JP2007005834A - 研磨方法および研磨システム - Google Patents
研磨方法および研磨システム Download PDFInfo
- Publication number
- JP2007005834A JP2007005834A JP2006275955A JP2006275955A JP2007005834A JP 2007005834 A JP2007005834 A JP 2007005834A JP 2006275955 A JP2006275955 A JP 2006275955A JP 2006275955 A JP2006275955 A JP 2006275955A JP 2007005834 A JP2007005834 A JP 2007005834A
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- workpiece
- type
- film thickness
- design data
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 149
- 238000000034 method Methods 0.000 title claims abstract description 53
- 238000012545 processing Methods 0.000 claims abstract description 17
- 238000005259 measurement Methods 0.000 claims description 55
- 238000013461 design Methods 0.000 claims description 39
- 230000010365 information processing Effects 0.000 claims description 35
- 238000007517 polishing process Methods 0.000 claims description 9
- 230000001276 controlling effect Effects 0.000 claims 2
- 230000002596 correlated effect Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 abstract description 71
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 239000010408 film Substances 0.000 description 144
- 235000012431 wafers Nutrition 0.000 description 50
- 238000003860 storage Methods 0.000 description 26
- 238000012360 testing method Methods 0.000 description 17
- 238000004088 simulation Methods 0.000 description 9
- 238000009826 distribution Methods 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 3
- 239000012788 optical film Substances 0.000 description 3
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 230000011218 segmentation Effects 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000004587 chromatography analysis Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012887 quadratic function Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006275955A JP2007005834A (ja) | 2006-10-10 | 2006-10-10 | 研磨方法および研磨システム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006275955A JP2007005834A (ja) | 2006-10-10 | 2006-10-10 | 研磨方法および研磨システム |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002157952A Division JP2003347258A (ja) | 2002-05-30 | 2002-05-30 | 研磨方法および研磨システム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007005834A true JP2007005834A (ja) | 2007-01-11 |
| JP2007005834A5 JP2007005834A5 (enExample) | 2007-03-01 |
Family
ID=37691053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006275955A Pending JP2007005834A (ja) | 2006-10-10 | 2006-10-10 | 研磨方法および研磨システム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2007005834A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013197260A (ja) * | 2012-03-19 | 2013-09-30 | Lapis Semiconductor Co Ltd | 半導体素子の製造方法及び製造装置 |
| CN119772182A (zh) * | 2025-03-07 | 2025-04-08 | 昆明理工大学 | 一种弥散强化铜合金制备系统及方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1044028A (ja) * | 1996-08-06 | 1998-02-17 | Sony Corp | 研磨シミュレーション方法 |
| JP2002110603A (ja) * | 2000-09-27 | 2002-04-12 | Matsushita Electric Ind Co Ltd | 化学機械研磨方法および化学機械研磨装置 |
-
2006
- 2006-10-10 JP JP2006275955A patent/JP2007005834A/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1044028A (ja) * | 1996-08-06 | 1998-02-17 | Sony Corp | 研磨シミュレーション方法 |
| JP2002110603A (ja) * | 2000-09-27 | 2002-04-12 | Matsushita Electric Ind Co Ltd | 化学機械研磨方法および化学機械研磨装置 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013197260A (ja) * | 2012-03-19 | 2013-09-30 | Lapis Semiconductor Co Ltd | 半導体素子の製造方法及び製造装置 |
| CN119772182A (zh) * | 2025-03-07 | 2025-04-08 | 昆明理工大学 | 一种弥散强化铜合金制备系统及方法 |
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Effective date: 20061010 Free format text: JAPANESE INTERMEDIATE CODE: A621 |
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| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070117 |
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