JP2007091799A - Thermosetting resin composition and its application - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition excellent in adhesive property, processability and heat resistance and also excellent in dielectric characteristics in the GHz zone, and to provide a layered product and a circuit board comprising it. <P>SOLUTION: The thermosetting resin composition contains (A) an imide oligomer component containing at least one imide oligomer having a specific structure and (B) an epoxy resin component containing at least one epoxy resin, and the epoxy resin component (B) contains at least one liquid epoxy resin. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a thermosetting resin composition used for the production of circuit boards such as flexible printed wiring boards and build-up circuit boards, and a resin solution, a prepreg, a laminate, and a circuit board using the same. More specifically, a thermosetting resin composition comprising an imide oligomer having a group capable of reacting with an epoxy resin and a liquid epoxy resin, and a resin solution, a prepreg, a laminate, and a circuit board comprising the same. It is about.

  In order to improve the information processing capability in electronic devices, in recent years, the frequency of electrical signals that transmit circuits on wiring boards used in electronic devices has been increased. For this reason, it is desirable to maintain the electrical reliability of the wiring (circuit) substrate even when the frequency of the electrical signal is increased, and to suppress a decrease in the transmission speed of the electrical signal in the circuit and the loss of the electrical signal.

By the way, an insulating layer such as a protective film for protecting the wiring board or circuit or an interlayer insulating film for ensuring insulation between layers in the multilayer wiring board is usually formed on the circuit board. Is done. Since the insulating layers such as the protective film and the interlayer insulating film are provided on the wiring board, in addition to the insulating properties, adhesiveness for bonding to the wiring board is also required.
In particular, when manufacturing a multilayered wiring board such as a build-up circuit board, each layer is bonded and fixed by the interlayer insulating layer, and at the same time, the material of the interlayer insulating layer is circuit wiring. The wiring is fixed by filling the gap between the lines. For this reason, the interlayer insulating film is required to have fluidity enough to fill the space between the circuit wirings together with excellent adhesion to the substrate or the like. Therefore, the insulating layers such as the protective film and the interlayer insulating film are formed using an adhesive material having adhesiveness and resin fluidity.

  In addition, in order to improve the information processing capability of electronic equipment by increasing the frequency of electrical signals, even when an insulating layer is formed using an adhesive material, high reliability of the wiring board is achieved in the GHz (gigahertz) band. It is desirable that it can be obtained and that it does not adversely affect the transmission of electrical signals.

  Conventionally, as an adhesive material used for a wiring board, for example, an epoxy-based adhesive material or a thermoplastic polyimide-based adhesive material is used. The above-mentioned epoxy-based adhesive material is excellent in workability such as bonding between adherends under low temperature and low pressure conditions and embedding between circuit wiring lines, and excellent adhesion to adherends. Yes. The thermoplastic polyimide-based adhesive material has a lower dielectric constant and dielectric loss tangent than epoxy resin, can handle higher frequencies, has a low volume resistivity, has a low thermal expansion, and has a low thermal decomposition temperature. Excellent heat resistance such as high.

  In Patent Document 1, as a material in which the epoxy resin and the polyimide resin are mixed, a polyimide resin having a glass transition temperature within a predetermined range, an epoxy compound, and a compound having an active hydrogen group capable of reacting with the epoxy compound; It is described that by using a film adhesive formed by mixing the two, adherends can be bonded at a low temperature in a short time and heat resistance reliability at a high temperature can be obtained.

On the other hand, Patent Document 2 describes a sealing epoxy resin composition containing an epoxy resin, a phenol resin-based curing agent, a specific imide oligomer, and an inorganic filler.
Patent Document 3 describes a hybrid adhesive composition containing an imide oligomer containing a specific repeating unit structure, an epoxy resin, and an epoxy curing agent.
Japanese Unexamined Patent Publication No. 08-27430 (Publication date: January 30, 1996) Japanese Patent Laid-Open No. 08-41172 (Publication date: February 13, 1996) Japanese translation of PCT publication No. 2004-502859 (publication date: January 29, 2004)

  However, the epoxy resin obtained by curing the epoxy adhesive material has a dielectric constant of 4 or more in the GHz band and a dielectric loss tangent of 0.02 or more, and thus has a problem that good dielectric properties cannot be obtained. is there.

  In contrast, a polyimide resin obtained by curing the thermoplastic polyimide adhesive material is excellent in heat resistance and insulation. On the other hand, in order to adhere the adherends using the thermoplastic polyimide adhesive material, it is necessary to bond the adherends under high temperature and high pressure conditions, and there is a problem in workability.

  Further, the film adhesive described in Patent Document 1 can be bonded at a low temperature in a short time and is excellent in heat resistance reliability at a high temperature. Properties) and dielectric properties are not described. The epoxy compound contained in the film adhesive described in Patent Document 1 improves the low temperature processability by lowering the softening temperature of the film adhesive. On the other hand, when a large amount of the epoxy compound is contained, the dielectric constant and dielectric loss tangent increase. There is a problem that it causes deterioration of dielectric characteristics.

  Therefore, in order to improve the information processing capability of electronic equipment by increasing the frequency of electrical signals, it has excellent adhesion, processability, resin fluidity, and heat resistance, and has a low dielectric constant and low dielectric loss tangent even in the GHz band. Development of an adhesive material capable of forming an insulating layer having excellent dielectric characteristics is expected.

  On the other hand, Patent Document 2 does not describe an imide oligomer having a specific structure of the present invention, and is a resin composition for use in sealing an electronic component such as a semiconductor, and has adhesiveness, fluidity, There is no description about characteristics such as dielectric characteristics.

  Patent Document 3 does not describe the imide oligomer having the specific structure of the present invention, and also includes adhesives in electronic industry such as flip chip adhesives and anisotropic conductive adhesives, sealing agents for electronic components, and the like. It is a resin composition for use in, and there is no description about characteristics such as dielectric characteristics and CTE (linear expansion coefficient).

  The present invention has been made to solve the above-described conventional problems, and the purpose thereof is an adhesive that can be suitably used for the manufacture of circuit boards such as flexible printed wiring boards and build-up circuit boards. A thermosetting resin composition having excellent properties, workability and heat resistance, and excellent resin fluidity and dielectric properties in the GHz band, and resin solutions, prepregs, laminates and circuit boards using the same. It is to provide.

  As a result of intensive studies in view of the above-mentioned problems, the present inventors have used circuit board and the like by using a thermosetting resin composition comprising an imide oligomer having a group capable of reacting with an epoxy resin and an epoxy resin as essential components. In addition to excellent adhesion to the adherend, heat resistance regarding thermal expansion and thermal decomposition, the fluidity of the resin necessary for embedding the circuit is improved, and at least one liquid epoxy resin is used as an epoxy resin component. It can be further improved by use, and the cured resin obtained by curing the thermosetting resin composition has a low dielectric constant and dielectric loss tangent in the GHz band, excellent dielectric properties, and heat resistance related to thermal expansion and thermal decomposition. The present inventors have found that a thermosetting resin composition having excellent properties can be obtained, and have completed the present invention.

  That is, the thermosetting resin composition of the present invention has at least the general formula (1) to solve the above problems.

（式中、Ｒ₁は、同一であっても異なっていても良く、少なくとも１つの芳香環を含む２価の有機基であり、Ｒ₂は、同一であっても異なっていても良く、少なくとも２つの芳香環を含む２価の有機基であり、Ｒ₃は、同一であっても異なっていても良く、−ＯＨ、または−ＮＨ₂から選択される１価の有機基であり、Ｒ₄は、同一であっても異なっていても良く、少なくとも１つの芳香環を含む４価の有機基を示し、Ｖは、直結、−Ｏ−，−ＣＯ−，−Ｏ−Ｔ−Ｏ−，及び，−ＣＯＯ−Ｔ−ＯＣＯ−、−Ｃ（ＣＨ₃）₂−、−Ｃ（ＣＦ₃）₂−からなる群より選択される２価の基であり、Ｔは２価の有機基であり、ａ、ｂは、それぞれ独立して０以上１５以下の整数であり、ａ＋ｂは０以上１５以下の整数を示す。また、（１）は、ブロック共重合体でも、ランダム共重合体であってもよい。）
または一般式（２）

(In the formula, R ₁ may be the same or different, and is a divalent organic group containing at least one aromatic ring, and R ₂ may be the same or different, and at least a divalent organic group comprising two aromatic rings, R ₃ may be the same or different and is a monovalent organic radical selected from -OH or -NH _2,, R ₄ , Which may be the same or different, each represents a tetravalent organic group containing at least one aromatic ring, and V represents a direct bond, —O—, —CO—, —O—T—O—, and , —COO—T—OCO—, —C (CH ₃ ) ₂ —, —C (CF ₃ ) ₂ —, and T is a divalent organic group, a and b are each independently an integer of 0 to 15, and a + b is an integer of 0 to 15. In addition, (1) It may be a polymer or a random copolymer.)
Or general formula (2)

（式中、Ｒ₁は、同一であっても異なっていても良く、少なくとも１つの芳香環を含む２価の有機基であり、Ｒ₂は、同一であっても異なっていても良く、少なくとも２つの芳香環を含む２価の有機基であり、Ｒ₃は、同一であっても異なっていても良く、−ＯＨ、または−ＮＨ₂から選択される１価の有機基であり、Ｒ₄は、同一であっても異なっていても良く、少なくとも１つの芳香環を含む４価の有機基を示し、Ｖは、直結、−Ｏ−，−ＣＯ−，−Ｏ−Ｔ−Ｏ−，及び，−ＣＯＯ−Ｔ−ＯＣＯ−、−Ｃ（ＣＨ₃）₂−、−Ｃ（ＣＦ₃）₂−からなる群より選択される２価の基であり、Ｔは２価の有機基であり、ｃは、１以上１５以下の整数、ｄは、０以上１５以下の整数を示し、ｃ＋ｄは、１以上１５以下の整数を示す。また、（２）は、ブロック共重合体でも、ランダム共重合体であってもよい。）で表されるイミドオリゴマーのうち１種を含む（Ａ）イミドオリゴマー成分と、少なくとも１種のエポキシ樹脂を含む（Ｂ）エポキシ樹脂成分を含有する熱硬化性樹脂組成物であって、上記（Ｂ）エポキシ樹脂成分に少なくとも１種の液状エポキシ樹脂を含有していることを特徴としている。
また、少なくとも１種のポリイミド樹脂を含む（Ｃ）ポリイミド樹脂成分を含むことが好ましい。

(In the formula, R ₁ may be the same or different, and is a divalent organic group containing at least one aromatic ring, and R ₂ may be the same or different, and at least a divalent organic group comprising two aromatic rings, R ₃ may be the same or different and is a monovalent organic radical selected from -OH or -NH _2,, R ₄ , Which may be the same or different, each represents a tetravalent organic group containing at least one aromatic ring, and V represents a direct bond, —O—, —CO—, —O—T—O—, and , —COO—T—OCO—, —C (CH ₃ ) ₂ —, —C (CF ₃ ) ₂ —, and T is a divalent organic group, c is an integer from 1 to 15, d is an integer from 0 to 15, c + d is an integer from 1 to 15. In addition, (2) is It may be a block copolymer or a random copolymer.) (A) an imide oligomer component containing one kind of imide oligomers represented by (B) an epoxy resin containing at least one epoxy resin A thermosetting resin composition containing a component, wherein the (B) epoxy resin component contains at least one liquid epoxy resin.
Moreover, it is preferable that the (C) polyimide resin component containing at least 1 type of polyimide resin is included.

  According to the above configuration, the cured resin formed by curing the thermosetting resin composition has excellent fluidity necessary for embedding a circuit, and exhibits a low dielectric constant and a low dielectric loss tangent even in the GHz band. Excellent dielectric properties can be obtained. Specifically, the dielectric constant in the frequency band of 1 GHz to 10 GHz of the cured resin obtained by heating the thermosetting resin composition under a temperature condition of 150 ° C. to 250 ° C. for 1 hour to 5 hours is 3. 3 or less, and the dielectric loss tangent can be 0.020 or less. If the dielectric constant in the GHz band is 3.3 or less and the dielectric loss tangent is 0.020 or less, the thermosetting resin composition of the present invention can be used as a circuit board protective material or an interlayer insulating material. The electrical reliability of the circuit board can be ensured, and the decrease in signal transmission speed and signal loss of the circuit on the circuit board can be suppressed.

  The thermosetting resin composition of the present invention has a heat resistance such as a low thermal expansion coefficient and a high thermal decomposition temperature, and adhesion between the thermosetting resin composition and an adherend such as a conductor or a circuit board. In addition, it is excellent in workability when the thermosetting resin composition is bonded to a conductor or a circuit board. Therefore, it can be suitably used for manufacturing circuit boards such as flexible printed wiring boards and build-up circuit boards.

  Thus, since the thermosetting resin composition of the present invention has the above-mentioned properties in a well-balanced manner, it can be suitably used for the production of circuit boards and the like, and the thermosetting resin composition of the present invention. Various characteristics can also be imparted to the circuit board obtained using the above-mentioned.

  In addition, it is preferable that the weight mixing ratio represented by the weight of the liquid epoxy resin component to the (B) epoxy resin component and the liquid epoxy resin component / (B) are 0.2 or more.

  Moreover, the weight mixing ratio (C) / expressed by the weight of the (C) polyimide resin component with respect to the total resin total weight of the (A) imide oligomer component, (B) epoxy resin component and (C) polyimide resin component. [(A) + (B) + (C)] is preferably in the range of 0.05 to 0.7.

  The molar mixing ratio (A) / (expressed by the number of moles of active hydrogen groups contained in the (A) imide oligomer component to the number of moles of epoxy groups of the epoxy resin contained in the (B) epoxy resin component. B) is preferably in the range of 0.4 to 2.0.

  Furthermore, it is preferable to contain the (D) inorganic filler component containing at least 1 type of inorganic filler.

  As a result, various properties such as excellent dielectric properties, fluidity, heat resistance, adhesiveness, workability, etc. for the thermosetting resin composition or a cured resin obtained by curing the thermosetting resin composition Can be imparted in a well-balanced manner.

  Moreover, in order to solve the said subject, the resin solution of this invention melt | dissolved the said thermosetting resin composition in the organic solvent, It is characterized by the above-mentioned.

  Moreover, the prepreg of the present invention is characterized in that the thermosetting resin composition is coated and impregnated on a sheet-like reinforcing substrate made of fibers.

  Moreover, the laminated body of this invention is characterized by including at least 1 layer of the resin layer formed of said thermosetting resin composition.

  Moreover, in order to solve the said subject, the circuit board of this invention has said thermosetting resin composition, It is characterized by the above-mentioned.

  The resin solution, prepreg, laminate, and circuit board include the thermosetting resin composition described above. Therefore, various properties such as dielectric properties, fluidity, heat resistance, adhesiveness, workability, etc. are applied to the resin layer formed of the thermosetting resin composition of the resin solution, prepreg, laminate and circuit board. It can be given in a balanced manner. Thereby, it becomes possible to manufacture suitably the said resin solution, a prepreg, a laminated body, and a circuit board. In particular, when the laminate and the circuit board have circuits or the like, the electrical reliability of each circuit can be ensured, and a decrease in signal transmission speed and signal loss in each circuit can be suppressed.

  As described above, the thermosetting resin composition of the present invention comprises an imide oligomer and an epoxy resin as essential components, and the epoxy resin component contains at least one liquid epoxy resin.

