JP2006511717A - 多化学物質の電気化学的処理システム - Google Patents
多化学物質の電気化学的処理システム Download PDFInfo
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Abstract
Description
Claims (23)
- 複数の電気化学的メッキセルが位置決めされたシステムプラットホームと、
上記複数のメッキセル間で基板を移送するように位置決めされた少なくとも1つのロボットと、
上記複数のメッキセルの各々に流体連通する流体配送システムであって、上記複数の処理セルの各々に複数のメッキ化学物質を与えるように構成された流体配送システムと、
を備えた電気化学的処理システム。 - 上記流体配送システムは、
第1の複数の添加剤ソースと、
上記添加剤ソースの各々に流体連通する計測ポンプと、
上記計測ポンプに流体連通する第1のバージン電解液ソースと、
入口では上記計測ポンプに、出口では上記複数のメッキセルに流体連通するマニホールドであって、上記複数のメッキセルの選択された1つに特定の化学物質を向けるように構成されたマニホールドと、
を備えた、請求項1に記載の電気化学的処理セル。 - 第2の複数の添加剤ソース及び第2のバージン電解液ソースを更に備え、該第2の複数の添加剤ソース及び第2のバージン電解液ソースは、上記複数のメッキセルに選択的に流体連通する第2のマニホールドと流体連通する、請求項1に記載の電気化学的処理セル。
- 上記第1の複数の添加剤ソースは、
電気化学的メッキ加速剤を与える第1ソースと、
電気化学的メッキならし剤を与える第2ソースと、
電気化学的メッキ抑制剤を与える第3ソースと、
を備えた、請求項2に記載の装置。 - 上記第1の複数の添加剤ソースの各々は、
少なくとも1つのバルク添加剤容器と、
容積が上記バルク添加剤容器より小さく、且つ関連バルク添加剤容器及び上記計測ポンプに流体連通する少なくとも1つの緩衝容器と、
を更に備えた、請求項2に記載の装置。 - 上記システムプラットホームに連通する少なくとも1つのアニールチャンバーを更に備えた、請求項1に記載の電気化学的処理セル。
- 上記流体配送システムは、更に、上記メッキセルのアノードチャンバーにアノード溶液を、上記メッキセルのカソードチャンバーにカソード溶液を供給するように構成された、請求項1に記載の電気化学的処理システム。
- 複数の処理セル位置を有する処理システムベースと、
2つの上記処理セル位置に位置決めされた少なくとも2つの電気化学的メッキセルと、
1つの上記処理セル位置に位置決めされた少なくとも1つのスピンリンス乾燥セルと、
1つの上記処理セル位置に位置決めされた少なくとも1つの基板ベベル清掃セルと、
上記少なくとも2つの電気化学的処理セルに流体連通する多化学物質メッキ溶液配送システムであって、計測ポンプ、該計測ポンプに流体連通する複数のメッキ溶液添加剤容器、上記計測ポンプに流体連通する少なくとも1つの第1バージン電解溶液容器、及び上記計測ポンプの出口に流体連通すると共に、前記少なくとも2つの電気化学的メッキセルの各々に選択的に個々に流体連通するメッキ溶液分配マニホールド、を含む、多化学物質メッキ溶液配送システムと、
を備えた電気化学的処理システム。 - 上記複数のメッキ溶液添加物容器は、緩衝容器に流体連通するバルク容器を備え、上記緩衝容器は上記計測ポンプに流体連通する、請求項8に記載の電気化学的処理システム。
- 上記計測ポンプは、複数の流体入口及び少なくとも1つの流体出口を有する高精度流体配送ポンプで構成され、更に、上記計測ポンプは、上記複数の流体入口で受け取られた流体成分を所定の比で混合して、上記流体成分の所定の比の混合物を上記少なくとも1つの流体出口から送出するように構成された、請求項8に記載の電気化学的処理システム。
- 上記多化学物質メッキ溶液配送システムは、更に、上記計測ポンプと流体連通する第2のバージン電解溶液容器を備え、該第2のバージン電解溶液容器は、上記少なくとも1つの第1バージン電解液容器に収容された第1バージン電解液とは異なる第2バージン電解液を与えるように構成された、請求項8に記載の電気化学的処理システム。
- 上記多化学物質メッキ溶液配送システムは、上記少なくとも2つの電気化学的メッキセルへ少なくとも2つの異なるメッキ化学物質を与えるように構成された、請求項8に記載の電気化学的処理システム。
- 上記多化学物質メッキ溶液配送システムは、上記電気化学的メッキセルのカソード液領域にカソード液メッキ溶液を且つ上記電気化学的メッキセルのアノード液領域にアノード溶液を供給するように構成された、請求項8に記載の電気化学的処理システム。
- 半導体基板上に少なくとも1つの層を電気化学的にメッキする方法において、
第1のメッキ操作に対して一体的メッキシステムプラットホーム上の第1電気化学的メッキセルに上記基板を位置決めするステップと、
第2のメッキ操作に対して上記一体的メッキシステムプラットホーム上の第2メッキセルに上記基板を位置決めするステップと、
上記システムプラットホームに連通して位置決めされた多化学物質の流体配送システムで上記第1メッキセルに第1の電気化学的メッキ化学物質を供給するステップと、
上記多化学物質の流体配送システムで上記第2メッキセルに第2の電気化学的メッキ化学物質を供給するステップであって、上記第1及び第2のメッキ化学物質が異なるものである、ステップと、
を備えた方法。 - 上記第1及び第2の電気化学的メッキ化学物質は異なるメッキ溶液ベースを含む、請求項14に記載の方法。
- 上記第1及び第2の電気化学的メッキ化学物質は異なる添加剤濃度を有する、請求項14に記載の方法。
- 上記第1の電気化学的メッキ化学物質は、最適化されたギャップ充填化学物質であり、上記第2の電気化学的メッキ化学物質は、最適化されたバルク充填化学物質である、請求項14に記載の方法。
- 上記第1の電気化学的メッキ化学物質は、最適化されたバリア上メッキ化学物質であり、上記第2の電気化学的メッキ化学物質は、最適化された特徴部充填平坦化化学物質である、請求項14に記載の方法。
- 上記第1の電気化学的メッキ化学物質は、最適化され合金メッキ化学物質であり、上記第2の電気化学的メッキ化学物質は、最適化された銅メッキ化学物質である、請求項14に記載の方法。
- 上記第1メッキ操作と第2メッキ操作との間に上記半導体基板をリンスするステップを更に備えた、請求項14に記載の方法。
- 上記第1メッキ操作と第2メッキ操作との間に上記半導体基板をスピン乾燥するステップを更に備えた、請求項14に記載の方法。
- 上記第1メッキ操作は銅メッキプロセスであり、上記第2メッキ操作は合金メッキプロセスである、請求項14に記載の方法。
- 上記第1メッキ操作は欠陥減少メッキプロセスである、請求項14に記載の方法。
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US43512102P | 2002-12-19 | 2002-12-19 | |
US10/438,624 US20040118694A1 (en) | 2002-12-19 | 2003-05-14 | Multi-chemistry electrochemical processing system |
PCT/US2003/040719 WO2004057060A2 (en) | 2002-12-19 | 2003-12-18 | Multi-chemistry electrochemical processing system |
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JP (1) | JP2006511717A (ja) |
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- 2003-12-18 TW TW092135943A patent/TW200415262A/zh unknown
- 2003-12-18 WO PCT/US2003/040719 patent/WO2004057060A2/en active Application Filing
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