JP2007019490A5 - - Google Patents
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- Publication number
- JP2007019490A5 JP2007019490A5 JP2006160027A JP2006160027A JP2007019490A5 JP 2007019490 A5 JP2007019490 A5 JP 2007019490A5 JP 2006160027 A JP2006160027 A JP 2006160027A JP 2006160027 A JP2006160027 A JP 2006160027A JP 2007019490 A5 JP2007019490 A5 JP 2007019490A5
- Authority
- JP
- Japan
- Prior art keywords
- region
- semiconductor layer
- conductive film
- gate electrode
- resist pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 35
- 239000012535 impurity Substances 0.000 claims 6
- 238000004519 manufacturing process Methods 0.000 claims 6
- 238000000034 method Methods 0.000 claims 6
- 230000015572 biosynthetic process Effects 0.000 claims 3
- 238000002425 crystallisation Methods 0.000 claims 2
- 230000008025 crystallization Effects 0.000 claims 2
- 238000005530 etching Methods 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 230000003197 catalytic effect Effects 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000000059 patterning Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006160027A JP5046565B2 (ja) | 2005-06-10 | 2006-06-08 | 半導体装置の作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005171565 | 2005-06-10 | ||
| JP2005171565 | 2005-06-10 | ||
| JP2006160027A JP5046565B2 (ja) | 2005-06-10 | 2006-06-08 | 半導体装置の作製方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012091011A Division JP5448278B2 (ja) | 2005-06-10 | 2012-04-12 | 半導体装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007019490A JP2007019490A (ja) | 2007-01-25 |
| JP2007019490A5 true JP2007019490A5 (enrdf_load_stackoverflow) | 2009-05-28 |
| JP5046565B2 JP5046565B2 (ja) | 2012-10-10 |
Family
ID=37756329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006160027A Expired - Fee Related JP5046565B2 (ja) | 2005-06-10 | 2006-06-08 | 半導体装置の作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5046565B2 (enrdf_load_stackoverflow) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5416881B2 (ja) * | 2005-10-18 | 2014-02-12 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US7601566B2 (en) | 2005-10-18 | 2009-10-13 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US9105652B2 (en) | 2011-05-24 | 2015-08-11 | Sharp Kabushiki Kaisha | Method of manufacturing semiconductor device |
| TWI575756B (zh) * | 2015-01-13 | 2017-03-21 | 群創光電股份有限公司 | 顯示面板 |
| US11187836B2 (en) * | 2018-03-06 | 2021-11-30 | Applied Materials, Inc. | Method of building a 3D functional optical material layer stacking structure |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000349298A (ja) * | 1999-03-26 | 2000-12-15 | Semiconductor Energy Lab Co Ltd | 電気光学装置およびその作製方法 |
| JP3688548B2 (ja) * | 2000-03-14 | 2005-08-31 | シャープ株式会社 | 画像表示装置 |
| JP4954401B2 (ja) * | 2000-08-11 | 2012-06-13 | 株式会社半導体エネルギー研究所 | 半導体装置の製造方法 |
| JP2002134756A (ja) * | 2000-10-26 | 2002-05-10 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
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2006
- 2006-06-08 JP JP2006160027A patent/JP5046565B2/ja not_active Expired - Fee Related