JP2007101882A - Exposure apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an exposure apparatus, capable of performing high accuracy exposure by improving flatness of a mask and capable of holding a mask by appropriate restraint force. <P>SOLUTION: The exposure apparatus is equipped with a work stage to hold a substrate as a material to be exposed, a mask stage 1 to hold a mask M disposed facing the substrate, and an irradiating means for irradiating the substrate with a light for pattern exposure via the mask M, wherein the mask stage 1 holds the mask M in at least two sides by a holding part 16, having a plurality of black grooves 16b in each side, and the mask M has a curved form which is rendered into planar as a bent state by own weight, when the mask is held by the holding part 16. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an exposure apparatus suitable for, for example, proximity exposure transfer of a mask pattern of a mask onto a substrate of a large flat panel display such as a liquid crystal display or a plasma display by a divided sequential exposure method.

  As a conventional exposure apparatus, as shown in FIG. 15, provided on a work stage 201 for placing a substrate W, a frame-like mask stage 202 disposed above the work stage 201, and the mask stage 202, An exposure apparatus 200 is known that includes a plurality of vacuum suction grooves 203 that detachably suck and hold a mask M having a predetermined mask pattern, and a mask drop prevention means 204 that prevents the mask M from dropping. The vacuum suction grooves 203 of the exposure apparatus 200 are respectively provided on the four sides of the opening of the mask stage 202, and suck and hold the mask M in contact with the lower surface of the mask stage 202 (see, for example, Patent Document 1). .)

Further, as a mask used in a conventional exposure apparatus, a mask using a synthetic quartz glass large substrate having a flatness / diagonal length of 6.0 × 10 ⁻⁵ or less and a diagonal length of 500 mm or more is known. ing. (For example, refer to Patent Document 2).

JP 2001-117238 A (page 3, FIGS. 1 and 2) JP 2003-292346 A (second page)

  By the way, flat panel display devices such as liquid crystal displays and plasma display devices have been increasing in size in recent years, and accordingly, used for manufacturing color filters of such flat panel display devices. The exposure apparatus to be used also needs to cope with an increase in size.

  However, in the exposure apparatus 200 described in Patent Document 1, when the mask M held on the mask stage 202 is enlarged like the mask described in Patent Document 2, the mask is held on the mask stage 202 as shown in FIG. The mask M is bent due to its own weight. As a result, it becomes difficult to accurately expose the mask pattern formed on the mask onto the substrate W on the work stage 201.

  In the exposure apparatus 200 described in Patent Document 1, since the mask M is held over the entire circumference of the four sides of the mask stage 202, the restraining force for holding the mask M may be too strong.

  When the mask M is held on the mask stage 202 by four sides as in the exposure apparatus 200 described in Patent Document 1, the mask and the substrate that are generally installed on the mask stage of the exposure apparatus are opposed to each other. There are restrictions on the location of various electronic devices such as a gap sensor that measures the gap between the surfaces, an alignment camera that detects the amount of plane displacement between the mask and the substrate, and a masking aperture that shields both ends of the mask as necessary. There was a problem of being.

  Further, when the mask M is held on the mask stage 202 with four sides, there is a problem that an area for holding the mask becomes large, so that an exposure area becomes narrow.

  Further, when the mask M is held on the mask stage 202 with four sides, only a mask having a size that matches the size of the opening of the mask stage can be held, so that an exposure apparatus with less mask size restrictions has been desired.

  The present invention has been made in order to eliminate such inconveniences, and an object of the present invention is to improve the flatness of the mask, perform high-precision exposure, and hold the mask with an appropriate restraining force. An object of the present invention is to provide an exposure apparatus capable of performing the above.

The above object of the present invention can be achieved by the following constitution.
(1) a work stage for holding a substrate as an exposed material, a mask stage for holding a mask opposed to the substrate, and irradiation means for irradiating the substrate with light for pattern exposure through the mask; The mask stage holds the mask by a holding unit having a plurality of suction grooves per side on at least two sides of the mask, and the mask is held by the holding unit. An exposure apparatus having a curved shape that is substantially flat when bent under its own weight.

