JP2006351590A - Substrate with built-in microdevice, and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate with built-in microdevice, which incorporates the microdevice having a functional element that has a vibrator or a movable part in the functional face and can be miniaturized or thinned, and to provide a manufacturing method of the substrate. <P>SOLUTION: The microdevice 21 has a device substrate having the function element where the movable part or the vibrator is formed on the function face, a protection member constituting a cavity which is installed in the functional face and protects the functional face, and a projection electrode formed on the functional face side. The device is mounted on a first substrate 10 having first wiring, so that the projection electrode is connected to first wiring and the protection member is not brought into contact with the first substrate; a resin layer 27 is formed on the first substrate so that it covers the outer peripheral face of the microdevice, being embedded in a gap between the first substrate and the micro device; and the surface becomes the same height as that of the upper face of the device substrate of the microdevice. A second substrate 28 having second wiring is laminated on the resin layer and the microdevice. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a microdevice-embedded substrate and a method for manufacturing the same, and in particular, is movable on a functional surface such as a MEMS (Micro Electro Mechanical Systems), a SAW (Surface Acoustic Wave) element, or an F-BAR (Thin Film Bulk Acoustic Wave Resonators). The present invention relates to a microdevice-embedded substrate that incorporates a microdevice having a functional element having a section or a vibrator, and a manufacturing method thereof.

  In recent years, mobile devices typified by mobile phones and personal computers have been reduced in size and weight, and have increased functionality and functionality, and the components and substrates that make up these devices have been similarly reduced in size, thickness, and weight. High-density mounting is progressing. As for the mounting of devices such as semiconductors, as the mounting area is reduced and the transmission signal speed is increased, the bare chip of the device is directly mounted on the substrate by the so-called flip chip mounting technology from the mounting by the mold or the ceramic package, and sealed. Attempts have been made to stop.

  However, this flip chip direct mounting method uses, for example, a movable part or a functional part such as a MEMS (Micro Electro Mechanical Systems), a SAW (Surface Acoustic Wave) element, or an F-BAR (Thin Film Bulk Acoustic Wave Resonators). In the case of a microdevice having a vibrator, since the functional surface cannot be covered with a sealing material or the like, a package structure is adopted that is hermetically sealed using a substrate such as ceramic, metal, or glass.

  As a package structure such as MEMS, Patent Document 1 discloses a semiconductor chip in which a microdevice having a vibrator or a movable part on a functional surface is provided in a cavity in a wiring board in which an insulating layer and a wiring layer are stacked. A hydrophobic material film is formed on the inner surface of the cavity so as to cover the surface of the insulating layer exposed to the cavity and the boundary between the insulating layer and the wiring layer on the inner surface of the hollow portion, and the upper surface of the cavity is a metal film. An element-embedded substrate configured to be covered is disclosed.

  In Patent Document 2, an element is mounted in a cavity formed in a wiring board via a plurality of conductive bumps, and a gap is formed between the functional surface of the element and the inner surface of the cavity. An element mounting substrate is disclosed in which a sealing material that hermetically separates the gap and the space in the cavity other than the gap is formed around the conductive bump.

  Further, in Patent Document 3, a cutout portion that penetrates in the thickness direction is formed only in the adhesive sheet, and the core substrate is stacked and heated and pressed so as to sandwich the adhesive sheet, and bonded to one surface of the adhesive sheet. A method for forming a cavity for a device built-in, in which a portion of the core substrate that overlaps the cut-out portion is cut in the thickness direction and connected to the cut-out portion of the adhesive sheet to form a device built-in substrate cavity, and thus formed An element-embedded substrate having a structured cavity is disclosed.

However, in the structures and forming methods disclosed in Patent Documents 1 to 3, since the cavity containing the semiconductor chip needs to be considerably larger than the size of the semiconductor chip, the size of the module or semiconductor device incorporating the microdevice is required. There was a disadvantage that the thickness would increase.
JP 2004-179573 A JP 2004-31651 A JP 2004-356188 A

  An object of the present invention is to incorporate a microdevice having a functional element having a vibrator or a movable part on a functional surface such as a MEMS, SAW element, or F-BAR, and can be reduced in size and thickness. It is to provide a substrate and a manufacturing method thereof.

