JP2007132946A - 圧力センサハウジング及び形態 - Google Patents

圧力センサハウジング及び形態 Download PDF

Info

Publication number
JP2007132946A
JP2007132946A JP2006305043A JP2006305043A JP2007132946A JP 2007132946 A JP2007132946 A JP 2007132946A JP 2006305043 A JP2006305043 A JP 2006305043A JP 2006305043 A JP2006305043 A JP 2006305043A JP 2007132946 A JP2007132946 A JP 2007132946A
Authority
JP
Japan
Prior art keywords
sensor
sss
pressure
chip
sensing die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2006305043A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007132946A5 (enExample
Inventor
Steven M Mcmonigal
スティーヴン・エム・マクモニガル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Publication of JP2007132946A publication Critical patent/JP2007132946A/ja
Publication of JP2007132946A5 publication Critical patent/JP2007132946A5/ja
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • G01L9/0055—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements bonded on a diaphragm
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0092—Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
    • G01L9/06—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of piezo-resistive devices
    • G01L9/065—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of piezo-resistive devices with temperature compensating means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)
JP2006305043A 2005-11-10 2006-11-10 圧力センサハウジング及び形態 Withdrawn JP2007132946A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US73597605P 2005-11-10 2005-11-10
US11/557,661 US7597005B2 (en) 2005-11-10 2006-11-08 Pressure sensor housing and configuration

Publications (2)

Publication Number Publication Date
JP2007132946A true JP2007132946A (ja) 2007-05-31
JP2007132946A5 JP2007132946A5 (enExample) 2009-08-13

Family

ID=37702242

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006305043A Withdrawn JP2007132946A (ja) 2005-11-10 2006-11-10 圧力センサハウジング及び形態

Country Status (3)

Country Link
US (1) US7597005B2 (enExample)
EP (1) EP1785710A3 (enExample)
JP (1) JP2007132946A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210069658A (ko) 2018-10-03 2021-06-11 도요보 가부시키가이샤 저흡착성 실란트 필름, 적층체 및 포장봉지

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8175835B2 (en) * 2006-05-17 2012-05-08 Honeywell International Inc. Flow sensor with conditioning-coefficient memory
US7600433B2 (en) 2007-02-23 2009-10-13 Silicon Micro Sensors Gmbh Pressure sensor with roughened and treated surface for improving adhesive strength and method of manufacturing the sensor
JP4916006B2 (ja) * 2007-02-28 2012-04-11 株式会社山武 圧力センサ
US20090288484A1 (en) * 2008-05-21 2009-11-26 Honeywell International Inc. Integrated mechanical package design for combi sensor apparatus
DE202008011684U1 (de) 2008-09-03 2008-12-24 Silicon Micro Sensors Gmbh Drucksensor
US8082797B2 (en) 2009-11-11 2011-12-27 Honeywell International Inc. Pressure sensor assembly
US7985659B1 (en) 2010-03-31 2011-07-26 Freescale Semiconductor, Inc. Semiconductor device with a controlled cavity and method of formation
US8297127B2 (en) 2011-01-07 2012-10-30 Honeywell International Inc. Pressure sensor with low cost packaging
US8718981B2 (en) 2011-05-09 2014-05-06 Honeywell International Inc. Modular sensor assembly including removable sensing module
US20130098160A1 (en) * 2011-10-25 2013-04-25 Honeywell International Inc. Sensor with fail-safe media seal
DE102013110368A1 (de) * 2013-09-19 2015-03-19 Endress + Hauser Gmbh + Co. Kg Druckmessumformer
GB2521163A (en) 2013-12-11 2015-06-17 Melexis Technologies Nv Semiconductor pressure sensor
US10317297B2 (en) * 2013-12-11 2019-06-11 Melexis Technologies Nv Semiconductor pressure sensor
CN209326840U (zh) 2018-12-27 2019-08-30 热敏碟公司 压力传感器及压力变送器

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3123788A (en) * 1964-03-03 Piezoresistive gage
US271701A (en) 1883-02-06 goodwin
US272306A (en) 1883-02-13 Steam-engine
US4321832A (en) * 1980-03-07 1982-03-30 Rockwell International Corporation High accuracy measuring apparatus
EP0195232B1 (en) 1985-03-20 1991-12-11 Hitachi, Ltd. Piezoresistive strain sensing device
US4683755A (en) * 1985-11-15 1987-08-04 Imo Delaval Inc. Biaxial strain gage systems
US5349867A (en) 1991-12-02 1994-09-27 Kavlico Corporation Sensitive resistive pressure transducer
US5459351A (en) * 1994-06-29 1995-10-17 Honeywell Inc. Apparatus for mounting an absolute pressure sensor
WO2003064989A1 (en) * 2002-01-30 2003-08-07 Honeywell International Inc. An absolute micromachined silicon pressure sensor with backside hermetic cover and method of making the same
US7000298B2 (en) 2004-04-20 2006-02-21 Honeywell International Inc. Method a quartz sensor
US7278319B2 (en) * 2005-11-10 2007-10-09 Honeywell International Inc. Pressure and temperature sensing element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210069658A (ko) 2018-10-03 2021-06-11 도요보 가부시키가이샤 저흡착성 실란트 필름, 적층체 및 포장봉지

Also Published As

Publication number Publication date
US20070113668A1 (en) 2007-05-24
EP1785710A2 (en) 2007-05-16
EP1785710A3 (en) 2008-06-25
US7597005B2 (en) 2009-10-06

Similar Documents

Publication Publication Date Title
US8631708B2 (en) Apparatus and method for minimizing drift of a piezo-resistive pressure sensor due to the progressive release of mechanical stress over time
US8297125B2 (en) Media isolated differential pressure sensor with cap
CN101900625B (zh) 基于微电子封装工艺的湿/湿差动压力感测器设计
EP0354479B1 (en) Semiconductor pressure sensor
US7216547B1 (en) Pressure sensor with silicon frit bonded cap
US7597005B2 (en) Pressure sensor housing and configuration
EP3118599B1 (en) Pressure sensor with built in stress buffer
KR19980032489A (ko) 반도체 압력 센서
JPH07103837A (ja) 物理量検出センサ
US7698951B2 (en) Pressure-sensor apparatus
US20020073783A1 (en) Pressure sensor
US8183975B2 (en) Miniature pressure transducer
JPH02138776A (ja) 半導体圧力センサ
JPS62291533A (ja) 圧力検出器
JP2512220B2 (ja) 複合機能形センサ
CN223470741U (zh) 一种压力测量组件
CN216246925U (zh) 一种降低输出漂移的mems压力传感器芯片
JPH08240494A (ja) 圧力センサ及びその製造方法
JPH02262032A (ja) 絶対圧型半導体圧力センサ
CN119268912A (zh) 一种压力测量组件及其制作方法
JPH08166305A (ja) 半導体圧力計
JPH0313832A (ja) 半導体圧力センサ

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090626

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090626

A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20091111