  As a result, it has excellent fluidity necessary for embedding a circuit, adhesion to an adherend such as a circuit board, processability and handleability enabling adhesion at low temperature, and heat resistance excellent in heat expansion and thermal decomposition. A curable resin composition can be provided. Moreover, the dielectric constant and dielectric loss tangent in the GHz band of the cured resin obtained by curing the thermosetting resin composition is much lower than that of a conventional resin composition comprising a polyimide resin and an epoxy resin. An excellent thermosetting resin composition can be provided.

  Therefore, the thermosetting resin composition of the present invention can be bonded at a low temperature as compared with conventional resin compositions, and is excellent in workability and handling properties, and in heat resistance and dielectric properties. The thermosetting resin composition having a balance of various properties can be provided.

  Therefore, there is an effect that it can be suitably used for the production of flexible printed wiring boards, build-up circuit boards, and laminates that require a low dielectric constant and a low dielectric loss tangent in the GHz band.

  An embodiment of the present invention will be described as follows. Note that the present invention is not limited to this.

  The thermosetting resin composition according to the present invention is used for a circuit board such as a flexible printed wiring board or a build-up circuit board, for example, and a protective material for protecting the circuit board or a patterned circuit on the circuit board, Alternatively, it is suitably used as an interlayer insulating material for ensuring insulation between layers in a multilayer circuit board.

  The thermosetting resin composition of the present invention has at least the general formula (1).

（式中、Ｒ₁は、同一であっても異なっていても良く、少なくとも１つの芳香環を含む２価の有機基であり、Ｒ₂は、同一であっても異なっていても良く、少なくとも２つの芳香環を含む２価の有機基であり、Ｒ₃は、同一であっても異なっていても良く、−ＯＨ、または−ＮＨ₂から選択される１価の有機基であり、Ｒ₄は、同一であっても異なっていても良く、少なくとも１つの芳香環を含む４価の有機基を示し、Ｖは、直結、−Ｏ−，−ＣＯ−，−Ｏ−Ｔ−Ｏ−，及び，−ＣＯＯ−Ｔ−ＯＣＯ−、−Ｃ（ＣＨ₃）₂−、−Ｃ（ＣＦ₃）₂−からなる群より選択される２価の基であり、Ｔは２価の有機基であり、ａ、ｂは、それぞれ独立して０以上１５以下の整数であり、ａ＋ｂは０以上１５以下の整数を示す。また、（１）は、ブロック共重合体でも、ランダム共重合体であってもよい。）
または一般式（２）

(In the formula, R ₁ may be the same or different, and is a divalent organic group containing at least one aromatic ring, and R ₂ may be the same or different, and at least a divalent organic group comprising two aromatic rings, R ₃ may be the same or different and is a monovalent organic radical selected from -OH or -NH _2,, R ₄ , Which may be the same or different, each represents a tetravalent organic group containing at least one aromatic ring, and V represents a direct bond, —O—, —CO—, —O—T—O—, and , —COO—T—OCO—, —C (CH ₃ ) ₂ —, —C (CF ₃ ) ₂ —, and T is a divalent organic group, a and b are each independently an integer of 0 to 15, and a + b is an integer of 0 to 15. In addition, (1) It may be a polymer or a random copolymer.)
Or general formula (2)

（式中、Ｒ₁は、同一であっても異なっていても良く、少なくとも１つの芳香環を含む２価の有機基であり、Ｒ₂は、同一であっても異なっていても良く、少なくとも２つの芳香環を含む２価の有機基であり、Ｒ₃は、同一であっても異なっていても良く、−ＯＨ、または−ＮＨ₂から選択される１価の有機基であり、Ｒ₄は、同一であっても異なっていても良く、少なくとも１つの芳香環を含む４価の有機基を示し、Ｖは、直結、−Ｏ−，−ＣＯ−，−Ｏ−Ｔ−Ｏ−，及び，−ＣＯＯ−Ｔ−ＯＣＯ−、−Ｃ（ＣＨ₃）₂−、−Ｃ（ＣＦ₃）₂−からなる群より選択される２価の基であり、Ｔは２価の有機基であり、ｃは、１以上１５以下の整数、ｄは、０以上１５以下の整数を示し、ｃ＋ｄは、１以上１５以下の整数を示す。また、（２）は、ブロック共重合体でも、ランダム共重合体であってもよい。）で表されるイミドオリゴマーのうちの１種を含む（Ａ）イミドオリゴマー成分と、少なくとも１種のエポキシ樹脂を含む（Ｂ）エポキシ樹脂成分を必須成分とし、（Ｂ）エポキシ樹脂成分には、少なくとも１種の液状エポキシ樹脂を含有している。

(In the formula, R ₁ may be the same or different, and is a divalent organic group containing at least one aromatic ring, and R ₂ may be the same or different, and at least a divalent organic group comprising two aromatic rings, R ₃ may be the same or different and is a monovalent organic radical selected from -OH or -NH _2,, R ₄ , Which may be the same or different, each represents a tetravalent organic group containing at least one aromatic ring, and V represents a direct bond, —O—, —CO—, —O—T—O—, and , —COO—T—OCO—, —C (CH ₃ ) ₂ —, —C (CF ₃ ) ₂ —, and T is a divalent organic group, c is an integer from 1 to 15, d is an integer from 0 to 15, c + d is an integer from 1 to 15. In addition, (2) is It may be a block copolymer or a random copolymer.) (A) an imide oligomer component containing one of the imide oligomers represented by (A) and at least one epoxy resin (B) an epoxy The resin component is an essential component, and the (B) epoxy resin component contains at least one liquid epoxy resin.

  The ratio of the liquid resin contained in the (B) epoxy resin component is the lower limit of the weight mixing ratio represented by the weight of the liquid epoxy resin component to the (B) epoxy resin component, the liquid epoxy resin component / (B). Is preferably 0.2 or more, and more preferably 0.4 or more. The upper limit of the weight mixing ratio is not particularly limited, but is 1.0 or less, and more preferably 0.8 or less.

  When the weight mixing ratio and the liquid epoxy resin component / (B) are less than 0.2, the resin fluidity in the semi-cured state (B stage state) of the thermosetting resin composition of the present invention is lowered (melt viscosity is low). Rise), it becomes brittle and easily broken, and it tends to be difficult to handle.

  The mixing ratio of each of the components of the thermosetting resin composition is the moles of active hydrogen groups contained in the (A) imide oligomer component relative to the number of moles of epoxy groups of the epoxy resin contained in the (B) epoxy resin component. In the molar mixing ratio (A) / (B) represented by a number, the lower limit value is preferably 0.4 or more, and more preferably 0.7 or more. The upper limit of the molar mixing ratio (A) / (B) is preferably 2.0 or less, and more preferably 1.1 or less.

  When the molar mixing ratio (A) / (B) is less than 0.4 or exceeds 2.0, the dielectric properties of the cured resin obtained by curing the thermosetting resin composition may be inferior. Moreover, the glass transition temperature of a thermosetting resin composition, a thermal expansion coefficient, the elastic modulus at the time of high temperature may fall, or heat resistance may be impaired.

  The number of moles of epoxy group may be calculated from the epoxy value, and the active hydrogen of the imide oligomer may be calculated from the molecular weight of the imide oligomer and the number of amino groups or hydroxyl groups present in the imide oligomer.

  The active hydrogen in the present invention refers to a hydrogen atom directly bonded to a nitrogen atom of an amino group or a hydrogen atom directly bonded to an oxygen atom of a hydroxyl group. Generally, two active hydrogen atoms per one amino group. There is one active hydrogen for hydrogen and one hydroxyl group.

  In addition, the thermosetting resin composition of the present invention preferably contains a polyimide resin as the component (C) when it is desired to further improve the heat resistance or to impart flexibility to the obtained cured product. (A) Imide oligomer component, (B) Epoxy resin component, and (C) Weight mixing ratio (C) / [() represented by the weight of the (C) polyimide resin component with respect to the total resin total weight of the polyimide resin component. In (A) + (B) + (C)], the lower limit is preferably 0.05 or more, and more preferably 0.1 or more. The upper limit of the weight mixing ratio (C) / [(A) + (B) + (C)] is preferably 0.7 or less, and more preferably 0.5 or less.

  (C) By using a polyimide resin, it is possible to impart heat resistance such as dielectric properties in the GHz band of the cured resin, thermal decomposition, and thermal expansion in a region below the glass transition temperature. Also, by mixing thermosetting resin component consisting of (A) imide oligomer component and (B) epoxy resin component, before curing, which is important at the time of processing such as bonding to conductor and circuit board and circuit embedding at the time of lamination Resin fluidity, heat resistance expressed by the modulus of elasticity and linear expansion coefficient at high temperatures of the cured resin sheet can be imparted, and if the mixing ratio is within the above range, such characteristics are more balanced. The resin composition which has can be obtained.

  By setting the thermosetting resin composition of the present invention to the above-mentioned weight mixing ratio, a cured resin obtained by curing the thermosetting resin composition exhibits excellent dielectric characteristics even in the GHz band. That is, the dielectric properties of the cured resin obtained by heating the thermosetting resin composition at 150 ° C. to 250 ° C. for 1 hour to 5 hours have a frequency of 1 GHz to 10 GHz and a dielectric constant of 3. 3 or less, and the dielectric loss tangent is 0.020 or less. If the dielectric constant and dielectric loss tangent are within the above ranges, the electrical insulation of the circuit board is ensured even when the thermosetting resin composition of the present invention is used as a protective material or interlayer insulation material for the circuit board. In addition, since it is possible to suppress a decrease in signal transmission speed of the circuit on the circuit board and signal loss, it is possible to provide a highly reliable circuit board.

  As described above, (A) an imide oligomer, (B) an epoxy resin, and (C) a polyimide resin in the thermosetting resin composition, and (B) a liquid epoxy resin contained in the epoxy resin. By making the mixing ratio within a specific range, fluidity necessary for embedding circuits, adhesion to adherends such as circuit boards and conductors, workability and handleability that enable adhesion at low temperatures, and heat Excellent balance of properties such as heat resistance related to expansion and thermal decomposition, moisture resistance test (PCT) resistance by pressure cooker, solder heat resistance, insulation, and dielectric properties of cured resin obtained by curing thermosetting resin composition Can be obtained. Hereinafter, the (A) imide oligomer component, (B) epoxy resin component, (C) polyimide resin, (D) inorganic filler, and other components contained in the thermosetting resin composition will be described in detail.

(A) Imide oligomer component The thermosetting resin composition of the present invention has at least one general formula (1).

（式中、Ｒ₁は、同一であっても異なっていても良く、少なくとも１つの芳香環を含む２価の有機基であり、Ｒ₂は、同一であっても異なっていても良く、少なくとも２つの芳香環を含む２価の有機基であり、Ｒ₃は、同一であっても異なっていても良く、−ＯＨ、または−ＮＨ₂から選択される１価の有機基であり、Ｒ₄は、同一であっても異なっていても良く、少なくとも１つの芳香環を含む４価の有機基を示し、Ｖは、直結、−Ｏ−，−ＣＯ−，−Ｏ−Ｔ−Ｏ−，及び，−ＣＯＯ−Ｔ−ＯＣＯ−、−Ｃ（ＣＨ₃）₂−、−Ｃ（ＣＦ₃）₂−からなる群より選択される２価の基であり、Ｔは２価の有機基であり、ａ、ｂは、それぞれ独立して０以上１５以下の整数であり、ａ＋ｂは０以上１５以下の整数を示す。また、（１）は、ブロック共重合体でも、ランダム共重合体であってもよい。）
または一般式（２）

(In the formula, R ₁ may be the same or different, and is a divalent organic group containing at least one aromatic ring, and R ₂ may be the same or different, and at least a divalent organic group comprising two aromatic rings, R ₃ may be the same or different and is a monovalent organic radical selected from -OH or -NH _2,, R ₄ , Which may be the same or different, each represents a tetravalent organic group containing at least one aromatic ring, and V represents a direct bond, —O—, —CO—, —O—T—O—, and , —COO—T—OCO—, —C (CH ₃ ) ₂ —, —C (CF ₃ ) ₂ —, and T is a divalent organic group, a and b are each independently an integer of 0 to 15, and a + b is an integer of 0 to 15. In addition, (1) It may be a polymer or a random copolymer.)
Or general formula (2)

（式中、Ｒ₁は、同一であっても異なっていても良く、少なくとも１つの芳香環を含む２価の有機基であり、Ｒ₂は、同一であっても異なっていても良く、少なくとも２つの芳香環を含む２価の有機基であり、Ｒ₃は、同一であっても異なっていても良く、−ＯＨ、または−ＮＨ₂から選択される１価の有機基であり、Ｒ₄は、同一であっても異なっていても良く、少なくとも１つの芳香環を含む４価の有機基を示し、Ｖは、直結、−Ｏ−，−ＣＯ−，−Ｏ−Ｔ−Ｏ−，及び，−ＣＯＯ−Ｔ−ＯＣＯ−、−Ｃ（ＣＨ₃）₂−、−Ｃ（ＣＦ₃）₂−からなる群より選択される２価の基であり、Ｔは２価の有機基であり、ｃは、１以上１５以下の整数、ｄは、０以上１５以下の整数を示し、ｃ＋ｄは、１以上１５以下の整数を示す。また、（２）は、ブロック共重合体でも、ランダム共重合体であってもよい。）で表されるイミドオリゴマーのうち１種を含む（Ａ）イミドオリゴマー成分を含有することにより、熱硬化性樹脂組成物に樹脂流動性を付与するとともに、熱硬化性樹脂組成物を硬化させて得られる硬化樹脂に対して耐熱性を付与する。また、上記によって、熱硬化性樹脂組成物を硬化させる場合に、後述する（Ｂ）エポキシ樹脂成分を効率よく硬化させることが可能になる。

(In the formula, R ₁ may be the same or different, and is a divalent organic group containing at least one aromatic ring, and R ₂ may be the same or different, and at least a divalent organic group comprising two aromatic rings, R ₃ may be the same or different and is a monovalent organic radical selected from -OH or -NH _2,, R ₄ , Which may be the same or different, each represents a tetravalent organic group containing at least one aromatic ring, and V represents a direct bond, —O—, —CO—, —O—T—O—, and , —COO—T—OCO—, —C (CH ₃ ) ₂ —, —C (CF ₃ ) ₂ —, and T is a divalent organic group, c is an integer from 1 to 15, d is an integer from 0 to 15, c + d is an integer from 1 to 15. In addition, (2) is It may be a block copolymer or a random copolymer.) By containing an imide oligomer component containing (A) one of the imide oligomers represented by (1), the resin flow into the thermosetting resin composition. Imparts heat resistance to a cured resin obtained by curing the thermosetting resin composition. Moreover, when hardening a thermosetting resin composition by the above, it becomes possible to harden the (B) epoxy resin component mentioned later efficiently.

  Furthermore, the cured resin obtained by curing the thermosetting resin composition by having an imide group structure imparts bending resistance, excellent mechanical properties, chemical resistance, and GHz. Excellent dielectric properties with low dielectric constant and dielectric loss tangent in the band can be imparted.

  The weight average molecular weight of the imide oligomer component is not particularly limited as long as the repeating unit of the structure is in the range of 1 to 15, but the upper limit is preferably 15000 or less from the viewpoint of excellent solvent solubility and fluidity. It is preferable that it is 10,000 or less.

  The imide oligomer can be produced by a conventionally known method. For example, it can be obtained by chemically or thermally imidizing an amic acid oligomer that is a precursor material of the imide oligomer.

