JP2006310689A5 - - Google Patents
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- Publication number
- JP2006310689A5 JP2006310689A5 JP2005134140A JP2005134140A JP2006310689A5 JP 2006310689 A5 JP2006310689 A5 JP 2006310689A5 JP 2005134140 A JP2005134140 A JP 2005134140A JP 2005134140 A JP2005134140 A JP 2005134140A JP 2006310689 A5 JP2006310689 A5 JP 2006310689A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005134140A JP2006310689A (ja) | 2005-05-02 | 2005-05-02 | ダブルアクセス型可撓性回路基板の製造方法 |
TW095115470A TWI384915B (zh) | 2005-05-02 | 2006-05-01 | 雙接達型撓性電路板的製造方法 |
KR1020060039241A KR20060114647A (ko) | 2005-05-02 | 2006-05-01 | 더블 액세스형 가요성 회로기판의 제조방법 |
CN2006100819121A CN1870859B (zh) | 2005-05-02 | 2006-05-08 | 两面露出型可挠性电路板的制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005134140A JP2006310689A (ja) | 2005-05-02 | 2005-05-02 | ダブルアクセス型可撓性回路基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006310689A JP2006310689A (ja) | 2006-11-09 |
JP2006310689A5 true JP2006310689A5 (pt) | 2007-11-22 |
Family
ID=37444381
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005134140A Pending JP2006310689A (ja) | 2005-05-02 | 2005-05-02 | ダブルアクセス型可撓性回路基板の製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2006310689A (pt) |
KR (1) | KR20060114647A (pt) |
CN (1) | CN1870859B (pt) |
TW (1) | TWI384915B (pt) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008288422A (ja) * | 2007-05-18 | 2008-11-27 | Kinsus Interconnect Technology Corp | フレキシブルプリント配線板及びその製造方法 |
US9161712B2 (en) * | 2013-03-26 | 2015-10-20 | Google Inc. | Systems and methods for encapsulating electronics in a mountable device |
TWI577251B (zh) * | 2015-12-01 | 2017-04-01 | 同泰電子科技股份有限公司 | 軟硬複合線路板及其製作方法 |
KR102260412B1 (ko) | 2019-10-02 | 2021-06-02 | 한화솔루션 주식회사 | 더블 어세스 방식의 fpcb 제조방법 |
KR102260413B1 (ko) | 2019-10-02 | 2021-06-02 | 한화솔루션 주식회사 | 더블 어세스 방식의 fpcb 제조방법 |
KR102260416B1 (ko) | 2019-10-02 | 2021-06-02 | 한화솔루션 주식회사 | 더블 어세스 방식의 fpcb 제조방법 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4883744A (en) * | 1988-05-17 | 1989-11-28 | International Business Machines Corporation | Forming a polymide pattern on a substrate |
JPH04206677A (ja) * | 1990-11-30 | 1992-07-28 | Hitachi Chem Co Ltd | ダブルアクセスフレキシブル印刷配線板の製造方法 |
JP3750140B2 (ja) * | 1994-05-10 | 2006-03-01 | 日立化成工業株式会社 | 配線板の製造法 |
JP2869969B2 (ja) * | 1995-04-28 | 1999-03-10 | ソニーケミカル株式会社 | フレキシブル回路基板の製造方法 |
JP3666955B2 (ja) * | 1995-10-03 | 2005-06-29 | 日本メクトロン株式会社 | 可撓性回路基板の製造法 |
JPH10224013A (ja) * | 1997-02-12 | 1998-08-21 | Nippon Mektron Ltd | 回路基板の製造法 |
JP3261064B2 (ja) * | 1997-03-24 | 2002-02-25 | 日本メクトロン株式会社 | 半導体装置用可撓性回路基板の製造法 |
JPH1117331A (ja) * | 1997-06-26 | 1999-01-22 | Nippon Mektron Ltd | 可撓性回路基板の製造法 |
JP3541697B2 (ja) * | 1998-11-20 | 2004-07-14 | ソニーケミカル株式会社 | フレキシブル配線板の製造方法 |
JP2001313451A (ja) * | 2000-04-28 | 2001-11-09 | Nitto Denko Corp | フレキシブル配線板の製造方法 |
JP4459406B2 (ja) * | 2000-07-27 | 2010-04-28 | ソニーケミカル&インフォメーションデバイス株式会社 | フレキシブル配線板製造方法 |
JP2002156758A (ja) * | 2000-11-16 | 2002-05-31 | Ube Ind Ltd | 感光性ポリイミドを用いた高密度フレキシブル基板の製法 |
JP4570799B2 (ja) * | 2001-02-16 | 2010-10-27 | 日東電工株式会社 | 配線回路基板の製造方法 |
JP4673507B2 (ja) * | 2001-06-29 | 2011-04-20 | オプトレックス株式会社 | フレキシブル配線基板の位置合わせ方法 |
-
2005
- 2005-05-02 JP JP2005134140A patent/JP2006310689A/ja active Pending
-
2006
- 2006-05-01 KR KR1020060039241A patent/KR20060114647A/ko not_active Application Discontinuation
- 2006-05-01 TW TW095115470A patent/TWI384915B/zh not_active IP Right Cessation
- 2006-05-08 CN CN2006100819121A patent/CN1870859B/zh not_active Expired - Fee Related
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