  According to the exposure apparatus of the present invention, the mask stage holds the mask by the holding unit having a plurality of suction grooves per side on at least two sides of the mask, and when the mask is held by the holding unit, Since the curved shape is substantially flat in the bent state, the flatness of the mask can be improved, so that highly accurate exposure can be performed. Further, since the suction area of the mask is divided into a plurality of portions per side, the mask can be held with an appropriate restraining force.

  Hereinafter, embodiments of an exposure apparatus according to the present invention will be described in detail with reference to the drawings.

(First embodiment)
First, a first embodiment of a divided sequential exposure apparatus which is an exposure apparatus according to the present invention will be described with reference to FIGS.
FIG. 1 is a partially exploded perspective view for explaining a first embodiment of the division sequential exposure apparatus according to the present invention, FIG. 2 is an enlarged perspective view of the mask stage shown in FIG. 1, and FIG. FIG. 4B is a top view of the mask position adjusting means of FIG. 4A, FIG. 4 is a bottom view of the mask stage shown in FIG. 2, and FIG. 5 is a diagram of the alignment camera and the focus adjustment mechanism of the alignment camera. FIG. 6 is a side view showing the basic structure, FIG. 6 is an explanatory diagram for explaining the irradiation optical system of the workpiece side alignment mark, FIG. 7 is a block diagram showing the focus adjustment mechanism of the alignment image, and FIG. 8 is the divided sequential approach shown in FIG. 9 is a front view of the exposure apparatus, FIG. 9 is a block diagram showing the electrical configuration of the divided sequential proximity exposure apparatus shown in FIG. 1, and FIG. 10 is an explanatory view for explaining the alignment between the workpiece side alignment mark and the mask side alignment mark. .

  As shown in FIG. 1, the division sequential exposure apparatus PE of this embodiment includes a mask stage 1 that holds a mask M, a work stage 2 that holds a glass substrate (material to be exposed) W, and an irradiation means for pattern exposure. And an apparatus base 4 that supports the mask stage 1 and the work stage 2.

  A glass substrate W (hereinafter simply referred to as “substrate W”) is disposed to face the mask M, and a surface (opposite surface of the mask M) for exposing and transferring the mask pattern P drawn on the mask M. A photosensitizer is applied to the surface to make it translucent.

  For convenience of explanation, the illumination optical system 3 will be described. The illumination optical system 3 is, for example, a high-pressure mercury lamp 31 that is a light source for ultraviolet irradiation, and a concave mirror 32 that collects light emitted from the high-pressure mercury lamp 31. Two types of optical integrators 33 that are switchably arranged in the vicinity of the focal point of the concave mirror 32, plane mirrors 35 and 36, and a spherical mirror 37, and are arranged between the plane mirror 36 and the optical integrator 33 to change the irradiation light path. And an exposure control shutter 34 that controls opening and closing.

  When the exposure control shutter 34 is controlled to be opened at the time of exposure, the light emitted from the high-pressure mercury lamp 31 is held on the mask M held on the mask stage 1 and then on the work stage 2 via the optical path L shown in FIG. Irradiated as parallel light for pattern exposure perpendicular to the surface of the substrate W. As a result, the mask pad P of the mask M is exposed and transferred onto the substrate W.

  Next, the mask stage 1 and the work stage 2 will be described in this order. First, the mask stage 1 includes a mask stage base 10, and the mask stage base 10 is supported on a mask stage column 11 protruding from the apparatus base 4 and is disposed above the work stage 2.

  As shown in FIG. 2, the mask stage base 10 has a substantially rectangular shape and has an opening 10a at the center. A mask holding frame 12 is mounted on the opening 10a so as to be movable in the X and Y directions. ing.

  As shown in FIG. 3A, the mask holding frame 12 has a flange 12 a provided on the outer periphery of the upper end thereof placed on the upper surface in the vicinity of the opening 10 a of the mask stage base 10. It is inserted through a predetermined gap between the inner periphery. Thereby, the mask holding frame 12 can be moved in the X and Y directions by this gap.

