JP2007099966A - Prepreg - Google Patents

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Publication number
JP2007099966A
JP2007099966A JP2005293449A JP2005293449A JP2007099966A JP 2007099966 A JP2007099966 A JP 2007099966A JP 2005293449 A JP2005293449 A JP 2005293449A JP 2005293449 A JP2005293449 A JP 2005293449A JP 2007099966 A JP2007099966 A JP 2007099966A
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Prior art keywords
prepreg
resin
resin film
base material
thermosetting resin
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Yoshihide Kakimoto
佳秀 柿本
Hisao Koba
久雄 木場
Yasushi Suzumura
靖 鈴村
Tadayoshi Saito
忠義 齋藤
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Mitsubishi Rayon Co Ltd
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Mitsubishi Rayon Co Ltd
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Priority to JP2005293449A priority Critical patent/JP2007099966A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a prepreg from which a skin material suppressed in resin deficiency, generation of pinhole and generation of not impregnated part, can be formed even in an oven formation under the atmospheric pressure using no autoclave. <P>SOLUTION: In the prepreg which has a base material (A) consisting of reinforcing fibers, a resin film (B) consisting of a thermosetting resin pasted on one surface of the base material (A), and a resin film (C) consisting of a thermosetting resin pasted on the other surface of the base material (A), and in which the base material (A) is impregnated with parts of thermoplastic resins of the resin film (B) and the resin film (C); the impregnation ratio of the thermosetting resins into the base material (A) is 10-60%, and the weight X g/m<SP>2</SP>of the resin film (B) and the weight Y g/m<SP>2</SP>of the resin film (C) satisfy the relation of formula (1); 0.3≤X/Y≤0.7. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、中空のコア材をプリプレグからなるスキン材で挟んだ積層体を製造する際の中間材料であるプリプレグに関する。   The present invention relates to a prepreg that is an intermediate material when a laminated body in which a hollow core material is sandwiched between skin materials made of prepreg.

ハニカム構造を有する中空のコア材の両面に、繊維強化樹脂のスキン材を設けた、いわゆるハニカムサンドイッチパネルは、軽量であり、かつ優れた機械特性を有することから、航空機、自動車等に幅広く利用されている。
ハニカムサンドイッチパネルは、通常、コア材と、補強繊維に熱硬化性樹脂を含浸させたプリプレグとの間にフィルム状接着剤を挿入し、これらをオートクレーブを用いて加熱、加圧することにより製造される。しかし、オートクレーブの設備は非常に高価なため、新規に導入することは困難ばかりでなく、一旦導入すると、そのオートクレーブの大きさによって成形品の大きさが制限され、それより大きな成形品の製造が事実上不可能となる。
A so-called honeycomb sandwich panel, in which a fiber reinforced resin skin material is provided on both sides of a hollow core material having a honeycomb structure, is lightweight and has excellent mechanical properties, so it is widely used in aircraft, automobiles, etc. ing.
A honeycomb sandwich panel is usually manufactured by inserting a film adhesive between a core material and a prepreg in which a reinforcing fiber is impregnated with a thermosetting resin, and heating and pressing them using an autoclave. . However, since the equipment of the autoclave is very expensive, it is not only difficult to introduce a new one, but once it is introduced, the size of the molded product is limited by the size of the autoclave, which makes it possible to produce larger molded products. Virtually impossible.

そこで、オートクレーブを用いないハニカムサンドイッチパネルの製造方法が検討されている。例えば、型(以下、ツールと記す。)の上にプリプレグ、コア材、およびプリプレグを順に積み重ね、この積重物をバッグで覆い、バッグとツールとの間を排気し、オーブンで加熱するオーブン成形(真空バッグ成形とも呼ばれる。)が提案されている。オーブン成形は、大気圧下で行うため、オートクレーブのようなしっかりした耐圧力容器は不要であり、加熱のみを行うオーブン(炉)があれば実施できる。また、断熱ボードと熱風ヒーターといった簡便な設備でも実施できる。   Thus, a method for manufacturing a honeycomb sandwich panel without using an autoclave has been studied. For example, an oven molding in which a prepreg, a core material, and a prepreg are sequentially stacked on a mold (hereinafter referred to as a tool), the stack is covered with a bag, the space between the bag and the tool is evacuated, and the oven is heated. (Also called vacuum bag molding) has been proposed. Since the oven molding is performed under atmospheric pressure, a solid pressure-resistant container such as an autoclave is not necessary, and can be performed if there is an oven (furnace) that only performs heating. It can also be implemented with simple equipment such as a heat insulation board and a hot air heater.

特許文献1には、セミ含浸プリプレグを用いた、オーブン成形によるハニカムサンドイッチパネルの製造方法が提案されている。セミ含浸プリプレグとは、補強繊維からなる基材の片面に熱硬化性樹脂フィルムを貼り合わせて、熱硬化性樹脂の一部を基材に含浸させたプリプレグ、または熱硬化性樹脂フィルムの両面に基材を貼り合わせて、熱硬化性樹脂の一部を基材に含浸させたプリプレグである。
しかし、セミ含浸プリプレグを用い、オーブン成形によって得られたハニカムサンドイッチパネルには、ツールに接したスキン材の表面に樹脂枯れまたはピンホールが発生する問題がある。
Patent Document 1 proposes a method for manufacturing a honeycomb sandwich panel by oven molding using a semi-impregnated prepreg. Semi-impregnated prepreg is a prepreg in which a thermosetting resin film is bonded to one side of a base material made of reinforcing fibers, and a part of the thermosetting resin is impregnated into the base material, or both sides of the thermosetting resin film. It is a prepreg in which a base material is bonded and a base material is impregnated with a part of the thermosetting resin.
However, a honeycomb sandwich panel obtained by oven-molding using a semi-impregnated prepreg has a problem that resin withering or pinholes occur on the surface of the skin material in contact with the tool.

また、低コスト化の要求から、高目付の補強繊維を用いたプリプレグが求められている。しかし、セミ含浸プリプレグの基材として、目付が400g/m2 以上の基材を用いた場合、オーブン成形では補強繊維に熱硬化性樹脂が含浸しにくくなる。そのため、スキン材としたときに、補強繊維に熱硬化性樹脂が含浸していない未含浸部分が生じ、ハニカムサンドイッチパネルの優れた機械特性を損なってしまう。
特開2004−058609号公報
In addition, from the demand for cost reduction, a prepreg using a high-weight reinforcing fiber is required. However, when a base material having a basis weight of 400 g / m 2 or more is used as the base material of the semi-impregnated prepreg, it is difficult for the thermosetting resin to be impregnated into the reinforcing fiber by oven molding. For this reason, when the skin material is used, an unimpregnated portion in which the reinforcing fiber is not impregnated with the thermosetting resin is generated, and the excellent mechanical properties of the honeycomb sandwich panel are impaired.
JP 2004-058609 A

本発明の目的は、オートクレーブを用いない大気圧下のオーブン成形であっても、樹脂枯れ、ピンホールの発生、未含浸部分の発生が抑えられたスキン材を形成できるプリプレグを提供することにある。   It is an object of the present invention to provide a prepreg capable of forming a skin material in which resin withering, generation of pinholes, and generation of unimpregnated portions are suppressed even in oven molding under atmospheric pressure without using an autoclave. .

