JP2006351942A5 - - Google Patents
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- Publication number
- JP2006351942A5 JP2006351942A5 JP2005177970A JP2005177970A JP2006351942A5 JP 2006351942 A5 JP2006351942 A5 JP 2006351942A5 JP 2005177970 A JP2005177970 A JP 2005177970A JP 2005177970 A JP2005177970 A JP 2005177970A JP 2006351942 A5 JP2006351942 A5 JP 2006351942A5
- Authority
- JP
- Japan
- Prior art keywords
- pair
- substrates
- conversion module
- electrode
- thermoelectric conversion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 18
- 238000006243 chemical reaction Methods 0.000 claims 11
- 229910000679 solder Inorganic materials 0.000 claims 5
- 238000004519 manufacturing process Methods 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005177970A JP4951880B2 (ja) | 2005-06-17 | 2005-06-17 | 熱電変換モジュール |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005177970A JP4951880B2 (ja) | 2005-06-17 | 2005-06-17 | 熱電変換モジュール |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006351942A JP2006351942A (ja) | 2006-12-28 |
| JP2006351942A5 true JP2006351942A5 (sr) | 2010-03-18 |
| JP4951880B2 JP4951880B2 (ja) | 2012-06-13 |
Family
ID=37647451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005177970A Expired - Fee Related JP4951880B2 (ja) | 2005-06-17 | 2005-06-17 | 熱電変換モジュール |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4951880B2 (sr) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5404025B2 (ja) * | 2008-12-24 | 2014-01-29 | 京セラ株式会社 | 熱電変換モジュールの製法 |
| CN113285009A (zh) * | 2021-05-26 | 2021-08-20 | 杭州大和热磁电子有限公司 | 一种通过沉积金锡焊料组装的tec及制备方法 |
| CN117979802B (zh) * | 2024-03-29 | 2024-07-05 | 四川科尔威光电科技有限公司 | 一种具有阻焊流动的集成电路结构及其制备方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5858379A (ja) * | 1981-09-29 | 1983-04-06 | 松下電工株式会社 | 開口体 |
| JPH0325965A (ja) * | 1989-06-23 | 1991-02-04 | Fuji Electric Co Ltd | 半導体装置 |
| JPH07111370A (ja) * | 1993-10-13 | 1995-04-25 | Fuji Electric Co Ltd | 半導体装置 |
| JP4127437B2 (ja) * | 1998-11-30 | 2008-07-30 | 小松エレクトロニクス株式会社 | サーモモジュール |
| JP2000286289A (ja) * | 1999-03-31 | 2000-10-13 | Fujitsu Ten Ltd | 金属貼付基板および半導体装置 |
| JP2001015820A (ja) * | 1999-07-02 | 2001-01-19 | Seiko Instruments Inc | 熱電素子 |
| JP3627719B2 (ja) * | 2001-04-10 | 2005-03-09 | ヤマハ株式会社 | 熱電モジュール |
| JP2004023039A (ja) * | 2002-06-20 | 2004-01-22 | Yamaha Corp | 熱電装置およびその製造方法 |
| JP2004031696A (ja) * | 2002-06-26 | 2004-01-29 | Kyocera Corp | 熱電モジュール及びその製造方法 |
| JP2004266103A (ja) * | 2003-02-28 | 2004-09-24 | Toshiba Corp | 窒化アルミニウムメタライズ基板およびその製造方法 |
| JP2004327785A (ja) * | 2003-04-25 | 2004-11-18 | Seiko Instruments Inc | 多段熱電素子及びこれを用いた電子機器 |
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2005
- 2005-06-17 JP JP2005177970A patent/JP4951880B2/ja not_active Expired - Fee Related