JP2007039712A5 - - Google Patents

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Publication number
JP2007039712A5
JP2007039712A5 JP2005222436A JP2005222436A JP2007039712A5 JP 2007039712 A5 JP2007039712 A5 JP 2007039712A5 JP 2005222436 A JP2005222436 A JP 2005222436A JP 2005222436 A JP2005222436 A JP 2005222436A JP 2007039712 A5 JP2007039712 A5 JP 2007039712A5
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JP
Japan
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JP2005222436A
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Japanese (ja)
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JP2007039712A (ja
JP4789535B2 (ja
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Publication of JP2007039712A5 publication Critical patent/JP2007039712A5/ja
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JP2005222436A 2005-08-01 2005-08-01 スパッタリング装置、成膜方法 Expired - Lifetime JP4789535B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005222436A JP4789535B2 (ja) 2005-08-01 2005-08-01 スパッタリング装置、成膜方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005222436A JP4789535B2 (ja) 2005-08-01 2005-08-01 スパッタリング装置、成膜方法

Publications (3)

Publication Number Publication Date
JP2007039712A JP2007039712A (ja) 2007-02-15
JP2007039712A5 true JP2007039712A5 (enrdf_load_stackoverflow) 2008-05-01
JP4789535B2 JP4789535B2 (ja) 2011-10-12

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Family Applications (1)

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JP2005222436A Expired - Lifetime JP4789535B2 (ja) 2005-08-01 2005-08-01 スパッタリング装置、成膜方法

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JP (1) JP4789535B2 (enrdf_load_stackoverflow)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011524463A (ja) * 2008-05-06 2011-09-01 エージェンシー フォー サイエンス，テクノロジー アンド リサーチ 光透過性デバイス用導電性構造
WO2009139434A1 (ja) 2008-05-15 2009-11-19 国立大学法人山口大学 薄膜作製用スパッタ装置及び薄膜作製方法
KR20110042217A (ko) * 2008-10-16 2011-04-25 가부시키가이샤 아루박 스퍼터링 장치, 박막 형성 방법 및 전계 효과형 트랜지스터의 제조 방법
KR20140108110A (ko) 2011-12-28 2014-09-05 파나소닉 주식회사 유기 el 소자의 제조 방법
KR101504541B1 (ko) * 2013-03-29 2015-03-20 삼한박막진공 주식회사 균일 증착을 위한 인라인 스퍼터링 장치
JP6309353B2 (ja) * 2014-06-06 2018-04-11 株式会社Ｓｃｒｅｅｎホールディングス スパッタリング装置およびスパッタリング方法
EP3438322B1 (en) * 2016-03-30 2022-05-25 Keihin Ramtech Co., Ltd. Sputtering device, and method for producing film-formed body
CN113151792B (zh) * 2021-03-26 2023-01-03 洛阳理工学院 磁体部件、磁控溅射阴极及柔性线材镀膜用磁控溅射装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6176673A (ja) * 1984-09-21 1986-04-19 Fujitsu Ltd スパツタリング方法
JPS61272374A (ja) * 1985-05-28 1986-12-02 Nec Corp スパツタ装置
JPH01298154A (ja) * 1988-05-26 1989-12-01 Kikuo Tominaga 対向ターゲット式プレーナーマグネトロンスパッタリング装置
JPH0288766A (ja) * 1988-09-26 1990-03-28 Hitachi Ltd スパッタ電極、スパッタリング装置およびスパッタリング方法
JPH02131547U (enrdf_load_stackoverflow) * 1989-03-29 1990-11-01
JP2660951B2 (ja) * 1992-12-25 1997-10-08 アネルバ株式会社 スパッタリング装置
JP3514488B2 (ja) * 1993-06-30 2004-03-31 株式会社アルバック マグネトロンスパッタ方法及び装置
JP2003239069A (ja) * 2002-02-15 2003-08-27 Ulvac Japan Ltd 薄膜の製造方法及び装置
JP2003346559A (ja) * 2002-05-24 2003-12-05 Okura Ind Co Ltd 透明導電膜、及びその形成方法

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