JP2007003528A5 - - Google Patents

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Publication number
JP2007003528A5
JP2007003528A5 JP2006173043A JP2006173043A JP2007003528A5 JP 2007003528 A5 JP2007003528 A5 JP 2007003528A5 JP 2006173043 A JP2006173043 A JP 2006173043A JP 2006173043 A JP2006173043 A JP 2006173043A JP 2007003528 A5 JP2007003528 A5 JP 2007003528A5
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JP
Japan
Prior art keywords
error
recipe
recipes
tool
measurement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006173043A
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English (en)
Japanese (ja)
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JP4398441B2 (ja
JP2007003528A (ja
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Publication date
Priority claimed from US11/160,404 external-priority patent/US7065425B1/en
Application filed filed Critical
Publication of JP2007003528A publication Critical patent/JP2007003528A/ja
Publication of JP2007003528A5 publication Critical patent/JP2007003528A5/ja
Application granted granted Critical
Publication of JP4398441B2 publication Critical patent/JP4398441B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2006173043A 2005-06-22 2006-06-22 超小型電子機構の所望寸法を測定するのに用いられる計測ツールにおける障害を識別する方法、及びそのコンピュータプログラム Expired - Fee Related JP4398441B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/160,404 US7065425B1 (en) 2005-06-22 2005-06-22 Metrology tool error log analysis methodology and system

Publications (3)

Publication Number Publication Date
JP2007003528A JP2007003528A (ja) 2007-01-11
JP2007003528A5 true JP2007003528A5 (https=) 2009-08-06
JP4398441B2 JP4398441B2 (ja) 2010-01-13

Family

ID=36586511

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006173043A Expired - Fee Related JP4398441B2 (ja) 2005-06-22 2006-06-22 超小型電子機構の所望寸法を測定するのに用いられる計測ツールにおける障害を識別する方法、及びそのコンピュータプログラム

Country Status (4)

Country Link
US (2) US7065425B1 (https=)
JP (1) JP4398441B2 (https=)
CN (1) CN100523839C (https=)
TW (1) TW200715160A (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7363098B2 (en) * 2005-12-19 2008-04-22 Tech Semiconductor Singapore Pte Ltd Method to identify machines causing excursion in semiconductor manufacturing
US7631286B2 (en) * 2005-12-30 2009-12-08 Wafertech Llc Automated metrology recipe generation
US7305320B2 (en) * 2006-02-15 2007-12-04 International Business Machines Corporation Metrology tool recipe validator using best known methods
EP2097794B2 (en) 2006-11-03 2017-03-08 Air Products and Chemicals, Inc. System and method for process monitoring
US7953511B1 (en) * 2007-09-21 2011-05-31 National Semiconductor Corporation System and method for reducing processing errors during wafer fabrication employing a 2D wafer scribe and monitoring system
JP5002395B2 (ja) * 2007-09-28 2012-08-15 株式会社日立ハイテクノロジーズ 荷電粒子線装置の制御装置
US10984143B2 (en) * 2015-01-23 2021-04-20 Hitachi High-Tech Corporation Recipe creation device for use in semiconductor measurement device or semiconductor inspection device
JP6339956B2 (ja) * 2015-03-19 2018-06-06 アズビル株式会社 不具合要因特定支援装置および不具合要因特定支援方法
US10372114B2 (en) * 2016-10-21 2019-08-06 Kla-Tencor Corporation Quantifying and reducing total measurement uncertainty
CN114245933B (zh) 2019-09-06 2025-11-18 株式会社日立高新技术 制程信息提示系统、制程错误推定系统
US12554571B2 (en) 2020-03-31 2026-02-17 Hitachi High-Tech Corporation Error cause estimation device and estimation method

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5914879A (en) * 1997-03-04 1999-06-22 Advanced Micro Devices System and method for calculating cluster tool performance metrics using a weighted configuration matrix
US6470227B1 (en) 1997-12-02 2002-10-22 Murali D. Rangachari Method and apparatus for automating a microelectric manufacturing process
US6303395B1 (en) * 1999-06-01 2001-10-16 Applied Materials, Inc. Semiconductor processing techniques
US6456894B1 (en) 1999-06-01 2002-09-24 Applied Materials, Inc. Semiconductor processing techniques
US6671570B2 (en) 2000-10-17 2003-12-30 Brooks Automation, Inc. System and method for automated monitoring and assessment of fabrication facility
US6727106B1 (en) * 2001-07-12 2004-04-27 Advanced Micro Devices, Inc. System and software for statistical process control in semiconductor manufacturing and method thereof
US6842659B2 (en) 2001-08-24 2005-01-11 Applied Materials Inc. Method and apparatus for providing intra-tool monitoring and control
US6708075B2 (en) * 2001-11-16 2004-03-16 Advanced Micro Devices Method and apparatus for utilizing integrated metrology data as feed-forward data
DE10240115B4 (de) 2002-08-30 2004-10-28 Advanced Micro Devices, Inc., Sunnyvale Verfahren und System zum Handhaben von Substraten in einer Produktionslinie mit einer Cluster-Anlage und einer Messanlage
US7684887B2 (en) 2003-04-30 2010-03-23 Infineon Technologies Ag Advanced process control method and advanced process control system for acquiring production data in a chip production installation
US20050010319A1 (en) 2003-07-09 2005-01-13 Sukesh Patel System and method for validating and visualizing APC assisted semiconductor manufacturing processes
US20050038554A1 (en) 2003-07-14 2005-02-17 Cory Watkins Inspection and metrology module cluster tool
US7257454B2 (en) * 2003-11-21 2007-08-14 Taiwan Semiconductor Manufacturing Company, Ltd. Dynamically adjusting the distribution for dispatching lot between current and downstream tool by using expertise weighting mechanism
US6999848B2 (en) 2003-12-19 2006-02-14 Intel Corporation Process control apparatus, systems, and methods
TWI236044B (en) * 2004-05-12 2005-07-11 Powerchip Semiconductor Corp System and method for real-time dispatching batch in manufacturing process

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