  In order to solve the above problems, a substrate with a built-in microdevice according to the present invention includes a first substrate having a first wiring, a device substrate having a functional element in which a movable part or a vibrator is formed on a functional surface, and the functional surface. A protective member that forms a cavity that protects the functional surface and a protruding electrode formed on the functional surface side, the protruding electrode is connected to the first wiring, and the protective member is A microdevice mounted on the first substrate so as not to contact the first substrate; an outer peripheral surface of the microdevice; a gap between the first substrate and the microdevice; A resin layer formed on the first substrate so as to be the same height as the upper surface of the device substrate, and a second wiring, and is laminated on the resin layer and the microdevice. And a second substrate.

  In the microdevice-embedded substrate of the present invention, the microdevice is mounted on the first substrate having the first wiring. Here, the micro device is formed on the functional surface side, a device substrate having a functional element in which a movable part or a vibrator is formed on the functional surface, a protective member that is provided on the functional surface and forms a cavity that protects the functional surface. The protruding electrode is mounted so that the protruding electrode is connected to the first wiring and the protective member is not in contact with the first substrate. In addition, a resin layer is formed on the first substrate so as to cover the outer peripheral surface of the micro device, to fill the gap between the first substrate and the micro device, and to have the surface flush with the upper surface of the device substrate of the micro device. The second substrate having the second wiring is laminated on the resin layer and the micro device.

  In addition, in order to solve the above-described problem, a method for manufacturing a microdevice-embedded substrate according to the present invention includes a device having a functional element in which a movable portion or a vibrator is formed on a functional surface on a first substrate having a first wiring. A microdevice having a substrate, a protective member provided on the functional surface and forming a cavity for protecting the functional surface, and a protruding electrode formed on the functional surface side, the protruding electrode serving as the first wiring Mounting so that the protective member does not contact the first substrate, covering the outer peripheral surface of the microdevice, and filling the gap between the first substrate and the microdevice, Forming a resin layer thereon, polishing the resin layer and the device substrate of the microdevice from above, and thinning the resin layer and the device substrate; A second substrate having a wiring and a step of laminating on the resin layer and the micro device.

The method for manufacturing a substrate with a built-in microdevice according to the present invention includes a device substrate having a functional element in which a movable portion or a vibrator is formed on a functional surface on a first substrate having a first wiring, and a functional surface. A micro device having a protective member constituting a cavity for protecting the functional surface and a protruding electrode formed on the functional surface side, the protruding electrode is connected to the first wiring, and the protective member is not in contact with the first substrate So that it mounts.
Next, a resin layer is formed on the first substrate by covering the outer peripheral surface of the microdevice and filling the gap between the first substrate and the microdevice.
Next, the resin layer and the device substrate of the micro device are polished from the upper surface to reduce the thickness of the resin layer and the device substrate.
Next, a second substrate having a second wiring is stacked on the resin layer and the microdevice.

  The microdevice-embedded substrate of the present invention has a microdevice having a functional element having a vibrator or a movable part on a functional surface such as a MEMS, SAW element, or F-BAR on the first substrate from the cavity side protecting the functional surface. In the mounted configuration, the resin layer on the outer periphery of the micro device and the device substrate of the micro device can be thinned by polishing, and the size and thickness can be reduced.

  In addition, the method for manufacturing a microdevice-embedded substrate according to the present invention includes polishing the resin layer and the device substrate of the microdevice from the upper surface to reduce the thickness of the resin layer and the device substrate. A microdevice-embedded substrate in which a microdevice having a functional element having a vibrator or a movable portion on the functional surface is incorporated can be manufactured in a reduced size or thickness.

  Hereinafter, a microdevice-embedded substrate and a manufacturing method thereof according to embodiments of the present invention will be described with reference to the drawings.

First Embodiment FIG. 1 is a cross-sectional view of a microdevice-embedded substrate according to the present embodiment.
It is a substrate incorporating a micro device including a functional element having a movable part or a vibrator such as a MEMS, SAW element or F-BAR.

For example, three insulating layers (11-13) made of resin or the like and four wiring layers (14-17) made of copper or the like are alternately stacked, and further, vertical wiring (18-20) connecting the wiring layers. The first substrate 10 is formed on which first wirings including four wiring layers (14 to 17) and vertical wirings (18 to 20) are formed.
Here, on one surface of the first substrate, the insulating layer 13 and the wiring layer 17 are partially removed to form a recess R.