  Hereinafter, in order to describe the method for producing the imide oligomer, a method for synthesizing the amide acid oligomer and a method for obtaining a polyimide resin by dehydrating and ring-closing the amide acid oligomer for imidization will be described in detail.

<Method for producing amide acid oligomer>
The amic acid oligomer comprises an acid dianhydride component comprising at least one acid dianhydride and an amine component comprising at least one diamine or / and a monoamine having a hydroxyl group in an organic solvent, It can be obtained by reacting amines in excess of the number of moles of acid anhydride.

  For example, when obtaining an imide oligomer mainly containing an imide oligomer having a repeating unit n of 1 and a terminal functional group of an amine group, 1 mol of dianhydride can be reacted with substantially 2 mol of diamine. Can be obtained.

  As a typical technique for the above reaction, a solution in which the amine component is dissolved in an organic solvent and then the acid dianhydride component is added to dissolve the amic acid oligomer (hereinafter referred to as a polyamic acid solution). The method of obtaining is carried out. Here, “dissolved” means a state where the solvent is completely dissolved in the solute, and a state where the solute is uniformly dispersed or diffused in the solvent and is substantially in the same dissolved state. Shall be included.

  The order of adding the amine component and the acid dianhydride component is not limited to the above, and those skilled in the art can appropriately change, modify, and modify the addition method. That is, for example, the above addition method may be a method in which an acid dianhydride component is dissolved or diffused in an organic solvent, and then an amine component is added to form an amic acid oligomer solution.

  The temperature condition of the reaction between the acid dianhydride and the amine (synthesis reaction of the amide acid oligomer) is not particularly limited as long as the acid dianhydride and the amine can be polymerized, but is preferably 80 ° C. or lower. More preferably, the temperature is in the range of 0 to 50 ° C. The reaction time is not particularly limited as long as the polymerization reaction between the acid dianhydride and the amine can be completed, but may be arbitrarily set within a range of 30 minutes to 50 hours.

  Furthermore, the organic solvent used in the synthesis reaction of the amic acid oligomer is not particularly limited as long as it is an organic polar solvent. The manufacturing process is to select an organic solvent having a low boiling point as much as possible from the viewpoints that the raw material for obtaining the amide acid oligomer and the amide acid oligomer dissolves and that the imide oligomer is easily dried when the imide oligomer is produced. This is advantageous.

  Specifically, as the organic solvent used in the synthesis reaction of the amic acid oligomer, sulfoxide solvents such as dimethyl sulfoxide and diethyl sulfoxide; formamide solvents such as N, N-dimethylformamide and N, N-diethylformamide; N , N-dimethylacetamide, N, N-diethylacetamide and other acetamide solvents; N-methyl-2-pyrrolidone, N-vinyl-2-pyrrolidone and other pyrrolidone solvents; phenol, o-cresol, m-cresol, p -Phenolic solvents such as cresol, xylenol, halogenated phenol, catechol; hexamethylphosphoramide, γ-butyrolactone, and the like. Furthermore, you may use it in combination with the said organic solvent and aromatic hydrocarbons, such as xylene or toluene, as needed.

<Acid dianhydride component used for production of amic acid oligomer>
Examples of the acid dianhydride contained in the acid dianhydride component used to synthesize the amic acid oligomer include solubility in various organic solvents, heat resistance, (B) epoxy resin component, and (C) polyimide described below. The acid dianhydride has the general formula (3) in that it has compatibility with the resin.

（式中、Ｖは、直結、−Ｏ−，−ＣＯ−，−Ｏ−Ｔ−Ｏ−，及び，−ＣＯＯ−Ｔ−ＯＣＯ−、−Ｃ（ＣＨ₃）₂−、−Ｃ（ＣＦ₃）₂−からなる群より選択される２価基であり、Ｔは２価の有機基を表す）で表される構造を有するものが好ましい。

(In the formula, V is a direct bond, —O—, —CO—, —O—T—O—, and —COO—T—OCO—, —C (CH ₃ ) ₂ —, —C (CF ₃ ). ₂ is a divalent group selected from the group consisting of-, and T represents a divalent organic group.

  Among the acid dianhydrides represented by the above general formula (3), in particular, in order to obtain a cured resin having a low dielectric constant and dielectric loss tangent in the GHz band and excellent heat resistance, the above general formula (3) It is preferable that V is —O—T—O— or —COO—T—OCO—.

  Here, T is the following general formula

からなる群より選択される２価基、及び、一般式（４）

A divalent group selected from the group consisting of: and general formula (4)

（式中、Ｚは、−（ＣＨ2）Q−，−Ｃ（＝Ｏ）−，−ＳＯ₂−，−Ｏ−，及び，−Ｓ−からなる群より選択される２価基であり、Ｑは１以上５以下の整数である）で表される構造を有する２価基であることが好ましい。

(In the formula, Z is a divalent group selected from the group consisting of — (CH 2) Q—, —C (═O) —, —SO ₂ —, —O—, and —S—; Is an integer of 1 or more and 5 or less) and is preferably a divalent group having a structure represented by:

  Among these, solubility in various organic solvents, heat resistance, (B) compatibility with the epoxy resin component and (C) polyimide resin, polyimide resin having various properties such as dielectric properties in a well-balanced manner, and In terms of availability, acid dianhydride has the following general formula

で表される４，４’−（４，４’−イソプロピリデンジフェノキシ）ビスフタル酸二無水物を用いることが特に好ましい。

It is particularly preferable to use 4,4 ′-(4,4′-isopropylidenediphenoxy) bisphthalic dianhydride represented by

  When synthesizing a polyimide resin, an acid dianhydride component comprising at least one acid dianhydride of the acid dianhydrides having the structure represented by the general formula (3) is used. Use it. That is, the acid dianhydride component may contain only one of the acid dianhydrides described above, or two or more of them may be combined in an arbitrary ratio. Furthermore, an acid dianhydride having a structure other than the structure represented by the general formula (3) (hereinafter referred to as other acid dianhydrides) may be included.

  The content of the acid dianhydride having the structure represented by the general formula (3) in the acid dianhydride component is 50 mol% or more of the total acid dianhydride in the acid dianhydride component. Preferably there is. If content is 50 mol% or more, the imide oligomer excellent in the solubility with respect to various organic solvents, (B) compatibility with an epoxy resin component, a dielectric characteristic, etc. can be obtained.

  Among the acid dianhydrides contained in the acid dianhydride component, other acid dianhydrides having a structure other than the structure represented by the general formula (3) include pyromellitic acid, 1, 2, 3,4-benzenetetracarboxylic acid, 1,2,3,4-cyclobutanetetracarboxylic acid, 1,2,4,5-cyclopentanetetracarboxylic acid, 1,2,4,5-cyclohexanetetracarboxylic acid, 3 , 3 ′, 4,4′-bicyclohexyltetracarboxylic acid, 2,3,5-tricarboxycyclopentylacetic acid, 3,4-dicarboxy-1,2,3,4-tetrahydronaphthalene-1-succinic acid, bis (3,4-dicarboxyphenyl) methane, bis (2,3-dicarboxyphenyl) methane, 1,1-bis (2,3-dicarboxyphenyl) ethane, 3,3 ′, 4,4′-diphenyl The Lufone tetracarboxylic acid, 2,3,3′4′-diphenylsulfone tetracarboxylic acid, 2,3,6,7-naphthalene tetracarboxylic acid, 1,4,5,8-naphthalene tetracarboxylic acid, 1,2, 5,6-naphthalenetetracarboxylic acid, 3,4,9,10-tetracarboxyperylene acid, 2,2-bis [4- (3,4-dicarboxyphenoxy) phenyl] propanoic acid, 2,2-bis [ 4- (3,4-dicarboxyphenoxy) phenyl] hexafluoropropanoic acid, 3,3 ′, 4,4′-dimethyldiphenylsilanetetracarboxylic acid, 1,2,3,4-furantetracarboxylic acid, 4, Anhydrous anhydride such as 4′-bis (3,4-dicarboxyphenoxy) diphenylpropanoic acid, 4,4′-hexafluoroisopropylidenediphthalic acid, p-phenylenediphthalic acid, etc. Or there may be mentioned lower alkyl esters such as, but the present invention is of course not limited thereto.

  Each of these compounds may be used alone or in combination of two or more, but as described above, at least one acid dianhydride represented by the general formula (3) is used. Is highly preferred.

<Amine component used for production of amic acid oligomer>
Moreover, as an amine contained in the amine component used for synthesizing the amic acid oligomer, an amine component used at the terminal of the imide oligomer (referred to as an amine component for terminal purposes for convenience) and a terminal other than the terminal of the imide oligomer. It can be roughly classified into amine components used (referred to as diamine components for convenience).

  As the terminal amine component and the diamine component, those that can provide an imide oligomer excellent in solubility in various organic solvents, heat resistance, solder heat resistance, PCT resistance, low water absorption, etc. are preferable. An amine is preferred. Hereinafter, the terminal amine component and the diamine component will be described separately.

(Terminal amine component)
As the terminal amine component, specifically, the general formula (5)

（式中Ｒ₁は、少なくとも１つの芳香環を含む２価の有機基であり、Ｒ₃は、−ＯＨ、または−ＮＨ₂から選択される１価の有機基）で表される構造を有するものが好ましい。

(Wherein R ₁ is a divalent organic group containing at least one aromatic ring, and R ₃ is a monovalent organic group selected from —OH or —NH ₂ ). Those are preferred.

  Examples of the amine having the structure represented by the general formula (5) include phenylenediamines such as 1,4-diaminobenzene, 1,2-diaminobenzene, 1,3-diaminobenzene, and 4,4 ′. Diaminodiphenyl ethers such as diaminodiphenyl ether, 1,3′-diaminodiphenyl ether, bis [4- (3-aminophenoxy) phenyl] methane, bis [4- (4-aminophenoxy) phenyl] methane, 1,1- Bis [4- (3-aminophenoxy) phenyl] ethane, 1,1-bis [4- (4-aminophenoxy) phenyl] ethane, 1,2-bis [4- (3-aminophenoxy) phenyl] ethane, 1,2-bis [4- (4-aminophenoxy) phenyl] ethane, 2,2-bis [4- (3-aminophenoxy) pheny Bis [(aminophenoxy) phenyl] alkanes such as propane, 2,2-bis [4- (4-aminophenoxy) phenyl] propane, 2,2-bis [4- (3-aminophenoxy) phenyl] butane 2,2-bis [3- (3-aminophenoxy) phenyl] -1,1,1,3,3,3-hexafluoropropane, 2,2-bis [4- (4-aminophenoxy) phenyl]; Bis [(aminophenoxy) phenyl] fluoroalkanes such as -1,1,1,3,3,3-hexafluoropropane; 1,3-bis (3-aminophenoxy) benzene, 1,4-bis (3 -Aminophenoxy) benzene, 1,4′-bis (4-aminophenoxy) benzene, 4,4′-bis (4-aminophenoxy) biphenyl and the like Zen compounds; bis [amino (phenoxy) ketone] compounds such as bis [4- (3-aminophenoxy) phenyl] ketone and bis [4- (4-aminophenoxy) phenyl] ketone; bis [4- (3 Bis [(aminophenoxy) phenyl] sulfide compounds such as -aminophenoxy) phenyl] sulfide and bis [4- (4-aminophenoxy) phenyl] sulfide; bis [4- (3-aminophenoxy) phenyl] sulfone, Bis [(aminophenoxy) phenyl] sulfone compounds such as bis [4- (4-aminophenoxy) phenyl] sulfone; bis [4- (3-aminophenoxy) phenyl] ether, bis [4- (4-aminophenoxy) ) [Bis ((aminophenoxy) phenyl] ether compounds such as phenyl] ether; Bis [(aminophenoxy) benzoyl] benzene compounds such as 1,4-bis [4- (3-aminophenoxy) benzoyl] benzene and 1,3-bis [4- (3-aminophenoxy) benzoyl] benzene; Bis [(aminophenoxy) benzoyl] diphenyl ether compounds such as 4,4′-bis [3- (4-aminophenoxy) benzoyl] diphenyl ether and 4,4′-bis [3- (3-aminophenoxy) benzoyl] diphenyl ether Benzophenone compounds such as 4,4′-bis [4- (4-amino-α, α-dimethylbenzyl) phenoxy] benzophenone; 4,4′-diaminodiphenyl sulfone, 4,4′-bis [4 -(4-amino-α, α-dimethylbenzyl) phenoxy] diphenylsulfone, bis [4- { (Phenoxy) phenylsulfone compounds such as-(4-aminophenoxy) phenoxy} phenyl] sulfone; 1,4-bis [4- (4-aminophenoxy) -α, α-dimethylbenzyl] benzene, 1,3 And bis [(aminophenoxy) dimethylbenzene] benzene compounds such as -bis [4- (4-aminophenoxy) -α, α-dimethylbenzyl] benzene.

  Alternatively, the amine contained in the amine component may be an amine having a hydroxyl group. The amine having a hydroxyl group is not particularly limited as long as it has a hydroxyl group. For example, aminophenols such as 4-aminophenol, 3-aminophenol and 2-aminophenol, aminophenoxyphenols such as 4- (4-aminophenoxy) phenol and 4- (3-aminophenoxy) phenol, Diaminophenol compounds such as 4-diaminophenol; diaminobiphenyl compounds such as 3,3′-dihydroxy-4,4′-diaminobiphenyl; 3,3′-diamino-4,4′-dihydroxybiphenyl, 4,4 Hydroxy such as '-diamino-3,3'-dihydroxybiphenyl, 4,4'-diamino-2,2'-dihydroxybiphenyl, 4,4'-diamino-2,2', 5,5'-tetrahydroxybiphenyl Biphenyl compounds; 3,3′-diamino-4,4′-dihydroxydiphenyl 4,4′-diamino-3,3′-dihydroxydiphenylmethane, 4,4′-diamino-2,2′-dihydroxydiphenylmethane, 2,2-bis [3-amino-4-hydroxyphenyl] propane 2,2-bis [4-amino-3-hydroxyphenyl] propane, 2,2-bis [3-amino-4-hydroxyphenyl] hexafluoropropane, 4,4′-diamino-2,2 ′, 5 , 5'-tetrahydroxydiphenylmethane and the like; 3,3'-diamino-4,4'-dihydroxydiphenyl ether, 4,4'-diamino-3,3'-dihydroxydiphenyl ether, 4,4'-diamino -2,2'-dihydroxydiphenyl ether, 4,4'-diamino-2,2 ', 5,5'-tetrahi Hydroxydiphenyl ether compounds such as loxydiphenyl ether; 3,3′-diamino-4,4′-dihydroxydiphenylsulfone, 4,4′-diamino-3,3′-dihydroxydiphenylsulfone, 4,4′-diamino-2, Diphenylsulfone compounds such as 2′-dihydroxydiphenylsulfone and 4,4′-diamino-2,2 ′, 5,5′-tetrahydroxydiphenylsulfone; 2,2-bis [4- (4-amino-3- Bis [(hydroxyphenyl) phenyl] alkanes such as hydroxyphenoxy) phenyl] propane; bis (hydroxyphenoxy) biphenyl compounds such as 4,4′-bis (4-amino-3-hydroxyphenoxy) biphenyl; 2 , 2-Bis [4- (4-amino-3-hydroxyphenoxy) phenyl Bis [(hydroxyphenoxy) phenyl] sulfone compounds such as sulfone.