  As shown in FIGS. 3 and 4, a pair of chuck portions 16, 16 that hold two opposing sides of the mask M are fixed to the lower surface of the mask holding frame 12 via a spacer 20. It can move in the X and Y directions with respect to the mask stage base 10 together with the holding frame 12. A plurality of suction nozzles 16a for adsorbing two sides facing the X direction of the mask M on which the mask pattern P is drawn are provided at predetermined intervals on the lower surfaces of the chuck portions 16, 16. The chuck portions 16 and 16 constitute a holding portion (chuck device) of the present invention. A plurality of box grooves 16b, each being a suction groove surrounding the suction nozzle 16a, are provided on the lower surface of each chuck portion 16, and the suction area on one side where the mask M is sucked is divided. As a result, the mask M is detachably held on the chuck portions 16 and 16 on two sides by a vacuum suction device (not shown) through the suction nozzle 16a.

  When the mask M is held by the chuck portions 16 and 16, the mask M has a curved shape that is substantially flat when bent by its own weight, that is, the upper side is convex in a weightless state (or a vertically placed state) where gravity does not act. In a state of being chucked by the chuck portions 16 and 16 in a state of being chucked by the chuck portions 16 and 16, it has a flat shape over the entire area of the plane. It is held (solid line in FIG. 3A).

  Further, in FIG. 2, the mask holding frame 12 is moved on the upper surface of the mask stage base 10 in the XY plane based on a detection result by an alignment camera 15 described later or a measurement result by a laser length measuring device 60 described later. A mask position adjusting means 13 for adjusting the position and posture of the mask M held by the mask holding frame 12 is provided.

  The mask position adjusting means 13 includes an X-axis direction driving device 13x attached to one side of the mask holding frame 12 along the Y-axis direction, and two Y-axes attached to one side of the mask holding frame 12 along the X-axis direction. Direction drive device 13y.

  The X-axis direction drive device 13x includes a drive actuator (for example, an electric actuator) 131 having a rod 131r extending and contracting in the X-axis direction, and a linear guide attached to a side portion along the Y-axis direction of the mask holding frame 12 ( Linear motion bearing guide) 133. The guide rail 133r of the linear guide 133 extends in the Y-axis direction and is fixed to the mask holding frame 12. The slider 133 s movably attached to the guide rail 133 r is connected to the tip of a rod 131 r fixed to the mask stage base 10 via a pin support mechanism 132.

  On the other hand, the Y-axis direction drive device 13y has the same configuration as the X-axis direction drive device 13x, and includes a drive actuator (for example, an electric actuator) 131 having a rod 131r that expands and contracts in the Y-axis direction, and a mask holding frame. 12 linear guides (linear motion bearing guides) 133 attached to side portions along the X-axis direction. The guide rail 133r of the linear guide 133 extends in the X-axis direction and is fixed to the mask holding frame 12. A slider 133s attached to the guide rail 133r so as to be movable is connected to the tip of the rod 131r via a pin support mechanism 132. The X-axis direction driving device 13x adjusts the mask holding frame 12 in the X-axis direction. The two Y-axis direction driving devices 13y adjust the mask holding frame 12 in the Y-axis direction and the θ-axis direction (oscillation around the Z-axis). ).

  Further, inside the two sides facing each other in the X-axis direction of the mask holding frame 12, as shown in FIG. 2, a gap sensor 14 as a means for measuring the gap between the opposing surfaces of the mask M and the substrate W; An alignment camera 15 is provided as means for detecting a plane deviation amount between the mask M and the alignment reference. Both the gap sensor 14 and the alignment camera 15 are movable in the X-axis direction via a moving mechanism 19.

  The moving mechanism 19 has a holding frame 191 for holding the gap sensor 14 and the alignment camera 15 extending in the Y-axis direction on the upper surfaces of the two sides facing each other in the X-axis direction of the mask holding frame 12. The end of the holding base 191 on the side away from the Y-axis direction driving device 13y is supported by a linear guide 192. The linear guide 192 includes a guide rail 192r that is installed on the mask stage base 10 and extends along the X-axis direction, and a slider (not shown) that moves on the guide rail 192r. The end of the gantry 191 is fixed.

