JP2006321560A - Spacer tape for transferring electronic component and electronic component tray - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a spacer tape for transferring electronic components or electronic component tray without using any carbon black as a conductive agent, showing no peeling or dropping of the conductive agent, generating less amount of worn powder and having a superior anti-wearing property or the like. <P>SOLUTION: The electronic component transferring spacer tape or electronic component tray produced by molding and processing a conductive sheet obtained by bonding a polyolefin film kneaded with a thermoplastic block polymer composed of a hydrophilic segment and a lipophilic segment acting as a conductive agent, preferably kneaded with a polyether/polyolefin block polymer to a base sheet composed of a thermoplastic resin. The polyolefin film is preferably used as a polyethylene film or polypropylene film and it is preferable that this film is bonded to the base sheet by lamination. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic component used for transporting and storing electronic components composed of semiconductor elements such as semiconductor chips, liquid crystal modules, and hard disk components in electronic equipment products. The present invention relates to a conveying spacer tape and an electronic component tray.

Various electronic products such as personal computers, mobile phones, digital cameras, video cameras, digital recorders, etc., have many IC (integrated circuits) and semiconductor chips such as LSI (large scale integrated circuits), liquid crystal modules, and hard disks. Incorporating electronic components composed of semiconductor elements such as components, they are becoming increasingly sophisticated and miniaturized.
In recent years, there has been a demand for electronic devices that are particularly small, light, and highly functional. In manufacturing such electronic device products, electronic components such as semiconductor chips, liquid crystal modules, and hard disk components used therein are transported to an assembly line and incorporated into the electronic device product. Recently, mounting methods using electronic component mounting film carrier tapes and electronic component trays have been adopted as mounting methods for these electronic components, especially for high-definition devices such as personal computers and mobile phones. This method is important in the electronics industry that uses liquid crystal display elements that are required to be smaller and thinner.

  Film carrier tape for mounting electronic components has a circuit pattern formed on a flexible insulating film that becomes a base material such as polyimide film, prevents short circuits due to dust and migration during mounting, and protects wiring and between wiring For example, TAB tape (Tape Automated Bonding), T-BGA tape (Tape Ball Grid Array), ASIC (Application Specific Integrated Circuit), etc. are manufactured. is there.

  This film carrier tape for mounting electronic components is mounted on the center of this spacer tape using a spacer tape with uneven portions by embossing etc. on both side edges when handling such as transportation and storage. The film carrier tape is placed and wound on a reel or the like, and when used for mounting, the film carrier tape is sequentially drawn out to pick up the electronic component mounting film carrier tape and use it for mounting.

  The electronic component tray is made of synthetic resin that is formed by vacuum forming or other means to accommodate a large number of storage parts (pockets) that store electronic components composed of semiconductor elements such as semiconductor chips, liquid crystal modules, and hard disk components. A large number of trays are stacked and transported or stored with electronic components inserted into the pockets.

  In electronic component transport spacer tapes or electronic component trays that transport electronic components composed of such semiconductors, friction between spacer tapes or trays and electronic components during transportation, storage, or other handling, or between spacer tapes or trays Static electricity may be generated due to friction, which may cause damage to electronic components due to static electricity and obstruct handling when picking up electronic components. It was necessary to prevent the occurrence of

  In order to prevent the generation of such static electricity, a method of applying a coating material containing a conductive material such as carbon black, polypyrrole, or polyaniline to the surface (for example, see Patent Documents 1 and 2) or an antistatic agent And a method of using a synthetic resin sheet kneaded with a conductive agent such as carbon black (see, for example, Patent Documents 3, 4, and 5).

Among these conventional methods, a method of applying a coating material containing a conductive material such as carbon black or a conductive polymer to the surface is a method of transporting or handling the spacer tape or the surface of the tray and internal electronic components. A major problem is that the abrasion powder such as carbon black peels off and falls off due to the friction and impact of the material and contaminates the electronic component such as adhering to the insulating part of the electronic component. As the internal electronic components become smaller and more accurate, the influence of foreign matters increases when they are arranged on the circuit board. Therefore, contamination due to falling off of carbon black or the like is a serious problem.
Further, the method using a conductive polymer such as polypyrrole or polyaniline is a method including the same problem, and there is a problem that a special high-cost material has to be used.

