JP2006332306A - Composite component - Google Patents

Composite component Download PDF

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Publication number
JP2006332306A
JP2006332306A JP2005153484A JP2005153484A JP2006332306A JP 2006332306 A JP2006332306 A JP 2006332306A JP 2005153484 A JP2005153484 A JP 2005153484A JP 2005153484 A JP2005153484 A JP 2005153484A JP 2006332306 A JP2006332306 A JP 2006332306A
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JP
Japan
Prior art keywords
graphite sheet
multilayer device
electrode
heat generating
mounting
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JP2005153484A
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Japanese (ja)
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JP4635718B2 (en
Inventor
Minoru Ouchi
実 大内
Norihiro Kawamura
典裕 河村
Kazuhiko Kubo
和彦 久保
Hidefumi Sasaki
英文 佐々木
Masashi Senba
正志 船場
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Priority to JP2005153484A priority Critical patent/JP4635718B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate

Abstract

<P>PROBLEM TO BE SOLVED: To improve the productivity of a composite component wherein a multilayer device with a heat generating electronic component provided thereon is integrated with a graphite sheet. <P>SOLUTION: The composite component is provided with: the multilayer device 1 wherein a predetermined electronic circuit is formed in the inner layer, and upper surface electrodes 4a, 4b electrically connected to the electronic circuit are provided on the upper surface thereof; a heat generating electronic component 6 having mounting electrodes 5a, 5b connected to the upper surface electrodes 4a, 4b mounted on the multilayer device 1; and a graphite sheet 7 provided at least in a region excluding the connecting part of the upper surface electrodes 4a, 4b and the mounting electrodes 5a, 5b on the upper surface of the multilayer device 1. In such a composite component, an insulating layer 8 is provided on an end surface positioned at least near the connecting part of the upper surface electrodes 4a, 4b and the mounting electrodes 5a, 5b in the graphite sheet 7. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、発熱電子部品が設けられた多層デバイスにグラファイトシートを一体化した複合部品に関する。   The present invention relates to a composite part in which a graphite sheet is integrated with a multilayer device provided with a heat generating electronic part.

近年、携帯電話などの電子機器にみられるように、電子機器の小型高機能化が進められており、このような電子機器を構成する各種電子部品においては、関連する電子部品の複合化が進められている。   In recent years, as seen in electronic devices such as mobile phones, electronic devices have been reduced in size and functionality, and in various electronic components that make up such electronic devices, related electronic components have become more complex. It has been.

そして、このような電子部品の複合化においては、例えば携帯電話であればその高周波ブロックを形成する高周波フィルタなどの多層デバイスで構成され、これに対してその後段に配置される発熱電子部品であるパワーアンプを複合化する形態などが考えられる。   And in such a composite of electronic components, for example, if it is a mobile phone, it is composed of a multilayer device such as a high-frequency filter that forms the high-frequency block, and is a heat generating electronic component that is arranged in the subsequent stage. A form in which the power amplifier is combined can be considered.

このような場合、多層デバイスが実質的に発熱電子部品のヒートシンクとして作用するため、発熱部品に生じる熱を効率よく多層デバイス内に分散させる必要が生じることから、従来、多層デバイスの上面にグラファイトシートを貼り付け、発熱電子部品による熱をすばやく多層デバイス上面の面内方向に拡散させることでその放熱効率を高めることができる。   In such a case, since the multilayer device substantially acts as a heat sink for the heat generating electronic component, it is necessary to efficiently dissipate the heat generated in the heat generating component in the multilayer device. The heat dissipation efficiency can be increased by quickly spreading the heat generated by the heat generating electronic component in the in-plane direction of the upper surface of the multilayer device.

なお、この出願の発明に関する先行技術文献情報としては、例えば、特許文献１が知られている。
特開平１０−３３０１７７号公報 As prior art document information relating to the invention of this application, for example, Patent Document 1 is known.
Japanese Patent Laid-Open No. 10-3301177

しかしながら、グラファイトシートは炭素を用いた構造であるため、シートの面内方向における熱伝導性に優れる反面、シート端面においては炭素が露出し、電気絶縁性が低くなってしまうため、グラファイトシートに近接する発熱電子部品の実装電極などとショートしてしまうという恐れがあるため、発熱部品を実装する際に注意を払わなければならなかった。   However, since the graphite sheet has a structure using carbon, it has excellent thermal conductivity in the in-plane direction of the sheet, while carbon is exposed at the sheet end surface, resulting in low electrical insulation, and therefore close to the graphite sheet. Therefore, care must be taken when mounting the heat generating component because there is a risk of short circuiting with the mounting electrode of the heat generating electronic component.

そこで本発明は、このような問題を解決し、発熱電子部品が設けられた多層デバイスにグラファイトシートを一体化した複合部品の生産性を高めることを目的とする。   SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve such problems and increase the productivity of composite parts in which a graphite sheet is integrated with a multilayer device provided with heat generating electronic parts.

