JP2006318971A - Electronic device - Google Patents

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Publication number
JP2006318971A
JP2006318971A JP2005137331A JP2005137331A JP2006318971A JP 2006318971 A JP2006318971 A JP 2006318971A JP 2005137331 A JP2005137331 A JP 2005137331A JP 2005137331 A JP2005137331 A JP 2005137331A JP 2006318971 A JP2006318971 A JP 2006318971A
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Prior art keywords
wiring
hole
support substrate
electronic device
wiring board
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JP2005137331A
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JP4639937B2 (en
Inventor
Yukihiro Maeda
幸宏 前田
Yuji Otani
祐司 大谷
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Denso Corp
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Denso Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

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  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To achieve a configuration that is suitable for miniaturization and can appropriately perform the wire bonding of both wiring boards in an electronic device in which the two wiring boards are connected by wire bonding. <P>SOLUTION: The electronic device comprises a flat support substrate 10, a first wiring board 20 bonded by allowing a rear 22 to oppose the side of one surface 11 of the support substrate 10, and a second wiring board 30 bonded by allowing a rear 32 to oppose the side of the other surface 12 of the support substrate 10. The edge of the first wiring board 20 and that of the second one 30 are bonded and fixed to the support substrate 10. A through-hole 10a, which passes through one surface 11 to the other 12, is provided on the support substrate 10. A part existing at the inner periphery as compared with the edge in the rear 32 of the second wiring board 30 is exposed from the through-hole 10a. The surface 21 of the first wiring board 20 is bonded to the rear 32 of the second one 30 by a bonding wire 60 via the through-hole 10a for electric connection. <P>COPYRIGHT: (C)2007,JPO&amp;INPIT

Description

本発明は、２枚の配線基板をワイヤボンディングによって接続してなる電子装置に関する。   The present invention relates to an electronic device in which two wiring boards are connected by wire bonding.

図１０、図１１、図１２は、従来のこの種の電子装置を示す概略断面図である。ここで、図１１に示される電子装置としては、たとえば特許文献１に記載されたものが提案され、図１２に示される電子装置としては、たとえば特許文献２に記載されたものが提案されている。   10, FIG. 11, and FIG. 12 are schematic cross-sectional views showing a conventional electronic device of this type. Here, as the electronic device shown in FIG. 11, for example, the one described in Patent Document 1 is proposed, and as the electronic device shown in FIG. 12, for example, the one described in Patent Document 2 is proposed. .

図１０に示される電子装置では、支持基板１０の一面１１に接着剤４０を介して、２枚の配線基板２０、３０が搭載され接着固定されている。そして、このように平面上に配置された第１の配線基板２０と第２の配線基板３０とはボンディングワイヤ６０により結線されることで接続されている。   In the electronic device shown in FIG. 10, two wiring boards 20 and 30 are mounted on and fixed to one surface 11 of the support substrate 10 via an adhesive 40. The first wiring board 20 and the second wiring board 30 arranged on a plane in this way are connected by being connected by bonding wires 60.

図１１に示される電子装置は、２枚の配線基板２０、３０のそれぞれを別々の支持基板１０に接着固定したうえで、２枚の配線基板２０、３０を上下に配置したものである。この場合、上下の各支持基板１０同士は、図示しない支持機構により支持され、互いに間隔を持って配置されている。   The electronic device shown in FIG. 11 has two wiring boards 20 and 30 arranged one above the other after bonding and fixing each of the two wiring boards 20 and 30 to separate support boards 10. In this case, the upper and lower support substrates 10 are supported by a support mechanism (not shown) and are arranged with a space therebetween.

そして、この図１１においては、両配線基板２０、３０を互いにずらして、ワイヤボンディング用のスペースＳを設け、それによって、両配線基板２０、３０の表面２１、３１同士をボンディングワイヤ６０により結線し、接続している。   In FIG. 11, both wiring boards 20, 30 are shifted from each other to provide a wire bonding space S, whereby the surfaces 21, 31 of both wiring boards 20, 30 are connected by bonding wires 60. Connected.

また、図１２に示される電子装置では、平板状の支持基板１０の一面１１側に第１の配線基板２０を接着剤４０を介して固定し、同じ支持基板１０の他面１２側に第２の配線基板３０を接着剤４０を介して固定している。   In the electronic device shown in FIG. 12, the first wiring substrate 20 is fixed to the one surface 11 side of the flat support substrate 10 via the adhesive 40, and the second surface 12 is fixed to the other surface 12 side of the same support substrate 10. The wiring board 30 is fixed with an adhesive 40.

それとともに、この図１２に示される電子装置では、第２の配線基板３０の端部を支持基板１０からはみ出させ、第２の配線基板３０の裏面３２のうちの当該はみ出し部分と第１の配線基板２０の表面２１とが、ボンディングワイヤ６０により結線され接続されている。
特開平５−１９３２９２号公報 特開２００４−２８１７２２号公報 At the same time, in the electronic device shown in FIG. 12, the end portion of the second wiring substrate 30 protrudes from the support substrate 10, and the protruding portion and the first wiring on the back surface 32 of the second wiring substrate 30. The surface 21 of the substrate 20 is connected and connected by a bonding wire 60.
JP-A-5-193292 JP 2004-281722 A

ところで、上記図１０に示される電子装置は、構造的には最も簡単な配置構成であるが、２枚の配線基板２０、３０を平面上に配置しており、配線基板の占有面積が非常に大きくなるという問題がある。   By the way, the electronic device shown in FIG. 10 has the simplest arrangement structure in terms of structure, but the two wiring boards 20 and 30 are arranged on a plane, and the occupied area of the wiring board is very large. There is a problem of growing.

また、図１１に示される電子装置では、配線基板２０、３０を支持する別々の支持基板１０同士を支持するための上記支持機構などが必要であり、構造が複雑となる。また、ワイヤボンディング装置の干渉を避けるために、ワイヤボンディング用の上記スペースＳを大きくとる必要があり、大型化につながる。   In addition, the electronic device shown in FIG. 11 requires the above-described support mechanism for supporting the separate support substrates 10 that support the wiring substrates 20 and 30, and the structure becomes complicated. Moreover, in order to avoid interference of a wire bonding apparatus, it is necessary to make the said space S for wire bonding large, and it leads to an enlargement.

さらに、この図１１に示される電子装置では、ボンディングワイヤ６０のループ形状の制約から、両配線基板２０、３０の間の段差Ｄ（図１１参照）を大きくとった場合、熱応力などによるボンディングワイヤ６０の信頼性を損なう恐れがある。   Further, in the electronic device shown in FIG. 11, when the step D (see FIG. 11) between the wiring boards 20 and 30 is large due to the restriction of the loop shape of the bonding wire 60, the bonding wire due to thermal stress or the like. The reliability of 60 may be impaired.

また、図１２に示される電子装置では、平板状の支持基板１０を挟んで２枚の配線基板２０、３０が積層された構成となっているため、配線基板による占有面積の増大を抑え、小型化に適した構成を実現することができるが、第２の配線基板３０の端部を支持基板１０からはみ出させているため、第２の配線基板３０の基板端部が、固定されずに開放端となる。   In addition, the electronic device shown in FIG. 12 has a configuration in which two wiring substrates 20 and 30 are laminated with a flat support substrate 10 interposed therebetween, and thus an increase in the area occupied by the wiring substrate is suppressed, and a small size is achieved. However, since the end portion of the second wiring substrate 30 is protruded from the support substrate 10, the end portion of the second wiring substrate 30 is opened without being fixed. End.

そのため、第２の配線基板３０の裏面３２のうちの当該はみ出し部分と第１の配線基板２０の表面２１とのワイヤボンディングを行うにあたっては、ボンディング時の超音波振動により第２の配線基板３０が共振し、当該超音波振動を的確にボンディング部に伝えることができなくなる。   Therefore, when performing wire bonding between the protruding portion of the back surface 32 of the second wiring board 30 and the front surface 21 of the first wiring board 20, the second wiring board 30 is caused by ultrasonic vibration during bonding. Resonates and the ultrasonic vibration cannot be accurately transmitted to the bonding part.

すると、ボンディングワイヤ６０の接合強度の確保が不十分となったり、ひいてはボンディングワイヤ６０による接合ができないという不具合が発生する可能性が、この図１２に示される電子装置では存在する。   Then, the electronic device shown in FIG. 12 has a possibility that the securing of the bonding strength of the bonding wire 60 may be insufficient, or that the bonding wire 60 cannot be bonded.

このようなワイヤボンディング時における超音波振動の伝達の不具合を防止するためには、ボンディング下面である第２の配線基板３０を固定支持する治具を作成する必要があるが、第２の配線基板３０に搭載されている部品やボンディング装置が干渉しないような治具を作成する必要があり、複雑な治具となってしまうという問題がある。   In order to prevent such a problem of transmission of ultrasonic vibration during wire bonding, it is necessary to create a jig for fixing and supporting the second wiring board 30 which is the lower surface of the bonding. It is necessary to create a jig that does not interfere with the components and bonding apparatus mounted on 30, which causes a problem that it becomes a complicated jig.