本発明のプリプレグは、補強繊維からなる基材(A)と、基材(A)の一方の面に貼り合わされた、熱硬化性樹脂からなる樹脂フィルム(B)と、基材(A)の他方の面に貼り合わされた、熱硬化性樹脂からなる樹脂フィルム(C)とを有し、樹脂フィルム(B)および樹脂フィルム(C)の熱硬化性樹脂の一部が、基材(A)に含浸したプリプレグであって、基材(A)への熱硬化性樹脂の含浸率が、10〜60%であり、樹脂フィルム(B)の重さX(g/m2 )と樹脂フィルム(C)の重さY(g/m2 )とが、下記式(1)の関係を満足することを特徴とする。
0.3≦X/Y≦0.7 ・・・(1)
The prepreg of the present invention comprises a base material (A) made of reinforcing fibers, a resin film (B) made of a thermosetting resin bonded to one surface of the base material (A), and a base material (A). A resin film (C) made of a thermosetting resin, which is bonded to the other surface, and a part of the thermosetting resin of the resin film (B) and the resin film (C) is a base material (A) The prepreg impregnated with the base material (A) has an impregnation ratio of the thermosetting resin of 10 to 60%, and the weight X (g / m 2 ) of the resin film (B) and the resin film ( The weight Y (g / m 2 ) of C) satisfies the relationship of the following formula (1).
0.3 ≦ X / Y ≦ 0.7 (1)

本発明のプリプレグによれば、オートクレーブを用いない大気圧下のオーブン成形であっても、樹脂枯れ、ピンホールの発生、未含浸部分の発生が抑えられたスキン材を形成できる。   According to the prepreg of the present invention, it is possible to form a skin material in which resin withering, generation of pinholes, and generation of unimpregnated portions are suppressed even in oven molding under atmospheric pressure without using an autoclave.

<プリプレグ>
図1は、本発明のプリプレグの一例を示す概略断面図である。プリプレグ10は、基材(A)11と、基材(A)11の一方の面に貼り合わされた樹脂フィルム(B)12と、基材(A)11の他方の面に貼り合わされた樹脂フィルム(C)13とを有し、樹脂フィルム(B)12および樹脂フィルム(C)13の熱硬化性樹脂の一部が、基材(A)11に含浸したプリプレグである。
<Prepreg>
FIG. 1 is a schematic cross-sectional view showing an example of the prepreg of the present invention. The prepreg 10 includes a base material (A) 11, a resin film (B) 12 bonded to one surface of the base material (A) 11, and a resin film bonded to the other surface of the base material (A) 11. (C) 13 and a part of the thermosetting resin of the resin film (B) 12 and the resin film (C) 13 is a prepreg impregnated in the base material (A) 11.

(基材(A))
基材(A)11は、補強繊維からなるシート状補強基材であり、熱硬化性樹脂が含浸した含浸部14と、熱硬化性樹脂が含浸していない未含浸部15とから構成される。
補強繊維としては、ガラス繊維、アラミド繊維、炭素繊維等が挙げられる。補強繊維としては、比強度、比剛性に優れた炭素繊維が好ましい。また、補強繊維としては、強度、剛性の点から、連続繊維が好ましい。
(Base material (A))
The base material (A) 11 is a sheet-like reinforcing base material made of reinforcing fibers, and is composed of an impregnated portion 14 impregnated with a thermosetting resin and an unimpregnated portion 15 not impregnated with the thermosetting resin. .
Examples of the reinforcing fiber include glass fiber, aramid fiber, and carbon fiber. As the reinforcing fiber, a carbon fiber excellent in specific strength and specific rigidity is preferable. The reinforcing fiber is preferably a continuous fiber from the viewpoint of strength and rigidity.

基材(A)11の形態としては、補強繊維が一方向に引き揃えられた一方向材;織物;編物;補強繊維が一方向または多方向に引き揃えられたものを積層したマルチファブリックをステッチングしたステッチングシート等が挙げられる。基材(A)11の形態としては、コア材の形状に合わせて容易に積層できるドレープ性を有する点で、織物が好ましい。織物の組織としては、平織、綾織、朱子織等が挙げられる。   As a form of the base material (A) 11, a unidirectional material in which reinforcing fibers are aligned in one direction; a woven fabric; a knitted fabric; a multi-fabric in which layers of reinforcing fibers are aligned in one direction or in multiple directions are stitched Stitched sheets and the like. As a form of the base material (A) 11, a woven fabric is preferable in that it has a drape property that can be easily laminated in accordance with the shape of the core material. Examples of the fabric structure include plain weave, twill weave and satin weave.

基材(A)11の目付は、400g/m2 以上が好ましい。本発明のプリプレグにあっては、目付が400g/m2 以上の基材(A)11を用いた場合であっても、オーブン成形の際に、基材(A)11に熱可塑性樹脂が充分に含浸するため、スキン材に未含浸部ができにくく、機械特性が良好になる。 The basis weight of the substrate (A) 11 is preferably 400 g / m 2 or more. In the prepreg of the present invention, even when the base material (A) 11 having a basis weight of 400 g / m 2 or more is used, the base material (A) 11 has sufficient thermoplastic resin during the oven molding. Therefore, it is difficult to form an unimpregnated portion in the skin material, and mechanical properties are improved.

基材(A)11への熱硬化性樹脂の含浸率は、10〜60%であり、20〜50%が好ましく、30〜40%がより好ましい。含浸率を10%以上とすることにより、オーブン成形の際に、基材(A)11に熱可塑性樹脂が充分に含浸するため、スキン材に未含浸部ができにくく、機械特性がさらに良好になる。含浸率を60%以下とすることにより、オーブン成形の脱気の際に、脱気通路となる未含浸部分が充分に確保されるため、スキン材内、およびスキン材とツールとの間の空気を充分に脱気でき、スキン材内のボイドの発生、およびスキン材表面のピンホールの発生が抑えられ、機械特性およびや外観を損なうことがない。   The impregnation rate of the thermosetting resin into the substrate (A) 11 is 10 to 60%, preferably 20 to 50%, and more preferably 30 to 40%. By setting the impregnation rate to 10% or more, the base material (A) 11 is sufficiently impregnated with the thermoplastic resin during the oven molding, so that the non-impregnated portion is hardly formed in the skin material, and the mechanical properties are further improved. Become. By setting the impregnation rate to 60% or less, an unimpregnated portion serving as a degassing passage is sufficiently ensured during the degassing of the oven molding, so the air in the skin material and between the skin material and the tool The generation of voids in the skin material and the generation of pinholes on the surface of the skin material are suppressed, and the mechanical properties and appearance are not impaired.

