JP2006324598A5 - - Google Patents

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Publication number
JP2006324598A5
JP2006324598A5 JP2005148425A JP2005148425A JP2006324598A5 JP 2006324598 A5 JP2006324598 A5 JP 2006324598A5 JP 2005148425 A JP2005148425 A JP 2005148425A JP 2005148425 A JP2005148425 A JP 2005148425A JP 2006324598 A5 JP2006324598 A5 JP 2006324598A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005148425A
Other languages
Japanese (ja)
Other versions
JP4397349B2 (ja
JP2006324598A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005148425A priority Critical patent/JP4397349B2/ja
Priority claimed from JP2005148425A external-priority patent/JP4397349B2/ja
Priority to TW095112349A priority patent/TW200735233A/zh
Priority to KR1020060038587A priority patent/KR100741740B1/ko
Publication of JP2006324598A publication Critical patent/JP2006324598A/ja
Publication of JP2006324598A5 publication Critical patent/JP2006324598A5/ja
Application granted granted Critical
Publication of JP4397349B2 publication Critical patent/JP4397349B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2005148425A 2005-05-20 2005-05-20 チップボンディング装置 Active JP4397349B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005148425A JP4397349B2 (ja) 2005-05-20 2005-05-20 チップボンディング装置
TW095112349A TW200735233A (en) 2005-05-20 2006-04-07 Bonding device for chip
KR1020060038587A KR100741740B1 (ko) 2005-05-20 2006-04-28 칩 본딩 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005148425A JP4397349B2 (ja) 2005-05-20 2005-05-20 チップボンディング装置

Publications (3)

Publication Number Publication Date
JP2006324598A JP2006324598A (ja) 2006-11-30
JP2006324598A5 true JP2006324598A5 (pl) 2007-09-13
JP4397349B2 JP4397349B2 (ja) 2010-01-13

Family

ID=37544022

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005148425A Active JP4397349B2 (ja) 2005-05-20 2005-05-20 チップボンディング装置

Country Status (3)

Country Link
JP (1) JP4397349B2 (pl)
KR (1) KR100741740B1 (pl)
TW (1) TW200735233A (pl)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5468313B2 (ja) * 2009-06-08 2014-04-09 Ｊｕｋｉ株式会社 部品実装装置
JP4897033B2 (ja) * 2009-12-01 2012-03-14 キヤノンマシナリー株式会社 半導体製造装置
JP2013026267A (ja) * 2011-07-15 2013-02-04 Hitachi High-Tech Instruments Co Ltd ２軸駆動機構及びダイボンダ並びにダイボンダの運転方法
JP2013026268A (ja) * 2011-07-15 2013-02-04 Hitachi High-Tech Instruments Co Ltd ２軸駆動機構及びダイボンダ
JP5705052B2 (ja) * 2011-07-26 2015-04-22 株式会社新川 ダイボンディング装置
JP5997448B2 (ja) * 2012-01-31 2016-09-28 ファスフォードテクノロジ株式会社 ダイボンダ及びボンディング方法
JP5941705B2 (ja) * 2012-02-29 2016-06-29 ファスフォードテクノロジ株式会社 ２軸駆動機構及びダイボンダ
TWI734434B (zh) * 2019-04-11 2021-07-21 日商新川股份有限公司 接合裝置
TWI784622B (zh) * 2020-08-12 2022-11-21 日商捷進科技有限公司 黏晶裝置及半導體裝置的製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH691719A5 (fr) 1997-04-11 2001-09-14 Etel Sa Table X-Y pour déplacer une charge, telle qu'un outil, selon deux directions perpendiculaires.

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