JP2007060214A - 圧電デバイス - Google Patents

圧電デバイス Download PDF

Info

Publication number
JP2007060214A
JP2007060214A JP2005242243A JP2005242243A JP2007060214A JP 2007060214 A JP2007060214 A JP 2007060214A JP 2005242243 A JP2005242243 A JP 2005242243A JP 2005242243 A JP2005242243 A JP 2005242243A JP 2007060214 A JP2007060214 A JP 2007060214A
Authority
JP
Japan
Prior art keywords
package body
piezoelectric device
circuit module
electrodes
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005242243A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007060214A5 (enrdf_load_stackoverflow
Inventor
Yuugo Koyama
裕吾 小山
Jitsuo Iwamoto
実雄 岩本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2005242243A priority Critical patent/JP2007060214A/ja
Publication of JP2007060214A publication Critical patent/JP2007060214A/ja
Publication of JP2007060214A5 publication Critical patent/JP2007060214A5/ja
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Oscillators With Electromechanical Resonators (AREA)
JP2005242243A 2005-08-24 2005-08-24 圧電デバイス Withdrawn JP2007060214A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005242243A JP2007060214A (ja) 2005-08-24 2005-08-24 圧電デバイス

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005242243A JP2007060214A (ja) 2005-08-24 2005-08-24 圧電デバイス

Publications (2)

Publication Number Publication Date
JP2007060214A true JP2007060214A (ja) 2007-03-08
JP2007060214A5 JP2007060214A5 (enrdf_load_stackoverflow) 2008-09-25

Family

ID=37923309

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005242243A Withdrawn JP2007060214A (ja) 2005-08-24 2005-08-24 圧電デバイス

Country Status (1)

Country Link
JP (1) JP2007060214A (enrdf_load_stackoverflow)

Similar Documents

Publication Publication Date Title
US7456552B2 (en) Piezo-electric oscillator and method of manufacturing the same
US7551040B2 (en) Surface mount crystal oscillator
JP2001196488A (ja) 電子部品装置及びその製造方法
JP2015128276A (ja) 表面実装水晶振動子及びその製造方法
US8072276B2 (en) Surface mount crystal oscillator
JP4091868B2 (ja) 表面実装型温度補償水晶発振器
JP4273910B2 (ja) 表面実装型圧電発振器及びその製造方法
JP2005244639A (ja) 温度補償型水晶発振器
JP2005065104A (ja) 表面実装型圧電振動子およびその製造方法
JP4508041B2 (ja) 圧電デバイス
JP5942312B2 (ja) 水晶発振器の組立方法
JP2007060214A (ja) 圧電デバイス
JP2000244090A (ja) 電子部品の構造、及びその支持構造
JP2007088979A (ja) 圧電デバイス
JP2005039791A (ja) 温度補償水晶発振器
JP4284143B2 (ja) 圧電発振器
JP2015195593A (ja) 水晶発振器
JP2004260598A (ja) 表面実装型温度補償水晶発振器
WO2006134780A1 (ja) 圧電発振器とこれを備えた通信機器及び電子機器
CN100471037C (zh) 压电振荡器及其制造方法
JP2000315918A (ja) 水晶発振器
JPH118334A (ja) ボールグリッドアレイパッケージの中間体及び製造方法
JP2005109576A (ja) 圧電発振器
JP4284142B2 (ja) 圧電発振器
JP2008010922A (ja) 圧電発振器

Legal Events

Date Code Title Description
RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20070405

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080811

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080811

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20100108

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100119

A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20100316