Japanese Utility Model Publication No. 7-40572 JP 2002-103532 A U.S. Pat. No. 4,478,034 WO96 / 39707 JP 2004-185928 A

  The present invention solves such problems of conventional spacer tapes or electronic component trays for transporting electronic components, does not use carbon black as a conductive agent, does not drop off the conductive agent, and has excellent impact resistance. An object of the present invention is to provide a component conveying spacer tape or an electronic component tray.

  As a result of conducting extensive research in view of the above situation, the present inventors have obtained this by using a conductive sheet obtained by laminating a thin film in which a specific conductive polymer is kneaded on the surface of a base sheet. The present inventors have found that the problem can be solved and have completed the present invention.

That is, the gist of the present invention is as follows.
(1) A conductive sheet obtained by bonding a polyolefin film in which a thermoplastic block polymer composed of a hydrophilic segment and a lipophilic segment is kneaded as a conductive agent to a base material sheet composed of a thermoplastic resin is formed and processed. Spacer tape or electronic component tray for transporting electronic components.
(2) The spacer tape or electronic component transporting electronic component according to (1) above, wherein the thermoplastic block polymer comprising a hydrophilic segment and a lipophilic segment of the conductive agent is a polyether / polyolefin block polymer. Parts tray.
(3) The electronic component carrying spacer tape or electronic component tray according to (1) or (2), wherein the polyolefin film is either a polyethylene film or a polypropylene film.
(4) The electronic component transport spacer tape or electronic component tray according to any one of (1) to (3), wherein the polyolefin film is obtained by forming a film by an inflation method.
(5) The polyolefin film according to any one of (1) to (4), wherein the polyolefin film is obtained by dry blending a polyolefin resin with a polyether / polyolefin block polymer and forming the film by an inflation method. Spacer tape or electronic component tray for transporting electronic components.
(6) The electronic component carrying spacer tape or electronic component according to any one of (1) to (5), wherein the base sheet is either a polyester resin or a high-impact polystyrene resin tray.
(7) The electron according to any one of (1) to (6), wherein the conductive sheet is a laminate of a polyolefin film obtained by kneading a conductive agent in a base sheet. Spacer tape or electronic component tray for parts conveyance.

  Since the spacer tape or electronic component tray of the present invention does not use a conductive filler such as carbon black as a conductive agent, it has not only excellent conductive performance but also a problem when used as a spacer tape or tray. Omission of the conductive agent such as carbon black can be eliminated. That is, because it has a structure in which a polyolefin film kneaded with a specific polymer-based conductive agent is bonded to a base sheet by lamination or the like, it not only has the same conductivity as the conventional one, but also very It has excellent wear resistance and generates very little abrasion powder and dust, as well as excellent shock resistance and chemical resistance.

The present invention is an electronic component transport spacer tape or an electronic component tray using a conductive sheet in which a conductive polyolefin film in which a specific polymer-based conductive agent is kneaded is bonded to a base sheet.
The base material sheet used in the electronic component transport spacer tape or the electronic component tray of the present invention is not particularly limited, and can be used as long as it is a thermoplastic resin having molding processability. For example, a polyester resin Polystyrene resin, polyamide resin, polyvinyl chloride resin, polycarbonate resin, polyether resin and the like can be used.

In the spacer tape or electronic component tray of the present invention, a polyolefin resin kneaded with a specific conductive agent is formed into a thin film and used after being bonded to a base sheet.
This specific conductive agent is a thermoplastic block polymer composed of a hydrophilic segment and a lipophilic segment, specifically, a polyether / polyolefin block polymer. This conductive agent can be easily and uniformly dispersed in a polyolefin resin such as polyethylene and polyolefin, and can impart very excellent conductivity by adding several% to several tens%. In other words, this polyether / polyolefin block polymer has excellent dispersibility in polyolefin resin, so it can be dispersed uniformly in the resin just by dry blending with the resin, giving the resin excellent electrical performance. To do. As such a polyether / polyolefin block polymer, for example, those sold under the trade name “Pelestat 230” (manufactured by Sanyo Chemical Industries, Ltd.) can be used.

  The electronic component carrying spacer tape or electronic component tray of the present invention uses a conductive sheet in which a polyolefin film kneaded with the above conductive agent is bonded to a base sheet. The polyolefin film is particularly preferably a polyethylene film or a polypropylene film. The polyolefin film can be formed into a thin film having a thickness of several μm to several tens of μm by various known processing methods, and in particular, a film made into a thin film by an inflation film forming method can be used. preferable.

