JP2006346848A5 - - Google Patents
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- Publication number
- JP2006346848A5 JP2006346848A5 JP2005206186A JP2005206186A JP2006346848A5 JP 2006346848 A5 JP2006346848 A5 JP 2006346848A5 JP 2005206186 A JP2005206186 A JP 2005206186A JP 2005206186 A JP2005206186 A JP 2005206186A JP 2006346848 A5 JP2006346848 A5 JP 2006346848A5
- Authority
- JP
- Japan
- Prior art keywords
- wire
- ultrasonic
- saw device
- groove
- roller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000006061 abrasive grain Substances 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000002002 slurry Substances 0.000 claims 1
- 238000004804 winding Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005206186A JP2006346848A (ja) | 2005-06-17 | 2005-06-17 | 超音波ワイヤソー装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005206186A JP2006346848A (ja) | 2005-06-17 | 2005-06-17 | 超音波ワイヤソー装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006346848A JP2006346848A (ja) | 2006-12-28 |
| JP2006346848A5 true JP2006346848A5 (cg-RX-API-DMAC7.html) | 2008-10-30 |
Family
ID=37643211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005206186A Pending JP2006346848A (ja) | 2005-06-17 | 2005-06-17 | 超音波ワイヤソー装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2006346848A (cg-RX-API-DMAC7.html) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102007019566B4 (de) * | 2007-04-25 | 2012-11-29 | Siltronic Ag | Drahtführungsrolle für Drahtsäge |
| JP5335322B2 (ja) * | 2007-08-27 | 2013-11-06 | 一正 大西 | 環状の切削ブレードを備えた回転切削装置 |
| JP2012045682A (ja) * | 2010-08-27 | 2012-03-08 | Tokuriki Honten Co Ltd | 固定砥粒ワイヤーソー装置 |
| CN102744794A (zh) * | 2011-04-01 | 2012-10-24 | 江苏省惠山中等专业学校 | 一种双片独立式的导线轮 |
| CN102284970B (zh) * | 2011-08-02 | 2013-03-13 | 浙江大学 | 非金属材料多丝线切割用的旋转超声换能器 |
| DE102011084454B3 (de) * | 2011-10-13 | 2013-01-17 | Solarworld Innovations Gmbh | Drahtführungsrolle |
| CN105171926B (zh) * | 2015-07-23 | 2017-03-29 | 厦门大学 | 一种单点金刚石切削刀具的振动辅助装置 |
| JP7070311B2 (ja) * | 2018-10-10 | 2022-05-18 | 株式会社デンソー | 切断装置 |
| CN115447001A (zh) * | 2022-10-10 | 2022-12-09 | 烟台力凯数控科技有限公司 | 一种应用于多线切割装备的超声导轮装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6367062U (cg-RX-API-DMAC7.html) * | 1986-10-22 | 1988-05-06 | ||
| JP3325676B2 (ja) * | 1993-11-29 | 2002-09-17 | シャープ株式会社 | シリコンインゴットのスライス加工方法 |
| US5609148A (en) * | 1995-03-31 | 1997-03-11 | Siemens Aktiengesellschaft | Method and apparatus for dicing semiconductor wafers |
| JPH1177510A (ja) * | 1997-09-05 | 1999-03-23 | Tokyo Seimitsu Co Ltd | 固定砥粒ワイヤソー及びその被加工物切断方法 |
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2005
- 2005-06-17 JP JP2005206186A patent/JP2006346848A/ja active Pending