また、この図１２に示される電子装置においても、ワイヤボンディング装置の干渉を避けるために、第２の配線基板３０の支持基板１０からのはみ出しを大きくする必要が起こりうるため、大型化につながる可能性がある。   Also in the electronic device shown in FIG. 12, it is necessary to increase the protrusion of the second wiring board 30 from the support substrate 10 in order to avoid interference of the wire bonding apparatus, which may lead to an increase in size. There is sex.

本発明は、上記問題に鑑みてなされたものであり、２枚の配線基板をワイヤボンディングにより接続してなる電子装置において、小型化に適し且つ両配線基板のワイヤボンディングを適切に行うことが可能な構成を実現することを目的とする。   The present invention has been made in view of the above problems, and in an electronic device in which two wiring boards are connected by wire bonding, it is suitable for downsizing and wire bonding of both wiring boards can be appropriately performed. The purpose is to realize a simple configuration.

上記目的を達成するため、請求項１に記載の発明では、平板状の支持基板（１０）と、支持基板（１０）の一面（１１）側に裏面（２２）を対向させて接着された第１の配線基板（２０）と、支持基板（１０）の他面（１２）側に裏面（３２）を対向させて接着された第２の配線基板（３０）とを備え、第１の配線基板（２０）の端部および第２の配線基板（３０）の端部は、支持基板（１０）に対して接着固定されており、支持基板（１０）には、一面（１１）から他面（１２）へ貫通する貫通穴（１０ａ）が設けられており、貫通穴（１０ａ）から、第２の配線基板（３０）の裏面（３２）のうち前記端部よりも内周の部位が露出しており、第１の配線基板（２０）の表面（２１）と第２の配線基板（３０）の裏面（３２）とは、貫通穴（１０ａ）を介してボンディングワイヤ（６０）により結線され、電気的に接続されていることを特徴としている。   In order to achieve the above object, in the first aspect of the present invention, the flat support substrate (10) is bonded to the one surface (11) side of the support substrate (10) with the back surface (22) facing each other. 1 wiring board (20), and a second wiring board (30) bonded with the back surface (32) facing the other surface (12) side of the support substrate (10). The end portion of (20) and the end portion of the second wiring board (30) are bonded and fixed to the support substrate (10). The support substrate (10) has one surface (11) to the other surface ( 12) is provided with a through hole (10a) penetrating to the inner periphery of the back surface (32) of the second wiring board (30) from the through hole (10a). The front surface (21) of the first wiring board (20) and the back surface (32) of the second wiring board (30) are through holes. 10a) through the connection by the bonding wire (60) is characterized by being electrically connected.

それによれば、平板状の支持基板（１０）を挟んで２枚の配線基板（２０、３０）が積層された構成となっているため、配線基板による占有面積の増大を抑え、小型化に適した構成を実現できる。   According to this, since the two wiring boards (20, 30) are laminated with the flat support board (10) sandwiched therebetween, an increase in the area occupied by the wiring board is suppressed and suitable for miniaturization. Configuration can be realized.

また、本発明では、支持基板（１０）に貫通穴（１０ａ）を設け、この貫通穴（１０ａ）を介して第１の配線基板（２０）と第２の配線基板（３０）とのワイヤボンディングを可能としているが、２枚の配線基板（２０、３０）の端部は、支持基板（１０）に対して接着固定されており、従来のような基板端面が開放端ではなく、固定端として構成されている。   In the present invention, the support substrate (10) is provided with a through hole (10a), and wire bonding between the first wiring substrate (20) and the second wiring substrate (30) is performed through the through hole (10a). However, the ends of the two wiring boards (20, 30) are bonded and fixed to the support board (10), and the conventional board end face is not an open end but a fixed end. It is configured.

そのため、本発明においては、第１の配線基板（２０）と第２の配線基板（３０）とのワイヤボンディングを行うにあたって、ボンディング時の超音波振動を的確にボンディング部に伝えることができる。   Therefore, in the present invention, when performing wire bonding between the first wiring board (20) and the second wiring board (30), ultrasonic vibration during bonding can be accurately transmitted to the bonding portion.

よって、本発明によれば、２枚の配線基板（２０、３０）をワイヤボンディングにより接続してなる電子装置において、小型化に適し且つ両配線基板（２０、３０）のワイヤボンディングを適切に行うことが可能な構成を実現することができる。   Therefore, according to the present invention, in an electronic device in which two wiring boards (20, 30) are connected by wire bonding, it is suitable for miniaturization and wire bonding of both wiring boards (20, 30) is performed appropriately. A possible configuration can be realized.

また、請求項２に記載の発明では、請求項１に記載の電子装置において、支持基板（１０）は、金属製の放熱板として構成されていることを特徴としている。   According to a second aspect of the present invention, in the electronic device according to the first aspect, the support substrate (10) is configured as a metal heat radiating plate.

それによれば、両配線基板（２０、３０）からの熱を効果的に放熱させることができ、好ましい。   Accordingly, it is possible to effectively dissipate heat from both wiring boards (20, 30), which is preferable.

ここで、支持基板（１０）は、金属製の放熱板として構成されている場合に、支持基板（１０）に貫通穴（１０ａ）を設けると、この貫通穴（１０ａ）の部分では熱が流れないため、貫通穴（１０ａ）は支持基板（１０）における放熱経路から外れた位置に設けることが好ましい。   Here, when the support substrate (10) is configured as a heat sink made of metal, if a through hole (10a) is provided in the support substrate (10), heat flows through the through hole (10a). Therefore, the through hole (10a) is preferably provided at a position off the heat dissipation path in the support substrate (10).

請求項３に記載の発明は、そのような観点から創出されたものであり、請求項１または請求項２に記載の電子装置において、支持基板（１０）は、被取付部材（２００）に取り付けられる取付部（１３）を有しており、第１および第２の配線基板（２０、３０）にて発生する熱がそれぞれの配線基板（２０、３０）から取付部（１３）へ向かって放熱される放熱経路が形成されており、貫通穴（１０ａ）は、前記放熱経路から外れた位置に設けられていることを特徴としている。   The invention according to claim 3 was created from such a viewpoint, and in the electronic device according to claim 1 or 2, the support substrate (10) is attached to the attached member (200). The heat generated in the first and second wiring boards (20, 30) is dissipated from the respective wiring boards (20, 30) toward the mounting part (13). The heat dissipation path is formed, and the through hole (10a) is provided at a position away from the heat dissipation path.

このように、支持基板（１０）が取付部（１３）を有し、第１および第２の配線基板（２０、３０）にて発生する熱がそれぞれの配線基板（２０、３０）から取付部（１３）へ向かって放熱される放熱経路が形成されている場合、貫通穴（１０ａ）を当該放熱経路から外れた位置に設ければ、装置の放熱特性上、好ましいものとなる。   Thus, the support substrate (10) has the attachment portion (13), and the heat generated in the first and second wiring substrates (20, 30) is attached to the attachment portion from the respective wiring substrates (20, 30). In the case where a heat dissipation path for radiating heat toward (13) is formed, it is preferable in terms of heat dissipation characteristics of the device if the through hole (10a) is provided at a position away from the heat dissipation path.

また、請求項４に記載の発明では、請求項１〜請求項３に記載の電子装置において、貫通穴（１０ａ）は、支持基板（１０）の他面（１２）から一面（１１）に向かってテーパ状に径が拡がったものであることを特徴としている。   According to a fourth aspect of the present invention, in the electronic device according to the first to third aspects, the through hole (10a) extends from the other surface (12) to the one surface (11) of the support substrate (10). It is characterized in that the diameter is increased in a tapered shape.

それによれば、支持基板（１０）の他面（１２）側に位置する第２の配線基板（３０）の裏面（３２）に対して、貫通穴（１０ａ）を介してワイヤボンディングを行うときに、ワイヤボンディング装置（３００）が貫通穴（１０ａ）の縁部に接触しにくくなり、その結果、ワイヤボンディングが行いやすくなるため、好ましい。   According to this, when wire bonding is performed to the back surface (32) of the second wiring substrate (30) located on the other surface (12) side of the support substrate (10) through the through hole (10a). It is preferable because the wire bonding apparatus (300) is less likely to contact the edge of the through hole (10a), and as a result, wire bonding is facilitated.