In particular, solubility in solvents, good reactivity with the epoxy resin, also from the viewpoint of availability, at the general formula (5), R ₁ is,

からなる群より選択される２価の有機基、及び一般式（６）

A divalent organic group selected from the group consisting of:

（式中、Ｘは、それぞれ独立して−Ｃ（＝Ｏ）−，−ＳＯ₂−，−Ｏ−，−Ｓ−，−（ＣＨ₂）ｌ−，−ＮＨＣＯ−，−Ｃ（ＣＨ₃）₂−，−Ｃ（ＣＦ₃）₂−，及び，−Ｃ（＝Ｏ）Ｏ−からなる群より選択される２価基、又は、直接結合を表し、Ｒ₅は、それぞれ独立して、−ＯＨ、−ＮＨ₂、水素，ハロゲン，又は，炭素数１〜４のアルキル基を表し、ｌ、sは、それぞれ独立して０以上５以下の整数である。

(In the formula, X is independently —C (═O) —, —SO ₂ —, —O—, —S—, — (CH ₂ ) 1 —, —NHCO—, —C (CH ₃ ). _2- , -C (CF ₃ ) _2- , and -C (= O) O- represents a divalent group selected from the group consisting of or a direct bond, and R ₅ each independently represents- OH, —NH ₂ , hydrogen, halogen, or an alkyl group having 1 to 4 carbon atoms is represented, and l and s are each independently an integer of 0 or more and 5 or less.

(Diamine component)
As the diamine component, a diamine when R ₃ in the above general formula (5) is NH ₂ can be used. From the viewpoint of solubility of the imide oligomer in the solvent, the general formula (7)

（式中Ｒ₂は、少なくとも１つの芳香環を含む２価の有機基を表す。）で表されるジアミンを含有することが好ましい。
特に溶媒への溶解性、エポキシ樹脂との反応性に優れ、また入手性の点から、上記一般式（７）にて、Ｒ₂が下記一般式(６)

(Wherein R ₂ represents a divalent organic group containing at least one aromatic ring), and preferably contains a diamine.
In particular, it is excellent in solubility in a solvent and reactivity with an epoxy resin, and from the viewpoint of availability, in the above general formula (7), R ₂ is represented by the following general formula (6).

（式中、Ｘは、それぞれ独立して−Ｃ（＝Ｏ）−，−ＳＯ₂−，−Ｏ−，−Ｓ−，−（ＣＨ₂）ｌ−，−ＮＨＣＯ−，−Ｃ（ＣＨ₃）₂−，−Ｃ（ＣＦ₃）₂−，及び，−Ｃ（＝Ｏ）Ｏ−からなる群より選択される２価基、又は、直接結合を表し、Ｒ₅は、それぞれ独立して、−ＯＨ、−ＮＨ₂、水素，ハロゲン，又は，炭素数１〜４のアルキル基を表し、ｌ、sは、それぞれ独立して０以上５以下の整数である。）からなる群より選択される２価の有機基であることが好ましい。

(In the formula, X is independently —C (═O) —, —SO ₂ —, —O—, —S—, — (CH ₂ ) 1 —, —NHCO—, —C (CH ₃ ). _2- , -C (CF ₃ ) _2- , and -C (= O) O- represents a divalent group selected from the group consisting of or a direct bond, and R ₅ each independently represents- OH, —NH ₂ , hydrogen, halogen, or an alkyl group having 1 to 4 carbon atoms, and l and s are each independently an integer of 0 or more and 5 or less. A valent organic group is preferred.

<Imidation of amic acid oligomer>
A method of imidizing the amic acid oligomer in order to obtain an imide oligomer using the amic acid oligomer solution containing the amic acid oligomer will be described. The imidization is performed, for example, by dehydrating and ring-closing the polyamic acid in the polyamic acid solution by a thermal method. The thermal method is a method of dehydrating the amic acid oligomer solution by heat treatment. Hereinafter, the above method will be described.

  Examples of the dehydration ring closure by a thermal method include a method in which the imidization reaction is advanced by the heat treatment of the amic acid oligomer solution and the solvent is evaporated at the same time. By this thermal method, a solid polyimide resin can be obtained. In addition, although the conditions of the said heat processing are not specifically limited, It is preferable to heat at the temperature of 300 degrees C or less for the time of the range for about 5 minutes-20 minutes.

  In the above thermal method, the method for evaporating the solvent has been described. However, there is a method for not evaporating the solvent. Specifically, the imide oligomer solution obtained by the above thermal method is added to a poor solvent to precipitate the imide oligomer, and the unreacted monomer (acid dianhydride / amine) is removed and purified and dried. This is a method for obtaining a solid imide oligomer. The poor solvent is not particularly limited as long as it is well mixed with the solvent of the imide oligomer solution, but the imide oligomer is not easily dissolved, for example, acetone, methanol, ethanol, isopropanol, benzene, methyl cellosolve. (Registered trademark), methyl ethyl ketone, and the like.

  Furthermore, in the method of imidizing the amic acid oligomer by performing heat treatment under reduced pressure, the heating condition may be 80 ° C. to 400 ° C., but in order to perform imidization and dehydration efficiently, 100 ° C. or higher. It is more preferable to set it as 120 degreeC or more. In addition, it is preferable that the maximum temperature in heat processing shall be below the thermal decomposition temperature of an imide oligomer, and it is normally set in the temperature range of about 250 to 350 degreeC which is the completion temperature of imidation. Further, the pressure condition is preferably low pressure, specifically, preferably in the range of 0.001 atmosphere to 0.9 atmosphere, more preferably 0.001 atmosphere to 0.8 atmosphere. Preferably, it is 0.001 to 0.7 atm.

  According to the method of imidizing the amic acid oligomer by performing the heat treatment under the reduced pressure, water generated by imidization can be positively removed out of the system, so that hydrolysis of the polyamic acid is suppressed. Can do. As a result, an imide oligomer having a desired molecular weight can be obtained. Furthermore, if this method is used, one-side ring-opened product or both-side ring-opened products existing as impurities in the acid dianhydride that is a raw material of the amic acid oligomer can be closed, so that the molecular weight of the imide oligomer can be controlled. This can be further improved.

(B) Epoxy resin component Next, the epoxy resin contained in the thermosetting resin composition of this invention is demonstrated. The thermosetting resin composition of the present invention contains (B) an epoxy resin component comprising at least one epoxy resin, thereby imparting resin fluidity to the thermosetting resin composition and thermosetting. In addition to imparting heat resistance and insulating properties to the cured resin obtained by curing the conductive resin composition, it is possible to impart adhesion to conductors such as metal foil and circuit boards.
In addition, by containing at least one liquid epoxy resin in the (B) epoxy resin component, the resin fluidity in a semi-cured state (B stage state) can be further improved, and when it is in the form of a sheet The handling property can be improved, such as the sheet is less likely to break and the slits are easily formed.

  The liquid epoxy resin of the present invention refers to an epoxy resin having a minimum viscosity of 10 Pa · S (100 poise) or less in a temperature range of 60 ° C. or less. In the present invention, it is more preferable to use a liquid epoxy resin having a minimum melt viscosity of 60 ° C. or less and 5 Pa · S or less.

  The liquid epoxy resin is not particularly limited as long as it is liquid. Examples of the polyfunctional liquid epoxy resin include Epicoat E152 (trade name, manufactured by Japan Epoxy Resin Co., Ltd.), Epicron N730-S (trade name, large size). Liquid phenol novolak type epoxy resin such as Nippon Ink Industries Co., Ltd., liquid bisphenol A type epoxy resin such as Epicoat E827 and Epicoat E828 (both trade names, manufactured by Japan Epoxy Resin Co., Ltd.), Epicoat E806, Epicoat E807 ( Liquid bisphenol F type epoxy resin such as trade name, manufactured by Japan Epoxy Resin Co., Ltd., Epicoat E630 product name, manufactured by Japan Epoxy Resin Co., Ltd., GOT, GAN (trade name, manufactured by Nippon Kayaku Co., Ltd.) Liquid glycidylamine type epoxy resin, EPU- 3 (trade name, Asahi Denka Kogyo Co., Ltd.) liquid urethane-modified bisphenol A type epoxy resin, YED122, YED111N (both trade names, manufactured by Japan Epoxy Resin Co., Ltd.) and other liquid epoxy resins such as monofunctional epoxy resins Is mentioned.

  Of the above epoxy resins, liquid phenol novolac type epoxy resins, liquid bisphenol F type epoxy resins, and liquid bisphenol A type epoxy resins are preferred.

  The epoxy resin is easily available, (A) an imide oligomer component, (C) a polyimide resin described later, (E) compatibility with other components, and excellent resin fluidity of the thermosetting resin composition, The handling property in a semi-cured state can be improved, and excellent heat resistance and insulation can be imparted to the cured resin.

  The epoxy resin other than the liquid epoxy resin is not particularly limited. For example, bisphenol type epoxy resin, bisphenol A novolac type epoxy resin, biphenyl type epoxy resin, phenol novolak type epoxy resin, alkylphenol novolac type epoxy resin, polyglycol type Epoxy resins, cycloaliphatic epoxy resins, cresol novolac type epoxy resins, glycidylamine type epoxy resins, naphthalene type epoxy resins, urethane modified epoxy resins, rubber modified epoxy resins, epoxy modified polysiloxanes, and their halogens And a crystalline epoxy resin having a melting point.

    Among the above epoxy resins, epoxy resins having at least one aromatic ring and / or aliphatic ring in the molecular chain, biphenyl type epoxy resins having a biphenyl skeleton, naphthalene type epoxy resins having a naphthalene skeleton, crystallinity having a melting point Epoxy resins are preferred. The epoxy resin is easily available, (A) an imide oligomer component, (C) a polyimide resin described later, (E) compatibility with other components, and excellent resin fluidity of the thermosetting resin composition, Excellent heat resistance and insulation can be imparted to the cured resin.

  The epoxy resin contained in the thermosetting resin composition is preferably a high-purity epoxy resin in order to obtain highly reliable electrical insulation. That is, the content concentration of halogen or alkali metal contained in the epoxy resin is preferably 25 ppm or less, more preferably 15 ppm or less when extracted under the conditions of 120 ° C. and 2 atm. When the content concentration of halogen or alkali metal is higher than 25 ppm, the reliability of electrical insulation of the cured resin obtained by curing the thermosetting resin composition may be impaired.

  The epoxy resin preferably has an epoxy value (also referred to as epoxy equivalent) lower limit value of 150 or more, more preferably 170 or more, and most preferably 190 or more. The upper limit value of the epoxy value of the epoxy resin is preferably 700 or less, more preferably 500 or less, and most preferably 300 or less.

  When the epoxy value of the epoxy resin is less than 150, the number of polar groups in the cured resin obtained by curing the thermosetting resin composition increases, so that the dielectric properties may be impaired. That is, the dielectric constant and dielectric loss tangent of the cured resin may increase. On the other hand, when the epoxy value exceeds 700, the crosslink density in the cured resin is lowered, so that the heat resistance may be impaired.

(C) Polyimide resin component The thermosetting resin composition of the present invention contains (C) a polyimide resin component that further contains at least one polyimide resin in the (A) component and the (B) component. In addition to imparting heat resistance to the curable resin composition, and further imparting bending resistance, excellent mechanical properties, and chemical resistance to the cured resin obtained by curing the thermosetting resin composition, Excellent dielectric properties can be imparted with a low dielectric constant and dielectric loss tangent in the GHz band.

  Although it does not specifically limit as a polyimide resin, It is preferable that it is a soluble polyimide resin which melt | dissolves in an organic solvent. Here, the soluble polyimide resin refers to a polyimide resin that dissolves in an organic solvent in an amount of 1% by weight or more in a temperature range of 15 ° C to 100 ° C.

  Examples of the organic solvent include ether solvents such as dioxane, dioxolane and tetrahydrofuran; acetamide solvents such as N, N-dimethylformamide and N, N-diethylacetamide; formamide solvents such as N, N-diethylformamide and the like. Examples of the solvent include at least one solvent selected from N, N-dimethylacetamide; pyrrolidone solvents such as N-methyl-2-pyrrolidone and N-vinyl-2-pyrrolidone.

  If the said soluble polyimide resin is used, in the thermosetting of the thermosetting resin composition of this invention, the process for high temperature and a long time is not required. Therefore, it is preferable from the point of workability to use a soluble polyimide resin as a polyimide resin.

The polyimide resin can be produced by a conventionally known method.
It can be obtained by chemically or thermally imidizing a polyamic acid, which is a precursor material of a polyimide resin.

  Hereinafter, in order to explain the method for producing the polyimide resin, a method for synthesizing a polyamic acid and a method for obtaining a polyimide resin by dehydrating and ring-closing the polyamic acid to perform imidization will be described in detail.

<Method for producing polyamic acid>
The polyamic acid comprises an acid dianhydride component comprising at least one acid dianhydride and a diamine component comprising at least one diamine in an organic solvent, and the acid dianhydride and diamine. However, it can be obtained by carrying out the reaction so as to be substantially equimolar. Alternatively, when two or more types of acid dianhydride components and two or more types of diamine components are used, the molar ratio of the total amount of plural diamine components and the molar ratio of the total amount of plural acid dianhydride components are substantially equimolar. If adjusted so as to be, a polyamic acid copolymer can be arbitrarily obtained.

  As a typical method of the above reaction, a solution obtained by dissolving the diamine component in an organic solvent and then adding the acid dianhydride component to dissolve the polyamic acid (hereinafter referred to as a polyamic acid solution). ). Here, “dissolved” means a state where the solvent is completely dissolved in the solute, and a state where the solute is uniformly dispersed or diffused in the solvent and is substantially in the same dissolved state. Shall be included.

  The order of adding the diamine component and the acid dianhydride component is not limited to the above, and those skilled in the art can appropriately change, modify, or modify the addition method. That is, for example, the addition method may be a method in which an acid dianhydride component is dissolved or diffused in an organic solvent, and then a diamine component is added to form a polyamic acid solution. Alternatively, first, an appropriate amount of the diamine component is added to the organic solvent, and then an acid dianhydride component containing an acid dianhydride that is excessive with respect to the diamine in the diamine component is added, and the excess of the acid dianhydride is added. A method of adding a diamine component containing an amount of diamine corresponding to the amount to form a polyamic acid solution may be used.

  The temperature condition of the reaction between the acid dianhydride and the diamine (polyamide acid synthesis reaction) is not particularly limited as long as the acid dianhydride and the diamine can be polymerized, but is preferably 80 ° C. or less. More preferably, it is in the range of 0 to 50 ° C. The reaction time is not particularly limited as long as the polymerization reaction between the acid dianhydride and the diamine can be completed, but may be arbitrarily set within a range of 30 minutes to 50 hours.

  Furthermore, the organic solvent used for the synthesis reaction of the polyamic acid is not particularly limited as long as it is an organic polar solvent. However, it is a good solvent for polyamic acid from the viewpoint of facilitating stirring by suppressing an increase in viscosity during polymerization of the polyamic acid, and facilitating drying of the polyimide resin when producing the polyimide resin. Therefore, it is advantageous in the production process to select an organic solvent having a low boiling point as much as possible.

  Specifically, as the organic solvent used for the polyamic acid synthesis reaction, sulfoxide solvents such as dimethyl sulfoxide and diethyl sulfoxide; formamide solvents such as N, N-dimethylformamide and N, N-diethylformamide; N, Acetamide solvents such as N-dimethylacetamide and N, N-diethylacetamide; pyrrolidone solvents such as N-methyl-2-pyrrolidone and N-vinyl-2-pyrrolidone; phenol, o-cresol, m-cresol, p- Examples thereof include phenol solvents such as cresol, xylenol, halogenated phenol, and catechol; hexamethylphosphoramide, γ-butyrolactone, and the like. Furthermore, you may use it in combination with the said organic solvent and aromatic hydrocarbons, such as xylene or toluene, as needed.