The micro device 21 is mounted on the first substrate 10 having the above configuration.
Here, in the micro device 21, a functional element having a movable portion or a vibrator such as a MEMS, SAW element, or F-BAR is formed on a functional surface 23 of a device substrate 22 made of a semiconductor. A cap 24 made of glass or the like is bonded with an adhesive layer 25 such as a resin so as to constitute a cavity C that protects the functional surface 23, and a protective member is provided on the functional surface 23 side. A bump (projection electrode) 26 such as a bump or a solder ball bump is formed. The bump 26 is connected to the first wiring of the first substrate 10, and a protective member composed of the cap 24 and the adhesive layer 25 is provided. It is mounted so as not to contact the first substrate 10.
The cavity C constituted by the functional surface 23 of the microdevice 21 and the inner surface of the protective member is maintained in, for example, a vacuum, a reduced pressure, a reducing atmosphere, or an inert gas atmosphere.

  Here, the protective member made up of the cap 24 and the adhesive layer 25 is provided on the device substrate 22 so as to protrude from the bumps 26, but the microdevice 21 is arranged so that the protective member is inserted into the recess R of the first substrate 10. What is necessary is just to be mounted on the 1 board | substrate 10, and the protection member which consists of the cap 24 and the contact bonding layer 25 should just be comprised so that the 1st board | substrate 10 may not be contacted.

A resin layer 27 is formed on the first substrate 10 so as to cover the outer peripheral surface of the microdevice 21 and fill the gap between the first substrate 10 and the microdevice 21.
Here, in the configuration in which the concave portion R is provided in the first substrate 10 as described above and the microdevice 21 is mounted so that the protective member of the microdevice 21 is fitted into the concave portion R of the first substrate 10, the resin layer 27 is formed by filling the gap between the first substrate 10 and the micro device 21 in the recess R.

  The surfaces of the microdevice 21 and the resin layer 27 are polished, so that the surface of the resin layer 27 is flush with the upper surface of the device substrate 22 of the microdevice 21. For example, it is preferable that the thickness of the device substrate 22 and the height of the bump 26 is reduced to 200 μm or less, more preferably 100 μm or less by polishing.

Further, the second substrate 28 is laminated on the resin layer 27 and the micro device 21.
In the second substrate 28, for example, wiring layers (30, 31) made of copper or the like are formed on both surfaces of an insulating layer 29 made of resin or the like, and vertical wirings 32 connecting the wiring layers are further formed. In this configuration, the second wiring composed of the wiring layers (30, 31) and the vertical wiring 32 is formed.
As a part of the second wiring, a post (projection wiring) 33 made of copper or the like is formed on the wiring layer 30 so as to protrude, and the post 33 penetrates the resin layer 27 to form the first of the first substrate 10. Connected to wiring.

  In the microdevice-embedded substrate of the present embodiment, the microdevice having a functional element having a vibrator or a movable portion on the functional surface such as MEMS, SAW element, or F-BAR is first from the cavity side protecting the functional surface. Mounted on the substrate (flip chip mounting), it is possible to reduce the thickness by thinning the resin layer on the outer periphery of the microdevice and the device substrate of the microdevice, which can be reduced in size and thickness .

Next, a method for manufacturing a microdevice-embedded substrate according to the present embodiment will be described.
2A to 4B are cross-sectional views illustrating a method for manufacturing a microdevice-embedded substrate according to this embodiment.

First, a functional element having a movable portion or a vibrator such as a MEMS, SAW element, or F-BAR is formed on the functional surface 23 of the device substrate 22 made of semiconductor, as shown in FIG. A cap 24 made of glass or the like is bonded to the functional surface 23 with an adhesive layer 25 such as a resin so as to constitute a cavity C that protects the functional surface 23, and a protective member is provided on the functional surface 23 side. A micro device 21 having a configuration in which bumps (projection electrodes) 26 such as gold stud bumps and solder ball bumps connected to the substrate are formed separately.
This is called a zero level package. For example, functional elements are formed on the functional surface 23 of the device substrate 22 and separated into a predetermined size so as to form a cavity C that protects the functional surface. A functional surface 23 is hermetically sealed by adhering a cap 24 such as glass with an adhesive layer 25 such as resin.
By performing the above-described sealing step in a vacuum, reduced pressure, reducing atmosphere, or inert gas atmosphere, the inside of the cavity C can be maintained in a vacuum, reduced pressure, reducing atmosphere, or inert gas atmosphere.
By packaging the microdevice as described above, handling of the microdevice becomes easy.
Here, for example, in the micro device 21, a protective member including a cap 24 and an adhesive layer 25 is provided on the device substrate 22 so as to protrude from the bumps 26.

