JP2007050635A - Cleaning apparatus for resin mold - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cleaning apparatus for a resin mold, which can rapidly remove a resin-molded film, a gas burn and a grain stain, which dispenses with a large-sized tank even if the cleaning equipment is upsized, which dispenses with an increase in the number of ultrasonic wave generators, and which dispenses with the upsizing of an ultrasonic output device. <P>SOLUTION: A lye 2 is poured into a vessel 1; a workpiece table 3 is mounted in the vessel 1; the resin mold 4 is placed on the workpiece table 3; a mold 4a is formed on the surface of the resin mold 4; a screen electrode 5 is mounted on the resin mold 4, and connected to the positive side of a direct-current power supply 6; the negative side of the power supply 6 is connected to the workpiece table 3; a liquid carrying pump 7 is mounted in the lye 2 in the vessel 1; the lye 2 for being carried by the pump 7 is carried to a lead-in port 9a of a pulse jet nozzle 9 through a liquid measure controller 8; and an oscillator 11 is connected to an ultrasonic transducer 10 of the nozzle 9. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  In order to overhaul the resin mold, the present invention uses a pulse jet nozzle to inject an alkaline liquid or a neutralizing liquid onto the resin mold, and applies direct current electricity to form a resin mold mold film, gas burner, The present invention relates to a resin mold cleaning device for removing wrinkle stains.

  Conventionally, as a cleaning device that removes resin mold molding film, gas burns and wrinkle stains, a tank-shaped tank is filled with an alkali solution or neutralizing solution, and the resin molding die is immersed in it and irradiated with ultrasonic waves. Or by applying a voltage to the alkaline solution or neutralizing solution to perform removal cleaning by electrolysis.

However, in the removal cleaning method configured as described above, when the size of the resin molding die is increased, the alkali liquid or the neutralizing liquid is increased accordingly, the number of ultrasonic generators is increased, and the power is increased. Therefore, there is a problem that the ultrasonic irradiation area has to be enlarged, which increases the cost of the alkaline liquid or the neutralizing liquid, increases the cost of the ultrasonic generator, and further enlarges the transport system. is there.
Japanese Patent No. 2639551

  The problem to be solved is that the alkaline solution or neutralizing solution increases and the number of ultrasonic generators increases, which increases the cost.

  In the present invention, the container is filled with an alkali solution or a neutralizing solution, the work table is installed in the container, the resin mold is placed on the work table, the pulse jet nozzle is equipped with an ultrasonic vibrator inside, An introduction port for introducing an alkali liquid or neutralizing liquid is provided in front of the ultrasonic vibrator, and a nozzle for ejecting the alkaline liquid or neutralizing liquid is provided. The oscillator applies an oscillation output to the ultrasonic vibrator of the pulse jet nozzle. The liquid transport pump supplies the alkaline liquid or neutralizing liquid in the container to the inlet of the pulse jet nozzle, the electrode wire mesh is mounted on the front surface of the pulse jet nozzle, and the DC power supply is connected between the work table and the electrode wire mesh. The liquid transfer pump is driven, the alkali liquid or the neutralized liquid is sprayed from the pulse jet nozzle to the resin mold through the metal mesh electrode, and the DC voltage is applied to the metal mesh electrode from the DC power source. It is intended to cleaning.

  In the resin mold cleaning apparatus of the present invention, the ultrasonic wave generated by the ultrasonic vibrator and the alkali liquid are irradiated from the pulse jet nozzle, and the alkali liquid ejected from the pulse jet nozzle is injected to the resin mold through the metal mesh electrode. By applying a DC voltage between the work table and the alkaline liquid, it is possible to quickly remove the resin molding film, gas burn, and wrinkle dirt by spraying the alkaline liquid and applying the DC voltage. Yes, even if the resin mold becomes large, there is an advantage that a large tank is not required, there is no need to increase the number of ultrasonic waves, and there is no need to increase the size of the ultrasonic output device. .