そしてこの目的を達成するために本発明は、発熱電子部品が設けられた多層デバイスにグラファイトシートを一体化した複合部品において、多層デバイスに設けた表面電極と発熱電子部品に設けた実装電極との接続部分の近傍に位置するグラファイトシートの端面に絶縁層を設けた構造としたのである。   In order to achieve this object, the present invention provides a composite component in which a graphite sheet is integrated with a multilayer device provided with a heat generating electronic component, and includes a surface electrode provided on the multilayer device and a mounting electrode provided on the heat generating electronic component. This is a structure in which an insulating layer is provided on the end face of the graphite sheet located in the vicinity of the connecting portion.

この構成により、グラファイトシートの端面部分と上面電極や実装電極とのショートが抑制でき、結果として発熱電子部品が設けられた多層デバイスにグラファイトシートを一体化した複合部品の生産性を高めることができるのである。   With this configuration, it is possible to suppress a short circuit between the end surface portion of the graphite sheet and the upper surface electrode and the mounting electrode, and as a result, it is possible to increase the productivity of a composite part in which the graphite sheet is integrated with the multilayer device provided with the heat generating electronic parts. It is.

以下、本発明の一実施形態について図を用いて説明する。   Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

図１は、発熱電子部品が実装された多層デバイスにグラファイトシートを一体化した複合部品の断面を模式的に示したものである。   FIG. 1 schematically shows a cross-section of a composite part in which a graphite sheet is integrated with a multilayer device on which heat-generating electronic parts are mounted.

多層デバイス１は、誘電体、圧電体、磁性体などの絶縁性セラミックから成る成形体の内層部分において、インダクタやコンデンサを構成する内部電極２により所定の電子回路を形成し、その上面に内部電極２と電気的に接続された上面電極４ａ、４ｂを有する構造となっている。なお、多層デバイスの下面には、基板に接続される外部接続電極３が設けられている。   In the multilayer device 1, a predetermined electronic circuit is formed by an internal electrode 2 constituting an inductor or a capacitor in an inner layer portion of a molded body made of an insulating ceramic such as a dielectric material, a piezoelectric material, and a magnetic material, and an internal electrode is formed on the upper surface thereof. 2 has upper surface electrodes 4 a and 4 b electrically connected to each other. An external connection electrode 3 connected to the substrate is provided on the lower surface of the multilayer device.

また、この多層デバイス１上には、上面電極４とはんだ９を介して接続される実装電極５ａ、５ｂを下面に有する発熱電子部品６が実装されており、この実装領域を含む多層デバイス１の上面における上面電極４と実装電極５の接続部分を除く領域にグラファイトシート７が設けられており、発熱電子部品から生じる熱を、グラファイトシートを介してすばやく多層デバイスの上面の面内方向に拡散させ、実質的に発熱電子部品のヒートシンクとなる多層デバイスへの熱伝導性を高め、その放熱特性を向上させた構成としている。   On the multilayer device 1, a heat generating electronic component 6 having mounting electrodes 5a and 5b connected to the upper surface electrode 4 via the solder 9 on the lower surface is mounted. A graphite sheet 7 is provided in a region on the upper surface excluding the connection portion between the upper electrode 4 and the mounting electrode 5, and heat generated from the heat generating electronic component is quickly diffused in the in-plane direction of the upper surface of the multilayer device through the graphite sheet. The heat conductivity to the multilayer device that substantially becomes the heat sink of the heat generating electronic component is increased, and the heat dissipation characteristic is improved.

なお、グラファイトシート７はポリイミドなどの有機樹脂シートを１２００度以上の温度で炭化させ、その後、２６００度以上の温度でグラファイト化し形成されたもので、図２に示されるように炭素が二次元的に密に結合した炭素層の多層構造体であり、炭素の結合面内、つまりグラファイトシート７の面内方向に高い熱伝導特性を示すものである。   The graphite sheet 7 is formed by carbonizing an organic resin sheet such as polyimide at a temperature of 1200 ° C. or higher and then graphitizing at a temperature of 2600 ° C. or higher. As shown in FIG. 2, the carbon is two-dimensionally formed. Is a multi-layered structure of carbon layers tightly bonded to each other, and exhibits high thermal conductivity in the bonding plane of carbon, that is, in the in-plane direction of the graphite sheet 7.

しかしながらグラファイトシートの面内方向において炭素が結合した構成であるため、この面内方向における熱伝導性が高いものとなる一方、炭素自体が電気導通性を有するため、この図１に示される複合部品においては上面電極４ａと実装電極５ａとの接続部分と上面電極４ｂと実装電極５ｂとの接続部分において双方の近傍に位置するグラファイトシート７の端面は炭素が露出し、この上面電極４や実装電極５とショートしてしまう恐れがある。   However, since the carbon is bonded in the in-plane direction of the graphite sheet, the thermal conductivity in the in-plane direction is high, while the carbon itself has electric conductivity, so that the composite part shown in FIG. In FIG. 4, carbon is exposed at the end face of the graphite sheet 7 located in the vicinity of the connection portion between the upper surface electrode 4a and the mounting electrode 5a and the connection portion between the upper surface electrode 4b and the mounting electrode 5b. There is a risk of shorting with 5.