Next, as shown in FIG. 2 (a), three insulating layers (11 to 13) made of resin and four wiring layers (14 to 17) made of copper and the like are alternately laminated, and wiring is further performed. The first substrate 10 is formed by forming vertical wirings (18 to 20) connecting the layers. The first wiring of the first substrate 10 is composed of four wiring layers (14 to 17) and vertical wirings (18 to 20).
In addition, on one surface of the first substrate 10, a part of the insulating layer 13 and the wiring layer 17 is removed to form a recess R.

Next, as shown in FIG. 2B, the micro device 21 is connected to the first wiring of the first substrate 10 on the first substrate 10 having the first wiring, and the cap 24 is connected to the first wiring of the first substrate 10. The protective member made of the adhesive layer 25 is mounted by flip chip so as not to contact the first substrate 10.
In the present embodiment, a concave portion is formed on one surface of the first substrate 10 so as to correspond to the configuration in which the protective member including the cap 24 and the adhesive layer 25 protrudes from the bump 26 on the device substrate 22 as described above. R is provided, and the protection member is mounted so as to be inserted into the recess R.

Next, as shown in FIG. 3A, an uncured resin layer 27 b is formed on the first substrate 10 by covering the outer peripheral surface of the microdevice 21 and filling the gap between the first substrate 10 and the microdevice 21. To do. In the present embodiment, the resin layer 27b is formed so as to fill the gap between the first substrate 10 and the microdevice 21 in the recess R.
As the above-mentioned uncured resin layer, it is completely cured to the extent that it maintains its own shape by impregnating various kinds of resin such as epoxy resin into woven fabric such as carbon fiber or glass fiber or unidirectionally aligned fiber called prepreg A resin-impregnated sheet formed into a sheet shape without using it is used.
For example, a prepreg in which a portion corresponding to a micro device is cut out in advance is pasted and molded, and the prepreg enters a gap between the first substrate and a protective member such as a micro device and a cap to obtain a more airtight structure. Here, the thickness of the prepreg is desirably slightly thicker than the thickness of the microdevice, for example, about 300 to 400 μm.
Since the cavity that protects the functional surface of the microdevice is double-protected by the protective member and the resin layer as described above, the hermetic sealing ability of the functional surface can be enhanced.

Next, as illustrated in FIG. 3B, the resin layer 27 b and the device substrate 22 of the micro device 21 are polished from the upper surface, and the resin layer 27 b and the device substrate 22 are thinned.
For example, polishing is preferably performed so that the sum of the thickness of the device substrate 22 and the height of the bump 26 is 200 μm or less, and more preferably 100 μm or less.

Next, as shown in FIG. 4A, for example, wiring layers (30, 31) made of copper or the like are formed on both surfaces of an insulating layer 29 made of resin or the like, and vertical wiring that connects the wiring layers. The second substrate 28 having the structure in which the second wiring composed of the wiring layers (30, 31) and the vertical wiring 32 is formed is laminated from the resin layer 27b and the device substrate 22 side.
Here, as part of the second wiring, a post (projection wiring) 33 made of copper or the like is formed on the wiring layer 30 so as to protrude.

As a result of laminating the second substrate as described above, as shown in FIG. 4B, the post 33 penetrates the uncured resin layer 27b and is connected to the first wiring of the first substrate 10, Laminate.
After the second substrate 28 is laminated, the uncured resin layer 27b is cured to form a cured resin layer 27 as shown in FIG.
By laminating the second substrate on which posts such as copper are previously formed as described above, it is possible to form a wiring (via) for connecting the first wiring and the second wiring together with the substrate molding. As described above, it is possible to make the resin layer 27 as the interlayer thickness thin by allowing the post such as copper to penetrate through the base material and electrically connect it.