  The method of the polyolefin film is not particularly limited, and can be bonded to the base material sheet by various known methods, but is preferably bonded by a laminating method. As a method of laminating the polyolefin film, it is preferable to bond them together by a known dry laminating method. The polyolefin film is preferably bonded to both sides of the base sheet.

  A conductive sheet in which a polyolefin film in which a polyether / polyolefin block polymer of a conductive agent is kneaded is bonded to a base material sheet is molded into a spacer tape or tray shape, and the spacer tape for transporting electronic components of the present invention or Electronic component tray.

  In the case of a spacer tape for transporting electronic components, the conductive sheet is formed into various tape sizes according to the size and shape of the electronic component mounting film carrier tape used in combination, such as a TAB tape. And Then, unevenness is provided by embossing or the like at both ends in the width direction of the tape, and the tape is wound on a reel while being superposed on a film carrier tape for mounting electronic components. When wound up in this way, a certain space is formed between the spacer tapes by the irregularities at both ends of the tape, and a film carrier tape for mounting electronic components is inserted therein.

  In the case of an electronic component tray, the sheet is formed on the conductive sheet obtained as described above so as to form a large number of pockets in accordance with the size and shape of the semiconductor chip or liquid crystal module placed thereon. Molded by vacuum forming. Electronic parts such as semiconductor chips and liquid crystal modules are inserted into the pocket portion, and a large number of electronic component trays are stacked and transported to a required place, stored, and then picked up from the tray for use in subsequent steps.

  Conventional spacer tapes for transporting electronic components and electronic component trays have been coated or coated with a paint or resin containing a conductive material such as carbon black on the surface in order to impart conductivity. Such spacer tapes and trays are worn out from these spacer tapes and trays because they are subjected to vibrations, shocks, and other external forces while being transported with electronic components inserted and other various handling. Powder, dust and other foreign matters are generated, or the carbon black of the conductive agent falls off, adheres to the electronic components, contaminates the insulation and finely processed parts, and even the environment in the customer's manufacturing process. It was contaminated.

However, the spacer tape for electronic component transportation and the electronic component tray of the present invention do not use carbon black conductive agent, so there is no problem of falling off of carbon black or the like, and it is applied or coated on the surface of the base sheet. There is very little generation of wear powder and dust because it is not a thing.
Furthermore, since the spacer tape for electronic component transportation and the electronic component tray of the present invention have a structure in which a polyolefin thin film is bonded to a substrate sheet, the properties of the polyolefin sheet include viscoelasticity as well as the strength and workability of the substrate sheet. In combination, it has very good impact resistance. For this reason, the spacer tape or tray is less likely to be damaged even when an impact is applied during use of the spacer tape or tray, and the internal electronic components can be reliably protected. In addition, the spacer tape and tray may be used after being used once and then washed with a solvent such as isopropyl alcohol, and the spacer tape or electronic component tray of the present invention may have a polyolefin surface. Since it is coated, it has extremely excellent solvent resistance, and its physical properties change little even after repeated washing with a solvent.

  EXAMPLES Next, although an Example demonstrates this invention further in detail, this invention is not limited to the Example shown below. In the examples, “%” and “part” are based on mass unless otherwise noted.

(1) Measurement of electrical properties of conductive sheet A polyester resin sheet having a thickness of 150 μm was used as a base sheet. On the other hand, 20-30% of a polyether / polyolefin block polymer (trade name “Pelestat 230”, manufactured by Sanyo Chemical Industries, Ltd.) is added as a conductive agent to polyethylene resin (LDPE), and dry blended at 150 ° C. with a kneader. Was uniformly kneaded into polyethylene resin. The polyethylene resin kneaded with this conductive agent was applied to an inflation film forming apparatus to produce a polyethylene film having a thickness of about 40 μm. Next, the polyethylene film thus obtained was laminated on the base material sheet to produce a conductive sheet.

With respect to the conductive sheet laminated with the polyethylene film containing the conductive agent, the surface resistivity after 1 minute of DC 500V application and the time when the value is reduced to 5KV after application of DC 10KV by the following method and conditions ( Half-life) was examined.
(i) Surface resistivity (Ω)
Test method: IEC60093
Measurement surface: Surface with low resistance Test condition: 500 V x 1 minute application Test environment: 23 ° C, 50% RH
Test equipment: Super insulation meter R-503 (Kawaguchi Electric Works)
Electrode device P-616 type Main electrode diameter 50mmφ (Kawaguchi Electric Mfg. Co., Ltd.)
(ii) Half-life (seconds)
Test method: JIS L7142
Measurement surface: Surface with low resistance Test conditions: Application of 10 kV × 30 seconds Test environment: 20 ° C., 40% RH
Test equipment: Static Honest Meter S-5109 (Sisid electrostatic)
The results are shown in Table 1.

