TW200735233A - Bonding device for chip - Google Patents

Bonding device for chip

Info

Publication number
TW200735233A
TW200735233A TW095112349A TW95112349A TW200735233A TW 200735233 A TW200735233 A TW 200735233A TW 095112349 A TW095112349 A TW 095112349A TW 95112349 A TW95112349 A TW 95112349A TW 200735233 A TW200735233 A TW 200735233A
Authority
TW
Taiwan
Prior art keywords
driving
motor
platform
axis
bonding device
Prior art date
Application number
TW095112349A
Other languages
English (en)
Other versions
TWI334627B (zh
Inventor
Osamu Sumiya
Masato Tsuji
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW200735233A publication Critical patent/TW200735233A/zh
Application granted granted Critical
Publication of TWI334627B publication Critical patent/TWI334627B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/40—Details of apparatuses used for either manufacturing connectors or connecting the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW095112349A 2005-05-20 2006-04-07 Bonding device for chip TW200735233A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005148425A JP4397349B2 (ja) 2005-05-20 2005-05-20 チップボンディング装置

Publications (2)

Publication Number Publication Date
TW200735233A true TW200735233A (en) 2007-09-16
TWI334627B TWI334627B (zh) 2010-12-11

Family

ID=37544022

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095112349A TW200735233A (en) 2005-05-20 2006-04-07 Bonding device for chip

Country Status (3)

Country Link
JP (1) JP4397349B2 (zh)
KR (1) KR100741740B1 (zh)
TW (1) TW200735233A (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102097350A (zh) * 2009-12-01 2011-06-15 佳能机械株式会社 结合装置
CN102881614A (zh) * 2011-07-15 2013-01-16 株式会社日立高新技术仪器 双轴驱动机构和模片结合器以及模片结合器的运转方法
CN103227118A (zh) * 2012-01-31 2013-07-31 株式会社日立高新技术仪器 芯片接合机及接合方法
TWI451515B (zh) * 2011-07-26 2014-09-01 Shinkawa Kk Grain bonding device
CN113661564A (zh) * 2019-04-11 2021-11-16 株式会社新川 接合装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5468313B2 (ja) * 2009-06-08 2014-04-09 Ｊｕｋｉ株式会社 部品実装装置
JP2013026268A (ja) * 2011-07-15 2013-02-04 Hitachi High-Tech Instruments Co Ltd ２軸駆動機構及びダイボンダ
JP5941705B2 (ja) * 2012-02-29 2016-06-29 ファスフォードテクノロジ株式会社 ２軸駆動機構及びダイボンダ
TWI784622B (zh) * 2020-08-12 2022-11-21 日商捷進科技有限公司 黏晶裝置及半導體裝置的製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH691719A5 (fr) 1997-04-11 2001-09-14 Etel Sa Table X-Y pour déplacer une charge, telle qu'un outil, selon deux directions perpendiculaires.

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102097350A (zh) * 2009-12-01 2011-06-15 佳能机械株式会社 结合装置
CN102097350B (zh) * 2009-12-01 2014-09-24 佳能机械株式会社 结合装置
CN102881614A (zh) * 2011-07-15 2013-01-16 株式会社日立高新技术仪器 双轴驱动机构和模片结合器以及模片结合器的运转方法
CN102881614B (zh) * 2011-07-15 2015-05-13 株式会社日立高新技术仪器 双轴驱动机构和模片结合器
TWI451515B (zh) * 2011-07-26 2014-09-01 Shinkawa Kk Grain bonding device
CN103227118A (zh) * 2012-01-31 2013-07-31 株式会社日立高新技术仪器 芯片接合机及接合方法
CN103227118B (zh) * 2012-01-31 2018-04-06 捷进科技有限公司 芯片接合机及接合方法
CN113661564A (zh) * 2019-04-11 2021-11-16 株式会社新川 接合装置
CN113661564B (zh) * 2019-04-11 2024-03-01 株式会社新川 接合装置

Also Published As

Publication number Publication date
KR20060120408A (ko) 2006-11-27
KR100741740B1 (ko) 2007-07-24
JP2006324598A (ja) 2006-11-30
JP4397349B2 (ja) 2010-01-13
TWI334627B (zh) 2010-12-11

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