  The manufacturing method of the substrate with a built-in microdevice according to the present embodiment has a function such as MEMS, SAW element or F-BAR by polishing the resin layer and the device substrate of the microdevice from the upper surface to reduce the thickness of the resin layer and the device substrate. A microdevice-embedded substrate in which a microdevice having a functional element having a vibrator or a movable portion on the surface is incorporated can be manufactured in a reduced size or a reduced thickness.

  In this embodiment, the degree of freedom in designing the post that becomes the wiring connecting the first substrate and the second substrate is increased, the post can be formed with a diameter of 0.1 mm or less, and the mounting area can be widened with the substrate of the same size. This makes it possible to reduce the size of the product.

In addition, the microdevice-embedded substrate can be made smaller and thinner by incorporating the microdevice into the substrate, thinning the substrate, and reducing the diameter of the post serving as the wiring between the substrates.
Moreover, sealing and wiring formation between the substrates can be performed at the same time as the substrate lamination molding process, and the process can be shortened.

  In the present embodiment, a method of manufacturing one microdevice-embedded substrate is illustrated and described. However, a workpiece made of an assembly (substrate) on which a plurality of identical pieces are arranged is handled and collectively manufactured. Is possible. In this case, after laminating the first substrate, the micro device, the resin layer and the second substrate, it is divided into individual modules by die molding or dicing, etc. After mounting the surface mount component, it may be divided.

Second Embodiment FIG. 5 is a cross-sectional view of a microdevice-embedded substrate according to this embodiment.
As in the first embodiment shown in FIG. 1, a post (as a part of the second wiring of the second substrate 28 is connected so as to connect the first wiring of the first substrate 10 and the second wiring of the second substrate 28. Instead of the formation of the projecting wiring, an opening hole V penetrating the second substrate 28 and the resin layer 27 is formed, and a conductor is embedded in the opening hole V so that the first wiring and the second wiring are formed. The difference is that a plug 34 for connecting the wiring is formed.
Other than the above, it is substantially the same as the substrate with a built-in microdevice of the first embodiment.

Next, a method for manufacturing a microdevice-embedded substrate according to the present embodiment will be described.
6A to 7B are cross-sectional views illustrating a method for manufacturing a microdevice-embedded substrate according to this embodiment.

  First, in the same manner as in the first embodiment, the microdevice 21 is mounted on the first substrate 10 by flip chip, and the uncured resin layer 27b is formed on the first substrate 10 at the outer periphery thereof.

  Next, as shown in FIG. 6A, the uncured resin layer 27 b is cured to obtain a cured resin layer 27.

Next, as shown in FIG. 6B, the cured resin layer 27 and the device substrate 22 of the microdevice 21 are polished from the upper surface, and the resin layer 27 and the device substrate 22 are thinned.
For example, polishing is preferably performed so that the sum of the thickness of the device substrate 22 and the height of the bump 26 is 200 μm or less, and more preferably 100 μm or less.

  Next, as shown in FIG. 7A, for example, wiring layers (30, 31) made of copper or the like are formed on both surfaces of an insulating layer 29 made of resin or the like, and a vertical wiring connecting the wiring layers. A second substrate 28 having a configuration in which a second wiring composed of a wiring layer (30, 31) and a vertical wiring 32 is formed is laminated from the resin layer 27 and the device substrate 22 side.

Next, as shown in FIG. 7B, etching processing such as resist film pattern formation and anisotropic etching by a photolithography process is performed, and the second substrate 28 is connected at a position where the first substrate and the second substrate are connected. And the opening hole V which penetrates the resin layer 27 is formed. Here, an etching stopper can be formed on the surface of the wiring layer 17 so as to stop the etching on the surface of the wiring layer 17 of the first substrate.
Further, the opening V is filled with a conductor, and a plug wiring connected to the first wiring of the first substrate 10 is formed as a part of the second wiring of the second substrate 28 to obtain the configuration shown in FIG.
In the formation of the plug wiring by forming the above opening holes, the resin layer 27 which is the interlayer thickness is made thin so that the connection can be made with the opening holes having a small diameter.

  The manufacturing method of the substrate with a built-in microdevice according to the present embodiment has a function such as MEMS, SAW element or F-BAR by polishing the resin layer and the device substrate of the microdevice from the upper surface to reduce the thickness of the resin layer and the device substrate. A microdevice-embedded substrate in which a microdevice having a functional element having a vibrator or a movable portion on the surface is incorporated can be manufactured in a reduced size or a reduced thickness.