<Acid dianhydride component used in the production of polyamic acid>
Examples of the acid dianhydride contained in the acid dianhydride component used for synthesizing the polyamic acid include solubility in various organic solvents, heat resistance, the aforementioned (A) imide oligomer component, and (B) epoxy resin. Although it will not specifically limit if the polyimide resin which has compatibility with a component, etc. is obtained, Aromatic tetracarboxylic dianhydride is preferable. Specifically, the acid dianhydride has the general formula (3)

（式中、Ｖは、−Ｏ−，−ＣＯ−，−Ｏ−Ｔ−Ｏ−，及び，−ＣＯＯ−Ｔ−ＯＣＯ−からなる群より選択される２価基であり、Ｔは２価の有機基を表す）で表される構造を有するものが好ましい。

(In the formula, V is a divalent group selected from the group consisting of —O—, —CO—, —O—T—O—, and —COO—T—OCO—, and T is a divalent group. Those having a structure represented by (representing an organic group) are preferred.

  Among the acid dianhydrides represented by the above general formula (3), in particular, in order to obtain a cured resin having a low dielectric constant and dielectric loss tangent in the GHz band and excellent heat resistance, the above general formula (3) It is preferable that V is —O—T—O— or —COO—T—OCO—.

  Here, T is the following general formula

からなる群より選択される２価基、及び、一般式（４）

A divalent group selected from the group consisting of: and general formula (4)

（式中、Ｚは、−（ＣＨ2）Q−，−Ｃ（＝Ｏ）−，−ＳＯ₂−，−Ｏ−，及び，−Ｓ−からなる群より選択される２価基であり、Ｑは１以上５以下の整数である）で表される構造を有する２価基であることが好ましい。

(In the formula, Z is a divalent group selected from the group consisting of — (CH 2) Q—, —C (═O) —, —SO ₂ —, —O—, and —S—; Is an integer of 1 or more and 5 or less) and is preferably a divalent group having a structure represented by:

  Among these, the solubility to various organic solvents, heat resistance, compatibility with (B) diamine component and (C) epoxy resin component, polyimide resin having various properties such as dielectric properties, and the like are obtained, and In terms of availability, acid dianhydride has the following general formula

で表される４，４’−（４，４’−イソプロピリデンジフェノキシ）ビスフタル酸二無水物を用いることが特に好ましい。

It is particularly preferable to use 4,4 ′-(4,4′-isopropylidenediphenoxy) bisphthalic dianhydride represented by

  When synthesizing a polyimide resin, an acid dianhydride component comprising at least one acid dianhydride of the acid dianhydrides having the structure represented by the general formula (3) is used. Use it. That is, the acid dianhydride component may contain only one of the acid dianhydrides described above, or two or more of them may be combined in an arbitrary ratio. Furthermore, an acid dianhydride having a structure other than the structure represented by the general formula (3) (hereinafter referred to as other acid dianhydrides) may be included.

  The content of the acid dianhydride having the structure represented by the general formula (3) in the acid dianhydride component is 50 mol% or more of the total acid dianhydride in the acid dianhydride component. Preferably there is. If content is 50 mol% or more, the polyimide resin excellent in the solubility with respect to various organic solvents, compatibility with (A) imide oligomer component and (B) epoxy resin component, dielectric characteristics, etc. can be obtained. .

  Among the acid dianhydrides contained in the acid dianhydride component, other acid dianhydrides having a structure other than the structure represented by the general formula (3) are not particularly limited, but the general formula An aromatic tetracarboxylic dianhydride having a structure other than the structure represented by (3) is preferred.

  Examples of the other acid dianhydrides include pyromellitic acid, 1,2,3,4-benzenetetracarboxylic acid, 1,2,3,4-cyclobutanetetracarboxylic acid, 1,2,4,5- Cyclopentanetetracarboxylic acid, 1,2,4,5-cyclohexanetetracarboxylic acid, 3,3 ′, 4,4′-bicyclohexyltetracarboxylic acid, 2,3,5-tricarboxycyclopentylacetic acid, 3,4- Dicarboxy-1,2,3,4-tetrahydronaphthalene-1-succinic acid, bis (3,4-dicarboxyphenyl) methane, bis (2,3-dicarboxyphenyl) methane, 1,1-bis (2 , 3-dicarboxyphenyl) ethane, 3,3 ′, 4,4′-diphenylsulfonetetracarboxylic acid, 2,3,3′4′-diphenylsulfonetetracarboxylic acid, 2,3, , 7-naphthalene tetracarboxylic acid, 1,4,5,8-naphthalene tetracarboxylic acid, 1,2,5,6-naphthalene tetracarboxylic acid, 3,4,9,10-tetracarboxyperylene acid, 2,2 -Bis [4- (3,4-dicarboxyphenoxy) phenyl] propanoic acid, 2,2-bis [4- (3,4-dicarboxyphenoxy) phenyl] hexafluoropropanoic acid, 3,3 ′, 4 4'-dimethyldiphenylsilanetetracarboxylic acid, 1,2,3,4-furantetracarboxylic acid, 4,4'-bis (3,4-dicarboxyphenoxy) diphenylpropanoic acid, 4,4'-hexafluoroisopropyl Examples thereof include anhydrides such as lidene diphthalic acid and p-phenylenediphthalic acid, or lower alkyl esters thereof, but are of course limited thereto. Not to.

  The above-mentioned other acid dianhydrides may be used alone or in combination of two or more at any ratio.

<Diamine component used for production of polyamic acid>
The diamine contained in the diamine component used to synthesize the polyamic acid is a polyimide excellent in solubility in various organic solvents, heat resistance, solder heat resistance, PCT resistance, low water absorption, thermoplasticity, etc. What can obtain resin is preferable, and it is preferable that it is aromatic diamine. Specifically, as the diamine, the general formula (8)

（式中、Ｙは、それぞれ独立して、−Ｃ（＝Ｏ）−，−ＳＯ₂−，−Ｏ−，−Ｓ
−，−（ＣＨ₂）u−，−ＮＨＣＯ−，−Ｃ（ＣＨ₃）₂−，−Ｃ（ＣＦ₃）₂−，及び，−Ｃ（＝Ｏ）Ｏ−からなる群より選択される２価基、又は、直接結合を表し、Ｒ６は、それぞれ独立して、水素，ハロゲン，又は，炭素数１〜４のアルキル基を表し、ｔ、uは、それぞれ独立して１以上５以下の整数である）で表される構造を有するものが好ましい。ここで、直接結合とは、２つのベンゼン環のそれぞれに含まれる炭素が直接結合することによって、２つのベンゼン環が結合していることをいう。

(Wherein, Y are each independently, -C (= O) -, - SO 2 -, - O -, - S
_{-, - (CH 2) u} -, - NHCO -, - C (CH 3) 2 -, - C (CF 3) 2 -, and, -C (= O) 2, which is selected from the group consisting of O- Represents a valent group or a direct bond, each R6 independently represents hydrogen, halogen, or an alkyl group having 1 to 4 carbon atoms, and t and u are each independently an integer of 1 to 5. It is preferable to have a structure represented by: Here, the direct bond means that the two benzene rings are bonded by directly bonding the carbon contained in each of the two benzene rings.

  Examples of the diamine having the structure represented by the general formula (8) include bis [4- (3-aminophenoxy) phenyl] methane, bis [4- (4-aminophenoxy) phenyl] methane, 1 , 1-bis [4- (3-aminophenoxy) phenyl] ethane, 1,1-bis [4- (4-aminophenoxy) phenyl] ethane, 1,2-bis [4- (3-aminophenoxy) phenyl ] Ethane, 1,2-bis [4- (4-aminophenoxy) phenyl] ethane, 2,2-bis [4- (3-aminophenoxy) phenyl] propane, 2,2-bis [4- (4- Bis [(aminophenoxy) phenyl] alkanes such as aminophenoxy) phenyl] propane and 2,2-bis [4- (3-aminophenoxy) phenyl] butane; 2,2-bis [3- (3 Aminophenoxy) phenyl] -1,1,1,3,3,3-hexafluoropropane, 2,2-bis [4- (4-aminophenoxy) phenyl] -1,1,1,3,3,3 -Bis [(aminophenoxy) phenyl] fluoroalkanes such as hexafluoropropane; 1,3-bis (3-aminophenoxy) benzene, 1,4-bis (3-aminophenoxy) benzene, 1,4'-bis Bis (aminophenoxy) benzene compounds such as (4-aminophenoxy) benzene and 4,4′-bis (4-aminophenoxy) biphenyl; bis [4- (3-aminophenoxy) phenyl] ketone, bis [4 Bis (aminophenoxy) ketone compounds such as-(4-aminophenoxy) phenyl] ketone; bis [4- (3-aminophenoxy) phenyl Bis [(aminophenoxy) phenyl] sulfide compounds such as sulfide and bis [4- (4-aminophenoxy) phenyl] sulfide; bis [4- (3-aminophenoxy) phenyl] sulfone, bis [4- (4 -Bis [(aminophenoxy) phenyl] sulfone compounds such as aminophenoxy) phenyl] sulfone; bis [4- (3-aminophenoxy) phenyl] ether, bis [4- (4-aminophenoxy) phenyl] ether, etc. Bis [(aminophenoxy) phenyl] ether compounds; 1,4-bis [4- (3-aminophenoxy) benzoyl] benzene, 1,3-bis [4- (3-aminophenoxy) benzoyl] benzene, etc. Bis [(aminophenoxy) benzoyl] benzene compounds; 4,4′-bis [3- Bis [(aminophenoxy) benzoyl] diphenyl ether compounds such as (4-aminophenoxy) benzoyl] diphenyl ether and 4,4′-bis [3- (3-aminophenoxy) benzoyl] diphenyl ether; 4,4′-bis [ Benzophenone compounds such as 4- (4-amino-α, α-dimethylbenzyl) phenoxy] benzophenone; 4,4′-bis [4- (4-amino-α, α-dimethylbenzyl) phenoxy] diphenylsulfone, (Phenoxy) phenylsulfone compounds such as bis [4- {4- (4-aminophenoxy) phenoxy} phenyl] sulfone; 1,4-bis [4- (4-aminophenoxy) -α, α-dimethylbenzyl Benzene, 1,3-bis [4- (4-aminophenoxy) -α, α-dimethylbenzen Bis [(aminophenoxy) dimethylbenzene] benzene-based compounds such as benzene].

  Of the diamines having the structure represented by the general formula (8), diamines having an amino group at the meta position are more preferable. If a diamine having an amino group at the meta position is used, a polyimide resin having further excellent solubility in various organic solvents can be obtained as compared with the case of using a diamine having an amino group at the para position. The diamine having an amino group at the meta position is represented by the general formula (9)

（式中、Ｙは、それぞれ独立して、−Ｃ（＝Ｏ）−，−ＳＯ₂−，−Ｏ−，−Ｓ−，−（ＣＨ₂）ｕ−，−ＮＨＣＯ−，−Ｃ（ＣＨ₃）₂−，−Ｃ（ＣＦ₃）₂−，及び，−Ｃ（＝Ｏ）Ｏ−からなる群より選択される２価基、又は、直接結合を表し、Ｒは、それぞれ独立して、水素，ハロゲン，又は，炭素数１〜４のアルキル基を表し、ｔ、ｕは、それぞれ独立して１以上５以下の整数である）で表される構造を有する。

(Wherein, Y are each independently, -C (= O) -, - SO 2 -, - O -, - S -, - (CH 2) u -, - NHCO -, - C (CH 3 ) _2- , -C (CF ₃ ) _2- , and -C (= O) O- represent a divalent group selected from the group consisting of or a direct bond, and each R independently represents hydrogen. , Halogen, or an alkyl group having 1 to 4 carbon atoms, and t and u are each independently an integer of 1 or more and 5 or less.

  Examples of the diamine having the structure represented by the general formula (9) include 1,1-bis [4- (3-aminophenoxy) phenyl] ethane and 1,2-bis [4- (3-aminophenoxy) phenyl] ethane, 2,2-bis [4- (3-aminophenoxy) phenyl] propane, 2,2-bis [4- (3) -aminophenoxy) phenyl] butane, 2,2 -Bis [3- (3-aminophenoxy) phenyl] -1,1,1,3,3,3-hexafluoropropane, 1,3-bis (3-aminophenoxy) benzene, 1,4-bis (3 -Aminophenoxy) benzene, bis [4- (3-aminophenoxy) phenyl] ketone, bis [4- (3-aminophenoxy) phenyl] sulfide, bis [4- (3-aminophenoxy) phene Ru] sulfone, bis [4- (3-aminophenoxy) phenyl] ether, 1,4-bis [4- (3-aminophenoxy) benzoyl] benzene, 1,3-bis [4- (3-aminophenoxy) Benzoyl] benzene, 4,4′-bis [3- (3-aminophenoxy) benzoyl] diphenyl ether, and the like. Among these, it is particularly preferable to use 1,3-bis (3-aminophenoxy) benzene. If the 1,3-bis (3-aminophenoxy) benzene is used, it becomes possible to provide a thermosetting resin composition excellent in solubility in various organic solvents, solder heat resistance, and PCT resistance.

  Alternatively, the diamine contained in the diamine component may be a diamine having a hydroxyl group and / or a carboxyl group. If a polyamic acid is produced using a diamine having a hydroxyl group and / or a carboxyl group to obtain a polyimide resin, a polyimide resin having a hydroxyl group and / or a carboxyl group can be obtained.

  When a hydroxyl group and / or a carboxyl group are introduced into the polyimide resin, curing of the (B) epoxy resin component can be promoted. Therefore, it becomes possible to perform the thermosetting of the (B) epoxy resin component at a low temperature or in a short time. Furthermore, since the (B) epoxy resin component reacts with a hydroxyl group and / or a carboxyl group, the polyimide resins are cross-linked via the epoxy resin contained in the (B) epoxy resin component. Accordingly, in order to obtain a polyimide resin having a hydroxyl group and / or a carboxyl group, if a diamine having a hydroxyl group and / or a carboxyl group is used as the diamine, thermosetting further excellent in heat resistance, solder heat resistance, PCT resistance, etc. Resin composition can be obtained.