また、請求項５に記載の発明では、請求項１〜請求項４に記載の電子装置において、貫通穴（１０ａ）の内部には、第２の配線基板（３０）の裏面（３２）と電気的に接続された接続部材（７０）が配置されており、接続部材（７０）に対して、第１の配線基板（２０）の表面（２１）からボンディングワイヤ（６０）が接続されていることを特徴としている。   According to a fifth aspect of the present invention, in the electronic device according to the first to fourth aspects, the back surface (32) of the second wiring board (30) is electrically connected to the inside of the through hole (10a). Connected connection member (70) is disposed, and bonding wire (60) is connected to connection member (70) from surface (21) of first wiring board (20). It is characterized by.

それによれば、貫通穴（１０ａ）の内部に設けられた接続部材（７０）を介して、第１の配線基板（２０）と第２の配線基板（３０）とがワイヤボンディングにて接続された構成となる。   According to this, the 1st wiring board (20) and the 2nd wiring board (30) were connected by wire bonding via the connection member (70) provided in the inside of the through hole (10a). It becomes composition.

そして、貫通穴（１０ａ）の内部に接続部材（７０）を設けることにより、この接続部材（７０）の厚さの分、ワイヤボンディングされる部位が貫通穴（１０ａ）の外側へ移行するため、ワイヤボンディング装置（３００）が入らないような貫通穴（１０ａ）のサイズであっても、ワイヤボンディングが可能になる。   And, by providing the connection member (70) inside the through hole (10a), the portion to be wire bonded shifts to the outside of the through hole (10a) by the thickness of the connection member (70). Even if the size of the through hole (10a) is such that the wire bonding apparatus (300) does not enter, wire bonding is possible.

つまり、本発明によれば、貫通穴（１０ａ）のサイズを極力小さくすることができ、特に、支持基板（１０）が放熱板であるような場合には、放熱特性の向上につながるという利点がある。   In other words, according to the present invention, the size of the through hole (10a) can be made as small as possible, and particularly when the support substrate (10) is a heat dissipation plate, there is an advantage that the heat dissipation characteristics are improved. is there.

また、第２の配線基板（３０）と支持基板（１０）とを接着する接着剤（４０）が、第２の配線基板（３０）の裏面（３２）のうち貫通穴（１０ａ）から露出する部位を汚染し、この汚染によってワイヤボンディングができなくなることが懸念されるが、本発明によれば、接続部材（７０）がボンディング部となるため、そのような汚染は回避され、適切なワイヤボンディングを行える。   Further, the adhesive (40) for bonding the second wiring board (30) and the support board (10) is exposed from the through hole (10a) in the back surface (32) of the second wiring board (30). Although there is a concern that the site may be contaminated and wire bonding cannot be performed due to this contamination, according to the present invention, since the connecting member (70) becomes a bonding portion, such contamination is avoided, and appropriate wire bonding is achieved. Can be done.

また、請求項６に記載の発明では、請求項１〜請求項５に記載の電子装置において、支持基板（１０）のうち貫通穴（１０ａ）の外周には、第１の配線基板（２０）と支持基板（１０）とを接着する接着剤（４０）および第２の配線基板（３０）と支持基板（１０）とを接着する接着剤（４０）が、貫通穴（１０ａ）の内部へ侵入するのを防止するための侵入防止部（１０ｂ、１０ｃ）が設けられていることを特徴としている。   According to a sixth aspect of the present invention, in the electronic device according to any of the first to fifth aspects, the first wiring board (20) is provided on the outer periphery of the through hole (10a) of the support board (10). Adhesive (40) for bonding the substrate and the support substrate (10) and the adhesive (40) for bonding the second wiring substrate (30) and the support substrate (10) enter the through hole (10a). An intrusion prevention part (10b, 10c) for preventing this is provided.

それによれば、各配線基板（２０、３０）と支持基板（１０）とを接着する接着剤（４０）によって、第２の配線基板（３０）の裏面（３２）のうち貫通穴（１０ａ）から露出する部位が汚染されることを防止できる結果、適切なワイヤボンディングを行うことができる。   According to this, from the through hole (10a) in the back surface (32) of the second wiring board (30) by the adhesive (40) for bonding the wiring boards (20, 30) and the support board (10). As a result of preventing the exposed portion from being contaminated, appropriate wire bonding can be performed.

なお、上記各手段の括弧内の符号は、後述する実施形態に記載の具体的手段との対応関係を示す一例である。   In addition, the code | symbol in the bracket | parenthesis of each said means is an example which shows a corresponding relationship with the specific means as described in embodiment mentioned later.

以下、本発明の実施形態について図に基づいて説明する。なお、以下の各図相互において、互いに同一もしくは均等である部分には、説明の簡略化を図るべく、図中、同一符号を付してある。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, parts that are the same or equivalent to each other are given the same reference numerals in the drawings for the sake of simplicity.

（第１実施形態）
図１は、本発明の第１実施形態に係る電子装置１００の概略断面構成を示す図であり、本電子装置１００を被取付部材２００に取り付けた状態を示している。また、図２は、本電子装置１００の要部の概略平面図であり、第１の配線基板２０の表面２１をその上方からみた図である。 (First embodiment)
FIG. 1 is a diagram showing a schematic cross-sectional configuration of an electronic device 100 according to the first embodiment of the present invention, and shows a state in which the electronic device 100 is attached to a member 200 to be attached. FIG. 2 is a schematic plan view of a main part of the electronic device 100, and is a view of the surface 21 of the first wiring board 20 as viewed from above.

本電子装置１００は、大きくは、平板状の支持基板１０と、支持基板１０の一面（図１中の上面）１１側に裏面２２を対向させて接着剤４０を介して固定された第１の配線基板２０と、支持基板１０の他面（図１中の下面）１２側に裏面３２を対向させて接着剤４０を介して固定された第２の配線基板３０とを備えて構成されている。   The electronic device 100 is roughly composed of a flat support substrate 10 and a first substrate fixed via an adhesive 40 with a back surface 22 facing the one surface (upper surface in FIG. 1) 11 side of the support substrate 10. The wiring board 20 is configured to include a second wiring board 30 fixed with an adhesive 40 so that the back surface 32 faces the other surface (lower surface in FIG. 1) 12 of the support substrate 10. .

支持基板１０は、金属やセラミックなどからなるものであり、ここでは、ＣｕやＡｌ、鉄などの熱伝導性に優れた金属からなる放熱板として構成されている。図１に示されるように、本実施形態では、支持基板１０は、その他面１２を被取付部材２００に対向させた状態で配置されている。   The support substrate 10 is made of metal, ceramic, or the like, and here, is configured as a heat radiating plate made of metal having excellent thermal conductivity such as Cu, Al, or iron. As shown in FIG. 1, in the present embodiment, the support substrate 10 is disposed with the other surface 12 facing the attached member 200.

この支持基板１０の両端には、被取付部材２００に取り付けられる取付部１３が支持基板１０と一体に成形された状態で備えられており、これら支持基板１０および取付部１３全体として、図１に示されるように、断面Ｈ字形状のケースを構成している。   At both ends of the support substrate 10, attachment portions 13 attached to the attachment target member 200 are provided integrally with the support substrate 10. The support substrate 10 and the attachment portion 13 as a whole are shown in FIG. As shown, a case with an H-shaped cross section is constructed.

この取付部１３は、被取付部材２００に対してネジ１４を介してネジ結合されており、支持基板１０は、取付部１３を介して被取付部材２００に固定されている。そして、第１の配線基板２０および第２の配線基板３０にて発生する熱がそれぞれの配線基板２０、３０から取付部１３へ向かい、そこから被取付部材２００へ放熱される放熱経路が形成されている。   The attachment portion 13 is screwed to the attached member 200 via a screw 14, and the support substrate 10 is fixed to the attached member 200 via the attachment portion 13. A heat dissipation path is formed in which heat generated in the first wiring board 20 and the second wiring board 30 is directed from the respective wiring boards 20 and 30 to the mounting portion 13 and is radiated from there to the mounted member 200. ing.

ここで、支持基板１０は、放熱性や筐体としての剛性などを考慮し、その板厚がたとえば１．６ｍｍ以上であることが好ましい。   Here, the support substrate 10 preferably has a plate thickness of, for example, 1.6 mm or more in consideration of heat dissipation and rigidity as a housing.

また、支持基板１０の一面１１側と他面１２側とにおいて、取付部１３に対してフタ１５が溶接や接着などにより取り付けられており、このフタ１５によって、支持基板１０の一面１１側に搭載された第１の配線基板２０および支持基板１０の他面１２側に搭載された第２の配線基板３０が被覆保護されている。   Further, a lid 15 is attached to the mounting portion 13 on one side 11 side and the other side 12 side of the support substrate 10 by welding, adhesion, or the like. The first wiring board 20 and the second wiring board 30 mounted on the other surface 12 side of the support substrate 10 are covered and protected.

これら第１の配線基板２０および第２の配線基板３０は、ともに表面２１、３１と裏面２２、３２とにランドや配線部などの導体部を有し、且つ、これら表裏面の導体部が電気的に導通しているものである。   Both the first wiring board 20 and the second wiring board 30 have conductor portions such as lands and wiring portions on the front surfaces 21 and 31 and the rear surfaces 22 and 32, and the conductor portions on the front and rear surfaces are electrically connected. Is electrically connected.