Third Embodiment In the above embodiment, MEMS is shown as a micro device having a functional element having a vibrator or a movable part on the functional surface in the drawing. However, the present invention is not limited to this, and for example, F having a structure shown in FIG. -You may make it incorporate the microdevice provided with BAR, a SAW element, etc.
FIG. 8 is a schematic cross-sectional view illustrating an exemplary configuration of the F-BAR.
For example, the device substrate 40 is formed with an elastic resonance film composed of a laminate of the lower electrode 42, the piezoelectric film 43, and the upper electrode 44 via a gap 41 that constitutes a predetermined resonance region.
The lower electrode 42 and the upper electrode 44 are made of, for example, a conductive material such as Al, Pt, Au, Cu, W, Mo, Ti, and are formed with a film thickness of 0.1 to 0.5 μm, for example.
The piezoelectric film 43 is made of a piezoelectric material such as aluminum nitride or zinc oxide, is a dense film highly oriented in the c-axis, and has excellent piezoelectric characteristics and elastic characteristics. It is formed with a film thickness of 5 μm or less.
The gap 41 is supported by a leg formed by bending at the end of the lower electrode 42, and the height of the gap 41 is, for example, about several μm.
The film thickness of the lower electrode 42, the upper electrode 44, and the piezoelectric film 43, the height of the gap 41, and the like can be appropriately adjusted according to the resonance frequency.

According to the present invention, by making the layer in which the device is built in the substrate thin, through connection by a post (projection wiring) is possible, cost can be reduced by shortening the process, and the first wiring and the second wiring are connected. The wiring (via) to be performed can be designed at random, and the degree of freedom in board design is increased.
By polishing and thinning the substrate, the thickness of the microdevice built-in substrate itself can be reduced, and a product using the microdevice built-in substrate can be thinned.
By incorporating the microdevice into the substrate and reducing the diameter of the wiring between the substrates, the mounting area can be increased, and the product using the microdevice-embedded substrate can be downsized.
By carrying out the hollow package of the device simultaneously with the lamination of the substrates, the process can be shortened and the cost can be reduced.

The present invention is not limited to the above embodiment.
For example, a semiconductor device including a micro device having a functional element such as a SAW element or F-BAR in addition to the MEMS can be used.
The number of layers in which the resin layer and the wiring are laminated is not limited to the embodiment, and may be any number.
An image receiving element such as a capacitance element, an inductance, or an electric resistance element can be appropriately incorporated in the substrate. Further, a semiconductor chip on which an active element such as a transistor is formed can be appropriately incorporated.
In addition, various modifications can be made without departing from the scope of the present invention.

The substrate with a built-in micro device of the present invention can be applied to a substrate with a built-in micro device in which a micro device having a movable part or a vibrator on a functional surface such as a MEMS, SAW element, or F-BAR is built.
The method for manufacturing a substrate with a built-in microdevice of the present invention can be applied to a method for manufacturing a substrate with a built-in microdevice having a movable part or a vibrator on a functional surface such as a MEMS, SAW element, or F-BAR.

FIG. 1 is a schematic cross-sectional view of a microdevice-embedded substrate according to a first embodiment of the present invention. FIGS. 2A and 2B are schematic cross-sectional views showing manufacturing steps of the microdevice-embedded substrate according to the first embodiment of the present invention. FIGS. 3A and 3B are schematic cross-sectional views showing manufacturing steps of the microdevice-embedded substrate according to the first embodiment of the present invention. 4 (a) and 4 (b) are schematic cross-sectional views showing manufacturing steps of the microdevice-embedded substrate according to the first embodiment of the present invention. FIG. 5 is a schematic cross-sectional view of a microdevice built-in substrate according to a second embodiment of the present invention. FIG. 6A and FIG. 6B are schematic cross-sectional views showing the manufacturing process of the microdevice-embedded substrate according to the second embodiment of the present invention. FIG. 7A and FIG. 7B are schematic cross-sectional views showing manufacturing steps of the microdevice-embedded substrate according to the second embodiment of the present invention. FIG. 8 is a schematic cross-sectional view of the F-BAR included in the microdevice of the microdevice-embedded substrate according to the third embodiment of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... 1st board | substrate, 11-13 ... Insulating layer, 14-17 ... Wiring layer, 18-20 ... Vertical wiring, 21 ... Microdevice, 22 ... Device board | substrate, 23 ... Functional surface, 24 ... Cap, 25 ... Adhesion layer , 26 ... bumps, 27 ... resin layer, 28 ... second substrate, 29 ... insulating layer, 30, 31 ... wiring layer, 32 ... vertical wiring, 33 ... post (projection wiring), 34 ... plug, 40 ... device substrate, 41 ... Void, 42 ... Lower electrode, 43 ... Piezoelectric film, 44 ... Upper electrode, C ... Cavity, R ... Recess, V ... Open hole