含浸率は、熱硬化性樹脂が硬化反応中に実質的に流動しない条件で、プリプレグ10を硬化させた後に、硬化されたプリプレグ10の研磨断面を顕微鏡で観察し、含浸部14の占める面積の割合を算出することによって求められる。
プリプレグ10の断面を観察して、含浸部14と未含浸部15とを明確に区別するためには、プリプレグ10の断面を研磨処理しなければならない。そのためには、プリプレグ10を加熱して硬化させる必要がある。しかし、熱硬化性樹脂を加熱していくと、その粘度は温度上昇につれて一旦低下し、熱硬化性樹脂の流動が見られるようになる。硬化過程で熱硬化性樹脂が流動すると、プリプレグ10内に当初から存在していた未含浸部15に熱硬化性樹脂が入り込みことになり、得られたプリプレグ10の含浸率は、硬化前と異なってしまう。したがって、プリプレグ10の硬化においては、硬化反応による熱硬化性樹脂の粘度上昇分が、温度上昇による熱硬化性樹脂の粘度低下分を上回る必要がある。そのためには、温度を徐々に上昇させることによって熱硬化性樹脂を硬化させればよい。例えば、好ましい昇温速度は1℃/時間以下である。
The impregnation ratio is the area occupied by the impregnated portion 14 by observing the polished cross section of the cured prepreg 10 with a microscope after the prepreg 10 is cured under the condition that the thermosetting resin does not substantially flow during the curing reaction. It is obtained by calculating the ratio.
In order to clearly distinguish the impregnated portion 14 and the non-impregnated portion 15 by observing the cross section of the prepreg 10, the cross section of the prepreg 10 must be polished. For this purpose, it is necessary to heat and cure the prepreg 10. However, when the thermosetting resin is heated, its viscosity once decreases as the temperature rises, and the flow of the thermosetting resin is observed. When the thermosetting resin flows in the curing process, the thermosetting resin enters the unimpregnated portion 15 that has been present in the prepreg 10 from the beginning, and the impregnation ratio of the obtained prepreg 10 is different from that before the curing. End up. Therefore, in the curing of the prepreg 10, the increase in the viscosity of the thermosetting resin due to the curing reaction needs to exceed the decrease in the viscosity of the thermosetting resin due to the temperature increase. For this purpose, the thermosetting resin may be cured by gradually increasing the temperature. For example, a preferable temperature increase rate is 1 ° C./hour or less.

このようにして硬化させたプリプレグ10の研磨断面を光学顕微鏡によって観察すると、プリプレグ10中の未含浸部15は、マトリックス樹脂が欠落した空隙として観察される。写真撮影した顕微鏡像中の基材(A)11の面積をaとし、この部分の中に存在する未含浸部15(空隙)が占める面積をbとした場合、含浸率は下式(2)によって算出される。
含浸率(%)=(a−b)/a×100 ・・・(2)
When the polished cross section of the prepreg 10 thus cured is observed with an optical microscope, the unimpregnated portion 15 in the prepreg 10 is observed as a void lacking the matrix resin. When the area of the base material (A) 11 in the photographed microscopic image is a and the area occupied by the unimpregnated portion 15 (void) present in this portion is b, the impregnation rate is expressed by the following formula (2) Is calculated by
Impregnation rate (%) = (ab) / a × 100 (2)

(樹脂フィルム)
樹脂フィルム(B)12、樹脂フィルム(C)13は、熱硬化性樹脂からなるフィルムである。
熱硬化性樹脂としては、エポキシ樹脂、フェノール樹脂、ビスマレイミド樹脂、ビニールエステル樹脂、ベンゾオキサジン樹脂等が挙げられる。熱硬化性樹脂としては、機械特性に優れるエポキシ樹脂が好ましい。熱硬化性樹脂は、硬化剤、硬化促進剤等を含んでいてもよい。
(Resin film)
The resin film (B) 12 and the resin film (C) 13 are films made of a thermosetting resin.
Examples of the thermosetting resin include an epoxy resin, a phenol resin, a bismaleimide resin, a vinyl ester resin, and a benzoxazine resin. As the thermosetting resin, an epoxy resin excellent in mechanical properties is preferable. The thermosetting resin may contain a curing agent, a curing accelerator and the like.

樹脂フィルム(B)は、樹脂フィルム(C)よりも軽いフィルムであり、樹脂フィルム(B)12の重さX(g/m2 )と樹脂フィルム(C)13の重さY(g/m2 )とは、下記式(1)の関係を満足する必要がある。
0.3≦X/Y≦0.7 ・・・(1)
The resin film (B) is a lighter film than the resin film (C), and the weight X (g / m 2 ) of the resin film (B) 12 and the weight Y (g / m) of the resin film (C) 13. With 2 ), it is necessary to satisfy the relationship of the following formula (1).
0.3 ≦ X / Y ≦ 0.7 (1)

X/Yを0.3以上とすることによって、樹脂フィルム(B)12がツールに接した状態でオーブン成形を行うことによって形成されるスキン材表面に、樹脂枯れが発生しにくくなり、外観を損なうことがない。これは、樹脂フィルム(B)12の量をある程度確保することによって、コア材の中空部(セル)に熱硬化性樹脂が吸われても、プリプレグ10表面の熱硬化性樹脂が不足することがなく、熱硬化性樹脂の不足に起因する樹脂枯れが発生しにくくなっているためである。X/Yを0.7以下とすることにより、ツールとこれに接するプリプレグ10の樹脂フィルム(B)12との間の空気が充分に脱気されるため、スキン材表面に、空気に起因するピンホールが発生しにくくなり、外観を損うことがない。   By setting X / Y to 0.3 or more, the resin material (B) 12 is less likely to wither resin on the skin material surface formed by performing oven molding in a state where the resin film (B) is in contact with the tool. There is no loss. This is because by securing the amount of the resin film (B) 12 to some extent, the thermosetting resin on the surface of the prepreg 10 may be insufficient even if the thermosetting resin is sucked into the hollow portion (cell) of the core material. This is because the resin withering due to the shortage of thermosetting resin is less likely to occur. By setting X / Y to be 0.7 or less, air between the tool and the resin film (B) 12 of the prepreg 10 in contact with the tool is sufficiently deaerated. Pinholes are less likely to occur and the appearance is not impaired.