ここで、この導体部に関しては、図２において、第１の配線基板２０の表面２１に設けられた導体部２０ａと、第２の配線基板３０の裏面３２に設けられた導体部３０ａとが示されている。   Here, regarding this conductor portion, in FIG. 2, a conductor portion 20 a provided on the front surface 21 of the first wiring substrate 20 and a conductor portion 30 a provided on the back surface 32 of the second wiring substrate 30 are shown. Has been.

具体的には、第１の配線基板２０および第２の配線基板３０としては、表裏面の導体部を電気的に導通させるための内部配線やスルーホールなどを有するセラミック多層基板や単層基板などを採用することができる。   Specifically, as the first wiring board 20 and the second wiring board 30, a ceramic multilayer board or a single-layer board having internal wiring or through holes for electrically connecting the conductor portions on the front and back surfaces, etc. Can be adopted.

そして、これら第１の配線基板２０および第２の配線基板３０は、ともに裏面２２、３２側にて、樹脂などからなる上記接着剤４０を介して、支持基板１０に接着され固定されている。ここで、両配線基板２０、３０ともに、その端部（基板端部）が接着剤４０を介して支持基板１０にしっかりと固定されている。   The first wiring substrate 20 and the second wiring substrate 30 are both bonded and fixed to the support substrate 10 via the adhesive 40 made of resin or the like on the back surfaces 22 and 32 side. Here, the end portions (substrate end portions) of both the wiring boards 20 and 30 are firmly fixed to the support substrate 10 via the adhesive 40.

また、第１の配線基板２０の表面２１および第２の配線基板３０の表面３１には、それぞれ、電子部品５１、５２、５３が実装されている。これら電子部品５１〜５３は、その種類に応じて金やアルミなどからなるボンディングワイヤ５４や導電性接着剤５５を用いて実装されている。   Electronic components 51, 52, and 53 are mounted on the surface 21 of the first wiring board 20 and the surface 31 of the second wiring board 30, respectively. These electronic components 51 to 53 are mounted using a bonding wire 54 or a conductive adhesive 55 made of gold, aluminum, or the like according to the type.

本実施形態では、図１中、上側の第１の配線基板２０は、制御回路を有する制御基板として構成され、下側の第２の配線基板３０は、パワー基板として構成されている。つまり、第１の配線基板２０の表面２１には、マイコン５１や受動素子５２が実装され、第２の配線基板３０の表面３１には、パワー素子５３が実装されている。   In the present embodiment, in FIG. 1, the upper first wiring board 20 is configured as a control board having a control circuit, and the lower second wiring board 30 is configured as a power board. That is, the microcomputer 51 and the passive element 52 are mounted on the surface 21 of the first wiring board 20, and the power element 53 is mounted on the surface 31 of the second wiring board 30.

また、本電子装置１００では、第１の配線基板２０および第２の配線基板３０の少なくとも一方が、図示しないコネクタを介して外部と電気的に接続されている。そして、たとえば、第１の配線基板２０の制御回路により、第２の配線基板３０上のパワー素子５３に流される電流が制御されることによって、本電子装置１００は、図示しない外部のモータなどの機械装置を動作させるようにしている。   In the electronic device 100, at least one of the first wiring board 20 and the second wiring board 30 is electrically connected to the outside via a connector (not shown). Then, for example, the electronic circuit 100 is configured to control an external motor or the like (not shown) by controlling the current flowing through the power element 53 on the second wiring board 30 by the control circuit of the first wiring board 20. The machine is operated.

そのため、第１の配線基板２０と第２の配線基板３０とは電気的に接続されている必要がある。本実施形態では、図１、図２に示されるように、支持基板１０には、一面１１から他面１２へ貫通する貫通穴１０ａが設けられており、この貫通穴１０ａから、第２の配線基板３０の裏面３２のうち端部よりも内周の部位が露出している。   Therefore, the first wiring board 20 and the second wiring board 30 need to be electrically connected. In the present embodiment, as shown in FIGS. 1 and 2, the support substrate 10 is provided with a through hole 10a penetrating from the one surface 11 to the other surface 12, and the second wiring is formed from the through hole 10a. A portion of the back surface 32 of the substrate 30 that is inner peripheral than the end portion is exposed.

そして、図２に示されるように、第１の配線基板２０の表面２１の導体部２０ａと第２の配線基板３０の裏面３２の導体部３０ａとが、貫通穴１０ａを介して金やアルミなどからなるボンディングワイヤ６０により結線されている。それにより、両配線基板２０、３０は互いに電気的に接続されている。   As shown in FIG. 2, the conductor part 20a on the front surface 21 of the first wiring board 20 and the conductor part 30a on the back surface 32 of the second wiring board 30 are made of gold, aluminum, or the like through the through hole 10a. It is connected by a bonding wire 60 made of Thereby, both the wiring boards 20 and 30 are electrically connected to each other.

このような電子装置１００は、たとえば、次のようにして製造される。支持基板１０の一面１１、他面１２に、それぞれ電子部品５１〜５３が実装された第１の配線基板２０、第２の配線基板３０を接着剤４０を介して搭載する。   Such an electronic device 100 is manufactured as follows, for example. The first wiring board 20 and the second wiring board 30 on which the electronic components 51 to 53 are mounted are mounted on the one surface 11 and the other surface 12 of the support substrate 10 via the adhesive 40.

その後、接着剤４０を硬化させることにより、両配線基板２０、３０を支持基板１０に接着固定し、その後、貫通穴１０ａを介して両配線基板２０、３０をワイヤボンディングにて接続し、さらにフタ１５を取り付ける。こうして、本電子装置１００を製造することができる。   Thereafter, the adhesive 40 is cured to bond and fix both the wiring boards 20 and 30 to the support board 10, and then the two wiring boards 20 and 30 are connected by wire bonding through the through holes 10a. 15 is attached. In this way, the electronic device 100 can be manufactured.

ところで、本実施形態によれば、平板状の支持基板１０と、支持基板１０の一面１１側に裏面２２を対向させて接着された第１の配線基板２０と、支持基板１０の他面１２側に裏面３２を対向させて接着された第２の配線基板３０とを備え、第１の配線基板２０の端部および第２の配線基板３０の端部は、支持基板１０に対して接着固定されており、支持基板１０には、一面１１から他面１２へ貫通する貫通穴１０ａが設けられており、貫通穴１０ａから、第２の配線基板３０の裏面３２のうち端部よりも内周の部位が露出しており、第１の配線基板２０の表面２１と第２の配線基板３０の裏面３２とは、貫通穴１０ａを介してボンディングワイヤ６０により結線され、電気的に接続されていることを特徴とする電子装置１００が提供される。   By the way, according to the present embodiment, the flat support substrate 10, the first wiring substrate 20 bonded with the back surface 22 facing the one surface 11 side of the support substrate 10, and the other surface 12 side of the support substrate 10. And the second wiring substrate 30 bonded with the back surface 32 facing each other, and the end portion of the first wiring substrate 20 and the end portion of the second wiring substrate 30 are bonded and fixed to the support substrate 10. The support substrate 10 is provided with a through hole 10a penetrating from the one surface 11 to the other surface 12. From the through hole 10a, the inner surface of the back surface 32 of the second wiring substrate 30 is located at the inner periphery. The part is exposed, and the front surface 21 of the first wiring board 20 and the back surface 32 of the second wiring board 30 are connected by a bonding wire 60 through the through hole 10a and are electrically connected. An electronic device 100 is provided.

それによれば、平板状の支持基板１０を挟んで２枚の配線基板２０、３０が積層された構成となっているため、配線基板による占有面積の増大を抑え、小型化に適した構成を実現できる。   According to this, since the two wiring substrates 20 and 30 are laminated with the flat support substrate 10 interposed therebetween, an increase in the occupied area by the wiring substrate is suppressed, and a configuration suitable for downsizing is realized. it can.

また、本実施形態では、支持基板１０に貫通穴１０ａを設け、この貫通穴１０ａを介して第１の配線基板２０と第２の配線基板３０とのワイヤボンディングを可能としているが、２枚の配線基板２０、３０の端部は、支持基板１０に対して接着固定されており、従来のような基板端面が開放端ではなく、固定端として構成されている。   In the present embodiment, the support substrate 10 is provided with a through hole 10a, and the first wiring substrate 20 and the second wiring substrate 30 can be bonded to each other through the through hole 10a. The end portions of the wiring boards 20 and 30 are bonded and fixed to the support substrate 10, and the conventional board end face is configured as a fixed end instead of an open end.

