JP2006352175A5 - - Google Patents
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- Publication number
- JP2006352175A5 JP2006352175A5 JP2006270656A JP2006270656A JP2006352175A5 JP 2006352175 A5 JP2006352175 A5 JP 2006352175A5 JP 2006270656 A JP2006270656 A JP 2006270656A JP 2006270656 A JP2006270656 A JP 2006270656A JP 2006352175 A5 JP2006352175 A5 JP 2006352175A5
- Authority
- JP
- Japan
- Prior art keywords
- wires
- crimping
- diameter
- inner leads
- compression
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 7
- 238000002788 crimping Methods 0.000 claims 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 4
- 229910052763 palladium Inorganic materials 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006270656A JP2006352175A (ja) | 2006-10-02 | 2006-10-02 | 半導体集積回路装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006270656A JP2006352175A (ja) | 2006-10-02 | 2006-10-02 | 半導体集積回路装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000046724A Division JP2001230360A (ja) | 2000-02-18 | 2000-02-18 | 半導体集積回路装置およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006352175A JP2006352175A (ja) | 2006-12-28 |
| JP2006352175A5 true JP2006352175A5 (https=) | 2007-03-29 |
Family
ID=37647599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006270656A Pending JP2006352175A (ja) | 2006-10-02 | 2006-10-02 | 半導体集積回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2006352175A (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5634149B2 (ja) | 2010-07-16 | 2014-12-03 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP6657001B2 (ja) * | 2016-04-19 | 2020-03-04 | 株式会社デンソーテン | プリント配線板 |
-
2006
- 2006-10-02 JP JP2006270656A patent/JP2006352175A/ja active Pending
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