(プリプレグの製造)
プリプレグ10は、例えば、基材(A)11の一方の面に、離型紙上に形成された樹脂フィルム(B)12の樹脂面を貼り合わせ、基材(A)11の他方の面に、離型紙上に形成された樹脂フィルム(C)13の樹脂面を貼り合わせ、両面の離型紙側から加熱しながら加圧することによって製造される。
加圧手段としては、ヒュージングプレス等が挙げられる。
(Manufacture of prepreg)
For example, the prepreg 10 is bonded to the one surface of the base material (A) 11 with the resin surface of the resin film (B) 12 formed on the release paper, and to the other surface of the base material (A) 11. The resin surface of the resin film (C) 13 formed on the release paper is bonded together, and the resin film (C) 13 is manufactured by applying pressure while heating from the both sides of the release paper.
An example of the pressurizing means is a fusing press.

<積層体>
積層体は、中空のコア材と、コア材の両面に設けられたスキン材とを有する積層体であって、少なくとも一方のスキン材が、本発明のプリプレグからなり、かつ樹脂フィルム(B)が最外層となるように設けられているものである。該積層体は、スキン材における樹脂枯れ、ピンホールの発生、未含浸部分の発生が抑えられたものとなる。
図2は、積層体の一例を示す概略断面図である。積層体20は、中空のコア材21と、コア材21の両面に設けられたスキン材22,23とを有する積層体である。
<Laminated body>
The laminate is a laminate having a hollow core material and skin materials provided on both surfaces of the core material, at least one skin material being made of the prepreg of the present invention, and the resin film (B) being It is provided to be the outermost layer. In the laminate, resin withering in the skin material, generation of pinholes, and generation of unimpregnated portions are suppressed.
FIG. 2 is a schematic cross-sectional view showing an example of a laminated body. The laminate 20 is a laminate having a hollow core material 21 and skin materials 22 and 23 provided on both surfaces of the core material 21.

コア材21は、中空部を有する成形体である。コア材21としては、複数の柱状の開放セルを有するコア材が好ましく、ハニカム構造を有するコア材(以下、ハニカム材と記す。)が特に好ましい。ハニカム材としては、アルミニウムからなるアルミハニカム、繊維強化樹脂(FRP)からなるFRPハニカム、アラミド繊維の不織布にフェノール樹脂を含浸させたアラミドハニカム等が挙げられる。   The core material 21 is a molded body having a hollow portion. As the core material 21, a core material having a plurality of columnar open cells is preferable, and a core material having a honeycomb structure (hereinafter referred to as a honeycomb material) is particularly preferable. Examples of the honeycomb material include an aluminum honeycomb made of aluminum, an FRP honeycomb made of fiber reinforced resin (FRP), and an aramid honeycomb in which a non-woven fabric of an aramid fiber is impregnated with a phenol resin.

スキン材22は、プリプレグ10を硬化させてなるものであり、プリプレグ10の樹脂フィルム(C)13がコア材21側となり、樹脂フィルム(B)12が最外層となるように設けられている。
スキン材23は、プリプレグを硬化させてなるものである。スキン材23となるプリプレグは、プリプレグ10であってもよく、プリプレグ10以外の公知のプリプレグであってもよい。スキン材23となるプリプレグが、プリプレグ10である場合、プリプレグ10の樹脂フィルム(B)12がコア材21側となるように設けられていてもよく、樹脂フィルム(B)12が最外層となるように設けられていてもよい。
The skin material 22 is formed by curing the prepreg 10 and is provided so that the resin film (C) 13 of the prepreg 10 is on the core material 21 side and the resin film (B) 12 is the outermost layer.
The skin material 23 is formed by curing a prepreg. The prepreg to be the skin material 23 may be the prepreg 10 or a known prepreg other than the prepreg 10. When the prepreg used as the skin material 23 is the prepreg 10, the resin film (B) 12 of the prepreg 10 may be provided on the core material 21 side, and the resin film (B) 12 is the outermost layer. It may be provided as follows.

積層体20は、コア材21およびスキン材22,23以外の他の層を有していてもよい。他の層としては、コア材21とスキン材22との間に設けられた、熱硬化性樹脂の接着剤からなる接着剤層(図示略)等が挙げられる。   The laminate 20 may have a layer other than the core material 21 and the skin materials 22 and 23. Examples of the other layers include an adhesive layer (not shown) made of a thermosetting resin adhesive provided between the core material 21 and the skin material 22.

<積層体の製造方法>
積層体の製造方法は、プリプレグ、中空のコア材、およびプリプレグを順に積み重ねた積重物をツールの上に配置し、積重物をバッグで覆い、積重物の周囲にてバッグとツールとの間をシールし、バッグとツールとの間を脱気し、プリプレグの熱硬化性樹脂を加熱し、硬化させる積層体の製造方法において、ツールに接するプリプレグとして、本発明のプリプレグを用い、かつ樹脂フィルム(B)がツールに接するように配置することを特徴とする。該製造方法によれば、スキン材における樹脂枯れ、ピンホールの発生、未含浸部分の発生が抑えられた積層体を製造できる。
<Method for producing laminate>
A method of manufacturing a laminated body includes placing a prepreg, a hollow core material, and a stack of prepregs in order on a tool, covering the stack with a bag, and surrounding the stack with a bag and a tool. In the manufacturing method of a laminate in which the space between the bag and the tool is deaerated, the thermosetting resin of the prepreg is heated and cured, the prepreg of the present invention is used as the prepreg in contact with the tool, and It arrange | positions so that a resin film (B) may contact | connect a tool, It is characterized by the above-mentioned. According to this manufacturing method, it is possible to manufacture a laminate in which the resin withering in the skin material, the generation of pinholes, and the generation of unimpregnated portions are suppressed.

