JP2006312775A - めっき装置、めっき方法、及び半導体装置の製造方法 - Google Patents
めっき装置、めっき方法、及び半導体装置の製造方法 Download PDFInfo
- Publication number
- JP2006312775A JP2006312775A JP2005202283A JP2005202283A JP2006312775A JP 2006312775 A JP2006312775 A JP 2006312775A JP 2005202283 A JP2005202283 A JP 2005202283A JP 2005202283 A JP2005202283 A JP 2005202283A JP 2006312775 A JP2006312775 A JP 2006312775A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- solution
- substrate
- anode electrode
- plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 724
- 239000004065 semiconductor Substances 0.000 title claims abstract description 177
- 238000000034 method Methods 0.000 title claims description 93
- 238000004519 manufacturing process Methods 0.000 title claims description 23
- 239000000243 solution Substances 0.000 claims abstract description 330
- 239000008151 electrolyte solution Substances 0.000 claims abstract description 188
- 239000000758 substrate Substances 0.000 claims abstract description 143
- 238000005192 partition Methods 0.000 claims abstract description 91
- 239000010949 copper Substances 0.000 claims description 72
- 229910052802 copper Inorganic materials 0.000 claims description 66
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 65
- 229920002120 photoresistant polymer Polymers 0.000 claims description 50
- 239000003792 electrolyte Substances 0.000 claims description 48
- 239000012528 membrane Substances 0.000 claims description 39
- 150000002500 ions Chemical class 0.000 claims description 30
- 239000007788 liquid Substances 0.000 claims description 29
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 22
- 239000007864 aqueous solution Substances 0.000 claims description 22
- 238000000576 coating method Methods 0.000 claims description 13
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 12
- 229910052698 phosphorus Inorganic materials 0.000 claims description 12
- 239000011574 phosphorus Substances 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000002347 injection Methods 0.000 claims description 7
- 239000007924 injection Substances 0.000 claims description 7
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 4
- 239000003456 ion exchange resin Substances 0.000 claims description 4
- 229920003303 ion-exchange polymer Polymers 0.000 claims description 4
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- 239000007787 solid Substances 0.000 abstract description 32
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- 230000004888 barrier function Effects 0.000 abstract description 7
- 230000000593 degrading effect Effects 0.000 abstract 2
- 230000008569 process Effects 0.000 description 45
- 229910052751 metal Inorganic materials 0.000 description 19
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- 238000011109 contamination Methods 0.000 description 18
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- 230000008020 evaporation Effects 0.000 description 18
- 239000000654 additive Substances 0.000 description 17
- 239000002245 particle Substances 0.000 description 17
- 239000000126 substance Substances 0.000 description 17
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Substances [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 16
- 239000012298 atmosphere Substances 0.000 description 14
- 230000000996 additive effect Effects 0.000 description 13
- 238000005341 cation exchange Methods 0.000 description 13
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- 230000002411 adverse Effects 0.000 description 12
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 11
- -1 copper complex ion Chemical class 0.000 description 11
- 238000005530 etching Methods 0.000 description 11
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 11
- 239000010936 titanium Substances 0.000 description 11
- 229910052719 titanium Inorganic materials 0.000 description 11
- 239000004215 Carbon black (E152) Substances 0.000 description 9
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- 150000002430 hydrocarbons Chemical class 0.000 description 9
- 239000012466 permeate Substances 0.000 description 9
- 229920001155 polypropylene Polymers 0.000 description 9
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 7
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 7
- 229910001431 copper ion Inorganic materials 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
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- 229910000679 solder Inorganic materials 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