  Then, the gap sensor 14 and the alignment camera 15 are moved in the X-axis direction via the holding frame 191 by driving the slider by a driving actuator 193 including a motor and a ball screw.

  As shown in FIG. 5, the alignment camera 15 optically detects the mask-side alignment mark 101 on the surface of the mask M held on the lower surface of the mask stage 1 from the back side of the mask, and the focus adjustment mechanism 151. As a result, the focus is adjusted by moving toward and away from the mask M.

  The focus adjustment mechanism 151 includes a linear guide 152, a ball screw 153, and a motor 154. The linear guide 152 is provided with a guide rail 152r and a slider 152s. Among these, the guide rail 152r is attached to the holding frame 191 of the moving mechanism 19 of the mask stage 1 so as to extend in the vertical direction. The alignment camera 15 is fixed to the slider 152s via a table 152t. A nut screwed to the screw shaft of the ball screw 153 is connected to the table 152t, and the screw shaft is rotated by a motor 154.

  Further, in the present embodiment, as shown in FIG. 6, the work side alignment mark 100 is projected from below by having a light source 781 and a condenser lens 782 below the work chuck 8 provided on the work stage 2. An optical system 78 is disposed integrally with the Z-axis fine movement stage 24 in accordance with the optical axis of the alignment camera 15. A through hole corresponding to the optical path of the projection optical system 78 is formed in the work stage 2 and the Y-axis feed base 52.

  Further, in the present embodiment, as shown in FIG. 7, the best focus of the alignment image that detects the position of the mask M having the mask side alignment mark 101 (mask mark surface Mm) and prevents the alignment camera 15 from being out of focus. An adjustment mechanism 150 is provided. In addition to the alignment camera 15 and the focus adjustment mechanism 151, this best focus adjustment mechanism 150 uses the gap sensor 14 as a focus deviation detection means. That is, the measured value of the mask lower surface position measured by the gap sensor 14 is compared with the focus position preset by the control device 80 to obtain a difference, and the relative focus position change amount from the set focus position is calculated from the difference. The alignment camera 15 is moved by controlling the motor 154 of the focus adjustment mechanism 151 according to the calculated change amount, and thereby the focus of the alignment camera 15 is adjusted.

  By using the best focus adjustment mechanism 150, it is possible to perform high-precision focus adjustment of the alignment image regardless of the plate thickness change of the mask M and the plate thickness variation. That is, when a plurality of types of masks M are exchanged and used, proper focus can always be obtained even if the thicknesses of the individual masks are different. Note that the focus adjustment mechanism 151, the projection optical system 78, the best focus adjustment mechanism 150, and the like not only correspond to the high accuracy of the alignment of the first layer divided pattern, but also the high accuracy of the alignment after the second layer. If the thickness of the mask M is known, the best focus adjustment mechanism 150 may be omitted and the focus adjustment mechanism may be moved according to the thickness.

  Note that masking apertures (shielding plates) 17 that shield both ends of the mask M as necessary are disposed at both ends in the Y-axis direction of the opening 10a of the mask stage base 10 so as to be positioned above the mask M. The masking aperture 17 can be moved in the Y-axis direction by a masking aperture driving device 18 including a motor, a ball screw, and a linear guide so that the shielding areas at both ends of the mask M can be adjusted.

  Next, the work stage 2 is installed on the apparatus base 4, and a Z-axis feed base (gap adjusting means) 2A for adjusting the gap between the opposing surfaces of the mask M and the substrate W to a predetermined amount, and this Z A work stage feed mechanism 2B disposed on the axis feed base 2A and moving the work stage 2 in the XY-axis direction.

