JP2007009217A5 - - Google Patents
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- Publication number
- JP2007009217A5 JP2007009217A5 JP2006219129A JP2006219129A JP2007009217A5 JP 2007009217 A5 JP2007009217 A5 JP 2007009217A5 JP 2006219129 A JP2006219129 A JP 2006219129A JP 2006219129 A JP2006219129 A JP 2006219129A JP 2007009217 A5 JP2007009217 A5 JP 2007009217A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- resin
- composition according
- prepolymer
- cyanate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 claims description 16
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 239000011256 inorganic filler Substances 0.000 claims description 6
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 229920003986 novolac Polymers 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000011888 foil Substances 0.000 claims description 2
- 239000005350 fused silica glass Substances 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006219129A JP5303826B2 (ja) | 2006-08-11 | 2006-08-11 | 樹脂組成物、プリプレグ及びそれを用いたプリント配線板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006219129A JP5303826B2 (ja) | 2006-08-11 | 2006-08-11 | 樹脂組成物、プリプレグ及びそれを用いたプリント配線板 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001265431A Division JP4132755B2 (ja) | 2001-09-03 | 2001-09-03 | 樹脂組成物、プリプレグ及びそれを用いたプリント配線板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007009217A JP2007009217A (ja) | 2007-01-18 |
| JP2007009217A5 true JP2007009217A5 (https=) | 2008-10-16 |
| JP5303826B2 JP5303826B2 (ja) | 2013-10-02 |
Family
ID=37748101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006219129A Expired - Fee Related JP5303826B2 (ja) | 2006-08-11 | 2006-08-11 | 樹脂組成物、プリプレグ及びそれを用いたプリント配線板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5303826B2 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5120267B2 (ja) * | 2007-02-08 | 2013-01-16 | 住友ベークライト株式会社 | 積層体、積層体を含む回路基板、半導体パッケージおよび積層体の製造方法 |
| JP5293598B2 (ja) * | 2007-04-10 | 2013-09-18 | 住友ベークライト株式会社 | 樹脂組成物、プリプレグ、積層板、多層プリント配線板および半導体装置 |
| JP4968460B2 (ja) * | 2007-04-12 | 2012-07-04 | 住友ベークライト株式会社 | 樹脂組成物、樹脂組成物付き金属箔及びプリント配線板 |
| JP5428212B2 (ja) * | 2008-06-17 | 2014-02-26 | 住友ベークライト株式会社 | 樹脂組成物、プリプレグおよびそれを用いたプリント配線板 |
| TWI565750B (zh) * | 2009-02-20 | 2017-01-11 | Ajinomoto Kk | Resin composition |
| JP6109569B2 (ja) * | 2010-05-07 | 2017-04-05 | 住友ベークライト株式会社 | 回路基板用エポキシ樹脂組成物、プリプレグ、積層板、樹脂シート、プリント配線板用積層基材、プリント配線板、及び半導体装置 |
| KR101892784B1 (ko) | 2011-08-09 | 2018-08-28 | 미츠비시 가스 가가쿠 가부시키가이샤 | 신규한 시안산에스테르 화합물 및 그 제조 방법, 그리고 그 화합물을 함유하는 경화성 수지 조성물 및 그 경화물 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6354419A (ja) * | 1986-08-26 | 1988-03-08 | Mitsubishi Gas Chem Co Inc | 熱硬化性樹脂組成物 |
| DE3852839T2 (de) * | 1987-04-27 | 1995-06-22 | Mitsubishi Gas Chemical Co | Hitzehärtbare Harzzusammensetzung. |
| JP2993065B2 (ja) * | 1990-07-27 | 1999-12-20 | 三菱瓦斯化学株式会社 | 表面平滑金属箔張積層板 |
| JP2000001599A (ja) * | 1998-03-10 | 2000-01-07 | Kashima Oil Co Ltd | 高反応性変性フェノ―ル樹脂を用いた樹脂組成物、成形体、繊維強化樹脂板、摩擦材、発泡体、接着剤、防食塗料および難燃剤 |
| JP2000191776A (ja) * | 1998-12-24 | 2000-07-11 | Mitsubishi Gas Chem Co Inc | シアン酸エステル・コ−プレポリマー |
| JP2001172473A (ja) * | 1999-10-07 | 2001-06-26 | Nitto Denko Corp | 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置 |
| JP2002194121A (ja) * | 2000-12-26 | 2002-07-10 | Mitsubishi Gas Chem Co Inc | プリプレグ及び金属箔張り積層板 |
-
2006
- 2006-08-11 JP JP2006219129A patent/JP5303826B2/ja not_active Expired - Fee Related
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