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- 230000002093 peripheral effect Effects 0.000 description 5
- 238000004528 spin coating Methods 0.000 description 5
- 239000003011 anion exchange membrane Substances 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 150000001768 cations Chemical class 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 230000007935 neutral effect Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- 229920002449 FKM Polymers 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium peroxydisulfate Substances [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 2
- 150000001450 anions Chemical class 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 235000012489 doughnuts Nutrition 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 231100000989 no adverse effect Toxicity 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Inorganic materials [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- XNMARPWJSQWVGC-UHFFFAOYSA-N 2-[3-[11-[[5-(dimethylamino)naphthalen-1-yl]sulfonylamino]undecanoylamino]propoxy]-4-[(5,5,8,8-tetramethyl-6,7-dihydronaphthalene-2-carbonyl)amino]benzoic acid Chemical compound CC1(C)CCC(C)(C)C=2C1=CC(C(=O)NC=1C=C(C(=CC=1)C(O)=O)OCCCNC(=O)CCCCCCCCCCNS(=O)(=O)C1=C3C=CC=C(C3=CC=C1)N(C)C)=CC=2 XNMARPWJSQWVGC-UHFFFAOYSA-N 0.000 description 1
- 229920001342 Bakelite® Polymers 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 150000004699 copper complex Chemical class 0.000 description 1
- 101150038956 cup-4 gene Proteins 0.000 description 1
- 238000007323 disproportionation reaction Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000000909 electrodialysis Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 239000012510 hollow fiber Substances 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/002—Cell separation, e.g. membranes, diaphragms
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/008—Current shielding devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005202283A JP2006312775A (ja) | 2005-04-08 | 2005-07-11 | めっき装置、めっき方法、及び半導体装置の製造方法 |
| US11/398,637 US20060226018A1 (en) | 2005-04-08 | 2006-04-06 | Plating apparatus, plating method, and method for manufacturing semiconductor device |
| TW095112566A TWI300317B (en) | 2005-04-08 | 2006-04-07 | Plating apparatus, plating method, and method for manufacturing semiconductor device |
| KR1020060031859A KR100756160B1 (ko) | 2005-04-08 | 2006-04-07 | 도금 장치, 도금 방법, 및 반도체 장치의 제조 방법 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005112888 | 2005-04-08 | ||
| JP2005202283A JP2006312775A (ja) | 2005-04-08 | 2005-07-11 | めっき装置、めっき方法、及び半導体装置の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2006312775A true JP2006312775A (ja) | 2006-11-16 |
Family
ID=37082141
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005202283A Pending JP2006312775A (ja) | 2005-04-08 | 2005-07-11 | めっき装置、めっき方法、及び半導体装置の製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20060226018A1 (ko) |
| JP (1) | JP2006312775A (ko) |
| KR (1) | KR100756160B1 (ko) |
| TW (1) | TWI300317B (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113430614A (zh) * | 2020-03-23 | 2021-09-24 | 铠侠股份有限公司 | 阳极化装置 |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8012319B2 (en) * | 2007-11-21 | 2011-09-06 | Texas Instruments Incorporated | Multi-chambered metal electrodeposition system for semiconductor substrates |
| EP2085503A1 (de) * | 2008-01-31 | 2009-08-05 | HDO -Druckguss- und Oberflächentechnik GmbH | Verfahren und Vorrichtung zur Herstellung von Bauteilen |
| US8145749B2 (en) * | 2008-08-11 | 2012-03-27 | International Business Machines Corporation | Data processing in a hybrid computing environment |
| US8141102B2 (en) * | 2008-09-04 | 2012-03-20 | International Business Machines Corporation | Data processing in a hybrid computing environment |
| US7984267B2 (en) * | 2008-09-04 | 2011-07-19 | International Business Machines Corporation | Message passing module in hybrid computing system starting and sending operation information to service program for accelerator to execute application program |
| US8230442B2 (en) * | 2008-09-05 | 2012-07-24 | International Business Machines Corporation | Executing an accelerator application program in a hybrid computing environment |
| US8527734B2 (en) * | 2009-01-23 | 2013-09-03 | International Business Machines Corporation | Administering registered virtual addresses in a hybrid computing environment including maintaining a watch list of currently registered virtual addresses by an operating system |