The conductive sheet used in the present invention has a surface resistivity (Ω) of about 5 × 10 ⁹ , a half-life of 1.3 seconds, and has good conductivity and half-life.

(2) Evaluation of Physical Properties of Conductive Sheet In order to evaluate the physical properties of the conductive sheet, a tensile test, a Taber abrasion test, and a DuPont impact test were performed using the following sheet as a test sample.
Test sample:
-Product of the present invention: 700 μm thick impact-resistant polystyrene resin sheet (Hi-PS) is used as a base material. Polyethylene film having a thickness of about 40 μm is prepared on both sides in the same manner as (1) above. A conductive sheet 210 mm long by 300 mm wide obtained by laminating.
・ Comparative product ・ ・ ・ Coating with 2μm carbon conductive paint as a conductive layer on both sides of 700μm thick impact-resistant polystyrene resin sheet (Hi-PS) as base material, and wear-resistant top coating on top 210mm x 300mm in width by gravure printing
Conductive sheet.

(i) Tensile test Tensile strength (MPa) and elongation at break (%) of MD (longitudinal direction of the member) and TD (longitudinal direction of the member) of each of the five test samples under the following test apparatus and test conditions. The tensile modulus (MPa) was measured and the average value was obtained.
Tensile tester: Instron 5566
Tensile speed: 50 mm / min,
Distance between chucks: 100 mm,
Test environment: 23 ± 2 ° C, 50 ± 5% RH
These measurement results are shown in Table 2.

(ii) Taber abrasion test The abrasion test of each of the two test samples was performed with the following test apparatus and test conditions, the abrasion mass was measured from the weight before and after the test, and the average value was obtained.
Taber abrasion tester: Rotary ablation tester (Toyo Seiki Seisakusho)
Wear wheel: CS-17,
Load: 1000g
Number of rotations: 1000 rotations (rotation speed 60 rpm)
Test environment: 23 ± 2 ° C., 50 ± 5% RH
These measurement results are shown in Table 3.

(iii) DuPont impact test The impact test of each of five test samples was performed with the following test apparatus and test conditions, and the state of deformation or destruction of the test samples was observed.
DuPont impact tester: DuPont impact test (tester industry)
Radius of the strike core: 1/4 inch,
Weight: 500g
Drop height: 50cm
Test environment: 23 ± 2 ° C, 50 ± 5% RH
As a result, all of the products of the present invention were deformed but not broken, while all of the comparative products were broken due to the punched shear state.

  The product of the present invention also has physical properties such as tensile strength comparable to that of the conventional conductive sheet, but as can be seen from the results of the Taber abrasion test shown in Table 3, compared with the conductive sheet coated with the conventional conductive paint. As a result of the DuPont impact test, it has excellent impact resistance.

(3) Conductivity sheet detergency test To observe the decrease in conductivity of the surface of the electroconductive sheet due to the cleaning operation, the same test sample as used in the physical property test of (2) above was used. A cleaning test was performed by the method.
-Cleaning test method For each test sample of the product of the present invention and the comparative product, first, the initial surface resistance is measured, and then the cleaning and drying operations consisting of the following steps are repeated 10 times. After the treatment, the surface resistance was measured.
Immersion (20 minutes) → air drying → dryer drying → oven drying (60 ° C., 30 minutes)
→ Leave at room temperature (10 minutes)
For each test sample and cleaning solution, this cleaning test was performed twice, and the average value was obtained.
Two types of cleaning liquids were used: pure water and isopropyl alcohol (100%).
The results are shown in Table 4.

Manufacture of spacer tape for transporting electronic parts Using a conductive sheet laminated with polyethylene containing a conductive agent prepared in (1) of Example 1 above, this conductive sheet was cut into a tape having a width of 35 to 48 mm, The embossing machine was embossed with unevenness having a height of about 3 mm on both side edges to produce a spacer tape for transporting electronic components according to the present invention.
A TAB tape having a width of 35 to 48 mm on which a semiconductor chip was mounted was placed on the electronic component carrying spacer tape, and this was wound around a reel. The reel on which the tape was wound was subjected to vibration for 30 minutes, and then the tape was wound and wound on the reel again. After repeating this operation five times, the state of the spacer tape and the TAB tape was examined. As a result, no defective product was found in the semiconductor chip of the TAB tape. Further, the surface resistivity of the spacer tape was 5.3 × 10 ⁹ , indicating good conductivity.