積層体20は、例えば、以下のようにして製造される。
(1)図3に示すように、プリプレグ10、接着剤シート31、コア材21、接着剤シート31、およびプリプレグ16を順に積み重ねた積重物を、ツール30の上に配置する。
(2)積重物上に、必要に応じて離型フィルム32、不織布33を被せた後、積重物をバッグ34で覆う。
(3)積重物の周囲にてバッグ34とツール30との間をシーラント35にて気密にシールする。
(4)バッグ34とツール30との間を真空ポンプ(図示略)に接続した真空引き口36から脱気する。
(5)脱気を行いながら、大気下のオーブン内で加熱し、プリプレグ10の熱硬化性樹脂を硬化させ、積層体を得る。
The laminated body 20 is manufactured as follows, for example.
(1) As shown in FIG. 3, a stack in which the prepreg 10, the adhesive sheet 31, the core material 21, the adhesive sheet 31, and the prepreg 16 are sequentially stacked is disposed on the tool 30.
(2) The release film 32 and the non-woven fabric 33 are covered on the stack as necessary, and then the stack is covered with the bag 34.
(3) The bag 34 and the tool 30 are hermetically sealed with a sealant 35 around the stack.
(4) The space between the bag 34 and the tool 30 is deaerated from the vacuum suction port 36 connected to a vacuum pump (not shown).
(5) While performing deaeration, it heats in the oven under air | atmosphere, the thermosetting resin of the prepreg 10 is hardened, and a laminated body is obtained.

積重物をツール30の上に配置する際は、(i)あらかじめ別の場所にて、プリプレグ10、接着剤シート31、コア材21、接着剤シート31、およびプリプレグ16を順に積み重ねて形成した積重物を、ツール30の上に配置してもよく、(ii)ツール30の上に、プリプレグ10、接着剤シート31、コア材21、接着剤シート31、およびプリプレグ16を順に積み重ねて積重物を形成することによって、結果的に積重物をツール30の上に配置するようにしてもよい。
この際、プリプレグ10は、樹脂フィルム(C)13がコア材21に直接(または間接的に)接する側となり、樹脂フィルム(B)がツール30に直接、接する側となるように積み重ねる。
プリプレグ16は、プリプレグ10であってもよく、プリプレグ10以外の公知のプリプレグであってもよい。プリプレグ16としてプリプレグ10を用いる場合、プリプレグ16の樹脂フィルム(B)12がコア材21側となるように積み重ねられてもよく、樹脂フィルム(B)12がバッグ34側となるように積み重ねられてもよい。
オーブン内での加熱温度、加熱時間等は、用いた熱可塑性樹脂の種類、量、積層体に要求される物性等に応じて適宜決定すればよい。
When placing the stack on the tool 30, (i) the prepreg 10, the adhesive sheet 31, the core material 21, the adhesive sheet 31, and the prepreg 16 were sequentially stacked in advance at another location. The stack may be disposed on the tool 30. (ii) On the tool 30, the prepreg 10, the adhesive sheet 31, the core material 21, the adhesive sheet 31, and the prepreg 16 are stacked in order. As a result, the stack may be arranged on the tool 30 by forming the stack.
At this time, the prepreg 10 is stacked such that the resin film (C) 13 is on the side in direct contact (or indirectly) with the core material 21 and the resin film (B) is on the side in direct contact with the tool 30.
The prepreg 16 may be the prepreg 10 or a known prepreg other than the prepreg 10. When the prepreg 10 is used as the prepreg 16, the resin film (B) 12 of the prepreg 16 may be stacked so as to be on the core material 21 side, or may be stacked so that the resin film (B) 12 is on the bag 34 side. Also good.
What is necessary is just to determine suitably the heating temperature in an oven, heating time, etc. according to the kind etc. and quantity of the used thermoplastic resin, the physical property requested | required of a laminated body, etc.

以下、実施例を挙げて本発明を具体的に説明する。
(熱硬化性樹脂の調製)
エピコート828(ジャパンエポキシレジン社製)35質量部、アラルダイトAER4152(旭化成社製)37質量部、エピコート1002(ジャパンエポキシレジン社製)28質量部、およびEPPN502H(日本化薬社製)20質量部に、フェノトートYP70(東都化成社製)5質量部を160℃で溶解させ、ベース樹脂を調製した。
Hereinafter, the present invention will be specifically described with reference to examples.
(Preparation of thermosetting resin)
Epicoat 828 (manufactured by Japan Epoxy Resin) 35 parts by mass, Araldite AER4152 (manufactured by Asahi Kasei) 37 parts by mass, Epikote 1002 (manufactured by Japan Epoxy Resin) 28 parts by mass, and EPPN 502H (manufactured by Nippon Kayaku Co., Ltd.) 20 parts by mass A base resin was prepared by dissolving 5 parts by mass of phenotote YP70 (manufactured by Toto Kasei Co., Ltd.) at 160 ° C.

ベース樹脂とは別に、エピコート828(ジャパンエポキシレジン社製)12質量部、およびDCMU99(保土々谷化学社製)6質量部に、Dicy7(ジャパンエポキシレジン社製)4質量部を加え、3本ロールミルを用いて均一に分散させて触媒樹脂を調製した。
ベース樹脂120質量部と、触媒樹脂22質量部とを混合し、60℃にて均一に分散させて熱硬化性樹脂を得た。
Aside from the base resin, 4 parts by mass of Dicy7 (Japan Epoxy Resin Co., Ltd.) is added to 12 parts by mass of Epicoat 828 (Japan Epoxy Resin Co., Ltd.) and 6 parts by mass of DCMU99 (Hodogaya Chemical Co., Ltd.). A catalyst resin was prepared by uniformly dispersing using the present roll mill.
120 parts by mass of the base resin and 22 parts by mass of the catalyst resin were mixed and uniformly dispersed at 60 ° C. to obtain a thermosetting resin.

〔実施例1〕
(樹脂フィルムの製造)
熱硬化性樹脂を、フィルムコーターを用いて150g/m2 となるように離型紙に塗布し、樹脂フィルム(B)を得た。
同様に、熱硬化性樹脂を、フィルムコーターを用いて380g/m2 となるように離型紙に塗布し、樹脂フィルム(C)を得た。
[Example 1]
(Manufacture of resin film)
The thermosetting resin was applied to a release paper using a film coater so as to be 150 g / m 2 to obtain a resin film (B).
Similarly, a thermosetting resin was applied to release paper using a film coater so as to be 380 g / m 2 to obtain a resin film (C).

(プリプレグの製造)
基材(A)として、三菱レイヨン社製のTRK510(炭素繊維としてパイロフィルTR50S12Lを用いた、目付が648g/m2 の2/2綾織クロス。)を用意した。
基材(A)11の一方の面に、離型紙上に形成された樹脂フィルム(B)12の樹脂面を貼り合わせ、基材(A)11の他方の面に、離型紙上に形成された樹脂フィルム(C)13の樹脂面を貼り合わせ、温度50℃、圧力0.2MPa、送り速度1m/分の条件で、ヒュージングプレス(アサヒ繊維機械工業(株)、JR−600S、処理長1340mm、圧力はシリンダー圧)を用いて、両面の離型紙側から加熱しながら加圧し、プリプレグを得た。
(Manufacture of prepreg)
As a base material (A), TRK510 manufactured by Mitsubishi Rayon Co., Ltd. (2/2 twill cloth using Pyrofil TR50S12L as a carbon fiber and having a basis weight of 648 g / m 2 ) was prepared.
The resin surface of the resin film (B) 12 formed on the release paper is bonded to one surface of the substrate (A) 11, and the other surface of the substrate (A) 11 is formed on the release paper. The resin surface of the resin film (C) 13 was bonded, and the fusing press (Asahi Textile Machine Industry Co., Ltd., JR-600S, treatment length under the conditions of temperature 50 ° C., pressure 0.2 MPa, feed rate 1 m / min. Using a pressure of 1340 mm and a pressure of cylinder pressure), pressure was applied while heating from both sides of the release paper to obtain a prepreg.