  As shown in FIG. 8, the Z-axis feed base 2 </ b> A includes a Z-axis coarse movement stage 22 supported so as to be coarsely movable in the Z-axis direction by a vertical coarse movement device 21 erected on the apparatus base 4. A Z-axis fine movement stage 24 supported on a coarse shaft movement stage 22 via a vertical fine movement device 23 (see FIG. 1). For example, an electric actuator composed of a motor and a ball screw or a pneumatic shilling is used for the vertical movement device 21, and the Z-axis coarse movement stage 22 is moved to a preset position by performing a simple vertical movement. Then, it is moved up and down without measuring the gap between the mask M and the substrate W.

  On the other hand, the vertical fine movement device 23 shown in FIG. 1 includes a movable wedge mechanism formed by combining a motor, a ball screw, and a wedge. In this embodiment, for example, a motor installed on the upper surface of the Z-axis coarse movement stage 22. The screw shaft 232 of the ball screw is driven to rotate by H.231, and the ball screw nut 233 is formed in a wedge shape, and the slope of the wedge nut 233 protrudes from the lower surface of the Z-axis fine movement stage 24. Thus, a movable wedge mechanism is configured.

  When the screw shaft 232 of the ball screw is driven to rotate, the wedge-shaped nut 233 is finely moved in the Y-axis direction, and this horizontal fine movement is converted into a highly accurate vertical fine movement by the action of the slopes of both wedges 233 and 241. The

  The vertical fine movement device 23 composed of the movable wedge mechanism includes a total of three units, two on one end side (front side in FIG. 1) in the Y-axis direction and one on the other end side (not shown) of the Z-axis fine movement stage 24. It is installed and each is driven and controlled independently. Accordingly, the vertical fine movement device 23 also has a tilt function. Based on the measurement results of the gaps between the mask M and the substrate W by the three gap sensors 14, the mask M and the substrate W are parallel and predetermined. The height of the Z-axis fine movement stage 24 is finely adjusted so as to face each other through the gap. Note that the vertical coarse motion device 21 and the vertical fine motion device 23 may be provided in the Y-axis feed base 52.

  As shown in FIG. 8, the work stage feed mechanism 2 </ b> B is a kind of two sets of rolling guides that are spaced apart from each other in the Y-axis direction and extended along the X-axis direction on the upper surface of the Z-axis fine movement stage 24. A linear guide 41, an X-axis feed base 42 attached to a slider 41a of the linear guide 41, and an X-axis feed drive device 43 that moves the X-axis feed base 42 in the X-axis direction. The X-axis feed base 42 is connected to a ball screw nut 433 that is screwed onto a ball screw shaft 432 that is rotationally driven by a motor 431 of the X-axis feed driving device 43.

  Further, on the upper surface of the X-axis feed base 42, a linear guide 51 which is a kind of two sets of rolling guides that are spaced apart from each other in the X-axis direction and extend along the Y-axis direction, and the linear guide 51, a Y-axis feed base 52 attached to a slider 51a, and a Y-axis feed drive device 53 that moves the Y-axis feed base 52 in the Y-axis direction. A Y-axis feed base 52 is connected to a ball screw nut (not shown) screwed to a ball screw shaft 532 that is rotationally driven. The work stage 2 is attached to the upper surface of the Y-axis feed base 52.

  A laser length measuring device 60 as a moving distance measuring unit that detects the X-axis and Y-axis positions of the work stage 2 is provided on the device base 4. In the work stage 2 configured as described above, due to errors such as the shape of the ball screw and the linear guide itself, and mounting errors thereof, when the work stage 2 is moved, positioning errors, yawing, straightness, etc. Occurrence is inevitable. The laser length measuring device 60 is intended to measure these errors. As shown in FIG. 1, the laser length measuring device 60 is provided with a pair of Y-axis interferometers 62 and 63 each provided with a laser so as to face the Y-axis direction end of the work stage 2, and the X-axis of the work stage 2. One X-axis interferometer 64 provided at the end of the direction and provided with a laser, a Y-axis mirror 66 disposed at a position facing the Y-axis interferometers 62 and 63 of the work stage 2, and the X of the work stage 2 And an X-axis mirror 68 disposed at a position facing the axial interferometer 64.

