block diagram for demonstrating the control system of a substrate processing apparatus. It is a figure for demonstrating a process recipe. It is a figure for demonstrating a process recipe. It is a figure for demonstrating the other example of a process recipe. It is a figure for demonstrating the other example of a process recipe. It is a figure for demonstrating the other structural example of a functional water production | generation part.

Explanation of symbols

5a to 5d Cleaning processing unit 50 Chemical liquid processing nozzle 63 Chemical liquid processing supply pipe 65, 75 Open / close valve 70 Rinse processing nozzle 74 Rinse processing supply pipe 100 Substrate processing apparatus 200 Gas-liquid mixing module 201, 202 Piping 203 Resistance control valve 203
204 Carbon dioxide supply pipe 204a Ozone supply pipe 205 Gas adjustment valve 310 Chemical liquid supply source 410, 510 Functional water generator 550 Ozone mixing tank 702 Memory 701 CPU

Claims (10)

Functional water generating means for generating functional water;
A processing unit having a functional water supply unit that performs a predetermined process on the substrate and supplies the functional water generated by the functional water generation unit to the substrate;
Storage means for storing a processing recipe for defining the operation procedure and operation conditions of the substrate including the concentration setting value of the functional water;
A substrate processing apparatus comprising: a concentration adjusting unit configured to adjust a concentration of functional water generated by the functional water generating unit based on a concentration setting value included in a processing recipe stored in the storage unit. The processor is
A chemical solution supply means for supplying the chemical solution to the substrate;
The substrate processing apparatus according to claim 1, wherein the functional water supply unit supplies the functional water generated by the functional water generation unit to the substrate after the chemical solution is supplied by the chemical solution supply unit. The functional water generating means is
A pure water supply system for supplying pure water;
A gas supply system for supplying gas;
Mixing means for generating functional water by mixing pure water supplied from the pure water supply system and gas supplied from the gas supply system;
The concentration adjusting means controls at least one of a supply amount of pure water from the pure water supply system to the mixing means and a supply amount of gas from the gas supply system to the mixing means, The substrate processing apparatus according to claim 1, wherein the concentration of the functional water is adjusted. 4. The substrate processing apparatus according to claim 3, wherein the mixing means is a hollow fiber membrane module. The substrate processing apparatus according to claim 1, wherein the functional water is carbonated water containing carbon dioxide. The processor is
An alkali supply means for supplying an alkaline liquid to the substrate;
After the supply of the alkaline liquid by the alkali supply means, the functional water supply means supplies the functional water generated by the functional water generation means to the substrate,
The concentration adjusting means adjusts the concentration of the functional water so that the concentration at the end of supply of carbonated water by the functional water supply means is lower than the concentration at the start of supply of carbonated water by the functional water supply means. The substrate processing apparatus according to claim 5. The substrate processing apparatus according to claim 1, wherein the functional water is ozone water containing ozone. The concentration adjusting means adjusts the concentration of the functional water so that the concentration at the end of the supply of ozone water by the functional water supply means is lower than the concentration at the start of the supply of ozone water by the functional water supply means. The substrate processing apparatus according to claim 7. The substrate processing apparatus according to claim 1, wherein the functional water is hydrogen water containing hydrogen. A storage step for storing a processing recipe for defining a processing procedure and processing conditions of a substrate including a concentration setting value of functional water;
A functional water generating step for generating functional water whose concentration is adjusted based on the concentration setting value included in the processing recipe stored in the storing step;
A substrate processing method comprising: a functional water supply step of supplying functional water generated in the functional water generation step to the substrate.

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