(積層体の製造)
コア材として、200mm×200mmにカットしたアルミハニカム(昭和飛行機工業社製、AL1/8−52−10P)を用意し、接着剤シートとして、シート状エポキシ樹脂接着剤(三菱レイヨン社製、NB101HC50)を用意した。
コア材の両面に接着剤シートを貼り合わせ、さらにその両面に330mm×330mmにカットしたプリプレグを貼り合わせて積重物を作製した。この際、プリプレグは、樹脂フィルム(C)がコア材に接着剤シートを介して接する側となり、樹脂フィルム(B)がツールまたはバッグに接する側となるように貼り合わせた。
(Manufacture of laminates)
An aluminum honeycomb cut to 200 mm × 200 mm (AL1 / 8-52-10P) prepared as a core material was prepared, and a sheet-like epoxy resin adhesive (manufactured by Mitsubishi Rayon Co., Ltd., NB101HC50) was prepared as an adhesive sheet. Prepared.
An adhesive sheet was bonded to both surfaces of the core material, and a prepreg cut to 330 mm × 330 mm was bonded to both surfaces to produce a stack. At this time, the prepreg was bonded so that the resin film (C) was on the side in contact with the core material via the adhesive sheet, and the resin film (B) was on the side in contact with the tool or bag.

積重物を、図3に示すように、ツールの上に配置し、積重物上に離型フィルム(旭硝子社製、アフロンフィルム)、不織布を被せ、さらにこれらをナイロンバッグで覆った。
ついで、積重物の周囲にてナイロンバッグとツールとの間をシーラントにて気密にシールし、ナイロンバッグとツールとの間を真空ポンプに接続した真空引き口から、室温にて6時間脱気した。
As shown in FIG. 3, the stack was placed on a tool, and a release film (Aflon film manufactured by Asahi Glass Co., Ltd.) and a nonwoven fabric were placed on the stack, and these were further covered with a nylon bag.
Next, between the nylon bag and the tool is hermetically sealed with a sealant around the stack, and the nylon bag and the tool are deaerated for 6 hours at room temperature from a vacuum port connected to a vacuum pump. did.

ついで、ナイロンバッグで覆われた積重物を、ツールごとオーブン内に入れ、ナイロンバッグとツールとの間を脱気しながら、昇温速度1℃/分で室温から100℃まで昇温した後、100℃で1時間保持し、さらに昇温速度1℃/分で150℃まで昇温した後、150℃で2時間保持して、プリプレグの熱硬化性樹脂を硬化させ、積層体(ハニカムサンドイッチパネル)を得た。
得られたプリプレグおよび積層体について、以下の評価を行った。結果を表1に示す。
Next, after the stack covered with the nylon bag is put in the oven together with the tool, the temperature is raised from room temperature to 100 ° C. at a heating rate of 1 ° C./min while degassing between the nylon bag and the tool. , Held at 100 ° C. for 1 hour, further heated to 150 ° C. at a heating rate of 1 ° C./min, and then held at 150 ° C. for 2 hours to cure the thermosetting resin of the prepreg and laminate (honeycomb sandwich) Panel).
The following evaluation was performed about the obtained prepreg and laminated body. The results are shown in Table 1.

(含浸率)
プリプレグをオーブン内に入れ、昇温速度0.7℃/時間で25℃から150℃まで昇温した後、150℃で2時間保持した。硬化されたプリプレグの断面を研磨し、光学顕微鏡にて研磨断面を観察した。写真撮影した顕微鏡像中の基材(A)の面積をaとし、この部分の中に存在する未含浸部(空隙)が占める面積をbとし、含浸率を下式(2)から算出した。
含浸率(%)=(a−b)/a×100 ・・・(2)
(Impregnation rate)
The prepreg was put in an oven, heated from 25 ° C. to 150 ° C. at a heating rate of 0.7 ° C./hour, and then held at 150 ° C. for 2 hours. The cross section of the cured prepreg was polished, and the polished cross section was observed with an optical microscope. The area of the base material (A) in the photographed microscopic image was a, the area occupied by the unimpregnated part (void) present in this part was b, and the impregnation rate was calculated from the following formula (2).
Impregnation rate (%) = (ab) / a × 100 (2)

(ピンホール、樹脂枯れ)
オーブン成形時にツールに接していたスキン材の表面を目視にて観察し、ピンホールの個数および樹脂枯れの有無を確認した。
(スキン材の未含浸部の有無)
積層体を湿式カッターにて切断し、切断面を研磨し、研磨断面を光学顕微鏡にて観察した。ツールに接していたスキン材の未含浸部(空隙)の有無を確認した。
(Pinhole, resin dies)
The surface of the skin material that was in contact with the tool at the time of oven molding was visually observed to confirm the number of pinholes and the presence or absence of resin wilt.
(Presence or absence of non-impregnated skin material)
The laminate was cut with a wet cutter, the cut surface was polished, and the polished cross section was observed with an optical microscope. The presence or absence of an unimpregnated portion (void) of the skin material that was in contact with the tool was confirmed.

〔実施例2、3〕
樹脂フィルム(B)の重さX、および樹脂フィルム(C)の重さYを表1に示す重さに変更した以外は、実施例1と同様にしてプリプレグ、および積層体を製造した。
得られたプリプレグおよび積層体について、実施例1と同様の評価を行った。結果を表1に示す。
[Examples 2 and 3]
A prepreg and a laminate were manufactured in the same manner as in Example 1 except that the weight X of the resin film (B) and the weight Y of the resin film (C) were changed to the weights shown in Table 1.
About the obtained prepreg and laminated body, evaluation similar to Example 1 was performed. The results are shown in Table 1.