  In the present invention, the resin molding film, gas burn, and removal of wrinkle contamination are irradiated with ultrasonic waves and alkaline liquid generated by an ultrasonic vibrator from a pulse jet nozzle, and a DC voltage applied between the work table and the alkaline liquid. And could be achieved by

  FIG. 1 is a configuration diagram of a resin mold cleaning apparatus according to an embodiment of the present invention. An alkaline liquid 2 is placed in a container 1, a work table 3 is mounted in the container 1, and a resin is placed on the work table 3. A metal mold 4 is placed, the resin metal mold 4 has a metal mold 4 a formed on the surface, a metal mesh electrode 5 is mounted on the resin metal mold 4, and the metal mesh electrode 5 is placed on the positive side of the DC power supply 6. The negative side of the DC power source 6 is connected to the work table 3, and a liquid transport pump 7 is mounted in the alkaline liquid 2 of the container 1. The alkaline liquid 2 transported by the liquid transport pump 7 is a liquid It is conveyed to the inlet 9 a of the pulse jet nozzle 9 through the quantity controller 8.

  As shown in FIG. 2, the pulse jet nozzle 9 has a liquid pool 9b formed inside an introduction port 9a to which the liquid transport pump 7 is connected, and is tapered toward the tip from the liquid pool 9b. A nozzle 9c is formed, a support member 9d is attached to the end of the liquid reservoir 9b, an ultrasonic vibrator 10 is attached to the support member 9d, and the ultrasonic vibrator 10 is connected to the oscillator 11, Oscillation output is applied.

  In the resin mold cleaning apparatus of this embodiment configured as described above, a DC voltage is applied between the wire mesh electrode 5 and the work table 3, and the oscillator 11 supplies the ultrasonic vibrator 10 of the pulse jet nozzle 9. When the oscillation output is applied, the liquid transport pump 7 is driven, and the alkaline liquid 2 is ejected from the nozzle 9 c of the pulse jet nozzle 9, the ejected alkaline liquid 2 passes through the mesh of the metal mesh electrode 5 to form resin gold. Since it is sprayed onto the mold 4, the resin molding film, gas burn, and wrinkle dirt adhering to the resin mold 4 are quickly and neatly removed by the alkaline liquid and the DC voltage injected together with the ultrasonic waves generated by the ultrasonic vibrator 10. There is an advantage that even if the resin mold becomes large, there is no need for a large tank, it is not necessary to increase the number of ultrasonic waves, and it is not necessary to increase the size of the ultrasonic output device. .

  In the above embodiment, the DC voltage applied between the work table 3 and the wire mesh electrode 5 is about 5 volts, and a neutralizing solution may be used instead of the alkaline solution 2.

It is a block diagram of the cleaning apparatus of the resin metal mold | die of the Example of this invention. It is sectional drawing of the pulse jet nozzle of the resin mold cleaning apparatus of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Container 2 Alkaline liquid 3 Work stand 4 Resin metal mold 5 Wire mesh electrode 6 DC power supply 7 Liquid conveyance pump 8 Liquid quantity controller 9 Pulse jet nozzle 10 Ultrasonic vibrator 11 Oscillator

Claims (3)

  A container in which an alkaline solution or a neutralizing solution is placed, a work table installed in the container, a resin mold placed on the work table, and an ultrasonic vibrator mounted therein, the ultrasonic vibrator A pulse jet nozzle provided with an inlet for introducing the alkali liquid or neutralizing liquid on the front surface of the nozzle, and a nozzle for ejecting the alkali liquid or neutralizing liquid, and an oscillation output to the ultrasonic vibrator of the pulse jet nozzle An oscillator for applying a liquid, a liquid transport pump for supplying an alkaline liquid or a neutralizing liquid in the container to the inlet of the pulse jet nozzle, an electrode metal mesh mounted on the front surface of the pulse jet nozzle, and the work table And a direct current power source connected between the electrode metal mesh, driving the liquid transport pump, jetting the alkaline liquid or neutralizing liquid from the pulse jet nozzle to the resin mold, Mold cleaning device by applying a DC voltage from the DC power supply to the network electrode, characterized in that to clean the resin mold.   2. The mold cleaning apparatus according to claim 1, wherein the DC power source is connected so that a negative electrode is connected to the work table, a positive electrode is connected to the electrode wire mesh, and a voltage of 5 volts is applied.   The mold cleaning apparatus according to claim 1, wherein a liquid amount controller is connected to the liquid transport pump.

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