  As described above, by providing the two Y-axis interferometers 62 and 63 in the Y-axis direction, not only the information on the Y-axis direction position of the work stage 2 but also the difference between the position data of the Y-axis interferometers 62 and 63. You can also know yawing error. The position in the Y-axis direction can be calculated by appropriately correcting both the average value of the two in consideration of the position in the X-axis direction of the work stage 2 and the yawing error.

  Then, when the next divided pattern is connected and exposed following the exposure of the work stage 2 in the XY direction and the Y-axis feed base 52 and the previous divided pattern, each interference is performed at the stage of sending the substrate W to the next area. The detection signals output from the total 62 to 64 are input to the control device 80 as shown in FIG. The control device 80 controls the X-axis feed driving device 43 and the Y-axis feed driving device 53 in order to adjust the amount of movement in the XY direction for the divided exposure based on the detection signal, and also the X-axis interferometer 64. And the detection results of the Y-axis interferometers 62 and 63 are used to calculate a positioning correction amount for joint exposure, and the calculated result is used as the mask position adjustment means 13 (and the vertical fine movement device 23 as required). Output to. As a result, the mask position adjusting means 13 and the like are driven in accordance with the correction amount, and the influence of positioning error, straightness error, yawing and the like caused by the X-axis feed driving device 43 or the Y-axis feed driving device 53 is eliminated.

  Even when there is no error in feeding the work stage 2, if the orientation of the mask pattern P of the mask M is deviated from the feed direction of the work stage 2 in the initial state, the divided sequential exposure is performed on the substrate W. Each pattern to be formed is formed in an inclined state, or the joints of the patterns formed separately on the substrate W by connection exposure are shifted and not aligned.

  Further, as described above, the mask M is sucked and held on the lower surface of the chuck portion 16 via a vacuum suction device. When sucking and holding the mask M, the orientation of the mask pattern P of the mask M and the work stage feed mechanism 2B are used. It is difficult to match the moving direction of the work stage 2 with high accuracy.

  For example, as shown in FIG. 10 (a), when exposure is performed at an angle θ at the first position, the exposure pattern at the next position is indicated by a two-dot chain line even when there is no feed error. Similarly, it is formed in a tilted state.

  Therefore, in this embodiment, as shown in FIG. 10, for example, a cross shape (reticle) is formed in at least two places on the upper surface of the work stage 2 (actually, the work chuck 8 installed on the work stage 2). The workpiece-side alignment marks 100 are formed apart from each other in the X-axis direction. On the other hand, on the mask M, a mask measurement alignment mark 101 corresponding to the workpiece side alignment mark 100 is formed. The line connecting the centers of the two alignment marks 100 on the reference side is adjusted in advance so as to coincide with the X-axis direction in the initial state (reference position) and to be orthogonal to the Y-axis direction.

  Then, as shown in FIG. 10B, in the initial state (reference position), the alignment camera 15 detects the amount of misalignment between the alignment marks 100 and 101, and the X-axis direction drive device 13x and the Y-axis direction are detected. By adjusting the position of the mask holding frame 12 by the driving device 13y, the centers of the workpiece side alignment mark 100 and the mask side alignment mark 101 are substantially aligned and aligned in the XY plane.

  Further, the alignment between the workpiece side alignment mark 100 and the mask side alignment mark 101 is configured so as to be easily and accurately performed by the alignment camera 15 which is an alignment mark detection means.

  The control device 80 of the present embodiment controls the opening control of the exposure control shutter 34, the feed control of the work stage 2, the calculation of the correction amount based on the detection values of the laser interferometers 62 to 64, and the drive control of the mask position adjusting means 13. In addition to this, it is incorporated into the divided sequential proximity exposure apparatus, such as calculation of the correction amount at the time of alignment adjustment, drive control of the Z-axis feed base (gap adjustment means) 2A, drive control of the automatic workpiece feeder (not shown), and the like. Most actuators are driven and predetermined arithmetic processing is executed based on sequence control using a microcomputer, a sequencer, or the like.