Claims (10)

A first substrate having a first wiring;
A device substrate having a functional element in which a movable part or a vibrator is formed on a functional surface, a protective member that is provided on the functional surface and forms a cavity that protects the functional surface, and a protrusion formed on the functional surface side A micro device mounted on the first substrate so that the protruding electrode is connected to the first wiring and the protective member is not in contact with the first substrate;
A resin formed on the first substrate so as to cover an outer peripheral surface of the microdevice, fill a gap between the first substrate and the microdevice, and have a surface flush with the upper surface of the device substrate of the microdevice. Layers,
A microdevice-embedded substrate having a second wiring and having a second substrate laminated on the resin layer and the microdevice. The protective member is provided on the device substrate so as to protrude from the protruding electrode,
A recess is formed in the first substrate;
The microdevice is mounted on the first substrate so that the protective member fits into the recess;
The microdevice-embedded substrate according to claim 1, wherein the resin layer is formed by filling a gap between the first substrate and the microdevice in the recess. The microdevice-embedded substrate according to claim 1, wherein a sum of a thickness of the device substrate and a height of the protruding electrode is 200 μm or less. The microdevice-embedded substrate according to claim 1, wherein a part of the second wiring penetrates the resin layer and is connected to the first wiring. The microdevice-embedded substrate according to claim 4, wherein a part of the second wiring is formed so as to penetrate the second substrate and the resin layer. A protective substrate that forms a device substrate having a functional element having a movable portion or a vibrator formed on a functional surface on a first substrate having a first wiring, and a cavity provided on the functional surface to protect the functional surface Mounting a micro device having a protruding electrode formed on the functional surface side so that the protruding electrode is connected to the first wiring and the protective member is not in contact with the first substrate; ,
Covering a peripheral surface of the microdevice, filling a gap between the first substrate and the microdevice, and forming a resin layer on the first substrate;
Polishing the resin layer and the device substrate of the microdevice from above to thin the resin layer and the device substrate;
And a step of laminating a second substrate having a second wiring on the resin layer and the microdevice. Using the microdevice provided with the protective member protruding from the protruding electrode on the device substrate as the microdevice,
Using a substrate having a recess formed as the first substrate,
In the step of mounting the microdevice on the first substrate, the protection member is mounted so as to fit into the recess,
The method for manufacturing a microdevice-embedded substrate according to claim 6, wherein in the step of forming the resin layer, a gap is formed between the first substrate and the microdevice in the recess. 7. The microdevice-embedded substrate according to claim 6, wherein in the step of thinning the resin layer and the device substrate, polishing is performed so that a sum of a thickness of the device substrate and a height of the protruding electrode is 200 μm or less. Production method. Using a second substrate on which a protruding wiring having a height corresponding to the thickness of the resin layer is formed as a part of the second wiring,
In the step of forming the resin layer, an uncured resin layer is formed,
In the step of laminating the second substrate, the protruding wiring is laminated so as to penetrate the resin layer and connect to the first wiring,
The method for manufacturing a microdevice-embedded substrate according to claim 6, further comprising a step of curing the resin layer after the step of laminating the second substrate. Further comprising the step of curing the resin layer between the step of forming the resin layer and the step of thinning the resin layer and the device substrate;
After the step of laminating the second substrate, a step of forming an opening through the second substrate and the resin layer, and filling the opening with a conductor to form part of the second wiring The method for manufacturing a microdevice-embedded substrate according to claim 6, further comprising: forming a wiring connected to the wiring.

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