そのため、本実施形態においては、第１の配線基板２０と第２の配線基板３０とのワイヤボンディングを行うにあたって、ボンディング時の超音波振動を的確にボンディング部に伝えることができる。   Therefore, in the present embodiment, when wire bonding between the first wiring board 20 and the second wiring board 30 is performed, ultrasonic vibration during bonding can be accurately transmitted to the bonding portion.

よって、本実施形態によれば、２枚の配線基板２０、３０をワイヤボンディングにより接続してなる電子装置１００において、小型化に適し且つ両配線基板２０、３０のワイヤボンディングを適切に行うことが可能な構成を実現することができる。   Therefore, according to this embodiment, in the electronic device 100 in which the two wiring boards 20 and 30 are connected by wire bonding, it is suitable for downsizing and wire bonding of both the wiring boards 20 and 30 can be appropriately performed. Possible configurations can be realized.

また、本実施形態の電子装置１００においては、支持基板１０が金属製の放熱板として構成されていることも特徴のひとつである。それによれば、両配線基板２０、３０からの熱を効果的に放熱させることができ、好ましい。   Moreover, in the electronic device 100 of this embodiment, it is one of the characteristics that the support substrate 10 is comprised as a metal heat sink. According to this, the heat from both the wiring boards 20 and 30 can be effectively radiated, which is preferable.

（第２実施形態）
図３は、本発明の第２実施形態に係る電子装置１１０の要部の概略平面図であり、第１の配線基板２０の表面２１をその上方からみた図である。 (Second Embodiment)
FIG. 3 is a schematic plan view of the main part of the electronic device 110 according to the second embodiment of the present invention, and is a view of the surface 21 of the first wiring board 20 as viewed from above.

本実施形態の電子装置１１０も、上記実施形態と同様、平板状の支持基板１０を挟んで２枚の配線基板２０、３０が積層された構成となっており、支持基板１０設けられた貫通穴１０ａを介して第１の配線基板２０と第２の配線基板３０とのワイヤボンディングを可能としつつ、２枚の配線基板２０、３０の端部を固定端として構成している。そのため、本実施形態においても、小型化に適し且つ両配線基板２０、３０のワイヤボンディングを適切に行うことが可能な電子装置１１０を実現できる。   Similarly to the above-described embodiment, the electronic device 110 according to the present embodiment has a configuration in which two wiring boards 20 and 30 are stacked with a flat support substrate 10 interposed therebetween, and a through hole provided in the support substrate 10 is provided. The end portions of the two wiring substrates 20 and 30 are configured as fixed ends while enabling wire bonding between the first wiring substrate 20 and the second wiring substrate 30 via 10a. Therefore, also in the present embodiment, it is possible to realize the electronic device 110 that is suitable for downsizing and can appropriately perform wire bonding of both the wiring boards 20 and 30.

さらに、本実施形態の電子装置１１０は、上記図１に示される電子装置１００において、支持基板１０に形成される貫通穴１０ａの位置を変更したものである。   Furthermore, the electronic device 110 according to this embodiment is obtained by changing the position of the through hole 10a formed in the support substrate 10 in the electronic device 100 shown in FIG.

支持基板１０が金属製の放熱板として構成されている場合に、支持基板１０に貫通穴１０ａを設けると、この貫通穴１０ａの部分では熱が流れないため、貫通穴１０ａは支持基板１０における放熱経路から外れた位置に設けることが好ましい。   When the support substrate 10 is configured as a metal heat sink, if the support substrate 10 is provided with a through hole 10a, heat does not flow through the through hole 10a. It is preferable to provide at a position off the path.

図３に示される電子装置１１０においては、上記図１に示される電子装置１００と同様に、支持基板１０は、被取付部材に取り付けられる取付部１３を有しており、第１および第２の配線基板２０、３０にて発生する熱がそれぞれの配線基板２０、３０から取付部１３へ向かって放熱される放熱経路が形成されている。   In the electronic device 110 shown in FIG. 3, like the electronic device 100 shown in FIG. 1, the support substrate 10 has an attachment portion 13 that is attached to a member to be attached. A heat dissipation path is formed in which heat generated in the wiring boards 20 and 30 is radiated from the wiring boards 20 and 30 toward the mounting portion 13.

ここにおいて、上記図１においては、貫通穴１０ａは、各配線基板２０、３０と取付部１３との間に介在していたため、放熱経路を阻害していたが、本実施形態では、図３に示されるように、貫通穴１０ａは、各配線基板２０、３０と取付部１３との間には存在せず、放熱経路から外れた位置に設けられている。   Here, in FIG. 1, the through hole 10 a is interposed between the wiring boards 20, 30 and the mounting portion 13, so that the heat dissipation path is obstructed. As shown, the through hole 10a does not exist between the wiring boards 20 and 30 and the mounting portion 13, but is provided at a position away from the heat dissipation path.

本実施形態のように、貫通穴１０ａを電子装置１１０における放熱経路から外れた位置に設ければ、装置の放熱特性上、好ましいものとなる。   If the through hole 10a is provided at a position off the heat dissipation path in the electronic device 110 as in the present embodiment, it is preferable in terms of heat dissipation characteristics of the device.

（第３実施形態）
図４は、本発明の第３実施形態に係る電子装置１２０の概略断面構成を示す図であり、本電子装置１２０を被取付部材２００に取り付けた状態を示している。 (Third embodiment)
FIG. 4 is a diagram showing a schematic cross-sectional configuration of the electronic device 120 according to the third embodiment of the present invention, and shows a state in which the electronic device 120 is attached to the attached member 200.

図４に示されるように、本実施形態の電子装置１２０では、支持基板１０における一面１１と他面１２との上下関係が、上記図１とは反対になっている。つまり、本実施形態では、支持基板１０は、第１の配線基板２０が接着される一面１１を被取付部材２００に対向させている。   As shown in FIG. 4, in the electronic device 120 of this embodiment, the vertical relationship between the one surface 11 and the other surface 12 of the support substrate 10 is opposite to that in FIG. 1. That is, in the present embodiment, the support substrate 10 has the one surface 11 to which the first wiring substrate 20 is bonded facing the member to be attached 200.

そして、本実施形態では、支持基板１０の一面（図４中の下面）１１側に裏面２２を対向させて接着剤４０を介して固定された第１の配線基板２０が、パワー基板として構成され、支持基板１０の他面（図４中の上面）１２側に裏面３２を対向させて接着剤４０を介して固定された第２の配線基板３０が、制御基板として構成されている。   In the present embodiment, the first wiring board 20 that is fixed via the adhesive 40 with the back surface 22 facing the one surface (lower surface in FIG. 4) 11 side of the support substrate 10 is configured as a power substrate. A second wiring board 30 fixed with an adhesive 40 facing the back surface 32 on the other surface (upper surface in FIG. 4) 12 side of the support substrate 10 is configured as a control substrate.

つまり、本実施形態では、図４中、下側の第１の配線基板２０の表面２１には、パワー素子５３が実装され、上側の第２の配線基板３０の表面３１には、マイコン５１や受動素子５２が実装されている。   That is, in the present embodiment, in FIG. 4, the power element 53 is mounted on the surface 21 of the lower first wiring board 20, and the microcomputer 51 or the like is mounted on the surface 31 of the upper second wiring board 30. A passive element 52 is mounted.

さらに、本実施形態では、下側の第１の配線基板２０が２分割されており、２枚の第１の配線基板２０が構成されている。ここで、図４に示されるように、２枚の第１の配線基板２０はともに、その端部（基板端部）が接着剤４０を介して支持基板１０にしっかりと固定されている。   Further, in the present embodiment, the lower first wiring board 20 is divided into two, and two first wiring boards 20 are configured. Here, as shown in FIG. 4, the end portions (substrate end portions) of the two first wiring substrates 20 are both firmly fixed to the support substrate 10 via the adhesive 40.

支持基板１０においては、貫通穴１０ａは、これら２枚の第１の配線基板２０の間に設けられており、この貫通穴１０ａから、第２の配線基板３０の裏面３２のうち端部よりも内周の部位が露出している。   In the support substrate 10, the through hole 10 a is provided between the two first wiring boards 20, and from the through hole 10 a than the end of the back surface 32 of the second wiring board 30. The inner periphery is exposed.

そして、２枚の第１の配線基板２０の表面２１と第２の配線基板３０の裏面３２とが、貫通穴１０ａを介して金やアルミなどからなるボンディングワイヤ６０により結線されている。それにより、両配線基板２０、３０は互いに電気的に接続されている。   And the surface 21 of the two 1st wiring boards 20 and the back surface 32 of the 2nd wiring board 30 are connected by the bonding wire 60 which consists of gold | metal | money, aluminum, etc. through the through-hole 10a. Thereby, both the wiring boards 20 and 30 are electrically connected to each other.