  The diamine having a hydroxyl group and / or a carboxyl group is not particularly limited as long as it has a hydroxyl group and / or a carboxyl group. For example, diaminophenol compounds such as 2,4-diaminophenol; diaminobiphenyl compounds such as 3,3′-dihydroxy-4,4′-diaminobiphenyl; 3,3′-diamino-4,4′-dihydroxybiphenyl 4,4′-diamino-3,3′-dihydroxybiphenyl, 4,4′-diamino-2,2′-dihydroxybiphenyl, 4,4′-diamino-2,2 ′, 5,5′-tetrahydroxy Hydroxybiphenyl compounds such as biphenyl; 3,3′-diamino-4,4′-dihydroxydiphenylmethane, 4,4′-diamino-3,3′-dihydroxydiphenylmethane, 4,4′-diamino-2,2 ′ -Dihydroxydiphenylmethane, 2,2-bis [3-amino-4-hydroxyphenyl] propane, 2,2-bi [4-Amino-3-hydroxyphenyl] propane, 2,2-bis [3-amino-4-hydroxyphenyl] hexafluoropropane, 4,4′-diamino-2,2 ′, 5,5′-tetrahydroxy Hydroxydiphenylalkanes such as diphenylmethane; 3,3′-diamino-4,4′-dihydroxydiphenyl ether, 4,4′-diamino-3,3′-dihydroxydiphenyl ether, 4,4′-diamino-2,2′- Hydroxydiphenyl ether compounds such as dihydroxydiphenyl ether and 4,4′-diamino-2,2 ′, 5,5′-tetrahydroxydiphenyl ether; 3,3′-diamino-4,4′-dihydroxydiphenylsulfone, 4,4 ′ -Diamino-3,3'-dihydroxydiphenylsulfone, 4,4 ' Diphenylsulfone compounds such as diamino-2,2′-dihydroxydiphenylsulfone and 4,4′-diamino-2,2 ′, 5,5′-tetrahydroxydiphenylsulfone; 2,2-bis [4- (4- Bis [(hydroxyphenyl) phenyl] alkanes such as amino-3-hydroxyphenoxy) phenyl] propane; Bis (hydroxyphenoxy) biphenyl such as 4,4′-bis (4-amino-3-hydroxyphenoxy) biphenyl Compounds; bis [(hydroxyphenoxy) phenyl] sulfone compounds such as 2,2-bis [4- (4-amino-3-hydroxyphenoxy) phenyl] sulfone; diaminobenzoic acids such as 3,5-diaminobenzoic acid 3,3′-diamino-4,4′-dicarboxybiphenyl, 4,4′-diamino-3,3; Carboxyphenyl compounds such as '-dicarboxybiphenyl, 4,4'-diamino-2,2'-dicarboxybiphenyl, 4,4'-diamino-2,2', 5,5'-tetracarboxybiphenyl; 3 , 3′-diamino-4,4′-dicarboxydiphenylmethane, 4,4′-diamino-3,3′-dihydroxydiphenylmethane, 4,4′-diamino-2,2′-dihydroxydiphenylmethane, 2,2 -Bis [4-amino-3-carboxyphenyl] propane, 2,2-bis [3-amino-4-carboxyphenyl] hexafluoropropane, 4,4'-diamino-2,2 ', 5,5'- Carboxydiphenylalkanes such as carboxydiphenylmethane such as tetracarboxydiphenylmethane; 3,3′-diamino-4,4 ′ Dicarboxydiphenyl ether, 4,4′-diamino-3,3′-dicarboxydiphenyl ether, 4,4′-diamino-2,2′-dicarboxydiphenyl ether, 4,4′-diamino-2,2 ′, 5 Carboxydiphenyl ether compounds such as 5′-tetracarboxydiphenyl ether; 3,3′-diamino-4,4′-dicarboxydiphenyl sulfone, 4,4′-diamino-3,3′-dicarboxydiphenyl sulfone, 4,4 Diphenylsulfone compounds such as '-diamino-2,2'-dicarboxydiphenylsulfone and 4,4'-diamino-2,2', 5,5'-tetracarboxydiphenylsulfone; 2,2-bis [4- Bis [(carboxyl) such as (4-amino-3-carboxyphenoxy) phenyl] propane Nyl) phenyl] alkanes; bis (hydroxyphenoxy) biphenyl compounds such as 4,4′-bis (4-amino-3-hydroxyphenoxy) biphenyl; 2,2-bis [4- (4-amino- And bis [(carboxyphenoxy) phenyl] sulfone compounds such as 3-carboxyphenoxy) phenyl] sulfone.

  Among the above, in order to obtain good solder heat resistance and PCT resistance, the diamine having the hydroxyl group and / or carboxyl group is represented by the following formula:

で表される３，３’−ジヒドロキシ−４，４’−ジアミノビフェニルを用いることが特に好ましい。

It is particularly preferable to use 3,3′-dihydroxy-4,4′-diaminobiphenyl represented by the formula:

  When synthesizing a polyimide resin, it comprises at least one diamine having a structure represented by the general formula (8) and / or at least one diamine having a hydroxyl group and / or a carboxyl group. It is preferable to use a diamine component.

  When the diamine component includes a diamine having the structure represented by the general formula (8), the diamine (general formula (8)) is 60 mol% or more of all diamines in the diamine component. It is preferable to contain so that it may become mol% or less. Further, when the diamine component includes a diamine having a hydroxyl group and / or a carboxyl group, the diamine (having a hydroxyl group and / or a carboxyl group) is 1 mol% or more and 40 mol of all diamines in the diamine component. It is preferable to contain so that it may become% or less.

  More preferably, the diamine component may contain at least one diamine having a structure represented by the general formula (8) and at least one diamine having a hydroxyl group and / or a carboxyl group. . In particular, 3,3′-dihydroxy-4,4′-diaminobiphenyl is most preferably used as the diamine having a hydroxyl group and / or a carboxyl group. Thereby, more excellent solder heat resistance and PCT resistance can be obtained.

  Each diamine contained in the diamine component may be combined in any ratio, but the content of the diamine having the structure represented by the general formula (8) in the diamine component is 60 mol of the total diamine. % Or more and 99 mol% or more, and the content in the diamine component of the diamine having at least one hydroxyl group and / or carboxyl group is 1 mol% or more and 40 mol% or less of the total diamine. Is preferred. When the content of the diamine having the structure represented by the general formula (8) and the diamine having a hydroxyl group and / or a carboxyl group deviates from the above range, various types of polyimide resins obtained using the diamine can be obtained. There are cases in which the solubility in organic solvents, solder heat resistance, and PCT resistance are impaired.

  The diamine component includes diamines (hereinafter, other diamines) other than the diamines described above (diamines having a structure represented by the general formula (8) and diamines having a hydroxyl group and / or a carboxyl group). May be. Although it does not specifically limit as another diamine contained in the said diamine component, An aromatic diamine is preferable.

  Examples of the aromatic diamine include m-phenylenediamine, o-phenylenediamine, p-phenylenediamine, m-aminobenzylamine, p-aminobenzylamine, bis (3-aminophenyl) sulfide, (3-amino Phenyl) (4-aminophenyl) sulfide, bis (4-aminophenyl) sulfide, bis (3-aminophenyl) sulfoxide, (3-aminophenyl) (4-aminophenyl) sulfoxide, bis (3-aminophenyl) sulfone , (3-aminophenyl) (4-aminophenyl) sulfone, bis (4-aminophenyl) sulfone, 3,4'-diaminobenzophenone, 4,4'-diaminobenzophenone, 3,3'-diaminodiphenylmethane, 3, 4'-diaminodiphenylmethane, 4,4 ' Diaminodiphenylmethane, 4,4′-diaminodiphenyl ether, 3,3′-diaminodiphenyl ether, 3,4′-diaminodiphenyl ether, bis [4- (3-aminophenoxy) phenyl] sulfoxide, bis [4- (aminophenoxy) phenyl ] Sulphoxide etc. can be mentioned.

  The said other diamine should just be used 1 type or in combination of 2 or more types, and it is preferable that content in a diamine component is less than 10 mol% of all the diamine.

<Imidization of polyamic acid>
A method for imidizing the polyamic acid to obtain a soluble polyimide resin using the polyamic acid solution containing the polyamic acid will be described. The imidization is performed, for example, by dehydrating and ring-closing the polyamic acid in the polyamic acid solution by a thermal technique or a chemical technique. The thermal method is a method of dehydrating a polyamic acid solution by heat treatment, and the chemical method is a method of dehydrating using a dehydrating agent. In addition to these methods, there is a method in which polyamic acid is imidized by heat treatment under reduced pressure. Hereinafter, each method will be described.

  Examples of the dehydration ring closure by a thermal method include a method in which the imidization reaction is advanced by the heat treatment of the polyamic acid solution and the solvent is evaporated at the same time. By this thermal method, a solid polyimide resin can be obtained. In addition, although the conditions of the said heat processing are not specifically limited, It is preferable to heat at the temperature of 300 degrees C or less for the time of the range for about 5 minutes-20 minutes.

  On the other hand, examples of the dehydration ring closure by a chemical method include a method of performing a dehydration reaction and evaporation of an organic solvent by adding a dehydrating agent and a catalyst in a stoichiometric amount or more to the polyamic acid solution. . By this chemical method, a solid polyimide resin can be obtained.

  Examples of the dehydrating agent include aliphatic acid anhydrides such as acetic anhydride; aromatic acid anhydrides such as benzoic anhydride; carbodiimides such as N, N′-dicyclohexylcarbodiimide and N, N′-diisopropylcarbodiimide. Can do. Examples of the catalyst include aliphatic tertiary amines such as triethylamine; aromatic tertiary amines such as dimethylaniline; heterocyclic groups such as pyridine, α-picoline, β-picoline, γ-picoline, and isoquinoline. There may be mentioned tertiary amines. In addition, it is preferable that the temperature conditions at the time of performing dehydration ring closure by a chemical method are 100 degrees C or less, and it is preferable to perform reaction time within the range of about 1 minute-50 hours. The evaporation of the organic solvent is preferably performed at a temperature of 200 ° C. or less for a time in the range of about 5 minutes to 120 minutes.

  In the above thermal method and chemical method, the method for evaporating the solvent has been described, but there is also a method for not evaporating the solvent. Specifically, the polyimide resin solution obtained by the above thermal method or chemical method is added to a poor solvent, and the polyimide resin is precipitated, and unreacted monomer (acid dianhydride / diamine) is removed. This is a method for obtaining a solid polyimide resin by purification and drying. The poor solvent is not particularly limited as long as it is well mixed with the solvent of the polyimide resin solution, but the polyimide resin is difficult to dissolve. For example, acetone, methanol, ethanol, isopropanol, benzene, methyl cellosolve (Registered trademark), methyl ethyl ketone, and the like.

Furthermore, in the method of imidizing polyamic acid by performing heat treatment under reduced pressure,
Although heating conditions should just be 80 to 400 degreeC, in order to perform imidation and dehydration efficiently, it is more preferable to set it as 100 degreeC or more, and it is more preferable to set it as 120 degreeC or more. In addition, it is preferable that the maximum temperature in heat processing shall be below the thermal decomposition temperature of a polyimide resin, and it is normally set in the temperature range of about 250 to 350 degreeC which is the completion temperature of imidation. Further, the pressure condition is preferably low pressure, specifically, preferably in the range of 0.001 atmosphere to 0.9 atmosphere, more preferably 0.001 atmosphere to 0.8 atmosphere. Preferably, it is 0.001 to 0.7 atm.

According to the method of imidizing polyamic acid by performing the heat treatment under reduced pressure, water produced by imidization can be positively removed out of the system, so that hydrolysis of polyamic acid can be suppressed. it can. As a result, a high molecular weight polyimide resin can be obtained. Furthermore, if this method is used, one-side ring-opened product or both-side ring-opened product existing as an impurity in the acid dianhydride that is a raw material of polyamic acid can be closed, so that the molecular weight of the polyimide resin is further improved. can do.
(D) Inorganic filler component It is preferable to contain an inorganic filler (filler) component in order to improve the characteristics of the cured resin, particularly to further reduce the thermal expansion coefficient. The inorganic filler used as the inorganic filler component is not particularly limited, and specifically, inorganic fillers such as titanium oxide, calcium carbonate, alumina, silica (spherical melting, crushing), acrylic resins, silicone resins, etc. Organic fillers and the like. Of the inorganic filler components, spherical fused silica is particularly preferred.

  The inorganic filler can reduce the thermal expansion coefficient of the cured resin by being able to be filled at a high concentration, and does not hinder the resin fluidity of the resin composition in the process of curing from the B-stage state. The rise can be avoided, and excellent dielectric properties can be imparted to the cured product.

Spherical fused silica is not particularly limited as long as it has a substantially spherical shape and the main material is silica (SiO ₂ ). Here, the roundness of the spherical fused silica may be 0.5 or more, preferably 0.6 or more, and more preferably 0.8 or more.

  The material of the spherical fused silica is not particularly limited as long as it is silica, that is, silicon dioxide, as described above, but it is a glassy (amorphous) glass obtained by melting spherical fused silica, that is, silica. Silica is preferred. Spherical fused silica has excellent electrical properties (insulating properties, etc.) and scientific properties (stability, etc.) in addition to excellent thermal properties, such as the smallest thermal expansion coefficient among all industrial materials. By using this spherical fused silica, even when the filler-containing resin composition is melted, the adverse effect on the fluidity (melt viscosity) can be reduced, and the thermal expansion coefficient of the cured resin after curing can be reduced. It becomes possible to do.

  The average particle diameter of the spherical silica may be 3 μm or less, preferably 2 μm or less, and more preferably 1 μm or less. The particle size distribution of the spherical fused silica is not particularly limited, but the particles having a particle diameter of 10 μm or more are preferably 10% by weight or less of the total amount of the spherical silica, and 5% by weight or less. More preferably, it is 1% by weight or less.

  If the average particle diameter of the spherical fused silica is at most the above upper limit, an increase in fluidity can be avoided if the particle diameter of the spherical fused silica is small, which is advantageous for forming a fine circuit. Furthermore, if the content ratio (weight ratio) of particles of 10 μm or more is not more than the above upper limit, the processability of the filler-containing resin composition according to the present invention can be further improved, and a printed wiring board, particularly a build-up type When used as an interlayer insulating film of a printed wiring board, it is preferable because the embedding property of the inner layer circuit can be further improved.

  Although the smaller average particle size of spherical fused silica seems to be suitable for high-density circuit formation, the smaller the particle size, the larger the surface area of the filler and the lower the fluidity of the entire resin composition. It will be. Therefore, in order to achieve both physical properties of high density circuit formation and resin fluidity, the particle size of the spherical fused silica is preferably within the above range.

  In the present invention, the spherical fused silica can be used as it is, but it is more preferable that it is surface-treated so as to enhance at least the affinity with the (A) polyimide resin component. Such a surface treatment method is not particularly limited, but may be carried out under known conditions using a known surface treating agent.

  Specific examples of the compound that can be used as the surface treatment agent include various coupling agents such as silane coupling agents and titanate coupling agents, fatty acids such as stearic acid, various surfactants, and various resins. Acid, various phosphate esters, and the like can be used. Among these, a coupling agent is more preferable in terms of dispersibility to disperse the obtained surface-treated spherical silica well in the resin composition and avoiding / suppressing a decrease in melt viscosity of the filler-containing resin composition. Can be used.

  Although it does not specifically limit as a coupling agent which can be used by this invention, The said silane coupling agent and a titanate coupling agent can be used preferably. In general, those coupling agents that are commercially available as surface modifiers for inorganic fillers can be suitably used.

  The silane coupling agent generally contains silicon (Si), and has an organic functional group having a substituent having a high affinity for an organic material in one molecule and a polar group having a high affinity for an inorganic material. It has become the composition which is. Specific examples of such silane coupling agents include β- (3,4 epoxy cyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, and γ-glycidoxypropyltriethoxysilane. Γ-glycidoxypropylmethyldiethoxysilane, γ- (2-aminoethyl) aminopropyltrimethoxysilane, γ- (2-aminoethyl) aminopropyltriethoxysilane, γ- (2-aminoethyl) aminopropyl Examples include methyldimethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, and the like. It is not something. Besides these, silane monomers such as methyltrimethoxysilane and methyltriethoxysilane can also be suitably used. Each of these compounds may be used alone or in appropriate combination of two or more.