| US9286232B2 (en) * | 2009-01-26 | 2016-03-15 | International Business Machines Corporation | Administering registered virtual addresses in a hybrid computing environment including maintaining a cache of ranges of currently registered virtual addresses |
| US8843880B2 (en) * | 2009-01-27 | 2014-09-23 | International Business Machines Corporation | Software development for a hybrid computing environment |
| US8255909B2 (en) * | 2009-01-28 | 2012-08-28 | International Business Machines Corporation | Synchronizing access to resources in a hybrid computing environment |
| US9170864B2 (en) * | 2009-01-29 | 2015-10-27 | International Business Machines Corporation | Data processing in a hybrid computing environment |
| US20100191923A1 (en) * | 2009-01-29 | 2010-07-29 | International Business Machines Corporation | Data Processing In A Computing Environment |
| US8001206B2 (en) * | 2009-01-29 | 2011-08-16 | International Business Machines Corporation | Broadcasting data in a hybrid computing environment |
| US8010718B2 (en) * | 2009-02-03 | 2011-08-30 | International Business Machines Corporation | Direct memory access in a hybrid computing environment |
| US8037217B2 (en) * | 2009-04-23 | 2011-10-11 | International Business Machines Corporation | Direct memory access in a hybrid computing environment |
| US8180972B2 (en) * | 2009-08-07 | 2012-05-15 | International Business Machines Corporation | Reducing remote reads of memory in a hybrid computing environment by maintaining remote memory values locally |
| US9417905B2 (en) * | 2010-02-03 | 2016-08-16 | International Business Machines Corporation | Terminating an accelerator application program in a hybrid computing environment |
| US8578132B2 (en) * | 2010-03-29 | 2013-11-05 | International Business Machines Corporation | Direct injection of data to be transferred in a hybrid computing environment |
| TW201213622A (en) * | 2010-09-27 | 2012-04-01 | Pin-Chun Huang | Device and method for electroplating thin board |
| CN104032340B (zh) * | 2013-03-06 | 2018-02-06 | 中国人民解放军装甲兵工程学院 | 金属零部件电刷镀系统及方法 |
| MX368366B (es) | 2015-07-22 | 2019-09-30 | Dipsol Chem | Metodo de electrodeposicion de aleacion de zinc. |
| CN105586630A (zh) * | 2015-12-23 | 2016-05-18 | 南通富士通微电子股份有限公司 | 半导体封装中提升铜磷阳极黑膜品质的方法 |
| US11280021B2 (en) | 2018-04-19 | 2022-03-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of controlling chemical concentration in electrolyte and semiconductor apparatus |
| CN112708910B (zh) * | 2019-10-25 | 2021-11-23 | 联芯集成电路制造(厦门)有限公司 | 电化学电镀方法 |
| US11401624B2 (en) * | 2020-07-22 | 2022-08-02 | Taiwan Semiconductor Manufacturing Company Limited | Plating apparatus and method for electroplating wafer |
| KR20230089907A (ko) | 2021-12-14 | 2023-06-21 | 삼성전자주식회사 | 전도성 액체를 포함하는 도금 장치 및 도금 방법 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2908790B1 (ja) * | 1998-06-12 | 1999-06-21 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | カップ式めっき装置及びそれを用いたウェーハのめっき方法 |
| US6365017B1 (en) * | 1998-09-08 | 2002-04-02 | Ebara Corporation | Substrate plating device |
| KR100637890B1 (ko) * | 1999-07-08 | 2006-10-23 | 가부시키가이샤 에바라 세이사꾸쇼 | 도금장치 및 도금방법 및 도금처리설비 |
| JP3367655B2 (ja) * | 1999-12-24 | 2003-01-14 | 島田理化工業株式会社 | めっき処理装置及びめっき処理方法 |
| US6398926B1 (en) * | 2000-05-31 | 2002-06-04 | Techpoint Pacific Singapore Pte Ltd. | Electroplating apparatus and method of using the same |
| JP2002173794A (ja) * | 2000-12-05 | 2002-06-21 | Electroplating Eng Of Japan Co | カップ式めっき装置 |
| TWI255871B (en) * | 2000-12-20 | 2006-06-01 | Learonal Japan Inc | Electrolytic copper plating solution and process for electrolytic plating using the same |
| JP3821742B2 (ja) * | 2002-03-26 | 2006-09-13 | Ｎｅｃエレクトロニクス株式会社 | メッキ装置及びそれを用いたメッキ液の管理方法 |
| JP3819840B2 (ja) * | 2002-07-17 | 2006-09-13 | 大日本スクリーン製造株式会社 | メッキ装置およびメッキ方法 |
-
2005
- 2005-07-11 JP JP2005202283A patent/JP2006312775A/ja active Pending
-
2006
- 2006-04-06 US US11/398,637 patent/US20060226018A1/en not_active Abandoned
- 2006-04-07 KR KR1020060031859A patent/KR100756160B1/ko not_active IP Right Cessation
- 2006-04-07 TW TW095112566A patent/TWI300317B/zh not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113430614A (zh) * | 2020-03-23 | 2021-09-24 | 铠侠股份有限公司 | 阳极化装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100756160B1 (ko) | 2007-09-05 |
| KR20060107399A (ko) | 2006-10-13 |
| TW200704315A (en) | 2007-01-16 |
| US20060226018A1 (en) | 2006-10-12 |
| TWI300317B (en) | 2008-08-21 |
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