  Therefore, according to the divided sequential exposure apparatus PE of the present embodiment, the mask stage 1 has the chuck portions 16 and 16 that hold the two opposite sides of the mask M, and the mask M is held by the chuck portions 16 and 16. In this case, since the curved shape is substantially flat when bent by its own weight, the flatness of the mask M can be improved, so that highly accurate exposure can be performed. The mask stage 1 holds the mask M by chuck portions 16 and 16 having a plurality of block grooves 16b per side on at least two sides of the mask M, so that a plurality of suction areas of the mask M are provided per side. Therefore, the mask M can be held with an appropriate restraining force. As shown in FIG. 11, even when the mask stage 1 has a chuck portion 16 ′ that holds the four sides of the mask M, the above effect can be achieved by providing a plurality of block grooves 16 b per side. Can do.

  Further, since the mask M is held by the chuck portions 16 and 16 on two sides, the peripheral space of the opening 10a of the mask stage 1 can be used effectively, so that the degree of freedom for installing various electronic devices is improved. Can do. In addition, since the mask M is held by the chuck portions 16 and 16 on two sides, the area where the mask pattern P of the mask M is provided can be increased, so that the exposure area of the mask M can be increased. Furthermore, since the mask M is held by the chuck portions 16 and 16 on two sides, the length of the two sides of the mask M that are not held by the chuck portion 16 can be freely changed, thereby reducing the restriction on the mask size. can do. As shown in FIG. 12, even in the case of the configuration of the chuck portion 16 in which a plurality of suction nozzles 16a provided on one side are surrounded by one box groove 16b, the above-described effect by holding the mask M on two sides can be obtained. Play.

(Second Embodiment)
Next, with reference to FIG. 13, a second embodiment of a divided sequential exposure apparatus which is an exposure apparatus according to the present invention will be described. In addition, about the same or equivalent part as 1st Embodiment, the same code | symbol is attached | subjected to drawing, and the description is abbreviate | omitted or simplified.
FIG. 13 is a bottom view of the mask stage of the second embodiment of the division sequential exposure apparatus according to the present invention.

As shown in FIG. 13, the mask holding frame 12 of the present embodiment includes a pair of chuck portions 90 </ b> L and 90 </ b> R that hold two opposite sides of the mask M at three points on the lower surface thereof. Two suction nozzles 91L that suck and hold one of the two sides facing the X direction of the mask M are opened on the lower surface of the chuck portion 90L, and 2 opposite to the X direction of the mask M are formed on the lower surface of the chuck portion 90R. One suction nozzle 91R that sucks and holds the other side is opened. The suction nozzle 91L is disposed so as to suck and hold both ends of one of the two sides facing the X direction of the mask M, and the suction nozzle 91R is the other of the two sides facing the X direction of the mask M. It arrange | positions so that the center part of the edge | side may be adsorbed-held. The suction nozzles 91L and 91R open to block grooves 92L and 92R, which are suction grooves formed on the lower surfaces of the chuck portions 90L and 90R, respectively.
About another structure and an effect, it is the same as that of 1st Embodiment mentioned above.

(Third embodiment)
Next, with reference to FIG. 14, a third embodiment of a divided sequential exposure apparatus which is an exposure apparatus according to the present invention will be described. In addition, about the same or equivalent part as 1st Embodiment, the same code | symbol is attached | subjected to drawing, and the description is abbreviate | omitted or simplified.
FIG. 14 is a bottom view of the mask stage of the third embodiment of the division sequential exposure apparatus according to the present invention.

  As shown in FIG. 14, the mask holding frame 12 of the present embodiment includes a pair of chuck portions 95 and 95 that hold two opposing sides of the mask M at multiple points on the lower surface thereof. The chuck portions 95 and 95 include a chuck base 96 fixed to the mask stage base 10a and three suction blocks 97 fixed to the chuck base 96 by bolting. The suction block 97 is a chuck base. It arrange | positions at the center part and both ends of 96 of the Y direction, respectively. In addition, one suction nozzle 98 for sucking and holding the mask M is provided on the lower surface of the suction block 97. Each of these suction nozzles 98 opens into a block groove 99 which is a suction groove formed on the lower surface of the suction block 97.