  The titanate coupling agent, like the silane coupling agent, contains titanium, has an organic functional group having a substituent having a high affinity for an organic material in one molecule, and an affinity for an inorganic material. The structure has a high polar group. A more specific configuration of the titanate coupling agent is not particularly limited. For example, tri-n-butoxy titanium monostearate, diisopropoxy titanium bis (triethanolaminate), butyl titanate dimer, tetra-n Butyl titanate, tetra (2-ethylhexyl) titanate, titanium octylene glycolate, dihydroxybis (ammonium lactate) titanium, dihydroxytitanium bislactate, isopropyl tris (dioctylpyrophosphate) titanate, bis (dioctylpyrophosphate) oxyacetate titanate, isopropyl Tris stealoyyl titanate, isopropyl tris (dioctyl phosphate) titanate, isopropyl tri (N-amidoethyl amino ester) Can be exemplified Le) titanate, and is not particularly limited. Each of these compounds may be used alone or in appropriate combination of two or more. Moreover, you may use combining the said silane coupling agent and a titanate coupling agent, and you may use well-known coupling agents other than these individually or in combination of 2 or more types.

  The surface treatment method of spherical fused silica may be performed under known conditions using a surface modifier such as the above-mentioned coupling agent, but more specifically, particularly when a coupling agent is used, Examples thereof include a stirring method and a wet method.

  The agitation method is a method in which a coupling agent and spherical fused silica are previously charged in an agitator and agitated under appropriate conditions. As the agitator, a mixer capable of agitation and mixing at a high speed such as a Henschel mixer is used. However, it is not particularly limited. Stirring conditions are not particularly limited. Specifically, for example, spherical fused silica is charged into a Henschel mixer, premixed at 1000 rpm for 3 minutes, and then a coupling agent is dropped, and further at 1000 rpm for 5 minutes. The conditions of this mixing can be mentioned. In addition, what is necessary is just to select suitable conditions for the rotational speed and mixing time of the said premixing and this mixing according to the kind of coupling agent to be used, and the mixing | blending content and compounding quantity of spherical fused silica and a coupling agent.

  In the wet method, a sufficient amount of coupling agent relative to the surface area of the spherical fused silica to be surface-treated is dissolved in water or an organic solvent to hydrolyze the coupling agent molecules. To do. The concentration of the surface treatment solution is not particularly limited, and can include, for example, about 3% by weight. Spherical silica is added to the resulting surface treatment solution and stirred to form a slurry. After the coupling agent and the spherical silica are sufficiently reacted by stirring, the spherical fused silica is separated from the surface treatment solution by a method such as filtration or centrifugation, and is dried by heating.

  In addition to the above stirring method and wet method, for example, an integral blend method in which a coupling agent is directly added to a filler dispersion obtained by dispersing spherical fused silica in a solvent to modify the surface of the spherical fused silica. Can also be suitably used.

  In the present invention, by performing the surface modification treatment of spherical fused silica using the above coupling agent, in particular, resin components such as (A) imide oligomer component, (B) epoxy resin, and (C) polyimide The adhesion between the resin component and the spherical silica as the filler component (D) can be improved, and the dispersibility of the component (D) in the components (A), (B) and (C) can be improved. . Therefore, in the filler-containing resin composition according to the present invention, characteristics such as mechanical strength, heat resistance, and moisture resistance of the cured resin after curing can be improved.

The step of modifying the surface of the spherical fused silica is not particularly limited, so it may be blended in the step of preparing the filler-containing resin composition according to the present invention, or the spherical fused silica whose surface treatment has been completed in advance. It may be used.
(E) Other components In the thermosetting resin composition of the present invention, a curing agent for (E-1) an epoxy resin component other than (A) an imide oligomer component, or (E-2) an epoxy, if necessary. A thermosetting component such as a curing accelerator for accelerating the reaction between the resin component and the curing agent may be included.

  Although it does not specifically limit as said hardening | curing agent, Phenolic resins, such as a phenol novolak type phenol resin, a cresol novolak type phenol resin, a naphthalene type phenol resin; Dodecyl succinic anhydride, poly adipic acid anhydride, poly azelaic acid anhydride Aliphatic acid anhydrides such as hexahydrophthalic anhydride, methylhexahydrophthalic acid, etc .; phthalic anhydride, trimellitic anhydride, benzophenone tetracarboxylic acid, ethylene glycol bis trimellitate, glycerol tris Aromatic acid anhydrides such as trimellitate; amino resins, urea resins, melamine resins, dicyandiamide, dihydrazine compounds, imidazole compounds, Lewis acids, Bronsted acid salts, polymercaptan compounds, isocyanates And blocked isocyanate compounds, etc. can be mentioned.

  The said hardening | curing agent should just be used combining 1 type (s) or 2 or more types, and it is preferable to use within the range of 1 weight part-100 weight part with respect to 100 weight part of all the epoxy resins.

  Further, the curing accelerator is not particularly limited, but for example, phosphine compounds such as triphenylphosphine; amine compounds such as tertiary amine, trimethanolamine, triethanolamine, tetraethanolamine; 1,8 -Borate compounds such as diaza-bicyclo [5,4,0] -7-undecenium tetraphenylborate, imidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2- Imidazoles such as undecylimidazole, 1-benzyl-2-methylimidazole, 2-heptadecylimidazole, 2-isopropylimidazole, 2,4-dimethylimidazole, 2-phenyl-4-methylimidazole; 2-methylimidazoline, 2 -Ethyl imidazoline Imidazolines such as 2-isopropylimidazoline, 2-phenylimidazoline, 2-undecylimidazoline, 2,4-dimethylimidazoline, 2-phenyl-4-methylimidazoline; 2,4-diamino-6- [2′-methylimidazolyl -(1 ')]-ethyl-s-triazine, 2,4-diamino-6- [2'-undecylimidazolyl- (1')]-ethyl-s-triazine, 2,4-diamino-6- [ Examples include azine-based imidazoles such as 2′-ethyl-4′-methylimidazolyl- (1 ′)]-ethyl-s-triazine. When the imide oligomer contains an amino group, 2-ethyl-4-methylimidazole is particularly advantageous in that the minimum value of the melt viscosity of the thermosetting resin composition is greatly reduced and the circuit embedding property can be improved. It is preferable to use imidazoles such as 2-phenyl-4-methylimidazole and 2,4-diamino-6- [2′-undecylimidazolyl- (1 ′)]-ethyl-s-triazine.

  The said hardening accelerator should just be used combining 1 type (s) or 2 or more types, and it is used within the range of 0.01 weight part-10 weight part with respect to 100 weight part of all thermosetting resin group compositions. preferable.

  Furthermore, the thermosetting component contains a bismaleimide resin, a bismuth resin, and a thermosetting resin composition in order to improve various properties such as adhesion, heat resistance, and workability of the thermosetting resin composition or the cured resin of the thermosetting resin composition. Thermosetting resins such as allyl nadiimide resin, acrylic resin, methacrylic resin, hydrosilyl cured resin, allyl cured resin, unsaturated polyester resin; allyl group, vinyl group, alkoxysilyl group, hydrosilyl at the side chain or terminal of polymer chain A side chain reactive group type thermosetting polymer having a reactive group such as a group can be used. The thermosetting component may be used alone or in combination of two or more.

  In addition, it is preferable to contain the said hardening | curing agent, a hardening accelerator, and a thermosetting component in a thermosetting resin composition in the range which does not impair the dielectric property of the cured resin formed by hardening | curing a thermosetting resin composition.

  Next, although the usage aspect of the thermosetting resin composition of this invention is demonstrated, it is not limited to the following description.

  The thermosetting resin composition of the present invention can be used as a resin solution, for example, by adding to a suitable solvent and stirring. Or this resin solution can be obtained also by mixing the solution for each component formed by melt | dissolving each component of a thermosetting resin composition in a suitable solvent.

  The solvent that can be used for the resin solution is not limited as long as it is a solvent that can dissolve the thermosetting resin composition or each component of the thermosetting resin composition, but the boiling point is preferably 150 ° C. or lower. . Specifically, cyclic ethers such as tetrahydrofuran, dioxolane and dioxane; ethers such as chain ethers such as ethylene glycol dimethyl ether, triglyme, diethylene glycol, ethyl cellosolve and methyl cellosolve are preferably used. In addition, a mixed solvent obtained by mixing the above ethers with toluene, xylenes, glycols, N, N-dimethylformamide, N, N-dimethylacetamide, N-methylpyrrolidone, cyclic siloxane, chain siloxane, or the like is also preferably used. Can do.

  Moreover, the thermosetting resin composition of this invention can be used as a resin sheet by carrying out the shaping | molding process to the sheet form previously. Specifically, a single-layer sheet composed only of a thermosetting resin composition, a two-layer sheet or a three-layer sheet obtained by providing a resin layer composed of the thermosetting resin composition on one or both sides of a film substrate, a film A laminate such as a multilayer sheet obtained by alternately laminating a resin layer composed of a base material and a thermosetting resin composition can be given.

  The resin sheet can be formed into a film by casting or coating the above-described resin solution on the support surface and drying the cast or applied resin solution. This film-like thermosetting resin composition is in a semi-cured state (B stage state). Therefore, if the semi-cured film-like thermosetting resin composition is peeled from the support, the single-layer sheet can be obtained. Moreover, the said laminated body can be manufactured by repeating the operation which casts or apply | coats the said resin solution to the surface of the said film base material, and dries this resin solution.

  The resin in a semi-cured state of the thermosetting resin composition of the present invention has a melt viscosity of 10 Pa · S or more and 8000 Pa · S or less at any temperature in the range of 60 ° C. or more and 200 ° C. or less. It is preferable.

When the melt viscosity exceeds 8000 Pa · S, the circuit embedding property is lowered. When the melt viscosity is less than 10 Pa · S, a large amount of resin protrudes to the outside of the substrate during processing, and the amount of resin remaining on the substrate is reduced. As a result, the circuit is embedded. Cannot be done.
A prepreg can be obtained by coating and impregnating a sheet-like reinforcing base material comprising fibers with the thermosetting resin composition of the present invention by a hot melt method or a solvent method, followed by heating and semi-curing. That is, it is a fiber reinforced resin sheet in which a fibrous filler is contained in the thermosetting resin of the present invention. The sheet-like reinforcing substrate made of the above-mentioned fibers is not particularly limited. For example, a known and commonly used prepreg fiber such as a glass cloth, a glass mat, an aromatic polyamide fiber cloth, an aromatic polyamide fiber mat or a fluorine resin fiber is suitable. Can be used for The method for applying and impregnating the resin to the sheet-like reinforcing substrate made of the fiber is not particularly limited, but for example, a hot melt method, a solvent method, or the like can be suitably used. In the hot melt method, a solvent-free resin is used, and a prepreg can be produced by a method of coating a resin paper having good releasability with the resin and laminating it, or directly coating with a die coater. In the solvent method, a prepreg can be produced by immersing and impregnating a sheet-like reinforcing base material in a resin solution obtained by dissolving the thermosetting resin composition in an organic solvent, and then drying.

  If a metal such as copper or aluminum is used as the film base, a laminate with metal can also be obtained. That is, the laminate with metal is a laminate including a resin layer made of at least one thermosetting resin composition and at least one metal layer. The resin layer may be provided only on one side of the metal layer, or the metal layer and the resin layer may be alternately laminated.

  As described above, the laminate with metal can be produced by casting or coating a resin solution on the surface of a metal layer and drying the resin solution. It can also be produced by laminating a resin sheet or forming a metal layer by chemical plating or sputtering.

  Furthermore, if the metal layer is a metal that can be used as a conductor of a circuit board, the metal layer of the laminate with metal is subjected to metal etching or the like using a dry film resist or a liquid resist, and the like. A circuit having the pattern (hereinafter referred to as a pattern circuit) can also be formed. Therefore, if a patterned circuit is formed on the metal layer of the metallized laminate and a resin layer made of the thermosetting resin composition of the present invention is provided, it is used as a circuit board such as a flexible printed circuit board or a build-up circuit board. It becomes possible.

  For the metal layer on which the pattern circuit is formed, the semi-cured resin sheet described above may be used as the resin layer. Since the semi-cured resin sheet using the thermosetting resin composition of the present invention has appropriate fluidity, it can be used for hot pressing, laminating (thermal laminating), hot roll laminating, etc. When performing the thermocompression treatment, the pattern circuit can be embedded preferably. Thereby, a metal layer and a resin layer are bonded together.

  The treatment temperature in the thermocompression treatment is preferably 50 ° C. or higher and 200 ° C. or lower, more preferably 60 ° C. or higher and 180 ° C. or lower, and particularly preferably 80 ° C. or higher and 130 ° C. or lower. If the treatment temperature exceeds 200 ° C., the resin layer may be cured during the thermocompression treatment. On the other hand, when the processing temperature is less than 50 ° C., the fluidity of the resin layer is low and it becomes difficult to embed the pattern circuit.

  The resin layer provided on the pattern circuit becomes a protective material for protecting the pattern circuit or an interlayer insulating material in a multilayer circuit board. For this reason, it is preferable to completely cure by embedding the pattern circuit and then performing exposure processing, heat curing, and the like.

  In addition, when hardening the thermosetting resin composition of this invention, in order to fully advance the hardening reaction of the (B) epoxy resin component, after heat-bonding a metal layer and a resin layer, it is a post-heating process. It is preferable to implement. The conditions for the post heat treatment are not particularly limited, but it is preferable to perform the heat treatment for 10 minutes or more and 3 hours or less under a temperature condition in the range of 150 ° C. to 200 ° C.

  EXAMPLES Hereinafter, although this invention is demonstrated more concretely based on an Example and a comparative example, this invention is not limited to these. Those skilled in the art can make various changes, modifications, and alterations without departing from the scope of the present invention.

  Calculation of the B-stage flexibility, fluidity, laminability, and volatile component amount of the resin sheet comprising the thermosetting resin composition of the present invention, and the dielectric of a cured resin sheet obtained by heat-curing the resin sheet Properties, glass transition temperature, thermal decomposition temperature, thermal expansion coefficient, and breaking strength were measured and evaluated as follows.

[B stage flexibility]
A resin sheet with a PET film substrate is wound around a cylinder having an inner diameter of 3 inches and a wall thickness of 10 mm, and the thermosetting resin composition layer is wound on the outer side for one or more turns. The case where cracking did not occur was evaluated as ◯ (passed), and the case where cracking occurred was evaluated as x (failed).

〔Liquidity〕
Using a shear mode dynamic viscoelasticity measuring device (CVO, manufactured by Bohling), the melt viscosity (Pa · S) of the resin sheet before heat curing was measured under the following conditions.
. Evaluation of the melt viscosity of each resin sheet was performed by the smallest melt viscosity within the range of 60 ° C. or higher and 150 ° C. or lower.
Measurement frequency: 1Hz
Temperature rising rate: 12 ° C./min Measurement sample: Circular resin sheet with a diameter of 3 mm [Laminating property]
Glass epoxy board FR-4 (MCL-E-67, manufactured by Hitachi Chemical Co., Ltd.) having a circuit formed with a height of 18 μm, a circuit width of 50 μm, and a distance between circuits of 50 μm; thickness of copper foil 50 μm, overall thickness 1.2 mm) and the surface of the thermosetting resin composition layer of the resin sheet with a PET film substrate (50 μm thickness) are in contact with each other at a temperature of 150 ° C. The laminate was obtained by heating and pressing for 5 minutes under the condition of a pressure of 1 MPa. The PET film was peeled from the laminate, and the surface of the thermosetting resin composition was visually observed using an optical microscope (50 times magnification) to confirm the presence or absence of bubbles between the circuits.
The stacking property when the encroachment of bubbles between the circuits (the portion where the resin does not enter between the circuits) is not confirmed is accepted (O), and the laminating property when the entrapment of bubbles is confirmed is rejected ( Evaluation was carried out as x).