〔実施例4〕
プリプレグ製造時の温度を40℃とし、圧力を0.3MPaとし、送り速度を2m/分とした以外は、実施例1と同様にしてプリプレグ、および積層体を製造した。
得られたプリプレグおよび積層体について、実施例1と同様の評価を行った。結果を表1に示す。
Example 4
A prepreg and a laminate were manufactured in the same manner as in Example 1 except that the temperature during prepreg production was 40 ° C., the pressure was 0.3 MPa, and the feed rate was 2 m / min.
About the obtained prepreg and laminated body, evaluation similar to Example 1 was performed. The results are shown in Table 1.

〔実施例5〕
プリプレグ製造時の温度を60℃とし、圧力を0.15MPaとし、送り速度を0.7m/分とした以外は、実施例1と同様にしてプリプレグ、および積層体を製造した。
得られたプリプレグおよび積層体について、実施例1と同様の評価を行った。結果を表1に示す。
Example 5
A prepreg and a laminate were produced in the same manner as in Example 1 except that the temperature during prepreg production was 60 ° C., the pressure was 0.15 MPa, and the feed rate was 0.7 m / min.
About the obtained prepreg and laminated body, evaluation similar to Example 1 was performed. The results are shown in Table 1.

〔実施例6〕
基材(A)として、三菱レイヨン社製のTRK101(炭素繊維としてパイロフィルTR30S3Lを用いた、目付が400g/m2 の平織クロス。)を用い、樹脂フィルム(B)の重さX、および樹脂フィルム(C)の重さYを表1に示す重さに変更した以外は、実施例1と同様にしてプリプレグ、および積層体を製造した。
得られたプリプレグおよび積層体について、実施例1と同様の評価を行った。結果を表1に示す。
Example 6
As a base material (A), TRK101 manufactured by Mitsubishi Rayon Co., Ltd. (a plain woven cloth using pyrofil TR30S3L as carbon fiber and having a basis weight of 400 g / m 2 ), a weight X of the resin film (B), and a resin film A prepreg and a laminate were manufactured in the same manner as in Example 1 except that the weight Y of (C) was changed to the weight shown in Table 1.
About the obtained prepreg and laminated body, evaluation similar to Example 1 was performed. The results are shown in Table 1.

〔比較例1、2〕
樹脂フィルム(B)の重さX、および樹脂フィルム(C)の重さYを表2に示す重さに変更した以外は、実施例1と同様にしてプリプレグ、および積層体を製造した。
得られたプリプレグおよび積層体について、実施例1と同様の評価を行った。結果を表2に示す。
[Comparative Examples 1 and 2]
A prepreg and a laminate were manufactured in the same manner as in Example 1 except that the weight X of the resin film (B) and the weight Y of the resin film (C) were changed to the weights shown in Table 2.
About the obtained prepreg and laminated body, evaluation similar to Example 1 was performed. The results are shown in Table 2.

〔比較例3〕
プリプレグ製造時の温度を100℃とし、圧力を0.4MPaとした以外は、実施例1と同様にしてプリプレグ、および積層体を製造した。
得られたプリプレグおよび積層体について、実施例1と同様の評価を行った。結果を表2に示す。
[Comparative Example 3]
A prepreg and a laminate were manufactured in the same manner as in Example 1 except that the temperature during prepreg production was 100 ° C. and the pressure was 0.4 MPa.
About the obtained prepreg and laminated body, evaluation similar to Example 1 was performed. The results are shown in Table 2.

〔比較例4〕
プリプレグ製造時の温度を30℃とし、圧力を0.02MPaとし、送り速度を4m/分とした以外は、実施例1と同様にしてプリプレグ、および積層体を製造した。
得られたプリプレグおよび積層体について、実施例1と同様の評価を行った。結果を表2に示す。
[Comparative Example 4]
A prepreg and a laminate were manufactured in the same manner as in Example 1 except that the temperature during prepreg production was 30 ° C., the pressure was 0.02 MPa, and the feed rate was 4 m / min.
About the obtained prepreg and laminated body, evaluation similar to Example 1 was performed. The results are shown in Table 2.

〔比較例5〕
積層体を製造する際、コア材とプリプレグとを、樹脂フィルム(B)がコア材に接着剤シートを介して接する側となり、樹脂フィルム(C)がツールまたはバッグに接する側となるように貼り合わせた以外は、実施例1と同様にして積層体を製造した。
得られた積層体について、実施例1と同様の評価を行った。結果を表2に示す。
[Comparative Example 5]
When manufacturing the laminate, the core material and the prepreg are bonded so that the resin film (B) is in contact with the core material through the adhesive sheet and the resin film (C) is in contact with the tool or bag. A laminated body was manufactured in the same manner as in Example 1 except that they were combined.
About the obtained laminated body, evaluation similar to Example 1 was performed. The results are shown in Table 2.

〔比較例6〕
樹脂フィルム(B)の重さX、および樹脂フィルム(C)の重さYを表2に示す重さに変更した以外は、実施例1と同様にしてプリプレグ、および積層体を製造した。
得られたプリプレグおよび積層体について、実施例1と同様の評価を行った。結果を表2に示す。
[Comparative Example 6]
A prepreg and a laminate were manufactured in the same manner as in Example 1 except that the weight X of the resin film (B) and the weight Y of the resin film (C) were changed to the weights shown in Table 2.
About the obtained prepreg and laminated body, evaluation similar to Example 1 was performed. The results are shown in Table 2.

Figure 2007099966
Figure 2007099966

Figure 2007099966
Figure 2007099966

X/Yが0.3未満である比較例1の積層体は、ピンホールの発生は極めて少ないものの、ツールに接するプリプレグの樹脂フィルムの量が少ないため、オーブン成形時にアルミハニカムのセル内に熱硬化性樹脂が吸い込まれ、樹脂枯れが発生し、外観が損なわれた。
X/Yが0.7を超える比較例2および比較例6の積層体は、樹脂枯れの発生はないものの、ツールに接するプリプレグの樹脂フィルムの量が多いため、オーブン成形時にツールとプリプレグとの間の空気が充分に脱気されず残留してピンホールが多発した。
In the laminate of Comparative Example 1 where X / Y is less than 0.3, pinholes are generated very little, but the amount of prepreg resin film in contact with the tool is small. The curable resin was sucked in, the resin withered, and the appearance was impaired.
In the laminates of Comparative Example 2 and Comparative Example 6 in which X / Y exceeds 0.7, although resin withering does not occur, the amount of the prepreg resin film in contact with the tool is large. The air in between was not sufficiently deaerated and pinholes occurred frequently.

