JP2007086044A5 - - Google Patents

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Publication number
JP2007086044A5
JP2007086044A5 JP2005304993A JP2005304993A JP2007086044A5 JP 2007086044 A5 JP2007086044 A5 JP 2007086044A5 JP 2005304993 A JP2005304993 A JP 2005304993A JP 2005304993 A JP2005304993 A JP 2005304993A JP 2007086044 A5 JP2007086044 A5 JP 2007086044A5
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JP
Japan
Prior art keywords
resin film
probe
vertical
hole
vertical probe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005304993A
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English (en)
Japanese (ja)
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JP4962929B2 (ja
JP2007086044A (ja
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Publication date
Application filed filed Critical
Priority to JP2005304993A priority Critical patent/JP4962929B2/ja
Priority claimed from JP2005304993A external-priority patent/JP4962929B2/ja
Publication of JP2007086044A publication Critical patent/JP2007086044A/ja
Publication of JP2007086044A5 publication Critical patent/JP2007086044A5/ja
Application granted granted Critical
Publication of JP4962929B2 publication Critical patent/JP4962929B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2005304993A 2005-09-19 2005-09-19 プローバ装置及びこれに用いるプローブ組立体 Expired - Fee Related JP4962929B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005304993A JP4962929B2 (ja) 2005-09-19 2005-09-19 プローバ装置及びこれに用いるプローブ組立体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005304993A JP4962929B2 (ja) 2005-09-19 2005-09-19 プローバ装置及びこれに用いるプローブ組立体

Publications (3)

Publication Number Publication Date
JP2007086044A JP2007086044A (ja) 2007-04-05
JP2007086044A5 true JP2007086044A5 (enExample) 2008-12-04
JP4962929B2 JP4962929B2 (ja) 2012-06-27

Family

ID=37973153

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005304993A Expired - Fee Related JP4962929B2 (ja) 2005-09-19 2005-09-19 プローバ装置及びこれに用いるプローブ組立体

Country Status (1)

Country Link
JP (1) JP4962929B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009025267A (ja) * 2007-07-24 2009-02-05 Micronics Japan Co Ltd 電気的接続装置
JP5240827B2 (ja) * 2008-04-15 2013-07-17 Ｎｅｃカシオモバイルコミュニケーションズ株式会社 フレキシブル配線基板、及び電子機器
CN103529252B (zh) * 2013-10-18 2016-09-28 上海华力微电子有限公司 直插式通用电气连接装置
KR102279465B1 (ko) * 2017-07-21 2021-07-21 주식회사 기가레인 프로브 카드용 박막 저항기
CN114089068B (zh) * 2021-11-17 2024-07-02 歌尔科技有限公司 通讯模组、测试结构以及测试设备

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07105416B2 (ja) * 1987-10-21 1995-11-13 松下電器産業株式会社 測定装置
JP4323055B2 (ja) * 2000-03-22 2009-09-02 富士通マイクロエレクトロニクス株式会社 半導体装置試験用コンタクタ及びその製造方法
JP4391717B2 (ja) * 2002-01-09 2009-12-24 富士通マイクロエレクトロニクス株式会社 コンタクタ及びその製造方法並びにコンタクト方法
JP2004274010A (ja) * 2003-03-11 2004-09-30 Isao Kimoto プローバ装置

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