このように、本実施形態においても、平板状の支持基板１０と、支持基板１０の一面１１側に裏面２２を対向させて接着された第１の配線基板２０と、支持基板１０の他面１２側に裏面３２を対向させて接着された第２の配線基板３０とを備え、各配線基板２０、３０の端部は支持基板１０に接着固定されており、支持基板１０には上記貫通穴１０ａが設けられており、第１の配線基板２０の表面２１と貫通穴１０ａから露出する第２の配線基板３０の裏面３２とが貫通穴１０ａを介してボンディングワイヤ６０により結線され、電気的に接続されていることを特徴とする電子装置１２０が提供される。   As described above, also in the present embodiment, the flat support substrate 10, the first wiring substrate 20 bonded with the back surface 22 facing the one surface 11 side of the support substrate 10, and the other surface 12 of the support substrate 10. And a second wiring board 30 bonded with the back surface 32 facing the side, and the end portions of the wiring boards 20 and 30 are bonded and fixed to the supporting board 10. Are provided, and the front surface 21 of the first wiring board 20 and the back surface 32 of the second wiring board 30 exposed from the through hole 10a are connected by the bonding wire 60 through the through hole 10a and are electrically connected. An electronic device 120 is provided.

それにより、本実施形態においても、小型化に適し且つ両配線基板２０、３０のワイヤボンディングを適切に行うことが可能な構成を実現することができる。   Thereby, also in the present embodiment, it is possible to realize a configuration suitable for downsizing and capable of appropriately performing wire bonding of both the wiring boards 20 and 30.

また、本実施形態の電子装置１２０においては、第１の配線基板２０を２分割して、その間に貫通穴１０ａを設けているため、それぞれの第１の配線基板２０から取付部１３への放熱経路は貫通穴１０ａにて阻害されず、確保されている。このことから、本実施形態によれば、放熱特性の向上が図れる。   Further, in the electronic device 120 of the present embodiment, the first wiring board 20 is divided into two parts and the through hole 10a is provided between them, so that heat is radiated from each first wiring board 20 to the mounting portion 13. The path is secured without being blocked by the through hole 10a. Therefore, according to the present embodiment, the heat dissipation characteristics can be improved.

（第４実施形態）
図５は、本発明の第４実施形態に係る電子装置１３０の概略断面構成を示す図であり、本電子装置１３０を被取付部材２００に取り付けた状態を示している。 (Fourth embodiment)
FIG. 5 is a diagram showing a schematic cross-sectional configuration of an electronic device 130 according to the fourth embodiment of the present invention, and shows a state in which the electronic device 130 is attached to the attached member 200.

本実施形態の電子装置１３０は、上記図４に示される電子装置１２０において、支持基板１０に設けられる貫通穴１０ａの形状を変形したものである。   The electronic device 130 of the present embodiment is obtained by modifying the shape of the through hole 10a provided in the support substrate 10 in the electronic device 120 shown in FIG.

具体的には、図５に示されるように、本実施形態では、貫通穴１０ａは、支持基板１０の他面１２から一面１１に向かってテーパ状に径が拡がったものである。つまり、貫通穴１０ａは、ここに露出する第２の配線基板３０の裏面３２側の開口部からこれとは反対側の開口部へ向かって拡径したテーパ穴として構成されている。   Specifically, as shown in FIG. 5, in the present embodiment, the through hole 10 a has a diameter that increases in a tapered shape from the other surface 12 to the one surface 11 of the support substrate 10. That is, the through hole 10a is configured as a tapered hole whose diameter is increased from the opening on the back surface 32 side of the second wiring board 30 exposed here toward the opening on the opposite side.

図６は、この図５に示される電子装置１３０における貫通穴１０ａを介した第１の配線基板２０と第２の配線基板３０とのワイヤボンディング工程を示す図である。   FIG. 6 is a diagram showing a wire bonding process between the first wiring board 20 and the second wiring board 30 through the through hole 10a in the electronic device 130 shown in FIG.

ここでは、それぞれの基板端部が支持基板１０に接着固定された両配線基板２０、３０において、ワイヤボンディング装置３００を用いて、まず、第１の配線基板２０の表面２１に第１ボンディングを行った後、貫通穴１０ａを介して第２の配線基板３０の裏面３２に第２ボンディングを行うことにより、ボンディングワイヤ６０を形成する。   Here, first, the first bonding is performed on the surface 21 of the first wiring board 20 by using the wire bonding apparatus 300 in both the wiring boards 20 and 30 in which the end portions of the respective boards are bonded and fixed to the support substrate 10. After that, the bonding wire 60 is formed by performing the second bonding on the back surface 32 of the second wiring board 30 through the through hole 10a.

本実施形態では、貫通穴１０ａが上記テーパ穴形状を有するものであるため、支持基板１０の他面１２側に位置する第２の配線基板３０の裏面３２に対して、貫通穴１０ａを介してワイヤボンディングを行うときに、ワイヤボンディング装置３００が貫通穴１０ａの縁部に接触しにくくなる。   In the present embodiment, since the through hole 10a has the tapered hole shape, the back surface 32 of the second wiring board 30 located on the other surface 12 side of the support substrate 10 is interposed through the through hole 10a. When performing wire bonding, it becomes difficult for the wire bonding apparatus 300 to contact the edge part of the through-hole 10a.

その結果、ワイヤボンディングが行いやすくなるため、好ましい。また、本実施形態では、貫通穴１０ａにおいて径の小さい第２の配線基板３０側の開口部を、極力小さいものにできるため、貫通穴１０ａによる放熱性の低下が極力抑制され、好ましい。   As a result, wire bonding is facilitated, which is preferable. Moreover, in this embodiment, since the opening part by the side of the 2nd wiring board 30 with a small diameter in the through-hole 10a can be made as small as possible, the fall of the heat dissipation by the through-hole 10a is suppressed as much as possible, and it is preferable.

また、上述したように、本実施形態の電子装置１３０は、上記図４に示される電子装置１２０において、貫通穴１０ａの形状を変形したものであり、上記図４に示される電子装置１２０と同様の効果を奏することは、もちろんである。   Further, as described above, the electronic device 130 of the present embodiment is obtained by modifying the shape of the through hole 10a in the electronic device 120 shown in FIG. 4, and is similar to the electronic device 120 shown in FIG. Of course, the effects of

（第５実施形態）
図７は、本発明の第５実施形態に係る電子装置１４０の概略断面構成を示す図であり、本電子装置１４０を被取付部材２００に取り付けた状態を示している。 (Fifth embodiment)
FIG. 7 is a view showing a schematic cross-sectional configuration of an electronic device 140 according to the fifth embodiment of the present invention, and shows a state in which the electronic device 140 is attached to the attached member 200.

本実施形態の電子装置１４０は、上記図４に示される電子装置１２０において、支持基板１０に設けられる貫通穴１０ａの内部に、第２の配線基板３０の裏面３２と電気的に接続された接続部材７０を配置し、この接続部材７０に対して、第１の配線基板２０の表面２１からボンディングワイヤ６０を接続したものである。   The electronic device 140 of the present embodiment is a connection electrically connected to the back surface 32 of the second wiring board 30 inside the through hole 10a provided in the support substrate 10 in the electronic device 120 shown in FIG. A member 70 is arranged, and a bonding wire 60 is connected to the connecting member 70 from the surface 21 of the first wiring board 20.

図８は、この接続部材７０単体の外観斜視図である。図８に示されるように、本例の接続部材７０は、樹脂やセラミックなどのプレートを本体とし、一面側にバンプ７１を有し、他面側にボンディングパッド７２を有し、さらに、バンプ７１とボンディングパッド７２とが電気的に接続されたものである。   FIG. 8 is an external perspective view of the connecting member 70 alone. As shown in FIG. 8, the connection member 70 of this example has a plate made of resin or ceramic as a main body, has bumps 71 on one side, bonding pads 72 on the other side, and bumps 71. And the bonding pad 72 are electrically connected.

このような接続部材７０は、たとえば、バンプ７１を介して第２の配線基板３０の裏面３２にあらかじめ接続された状態で、第２の配線基板３０とともに支持基板１０に接着される。このとき、接続部材７０は、もちろん貫通穴１０ａに設置される。   Such a connection member 70 is bonded to the support substrate 10 together with the second wiring board 30 in a state of being connected in advance to the back surface 32 of the second wiring board 30 via the bumps 71, for example. At this time, the connecting member 70 is of course installed in the through hole 10a.

その後、支持基板１０に固定された第１の配線基板２０の表面２１と接続部材７０のボンディングパッド７２との間でワイヤボンディングが行われることにより、図８に示されるような電子装置１４０が形成される。   Thereafter, wire bonding is performed between the surface 21 of the first wiring substrate 20 fixed to the support substrate 10 and the bonding pads 72 of the connection member 70, thereby forming the electronic device 140 as shown in FIG. Is done.