In this embodiment, in order to ensure uniform flatness of the entire suction blocks 97, 97... Individually fixed to the chuck base 96, each suction block 97 temporarily fixed to the chuck base 96 is set in a predetermined manner. The reference surface block having flatness is sucked and held (positioned and fixed) to obtain a uniform predetermined flatness in each suction block 97 and then fixed to the main block.
About another structure and an effect, it is the same as that of 1st Embodiment mentioned above.

In addition, this invention is not limited to each embodiment mentioned above, A deformation | transformation, improvement, etc. are possible suitably.
For example, in this embodiment, the case where a mask formed in a curved shape in the X and Y directions is used as an example, but the present invention is not limited to this, and a mask formed in a curved shape in the X direction may be used.

1 is a partially exploded perspective view for explaining a first embodiment of a divided sequential exposure apparatus according to the present invention. FIG. It is an expansion perspective view of the mask stage shown in FIG. (A) is the sectional view on the AA line of FIG. 2, (b) is a top view of the mask position adjustment means of (a). FIG. 3 is a bottom view of the mask stage shown in FIG. 2. It is a side view which shows the basic structure of an alignment camera and the focus adjustment mechanism of this alignment camera. It is explanatory drawing for demonstrating the irradiation optical system of the workpiece | work side alignment mark. It is a block diagram which shows the focus adjustment mechanism of an alignment image. It is a front view of the division | segmentation successive proximity exposure apparatus shown in FIG. FIG. 2 is a block diagram showing an electrical configuration of the divided sequential proximity exposure apparatus shown in FIG. 1. It is explanatory drawing for demonstrating the alignment of a workpiece | work side alignment mark and a mask side alignment mark. It is a bottom view of the mask stage which is a modification of a chuck | zipper part. It is a bottom view of the mask stage which is the other modification of a chuck | zipper part. It is a bottom view of the mask stage of 2nd Embodiment of the division | segmentation sequential exposure apparatus which concerns on this invention. It is a bottom view of the mask stage of 3rd Embodiment of the division | segmentation sequential exposure apparatus which concerns on this invention. It is sectional drawing for demonstrating the conventional exposure apparatus. It is explanatory drawing for demonstrating the holding state of the mask of the exposure apparatus shown in FIG.

Explanation of symbols

PE division sequential exposure equipment (exposure equipment)
W Glass substrate (material to be exposed, substrate)
M mask P mask pattern 1 mask stage 2 work stage 2A Z-axis feed base (gap adjusting means)
2B Work stage feed mechanism 3 Illumination optical system (irradiation means)
4 Device base 8 Work chuck 10 Mask stage base 12 Mask holding frame 13 Mask position adjusting means 13x X-axis direction drive device 13y Y-axis direction drive device 14 Gap sensor (focus shift detection means)
15 Alignment camera 16 Chuck part (holding part)
16a Suction nozzle 19 Moving mechanism 21 Vertical movement device 22 Z-axis coarse movement stage 23 Vertical movement device 24 Z-axis fine movement stage 60 Laser length measuring device 62, 63 Y-axis interferometer (laser interferometer)
64 X-axis interferometer (laser interferometer)
66 Y-axis mirror 68 X-axis mirror 78 Projection optical system 80 Control device 100 Work side alignment mark 101 Mask side alignment mark 150 Best focus adjustment mechanism 151 Focus adjustment mechanism

Claims (1)

A work stage for holding a substrate as a material to be exposed, a mask stage for holding a mask disposed opposite to the substrate, and an irradiation means for irradiating the substrate with light for pattern exposure through the mask; An exposure apparatus comprising:
The mask stage holds the mask by a holding part having a plurality of suction grooves per side on at least two sides of the mask,
The exposure apparatus according to claim 1, wherein the mask has a curved shape that is substantially flat when bent by its own weight when held by the holding portion.

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