[Calculation of amount of volatile components in resin sheet]
Using a mass spectrometer (TGA50, manufactured by Shimadzu Corporation), the resin sheet was put into a sample container, and the change in weight was measured under the following conditions. The weight decreased in the range of 100 ° C to 300 ° C was measured before the change in weight. It calculated by the ratio with respect to the weight of a resin sheet, and made it the amount of volatile components.
Measurement temperature range: 15 ° C-350 ° C
Temperature rising rate: 20 ° C./min Measurement atmosphere: Nitrogen, flow rate 50 mL / min Sample container: Aluminum [Dielectric properties]
Using a cavity resonator perturbation method complex dielectric constant evaluation apparatus (trade name, manufactured by Kanto Electronics Application Development Co., Ltd.), the dielectric constant and dielectric loss tangent of the cured resin sheet were measured under the following conditions.
Measurement frequency: 3GHz, 5GHz, 10GHz,
Measurement temperature: 22 ° C to 24 ° C
Measurement humidity: 45% to 55%
Measurement sample: Resin sheet left for 24 hours under the above measurement temperature and humidity conditions [Glass transition temperature]
Using DMS-200 (manufactured by Seiko Denshi Kogyo Co., Ltd.) and measuring length (measurement jig interval) of 20 mm, the storage elastic modulus (ε ′) of the cured resin sheet is measured under the following conditions. The inflection point of the rate (ε ′) was defined as the glass transition temperature (° C.).
Measurement atmosphere: Under dry air atmosphere
Measurement temperature: 20 ° C to 400 ° C
Measurement sample: cured resin sheet slit to 9 mm width and 40 mm length [thermal decomposition temperature]
Using a mass spectrometer (TGA50, manufactured by Shimadzu Corporation), the cured resin sheet was placed in a sample container, the change in weight was measured under the following conditions, and the starting temperature defined by JIS K 7120 was defined as the thermal decomposition temperature.
Measurement temperature range: 30 ° C to 950 ° C
Temperature rising rate: 20 ° C./min Measurement atmosphere: Air, flow rate 50 mL / min Sample container: Platinum macrocell Sample amount: 5-10 mg
[Coefficient of thermal expansion]
The thermal expansion coefficient of the cured resin sheet was measured using Seiko Instruments' product name: TMA120C. After measuring the dimensional change with respect to temperature while raising the temperature from room temperature to 200 ° C. under the following predetermined measurement conditions, it was once cooled. By this operation, the residual stress in the measurement sample was released, and the dimensional change was measured again in the measurement temperature range under the following measurement conditions. In this second measurement, the temperature at the inflection point in the temperature-dimension change curve is the glass transition temperature (Tg), and the average thermal expansion coefficient in the temperature range of -55 ° C. to 125 ° C. is calculated as the thermal expansion coefficient of the sample. did.
Measurement sample size: Length approx. 20 mm x width 5 mm (15 mm between chucks)
Measurement temperature range: (first time) room temperature, (second time) -60 ° C to 300 ° C
Temperature increase rate: 10 ° C / min
Load: 1g
〔Breaking strength〕
The rupture strength of the cured resin sheet was measured under the following conditions using Strograph VES1D (trade name, manufactured by Toyo Seiki Seisakusho Co., Ltd.) according to the build-up wiring board technical standard ver2. Calculated.
Measurement sample size: Length approx. 80mm x width 15mm (60mm between chucks)
Tensile speed: 5 mm / min
[Synthesis example 1 of imide oligomer]
In a glass flask having a capacity of 2000 ml, 1293.2 g of dimethylformamide (hereinafter DMF) was added, and 292.1 g (1.0 mol) of 1,3-bis (3-aminophenoxy) benzene (Mitsui Chemicals, Inc.). Was dissolved under stirring in a nitrogen atmosphere to obtain a DMF solution. Subsequently, the flask was stirred while cooling the DMF solution with ice water under a nitrogen atmosphere, and 260.3 g (0.5 mol) of 4,4 ′-(4,4′-isopropylidenediphenoxy) bisphthalic anhydride. (GE Corp., hereinafter referred to as IPBP) was added and stirred for 2 hours to obtain an amic acid oligomer solution. Transfer 300 g of the above-mentioned amic acid oligomer solution to a vat coated with fluororesin, and heat in a vacuum oven under reduced pressure for 3 hours under the conditions of 200 ° C. and 5 mmHg (about 0.007 atm, about 5.65 hPa). As a result, an imide oligomer having an amino group (the amine value was calculated to be 267.2 g / eq, hereinafter referred to as oligomer A) was obtained. The weight average molecular weight was 1068.

[Synthesis example 2 of imide oligomer]
Into a glass flask with a capacity of 2000 ml, 400 g of DMF was added, and further 104.1 g (0.2 mol) of IPBP was added and stirred to dissolve in a nitrogen atmosphere to obtain a DMF solution. Subsequently, 25.8 g (0.1 mol) of 3,3′-diamino-4,4′-dihydroxydiphenylmethane (Gunei Chemical Industry Co., Ltd.) was stirred while cooling the DMF solution with ice water in a nitrogen atmosphere. Co., Ltd., hereinafter referred to as DAM-1) was added and stirred for 1 hour, and 21.8 g (0.2 mol) of 3-aminophenol (manufactured by Wako Pure Chemical Industries, Ltd.) was further added and stirred for 2 hours. Thus, an amic acid oligomer solution was obtained. Transfer 300 g of the above-mentioned amic acid oligomer solution to a vat coated with fluororesin, and heat in a vacuum oven under reduced pressure for 3 hours under the conditions of 200 ° C. and 5 mmHg (about 0.007 atm, about 5.65 hPa). Thus, an imide oligomer having a hydroxyl group (a hydroxyl value is 370.4 g / eq in calculation, hereinafter referred to as oligomer B) was obtained. The weight average molecular weight was 1478.

[Synthesis example of polyimide resin]
Into a glass flask having a capacity of 2000 ml, 1480 g of dimethylformamide (hereinafter, DMF) was charged, followed by 292 g (1 mol) of 1,3-bis (3-aminophenoxy) benzene (manufactured by Mitsui Chemicals, Inc., hereinafter). APB) and 8.64 g (0.04 mol) of 3,3′-dihydroxy-4,4′-diaminobiphenyl (manufactured by Wakayama Seika Kogyo Co., Ltd.) are added and dissolved by stirring under a nitrogen atmosphere. A DMF solution was obtained. Subsequently, the flask was stirred while cooling the DMF solution with ice water under a nitrogen atmosphere to obtain 541.3 g (1.04 mol) of 4,4 ′-(4,4′-isopropylidenediphenoxy) bisphthalic anhydride. (GE Corp., hereinafter referred to as IPBP) was added and further stirred for 3 hours to obtain a polyamic acid solution. By transferring 300 g of the polyamic acid solution to a vat coated with a fluororesin and heating in a vacuum oven under reduced pressure for 3 hours under the conditions of 200 ° C. and 5 mmHg (about 0.007 atm, about 5.65 hPa). A polyimide resin (PI) was obtained.

[Example 1]
The polyimide resin obtained above and a liquid bisphenol A type epoxy resin (E827, minimum melt viscosity 0.1 Pa · S (50 ° C.), epoxy value = 184 g / eq, Japan Epoxy Resins Co., Ltd.) Manufactured) and the imide oligomer A obtained in Synthesis Example 1 were dissolved in dioxolane with the formulation shown in Table 1 to obtain a resin solution.

The obtained resin solution was cast on the surface of a 38 μm-thick PET film (trade name Therapy HP, manufactured by Toyo Metallizing Co., Ltd.) as a support. Then, it heat-dried for 1 minute each at the temperature of 60 degreeC, 80 degreeC, 100 degreeC, and 120 degreeC with a hot air oven, and obtained the 2 layer sheet | seat which uses a PET film as a film base material. In addition, the thickness of the resin sheet (before heat-curing) layer containing the thermosetting resin composition was 50 μm. The two-layer sheet is folded so that the layers made of the thermosetting resin composition are in contact with each other, and bonded to each other at 80 ° C. using a hot roll laminator, and PET is formed on both surfaces of the resin sheet containing the thermosetting resin composition. A sheet provided with a film was obtained. The PET film on both sides was peeled off from the obtained sheet to obtain a resin sheet containing a 100 μm thermosetting resin composition. The obtained resin sheet (before heat-curing) was evaluated for the B-stage flexibility, resin fluidity, lamination property, and volatile component amount by the above evaluation methods. The results are shown in Table 3.
Furthermore, the layer which contains the thermosetting resin composition of the said 2 layer sheet | seat on the copper foil shine surface of this rolled copper foil using 18 micrometers rolled copper foil (BHY-22B-T, Japan Energy Co., Ltd. product). Are laminated so that the surfaces of the two layers are in contact with each other, pasted at 80 ° C. using a hot roll laminator, and further peeled off the PET film to obtain a laminate in which the resin sheet containing the thermosetting resin composition is laminated on the copper foil. It was. The obtained laminate was heated and heated from 60 ° C. to 180 ° C. over 1 hour in a hot air oven, and further heated and cured at 180 ° C. for 1 hour. The copper foil of the obtained copper foil laminate was removed by etching to obtain a cured resin sheet. The dielectric properties, glass transition temperature, thermal decomposition temperature, thermal expansion coefficient, and breaking strength of the cured resin sheet of the obtained cured resin sheet were measured. The results are shown in Table 4.

[Examples 2 to 8]
Except for mixing imide oligomer, epoxy resin, polyimide resin, inorganic filler, and imidazole in the ratios shown in Table 1, the resin sheet (before heat curing) and the resin sheet were cured in the same manner as in Example 1. A cured resin sheet was obtained. In Table 1, E827 (epoxy value = 184 g / eq, manufactured by Japan Epoxy Resins Co., Ltd.) is a bisphenol A type epoxy resin. NC3000H (epoxy value = 290 g / eq, Nippon Kayaku Co., Ltd., solid at 60 ° C. or lower) represents a biphenyl-phenol novolac copolymer epoxy resin, and C11z-A is 2,4-diamino-6- [ 2′-undecylimidazolyl- (1 ′)]-ethyl-s-triazine (Cureazole C11Z-A, manufactured by Shikoku Chemicals Co., Ltd.), E1 is spherical fused silica [SFP-130MC (trade name, electrochemistry) Kogyo Co., Ltd. average particle size 0.5 μm)]. About the obtained resin sheet, B stage flexibility, fluidity, lamination property, volatile component amount is evaluated, and for the cured resin sheet, the dielectric properties and glass transition temperature, thermal decomposition temperature, thermal expansion coefficient of the cured resin sheet, The breaking strength was evaluated. The results are shown in Tables 3 and 4.

[Comparative Example 1]
Example 1 except that a phenol resin was used as a curing agent instead of the imide oligomer obtained above, and a polyimide resin, an epoxy resin, a phenol resin, an imidazole, and an inorganic filler were mixed at a ratio shown in Table 2. In the same manner, a resin sheet (before heat curing) and a cured resin sheet obtained by curing the resin sheet were obtained. The resin sheet is evaluated for B-stage flexibility, fluidity, stackability, and volatile component amount. For the cured resin sheet, the dielectric properties and glass transition temperature, thermal decomposition temperature, thermal expansion coefficient, and breaking strength of the cured resin sheet are evaluated. evaluated. The results are shown in Tables 3 and 4.

上記の結果から、（Ａ）イミドオリゴマーと（Ｂ）エポキシ樹脂を必須成分とした熱硬化性樹脂組成物において（Ｂ）エポキシ樹脂に液状エポキシ樹脂を含有させた熱硬化性樹脂組成物を用いて樹脂シートを得ることにより、優れた流動性及び積層性を得ることができ、また誘電特性に優れ、耐熱性、強度が良好なものとなり得る硬化樹脂シートを得ることができる。

From the above results, in the thermosetting resin composition containing (A) an imide oligomer and (B) an epoxy resin as essential components, (B) using a thermosetting resin composition containing a liquid epoxy resin in the epoxy resin. By obtaining a resin sheet, it is possible to obtain a cured resin sheet that can obtain excellent fluidity and lamination properties, and can have excellent dielectric properties, heat resistance, and strength.

Claims (10)

At least general formula (1)

(In the formula, R ₁ may be the same or different, and is a divalent organic group containing at least one aromatic ring, and R ₂ may be the same or different, and at least a divalent organic group comprising two aromatic rings, R ₃ may be the same or different and is a monovalent organic radical selected from -OH or -NH _2,, R ₄ , Which may be the same or different, each represents a tetravalent organic group containing at least one aromatic ring, and V represents a direct bond, —O—, —CO—, —O—T—O—, and , —COO—T—OCO—, —C (CH ₃ ) ₂ —, —C (CF ₃ ) ₂ —, and T is a divalent organic group, a and b are each independently an integer of 0 to 15, and a + b is an integer of 0 to 15. In addition, (1) It may be a polymer or a random copolymer.)
Or general formula (2)

(In the formula, R ₁ may be the same or different, and is a divalent organic group containing at least one aromatic ring, and R ₂ may be the same or different, and at least a divalent organic group comprising two aromatic rings, R ₃ may be the same or different and is a monovalent organic radical selected from -OH or -NH _2,, R ₄ , Which may be the same or different, each represents a tetravalent organic group containing at least one aromatic ring, and V represents a direct bond, —O—, —CO—, —O—T—O—, and , —COO—T—OCO—, —C (CH ₃ ) ₂ —, —C (CF ₃ ) ₂ —, and T is a divalent organic group, c is an integer from 1 to 15, d is an integer from 0 to 15, c + d is an integer from 1 to 15. In addition, (2) is It may be a block copolymer or a random copolymer.) (A) an imide oligomer component containing one of the imide oligomers represented by (A) and at least one epoxy resin (B) an epoxy A thermosetting resin composition containing a resin component, wherein the (B) epoxy resin component contains at least one liquid epoxy resin. 2. The heat according to claim 1, wherein the weight mixing ratio represented by the weight of the liquid epoxy resin component to the epoxy resin component (B) and the liquid epoxy resin component / (B) are 0.2 or more. Curable resin composition. Furthermore, the thermosetting resin composition of Claim 1 or 3 containing the (C) polyimide resin component containing at least 1 sort (s) of polyimide resin. Weight mixing ratio (C) / [(expressed by the weight of the (C) polyimide resin component with respect to the total weight of the total resin of the (A) imide oligomer component, (B) epoxy resin component and (C) polyimide resin component. The thermosetting resin composition according to claim 3, wherein A) + (B) + (C)] is in the range of 0.05 to 0.7. The molar mixing ratio (A) / (B) represented by the number of moles of active hydrogen groups contained in the (A) imide oligomer component relative to the number of moles of epoxy groups contained in the (B) epoxy resin component is 0. The thermosetting resin composition according to any one of claims 1 to 4, wherein the thermosetting resin composition is in a range of 4 or more and 2.0 or less. The thermosetting resin composition according to any one of claims 1 to 5, further comprising (D) an inorganic filler component including at least one inorganic filler. A resin solution comprising the thermosetting resin composition according to any one of claims 1 to 6 dissolved in an organic solvent. A prepreg obtained by coating and impregnating a sheet-like reinforcing base material comprising fibers with the thermosetting resin composition according to any one of claims 1 to 6. A laminate comprising at least one resin layer formed of the thermosetting resin composition according to any one of claims 1 to 6. A circuit board comprising the thermosetting resin composition according to any one of claims 1 to 6.