このように、本実施形態の電子装置１４０によれば、貫通穴１０ａの内部に設けられた接続部材７０を介して、第１の配線基板２０と第２の配線基板３０とがワイヤボンディングにて接続された構成となる。   Thus, according to the electronic device 140 of the present embodiment, the first wiring board 20 and the second wiring board 30 are connected by wire bonding via the connection member 70 provided inside the through hole 10a. Connected configuration.

そして、貫通穴１０ａの内部に接続部材７０を設けることにより、この接続部材７０の厚さの分、ワイヤボンディングされる部位が貫通穴１０ａの外側へ移行するため、ワイヤボンディング装置３００（上記図６参照）が入らないような貫通穴１０ａのサイズであっても、ワイヤボンディングが可能になる。   Then, by providing the connection member 70 inside the through hole 10a, the portion to be wire bonded shifts to the outside of the through hole 10a by the thickness of the connection member 70, so the wire bonding apparatus 300 (FIG. 6 above). Even if it is the size of the through hole 10a that does not enter (see), wire bonding is possible.

つまり、本実施形態によれば、貫通穴１０ａのサイズを極力小さくすることができ、特に、支持基板１０が放熱板であるような場合には、放熱特性の向上につながるという利点がある。   That is, according to the present embodiment, the size of the through hole 10a can be reduced as much as possible. In particular, when the support substrate 10 is a heat dissipation plate, there is an advantage that the heat dissipation characteristics are improved.

また、第２の配線基板３０と支持基板１０とを接着する接着剤４０が、第２の配線基板３０の裏面３２のうち貫通穴１０ａから露出する部位を汚染し、この汚染によってワイヤボンディングができなくなることが懸念されるが、本実施形態によれば、接続部材７０がボンディング部となるため、そのような汚染は回避され、適切なワイヤボンディングを行える。   Further, the adhesive 40 that bonds the second wiring substrate 30 and the support substrate 10 contaminates the portion of the back surface 32 of the second wiring substrate 30 that is exposed from the through hole 10a, and this contamination enables wire bonding. However, according to the present embodiment, since the connection member 70 becomes a bonding portion, such contamination is avoided and appropriate wire bonding can be performed.

なお、接続部材７０としては、上記図８に示される例に限定されるものではなく、貫通穴１０ａ内部に設置可能であって一方で第２の配線基板３０の裏面３２と接続し且つ他方でワイヤボンディングすることで導通がとれるものでれば、かまわない。   Note that the connection member 70 is not limited to the example shown in FIG. 8 described above, and can be installed inside the through-hole 10a, while being connected to the back surface 32 of the second wiring board 30 and on the other side. It does not matter as long as it can be connected by wire bonding.

また、上述したように、本実施形態の電子装置１４０は、上記図４に示される電子装置１２０において、貫通穴１０ａに接続部材７０を設けたものであり、この接続部材７０による上記効果以外にも、上記図４に示される電子装置１２０と同様の効果を奏することは、もちろんである。   In addition, as described above, the electronic device 140 according to the present embodiment is the electronic device 120 shown in FIG. 4, in which the connection member 70 is provided in the through hole 10a. Of course, the same effects as those of the electronic device 120 shown in FIG. 4 can be obtained.

（第６実施形態）
図９は、本発明の第６実施形態に係る電子装置１５０の概略断面構成を示す図であり、本電子装置１５０を被取付部材２００に取り付けた状態を示している。 (Sixth embodiment)
FIG. 9 is a diagram showing a schematic cross-sectional configuration of an electronic device 150 according to the sixth embodiment of the present invention, and shows a state in which the electronic device 150 is attached to the attached member 200.

本実施形態の電子装置１５０は、上記図４に示される電子装置１２０において、支持基板１０のうち貫通穴１０ａの外周に、第１の配線基板２０と支持基板１０とを接着する接着剤４０および第２の配線基板３０と支持基板１０とを接着する接着剤４０が、貫通穴１０ａの内部へ侵入するのを防止するための侵入防止部１０ｂ、１０ｃを設けたことを特徴とするものである。   The electronic device 150 according to the present embodiment includes an adhesive 40 for bonding the first wiring substrate 20 and the support substrate 10 to the outer periphery of the through hole 10a in the support substrate 10 in the electronic device 120 shown in FIG. Intrusion prevention portions 10b and 10c are provided to prevent the adhesive 40 that bonds the second wiring substrate 30 and the support substrate 10 from entering the inside of the through hole 10a. .

具体的には、図９に示されるように、侵入防止部１０ｂ、１０ｃは、支持基板１０のうち貫通穴１０ａの外周に設けられた凹凸部１０ｂ、１０ｃである。   Specifically, as shown in FIG. 9, the intrusion prevention portions 10 b and 10 c are uneven portions 10 b and 10 c provided on the outer periphery of the through hole 10 a in the support substrate 10.

第１の配線基板２０が接着される支持基板１０の一面１１側では、貫通穴１０ａの開口縁部に侵入防止部としての凹部１０ｂが設けられ、第１の配線基板２０と支持基板１０とを接着する接着剤４０が貫通穴１０ａに侵入しようとすると、この凹部１０ｂに当該接着剤４０が溜められることにより、貫通穴１０ａへの侵入が防止される。   On one surface 11 side of the support substrate 10 to which the first wiring substrate 20 is bonded, a recess 10b as an intrusion prevention portion is provided at the opening edge portion of the through hole 10a, and the first wiring substrate 20 and the support substrate 10 are connected to each other. When the adhesive 40 to be bonded attempts to enter the through hole 10a, the adhesive 40 is stored in the recess 10b, thereby preventing the penetration into the through hole 10a.

一方、第２の配線基板３０が接着される支持基板１０の他面１２側では、貫通穴１０ａの開口縁部に侵入防止部としての凸部１０ｃが設けられ、第２の配線基板３０と支持基板１０とを接着する接着剤４０が貫通穴１０ａに侵入しようとすると、この凸部１０ｃがダムの作用をして当該接着剤４０をせき止めることにより、貫通穴１０ａへの侵入が防止される。   On the other hand, on the other surface 12 side of the support substrate 10 to which the second wiring substrate 30 is bonded, a protruding portion 10c as an intrusion prevention portion is provided at the opening edge of the through hole 10a, and the second wiring substrate 30 and the support are supported. When the adhesive 40 that adheres to the substrate 10 tries to enter the through hole 10a, the convex portion 10c acts as a dam to block the adhesive 40, thereby preventing the penetration into the through hole 10a.

このように、本実施形態の電子装置１５０によれば、各配線基板２０、３０と支持基板１０とを接着する接着剤４０によって、第２の配線基板３０の裏面３２のうち貫通穴１０ａから露出する部位が汚染されることを防止でき、その結果、適切なワイヤボンディングを行うことができる。   As described above, according to the electronic device 150 of the present embodiment, the adhesive 40 that bonds the wiring substrates 20 and 30 and the support substrate 10 is exposed from the through hole 10 a in the back surface 32 of the second wiring substrate 30. It is possible to prevent the portion to be contaminated from being contaminated, and as a result, appropriate wire bonding can be performed.

また、上述したように、本実施形態の電子装置１５０は、上記図４に示される電子装置１２０において、貫通穴１０ａの周囲に侵入防止部１０ｂ、１０ｃを設けたものであり、この侵入防止部１０ｂ、１０ｃによる上記効果以外にも、上記図４に示される電子装置１２０と同様の効果を奏することは、もちろんである。   Further, as described above, the electronic device 150 according to the present embodiment is the electronic device 120 shown in FIG. 4 described above, in which the intrusion prevention portions 10b and 10c are provided around the through hole 10a. It goes without saying that the same effects as those of the electronic device 120 shown in FIG.

（他の実施形態）
なお、支持基板１０に接着される第１および第２の配線基板２０、３０としては、上記したような制御基板やパワー基板として機能するものに限定されるものではない。 (Other embodiments)
Note that the first and second wiring boards 20 and 30 bonded to the support substrate 10 are not limited to those functioning as the control board and the power board as described above.

また、支持基板１０と取付部１３との形状は、上記図示例に示されるような断面Ｈ型の形状に限定されるものではない。また、取付部１３における被取付部材２００への取付方法もネジ結合以外のものであってもかまわない。   Further, the shapes of the support substrate 10 and the attachment portion 13 are not limited to the H-shaped cross section as shown in the illustrated example. Moreover, the attachment method to the to-be-attached member 200 in the attachment part 13 may be other than screw coupling.

また、貫通穴１０ａの形状は、上記図示例に限定されるものではなく、貫通穴を介したワイヤボンディングができるならばかまわない。また、貫通穴１０ａの数は、上記した放熱性などを考慮した上で、複数個あってもかまわない。   Further, the shape of the through hole 10a is not limited to the above-described example, and any wire bonding can be used as long as the through hole can be bonded. Further, the number of through holes 10a may be plural in consideration of the above-described heat dissipation.

