JP2007132946A5 - - Google Patents
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- Publication number
- JP2007132946A5 JP2007132946A5 JP2006305043A JP2006305043A JP2007132946A5 JP 2007132946 A5 JP2007132946 A5 JP 2007132946A5 JP 2006305043 A JP2006305043 A JP 2006305043A JP 2006305043 A JP2006305043 A JP 2006305043A JP 2007132946 A5 JP2007132946 A5 JP 2007132946A5
- Authority
- JP
- Japan
- Prior art keywords
- sensing die
- single sensing
- sensor
- tangential
- radial
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US73597605P | 2005-11-10 | 2005-11-10 | |
| US11/557,661 US7597005B2 (en) | 2005-11-10 | 2006-11-08 | Pressure sensor housing and configuration |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007132946A JP2007132946A (ja) | 2007-05-31 |
| JP2007132946A5 true JP2007132946A5 (enExample) | 2009-08-13 |
Family
ID=37702242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006305043A Withdrawn JP2007132946A (ja) | 2005-11-10 | 2006-11-10 | 圧力センサハウジング及び形態 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7597005B2 (enExample) |
| EP (1) | EP1785710A3 (enExample) |
| JP (1) | JP2007132946A (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8175835B2 (en) * | 2006-05-17 | 2012-05-08 | Honeywell International Inc. | Flow sensor with conditioning-coefficient memory |
| US7600433B2 (en) | 2007-02-23 | 2009-10-13 | Silicon Micro Sensors Gmbh | Pressure sensor with roughened and treated surface for improving adhesive strength and method of manufacturing the sensor |
| JP4916006B2 (ja) * | 2007-02-28 | 2012-04-11 | 株式会社山武 | 圧力センサ |
| US20090288484A1 (en) * | 2008-05-21 | 2009-11-26 | Honeywell International Inc. | Integrated mechanical package design for combi sensor apparatus |
| DE202008011684U1 (de) | 2008-09-03 | 2008-12-24 | Silicon Micro Sensors Gmbh | Drucksensor |
| US8082797B2 (en) | 2009-11-11 | 2011-12-27 | Honeywell International Inc. | Pressure sensor assembly |
| US7985659B1 (en) | 2010-03-31 | 2011-07-26 | Freescale Semiconductor, Inc. | Semiconductor device with a controlled cavity and method of formation |
| US8297127B2 (en) | 2011-01-07 | 2012-10-30 | Honeywell International Inc. | Pressure sensor with low cost packaging |
| US8718981B2 (en) | 2011-05-09 | 2014-05-06 | Honeywell International Inc. | Modular sensor assembly including removable sensing module |
| US20130098160A1 (en) * | 2011-10-25 | 2013-04-25 | Honeywell International Inc. | Sensor with fail-safe media seal |
| DE102013110368A1 (de) * | 2013-09-19 | 2015-03-19 | Endress + Hauser Gmbh + Co. Kg | Druckmessumformer |
| GB2521163A (en) | 2013-12-11 | 2015-06-17 | Melexis Technologies Nv | Semiconductor pressure sensor |
| US10317297B2 (en) * | 2013-12-11 | 2019-06-11 | Melexis Technologies Nv | Semiconductor pressure sensor |
| JPWO2020071315A1 (ja) | 2018-10-03 | 2021-09-24 | 東洋紡株式会社 | 低吸着性シーラントフィルム、積層体および包装袋 |
| CN209326840U (zh) | 2018-12-27 | 2019-08-30 | 热敏碟公司 | 压力传感器及压力变送器 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3123788A (en) * | 1964-03-03 | Piezoresistive gage | ||
| US271701A (en) | 1883-02-06 | goodwin | ||
| US272306A (en) | 1883-02-13 | Steam-engine | ||
| US4321832A (en) * | 1980-03-07 | 1982-03-30 | Rockwell International Corporation | High accuracy measuring apparatus |
| EP0195232B1 (en) | 1985-03-20 | 1991-12-11 | Hitachi, Ltd. | Piezoresistive strain sensing device |
| US4683755A (en) * | 1985-11-15 | 1987-08-04 | Imo Delaval Inc. | Biaxial strain gage systems |
| US5349867A (en) | 1991-12-02 | 1994-09-27 | Kavlico Corporation | Sensitive resistive pressure transducer |
| US5459351A (en) * | 1994-06-29 | 1995-10-17 | Honeywell Inc. | Apparatus for mounting an absolute pressure sensor |
| WO2003064989A1 (en) * | 2002-01-30 | 2003-08-07 | Honeywell International Inc. | An absolute micromachined silicon pressure sensor with backside hermetic cover and method of making the same |
| US7000298B2 (en) | 2004-04-20 | 2006-02-21 | Honeywell International Inc. | Method a quartz sensor |
| US7278319B2 (en) * | 2005-11-10 | 2007-10-09 | Honeywell International Inc. | Pressure and temperature sensing element |
-
2006
- 2006-11-08 US US11/557,661 patent/US7597005B2/en not_active Expired - Fee Related
- 2006-11-10 JP JP2006305043A patent/JP2007132946A/ja not_active Withdrawn
- 2006-11-10 EP EP06123811A patent/EP1785710A3/en not_active Ceased
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