含浸率が60%を超えるプリプレグを用いた比較例3の積層体は、脱気通路となる未含浸部が少ないため、プリプレグ内の空気が充分に脱気できないことによりピンホールが多発した。さらに、ツールに接するプリプレグの樹脂フィルムの量が少ないため、オーブン成形時にアルミハニカムのセル内に熱硬化性樹脂が吸い込まれ、樹脂枯れが発生した。
含浸率が10%未満であるプリプレグを用いた比較例4の積層体は、オーブン成形時に基材(A)に熱硬化性樹脂が充分に含浸されないため、スキン材に未含浸部が多く観察された。
Since the laminate of Comparative Example 3 using a prepreg having an impregnation rate exceeding 60% had few unimpregnated portions serving as a degassing passage, pinholes were frequently generated because the air in the prepreg could not be sufficiently degassed. Further, since the amount of the prepreg resin film in contact with the tool was small, the thermosetting resin was sucked into the cells of the aluminum honeycomb during the oven forming, and the resin withered.
In the laminate of Comparative Example 4 using a prepreg with an impregnation rate of less than 10%, the base material (A) is not sufficiently impregnated with the thermosetting resin during the oven molding, so that many unimpregnated parts are observed in the skin material. It was.

比較例5の積層体は、樹脂フィルム(B)よりも重い樹脂フィルム(C)がツールに接しているため、オーブン成形時にツールとプリプレグとの間の空気が充分に脱気されず残留してピンホールが多発した。   In the laminate of Comparative Example 5, since the resin film (C) heavier than the resin film (B) is in contact with the tool, the air between the tool and the prepreg is not sufficiently deaerated during oven molding and remains. There were many pinholes.

本発明のプリプレグは、航空機、自動車等に用いられるハニカムサンドイッチパネルのスキン材として有用である。   The prepreg of the present invention is useful as a skin material for honeycomb sandwich panels used in aircraft, automobiles and the like.

本発明のプリプレグの一例を示す概略断面図である。It is a schematic sectional drawing which shows an example of the prepreg of this invention. 積層体の一例を示す概略断面図である。It is a schematic sectional drawing which shows an example of a laminated body. 積層体の製造方法を説明するための概略断面図である。It is a schematic sectional drawing for demonstrating the manufacturing method of a laminated body.

符号の説明Explanation of symbols

10 プリプレグ
11 基材(A)
12 樹脂フィルム(B)
13 樹脂フィルム(C)
10 Prepreg 11 Base material (A)
12 Resin film (B)
13 Resin film (C)

Claims (1)

補強繊維からなる基材(A)と、
基材(A)の一方の面に貼り合わされた、熱硬化性樹脂からなる樹脂フィルム(B)と、
基材(A)の他方の面に貼り合わされた、熱硬化性樹脂からなる樹脂フィルム(C)とを有し、
樹脂フィルム(B)および樹脂フィルム(C)の熱硬化性樹脂の一部が、基材(A)に含浸したプリプレグであって、
基材(A)への熱硬化性樹脂の含浸率が、10〜60%であり、
樹脂フィルム(B)の重さX(g/m2 )と樹脂フィルム(C)の重さY(g/m2 )とが、下記式(1)の関係を満足するプリプレグ。
0.3≦X/Y≦0.7 ・・・(1)
A base material (A) made of reinforcing fibers;
A resin film (B) made of a thermosetting resin, bonded to one surface of the substrate (A);
Having a resin film (C) made of a thermosetting resin bonded to the other surface of the substrate (A),
A part of the thermosetting resin of the resin film (B) and the resin film (C) is a prepreg impregnated in the base material (A),
The impregnation rate of the thermosetting resin into the substrate (A) is 10 to 60%,
A prepreg in which the weight X (g / m 2 ) of the resin film (B) and the weight Y (g / m 2 ) of the resin film (C) satisfy the relationship of the following formula (1).
0.3 ≦ X / Y ≦ 0.7 (1)
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012530838A (en) * 2009-06-26 2012-12-06 ヘクセル コンポジット、リミテッド Improvement of composite materials
JP2014162858A (en) * 2013-02-26 2014-09-08 Toray Ind Inc Prepreg and production method of the same, and fiber reinforced composite material
JP2016501971A (en) * 2012-12-21 2016-01-21 サイテク・エンジニアド・マテリアルズ・インコーポレーテツド Curable prepreg with surface opening
CN113801439A (en) * 2021-08-12 2021-12-17 广东亚太新材料科技有限公司 Surfacing felt prepreg and preparation method thereof
WO2022255278A1 (en) * 2021-06-01 2022-12-08 昭和電工マテリアルズ株式会社 Prepreg, laminated plate, metal-clad laminated plate, printed wiring board, semiconductor package, method for manufacturing prepreg, and method for manufacturing metal-clad laminated plate

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JPS5959323A (en) * 1982-09-24 1984-04-05 Yamatake Honeywell Co Ltd Working table
JPH0489209A (en) * 1990-07-31 1992-03-23 Tonen Corp Manufacture of prepreg
JP2002179000A (en) * 2000-12-12 2002-06-26 Toshiba Corp Fabric prepreg and its manufacture and a panel structure using it
JP2002249605A (en) * 2001-02-26 2002-09-06 Toray Ind Inc Partially impregnated prepreg

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5959323A (en) * 1982-09-24 1984-04-05 Yamatake Honeywell Co Ltd Working table
JPH0489209A (en) * 1990-07-31 1992-03-23 Tonen Corp Manufacture of prepreg
JP2002179000A (en) * 2000-12-12 2002-06-26 Toshiba Corp Fabric prepreg and its manufacture and a panel structure using it
JP2002249605A (en) * 2001-02-26 2002-09-06 Toray Ind Inc Partially impregnated prepreg

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012530838A (en) * 2009-06-26 2012-12-06 ヘクセル コンポジット、リミテッド Improvement of composite materials
JP2016501971A (en) * 2012-12-21 2016-01-21 サイテク・エンジニアド・マテリアルズ・インコーポレーテツド Curable prepreg with surface opening
US9802358B2 (en) 2012-12-21 2017-10-31 Cytec Industries Inc. Curable prepregs with surface openings
JP2014162858A (en) * 2013-02-26 2014-09-08 Toray Ind Inc Prepreg and production method of the same, and fiber reinforced composite material
WO2022255278A1 (en) * 2021-06-01 2022-12-08 昭和電工マテリアルズ株式会社 Prepreg, laminated plate, metal-clad laminated plate, printed wiring board, semiconductor package, method for manufacturing prepreg, and method for manufacturing metal-clad laminated plate
WO2022254587A1 (en) * 2021-06-01 2022-12-08 昭和電工マテリアルズ株式会社 Prepreg, laminate plate, metal-clad laminate plate, printed wiring board, semiconductor package, method for manufacturing prepreg, and method for manufacturing metal-clad laminate plate
CN113801439A (en) * 2021-08-12 2021-12-17 广东亚太新材料科技有限公司 Surfacing felt prepreg and preparation method thereof

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