要するに、本発明は、平板状の支持基板と、支持基板の一面側に裏面を対向させて接着された第１の配線基板と、支持基板の他面側に裏面を対向させて接着された第２の配線基板とを備え、第１の配線基板の端部および第２の配線基板の端部を、支持基板に対して接着固定し、支持基板に、一面から他面へ貫通する貫通穴を設け、貫通穴から第２の配線基板の裏面のうち端部よりも内周の部位を露出させ、第１の配線基板の表面と第２の配線基板の裏面とを、貫通穴を介してボンディングワイヤにより結線し電気的に接続したことを要部とするものであり、その他の部分については適宜設計変更が可能である。   In short, the present invention includes a flat support substrate, a first wiring substrate bonded with the back surface facing the one surface side of the support substrate, and a first substrate bonded with the back surface facing the other surface side of the support substrate. 2, and the end portion of the first wiring substrate and the end portion of the second wiring substrate are bonded and fixed to the support substrate, and a through hole penetrating from one surface to the other surface is formed in the support substrate. And exposing a portion of the back surface of the second wiring substrate that is inner peripheral from the end portion through the through hole, and bonding the surface of the first wiring substrate and the back surface of the second wiring substrate through the through hole. The main part is that they are connected by wires and electrically connected, and the other parts can be appropriately changed in design.

本発明の第１実施形態に係る電子装置の概略断面図である。1 is a schematic cross-sectional view of an electronic device according to a first embodiment of the present invention. 図１に示される電子装置の要部の概略平面図である。It is a schematic plan view of the principal part of the electronic device shown by FIG. 本発明の第２実施形態に係る電子装置の要部の概略平面図である。It is a schematic plan view of the principal part of the electronic device which concerns on 2nd Embodiment of this invention. 本発明の第３実施形態に係る電子装置の概略断面図である。It is a schematic sectional drawing of the electronic device which concerns on 3rd Embodiment of this invention. 本発明の第４実施形態に係る電子装置の概略断面図である。It is a schematic sectional drawing of the electronic device which concerns on 4th Embodiment of this invention. 図５に示される電子装置における貫通穴を介したワイヤボンディング方法を示す図である。It is a figure which shows the wire bonding method through the through-hole in the electronic device shown by FIG. 本発明の第５実施形態に係る電子装置の概略断面図である。It is a schematic sectional drawing of the electronic device which concerns on 5th Embodiment of this invention. 図７中に示される接続部材単体の外観斜視図である。It is an external appearance perspective view of the connection member single-piece | unit shown in FIG. 本発明の第６実施形態に係る電子装置の概略断面図である。It is a schematic sectional drawing of the electronic device which concerns on 6th Embodiment of this invention. 従来の電子装置を示す概略断面図である。It is a schematic sectional drawing which shows the conventional electronic device. 従来の電子装置を示す概略断面図である。It is a schematic sectional drawing which shows the conventional electronic device. 従来の電子装置を示す概略断面図である。It is a schematic sectional drawing which shows the conventional electronic device.

符号の説明Explanation of symbols

１０…支持基板、１０ａ…貫通穴、１０ｂ…侵入防止部としての凹部、
１０ｃ…侵入防止部としての凸部、１１…支持基板の一面、１２…支持基板の他面、
１３…取付部、２０…第１の配線基板、２１…第１の配線基板の表面、
２２…第１の配線基板の裏面、３０…第２の配線基板、
３１…第２の配線基板の表面、３２…第２の配線基板の裏面、４０…接着剤、
６０…配線基板間接続用のボンディングワイヤ、７０…接続部材、
２００…被取付部材。 DESCRIPTION OF SYMBOLS 10 ... Support substrate, 10a ... Through-hole, 10b ... Concave part as an intrusion prevention part,
10c ... convex part as an intrusion prevention part, 11 ... one side of the support substrate, 12 ... the other side of the support substrate,
13 ... Mounting portion, 20 ... First wiring board, 21 ... Surface of first wiring board,
22 ... the back surface of the first wiring board, 30 ... the second wiring board,
31 ... Front surface of the second wiring board, 32 ... Back surface of the second wiring board, 40 ... Adhesive,
60: Bonding wire for connection between wiring boards, 70: Connection member,
200: A member to be attached.

Claims (6)

平板状の支持基板（１０）と、
前記支持基板（１０）の一面（１１）側に裏面（２２）を対向させて接着された第１の配線基板（２０）と、
前記支持基板（１０）の他面（１２）側に裏面（３２）を対向させて接着された第２の配線基板（３０）とを備え、
前記第１の配線基板（２０）の端部および前記第２の配線基板（３０）の端部は、前記支持基板（１０）に対して接着固定されており、
前記支持基板（１０）には、前記一面（１１）から前記他面（１２）へ貫通する貫通穴（１０ａ）が設けられており、
前記貫通穴（１０ａ）から、前記第２の配線基板（３０）の裏面（３２）のうち前記端部よりも内周の部位が露出しており、
前記第１の配線基板（２０）の表面（２１）と前記第２の配線基板（３０）の裏面（３２）とは、前記貫通穴（１０ａ）を介してボンディングワイヤ（６０）により結線され、電気的に接続されていることを特徴とする電子装置。 A flat support substrate (10);
A first wiring board (20) bonded with the back surface (22) facing the one surface (11) side of the support substrate (10);
A second wiring substrate (30) bonded to the other surface (12) side of the support substrate (10) with the back surface (32) facing it;
The end of the first wiring board (20) and the end of the second wiring board (30) are bonded and fixed to the support board (10),
The support substrate (10) is provided with a through hole (10a) penetrating from the one surface (11) to the other surface (12),
From the through hole (10a), a portion of the back surface (32) of the second wiring board (30) is exposed from the inner periphery of the end portion,
The front surface (21) of the first wiring substrate (20) and the back surface (32) of the second wiring substrate (30) are connected by a bonding wire (60) through the through hole (10a), An electronic device which is electrically connected. 前記支持基板（１０）は、金属製の放熱板として構成されていることを特徴とする請求項１に記載の電子装置。 The electronic device according to claim 1, wherein the support substrate is configured as a metal heat sink. 前記支持基板（１０）は、被取付部材（２００）に取り付けられる取付部（１３）を有しており、
前記第１および第２の配線基板（２０、３０）にて発生する熱がそれぞれの配線基板（２０、３０）から前記取付部（１３）へ向かって放熱される放熱経路が形成されており、
前記貫通穴（１０ａ）は、前記放熱経路から外れた位置に設けられていることを特徴とする請求項１または２に記載の電子装置。 The support substrate (10) has an attachment portion (13) attached to the attached member (200),
A heat dissipation path is formed in which heat generated in the first and second wiring boards (20, 30) is radiated from the respective wiring boards (20, 30) toward the mounting portion (13),
The electronic device according to claim 1, wherein the through hole (10 a) is provided at a position off the heat dissipation path. 前記貫通穴（１０ａ）は、前記支持基板（１０）の他面（１２）から一面（１１）に向かってテーパ状に径が拡がったものであることを特徴とする請求項１ないし３のいずれか１つに記載の電子装置。 The through hole (10a) has a diameter that tapers from the other surface (12) to the one surface (11) of the support substrate (10). The electronic device as described in any one. 前記貫通穴（１０ａ）の内部には、前記第２の配線基板（３０）の裏面（３２）と電気的に接続された接続部材（７０）が配置されており、
前記接続部材（７０）に対して、前記第１の配線基板（２０）の表面（２１）から前記ボンディングワイヤ（６０）が接続されていることを特徴とする請求項１ないし４のいずれか１つに記載の電子装置。 A connection member (70) electrically connected to the back surface (32) of the second wiring board (30) is disposed inside the through hole (10a),
The bonding wire (60) is connected to the connection member (70) from the surface (21) of the first wiring board (20). The electronic device described in one. 前記支持基板（１０）のうち前記貫通穴（１０ａ）の外周には、前記第１の配線基板（２０）と前記支持基板（１０）とを接着する接着剤（４０）および前記第２の配線基板（３０）と前記支持基板（１０）とを接着する接着剤（４０）が、前記貫通穴（１０ａ）の内部へ侵入するのを防止するための侵入防止部（１０ｂ、１０ｃ）が設けられていることを特徴とする請求項１ないし５のいずれか１つに記載の電子装置。
An adhesive (40) for bonding the first wiring board (20) and the supporting board (10) and the second wiring on the outer periphery of the through hole (10a) in the supporting board (10). Intrusion prevention portions (10b, 10c) are provided for preventing the adhesive (40) for bonding the substrate (30) and the support substrate (10) from entering the inside of the through hole (10a). The electronic device according to claim 1, wherein the electronic device is provided.
JP2005137331A 2005-05-10 2005-05-10 Electronic equipment Expired - Fee Related JP4639937B2 (en)

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JPH08204049A (en) * 1995-01-20 1996-08-09 Sony Corp Manufacture of package for optical component
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