そこでこの複合部品においては、この上面電極４と実装電極５との接続部分の近傍に位置するグラファイトシート７の端面に絶縁層８を設けた構成としている。   In view of this, the composite part has a configuration in which an insulating layer 8 is provided on the end surface of the graphite sheet 7 located in the vicinity of the connection portion between the upper surface electrode 4 and the mounting electrode 5.

この構成により、電気導通性を有する炭素がグラファイトシートの端面から露出することを防止できるので、この発熱電子部品６を多層デバイス１へ実装する作業が容易になり、発熱電子部品６が設けられた多層デバイス１にグラファイトシート７を一体化した複合部品の生産性を高めることができるのである。   With this configuration, it is possible to prevent the electrically conductive carbon from being exposed from the end face of the graphite sheet. Therefore, the operation of mounting the heat generating electronic component 6 on the multilayer device 1 is facilitated, and the heat generating electronic component 6 is provided. Productivity of composite parts in which the multilayer sheet 1 is integrated with the graphite sheet 7 can be increased.

なお、絶縁層８としては、絶縁性樹脂などの絶縁性を有する材料であれば同じ効果を得る。   As the insulating layer 8, the same effect can be obtained as long as it is an insulating material such as an insulating resin.

なお、発熱電子部品６に隣接したグラファイトシート７の端面を確実に絶縁層８で覆うために、グラファイトシート７の端面に加えて端面周囲の上面、下面も絶縁層８で覆ってもよい。   In order to reliably cover the end face of the graphite sheet 7 adjacent to the heat generating electronic component 6 with the insulating layer 8, the upper and lower surfaces around the end face may be covered with the insulating layer 8 in addition to the end face of the graphite sheet 7.

本発明は、発熱電子部品が設けられた多層デバイスにグラファイトシートを一体化した複合部品に関し、グラファイトシートと上面電極や実装電極とのショートが抑制でき、複合部品の生産性を高められるという効果を有し、特に小型高機能化の進む電子機器に用いられる複合部品として有用である。   The present invention relates to a composite part in which a graphite sheet is integrated with a multilayer device provided with a heat generating electronic part, and the short circuit between the graphite sheet and the upper surface electrode and the mounting electrode can be suppressed, and the productivity of the composite part can be improved. In particular, it is useful as a composite part used in electronic devices that are becoming smaller and more functional.

本発明の一実施形態における複合部品の断面図Sectional drawing of the composite component in one Embodiment of this invention 複合部品に実装するグラファイトシートの構造を示す模式図Schematic diagram showing the structure of a graphite sheet mounted on a composite part

符号の説明Explanation of symbols

１ 多層デバイス
２ 内部電極
３ 外部接続電極
４ａ 上面電極
４ｂ 上面電極
５ａ 実装電極
５ｂ 実装電極
６ 発熱電子部品
７ グラファイトシート
８ 絶縁層
９ はんだ DESCRIPTION OF SYMBOLS 1 Multilayer device 2 Internal electrode 3 External connection electrode 4a Upper surface electrode 4b Upper surface electrode 5a Mounting electrode 5b Mounting electrode 6 Heating electronic component 7 Graphite sheet 8 Insulating layer 9 Solder

Claims (1)

内層部分に所定の電子回路が形成され、上面に前記電子回路と電気的に接続された上面電極を有する多層デバイスと、前記多層デバイス上に実装され前記上面電極と接続される実装電極を有する発熱電子部品と、前記多層デバイスの上面において少なくとも前記上面電極と前記実装電極の接続部分を除く領域に設けられたグラファイトシートとを備えた複合部品において、前記グラファイトシートにおける少なくとも前記上面電極と前記実装電極の接続部分の近傍に位置する端面に絶縁層を設けたことを特徴とする複合部品。 A multilayer electronic device having a predetermined electronic circuit formed on an inner layer portion and having an upper surface electrode electrically connected to the electronic circuit on an upper surface, and heat generation having a mounting electrode mounted on the multilayer device and connected to the upper surface electrode In a composite part comprising an electronic component and a graphite sheet provided in a region excluding at least the upper surface electrode and the connection portion of the mounting electrode on the upper surface of the multilayer device, at least the upper surface electrode and the mounting electrode in the graphite sheet A composite part characterized in that an insulating layer is provided on an end face located in the vicinity of the connecting portion.
JP2005153484A 2005-05-26 2005-05-26 Composite parts Expired - Fee Related JP4635718B2 (en)

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JP4635718B2 JP4635718B2 (en) 2011-02-23

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003273275A (en) * 2002-03-19 2003-09-26 Matsushita Electric Ind Co Ltd High-frequency composite component
JP2004023066A (en) * 2002-06-20 2004-01-22 Sony Corp Metal-graphite sheet composite and electronic apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003273275A (en) * 2002-03-19 2003-09-26 Matsushita Electric Ind Co Ltd High-frequency composite component
JP2004023066A (en) * 2002-06-20 2004-01-22 Sony Corp Metal-graphite sheet composite and electronic apparatus

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