Comparative Example 1:
A polyester resin sheet having a thickness of 180 μm is used as a base sheet, and a resin paint kneaded with carbon black is applied to both sides of the base sheet so that the film thickness after drying becomes 2 μm. A carbon coating type conductive sheet was prepared by heating and drying at 1 ° C. for 1 hour. The conductive sheet was cut into a tape having a width of 50 mm in the same manner as in Example 1 and embossed on both end portions to produce a comparative electronic component transport spacer tape.
The same TAB tape as in Example 1 was overlaid on the comparative electronic component transport spacer tape and wound on a reel, and a vibration test was performed under the same conditions. As a result, the surface specific resistance value of the spacer tape was 4 × 10 ⁶ , indicating good conductivity, but defective products were found in the ratio of 1 out of 20 TAB tape semiconductor chips.

A high impact polystyrene resin (HIPS) having a thickness of 600 μm is used as a base sheet for manufacturing an electronic component tray, and a polyethylene resin film containing a conductive agent is laminated in the same manner as in Example 1 on the base sheet. Thus, a conductive sheet using a high impact polystyrene resin as a base sheet was prepared.
In this conductive sheet having a length of 300 mm, a width of 400 mm, and a thickness of 7.0 mm, 20 pocket portions corresponding to the shape of the liquid crystal module are formed by forming using a vacuum forming machine, and the electronic component tray of the present invention is formed. 10 similar trays were prepared.
A liquid crystal module for a mobile phone having a length of 50 mm, a width of 35 mm, and a height of 5 mm was inserted into the pocket portion of the 10 electronic component trays. Ten electronic component trays loaded with this liquid crystal module are stacked and fixed and subjected to vibration for 30 minutes. Then, all the liquid crystal modules are temporarily removed from the electronic component tray, and the liquid crystal module is again mounted in the pocket portion of the electronic component tray. I entered.
After repeating this operation five times, the state of the liquid crystal module and the electronic component tray was examined. As a result, no defective product was found in the semiconductor chip of the liquid crystal module. Moreover, the surface specific resistance value of the electronic component tray was 5.3 × 10 ⁹ , indicating good conductivity.

The spacer tape for electronic component transportation and the electronic component tray of the present invention are not coated or coated with a conductive agent such as carbon black for imparting electrical conductivity. It has excellent wear resistance, and also has excellent impact resistance and chemical resistance. Therefore, in the manufacture of electronic products such as personal computers and mobile phones, it is advantageously used for transportation, storage and other handling of electronic components in a mounting line for assembling semiconductor chips and liquid crystal modules.

Claims (7)

  Electronic component transport formed by molding and processing a conductive sheet obtained by laminating a polyolefin film kneaded with a thermoplastic block polymer consisting of a hydrophilic segment and a lipophilic segment as a conductive agent to a base material sheet made of a thermoplastic resin For spacer tape or electronic parts tray.   2. The electronic component transport spacer tape or electronic component tray according to claim 1, wherein the thermoplastic block polymer comprising a hydrophilic segment and a lipophilic segment of a conductive agent is a polyether / polyolefin block polymer.   The spacer tape or electronic component tray for electronic component conveyance according to claim 1 or 2, wherein the polyolefin film is either a polyethylene film or a polypropylene film.   The spacer tape or electronic component tray for electronic component conveyance according to any one of claims 1 to 3, wherein the polyolefin film is obtained by film formation by an inflation method.   The spacer tape for transporting electronic parts according to any one of claims 1 to 4, wherein the polyolefin film is obtained by dry blending a polyether / polyolefin block polymer with a polyolefin resin and forming the film by an inflation method. Or electronic parts tray.   The spacer tape for electronic component conveyance or the electronic component tray according to any one of claims 1 to 5, wherein the base sheet is either a polyester resin or a high impact polystyrene resin. The spacer tape for conveying an electronic component according to any one of claims 1 to 6, wherein the conductive sheet is obtained by laminating a polyolefin film in which a conductive agent is kneaded into a base sheet. Electronic component tray.