JP2007073976A5 - - Google Patents

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Publication number
JP2007073976A5
JP2007073976A5 JP2006260304A JP2006260304A JP2007073976A5 JP 2007073976 A5 JP2007073976 A5 JP 2007073976A5 JP 2006260304 A JP2006260304 A JP 2006260304A JP 2006260304 A JP2006260304 A JP 2006260304A JP 2007073976 A5 JP2007073976 A5 JP 2007073976A5
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JP
Japan
Prior art keywords
thin film
film transistor
semiconductor device
wiring layers
thru
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006260304A
Other languages
English (en)
Japanese (ja)
Other versions
JP4777203B2 (ja
JP2007073976A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006260304A priority Critical patent/JP4777203B2/ja
Priority claimed from JP2006260304A external-priority patent/JP4777203B2/ja
Publication of JP2007073976A publication Critical patent/JP2007073976A/ja
Publication of JP2007073976A5 publication Critical patent/JP2007073976A5/ja
Application granted granted Critical
Publication of JP4777203B2 publication Critical patent/JP4777203B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2006260304A 2005-01-28 2006-09-26 半導体装置 Expired - Fee Related JP4777203B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006260304A JP4777203B2 (ja) 2005-01-28 2006-09-26 半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005022214 2005-01-28
JP2005022214 2005-01-28
JP2006260304A JP4777203B2 (ja) 2005-01-28 2006-09-26 半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2006017033A Division JP4777078B2 (ja) 2005-01-28 2006-01-26 半導体装置の作製方法

Publications (3)

Publication Number Publication Date
JP2007073976A JP2007073976A (ja) 2007-03-22
JP2007073976A5 true JP2007073976A5 (zh) 2010-04-15
JP4777203B2 JP4777203B2 (ja) 2011-09-21

Family

ID=37935104

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006260304A Expired - Fee Related JP4777203B2 (ja) 2005-01-28 2006-09-26 半導体装置

Country Status (1)

Country Link
JP (1) JP4777203B2 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7066783B2 (ja) 2008-07-31 2022-05-13 株式会社半導体エネルギー研究所 半導体装置

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5616038B2 (ja) 2008-07-31 2014-10-29 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2010056541A (ja) 2008-07-31 2010-03-11 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
JP5608347B2 (ja) * 2008-08-08 2014-10-15 株式会社半導体エネルギー研究所 半導体装置及び半導体装置の作製方法
JP5480554B2 (ja) * 2008-08-08 2014-04-23 株式会社半導体エネルギー研究所 半導体装置
WO2010050419A1 (en) * 2008-10-31 2010-05-06 Semiconductor Energy Laboratory Co., Ltd. Driver circuit and display device
US8841661B2 (en) * 2009-02-25 2014-09-23 Semiconductor Energy Laboratory Co., Ltd. Staggered oxide semiconductor TFT semiconductor device and manufacturing method thereof
KR101107158B1 (ko) * 2009-07-10 2012-01-25 삼성모바일디스플레이주식회사 유기 발광 표시 장치 및 그 제조 방법
KR101882887B1 (ko) 2009-09-16 2018-07-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치 및 이의 제조 방법
KR102106817B1 (ko) * 2018-10-30 2020-05-14 재단법인대구경북과학기술원 색순도 조절 다층 구조 필터 및 이의 제조 방법

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002100621A (ja) * 2000-09-20 2002-04-05 Seiko Epson Corp 成膜装置、成膜方法、これにより成膜された基板及びこの基板を用いた液晶装置
JP2003133691A (ja) * 2001-10-22 2003-05-09 Seiko Epson Corp 膜パターンの形成方法、膜パターン形成装置、導電膜配線、電気光学装置、電子機器、並びに非接触型カード媒体
JP4566578B2 (ja) * 2003-02-24 2010-10-20 株式会社半導体エネルギー研究所 薄膜集積回路の作製方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7066783B2 (ja) 2008-07-31 2022-05-13 株式会社半導体エネルギー研究所 半導体装置

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