JP2006302940A5 - - Google Patents

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Publication number
JP2006302940A5
JP2006302940A5 JP2005118223A JP2005118223A JP2006302940A5 JP 2006302940 A5 JP2006302940 A5 JP 2006302940A5 JP 2005118223 A JP2005118223 A JP 2005118223A JP 2005118223 A JP2005118223 A JP 2005118223A JP 2006302940 A5 JP2006302940 A5 JP 2006302940A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2005118223A
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JP2006302940A (ja
JP4836483B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2005118223A priority Critical patent/JP4836483B2/ja
Priority claimed from JP2005118223A external-priority patent/JP4836483B2/ja
Priority to US11/404,934 priority patent/US7768102B2/en
Publication of JP2006302940A publication Critical patent/JP2006302940A/ja
Publication of JP2006302940A5 publication Critical patent/JP2006302940A5/ja
Application granted granted Critical
Publication of JP4836483B2 publication Critical patent/JP4836483B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2005118223A 2005-04-15 2005-04-15 半導体装置 Expired - Fee Related JP4836483B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005118223A JP4836483B2 (ja) 2005-04-15 2005-04-15 半導体装置
US11/404,934 US7768102B2 (en) 2005-04-15 2006-04-14 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005118223A JP4836483B2 (ja) 2005-04-15 2005-04-15 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011119228A Division JP2011171766A (ja) 2011-05-27 2011-05-27 半導体装置

Publications (3)

Publication Number Publication Date
JP2006302940A JP2006302940A (ja) 2006-11-02
JP2006302940A5 true JP2006302940A5 (ja) 2008-03-27
JP4836483B2 JP4836483B2 (ja) 2011-12-14

Family

ID=37107716

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005118223A Expired - Fee Related JP4836483B2 (ja) 2005-04-15 2005-04-15 半導体装置

Country Status (2)

Country Link
US (1) US7768102B2 (ja)
JP (1) JP4836483B2 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8552543B2 (en) * 2006-11-13 2013-10-08 International Rectifier Corporation Semiconductor package
JP5830958B2 (ja) * 2011-06-23 2015-12-09 日産自動車株式会社 半導体モジュール
US9171804B2 (en) 2012-11-19 2015-10-27 Infineon Technologies Ag Method for fabricating an electronic component
DE102014115770B4 (de) 2014-10-30 2018-03-29 Infineon Technologies Ag Verfahren zur verbindung eines substrats
US9496193B1 (en) * 2015-09-18 2016-11-15 Infineon Technologies Ag Semiconductor chip with structured sidewalls
US11251152B2 (en) 2020-03-12 2022-02-15 Diodes Incorporated Thinned semiconductor chip with edge support
US11133246B1 (en) * 2020-03-24 2021-09-28 Vanguard International Semiconductor Corporation Semiconductor structure employing conductive paste on lead frame

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04293268A (ja) * 1991-03-22 1992-10-16 Sharp Corp 半導体装置とその製造方法
US5171703A (en) * 1991-08-23 1992-12-15 Intel Corporation Device and substrate orientation for defect reduction and transistor length and width increase
JPH0620984A (ja) * 1992-06-29 1994-01-28 Toyota Motor Corp 半導体装置の裏面電極形成方法
US6104062A (en) * 1998-06-30 2000-08-15 Intersil Corporation Semiconductor device having reduced effective substrate resistivity and associated methods
US6335546B1 (en) * 1998-07-31 2002-01-01 Sharp Kabushiki Kaisha Nitride semiconductor structure, method for producing a nitride semiconductor structure, and light emitting device
US6406636B1 (en) * 1999-06-02 2002-06-18 Megasense, Inc. Methods for wafer to wafer bonding using microstructures
JP3215686B2 (ja) * 1999-08-25 2001-10-09 株式会社日立製作所 半導体装置及びその製造方法
JP2002029057A (ja) * 2000-07-18 2002-01-29 Casio Comput Co Ltd インクジェットプリントヘッド
ATE463462T1 (de) * 2000-10-09 2010-04-15 Imec Verfahren zur herstellung von mikrobearbeiteten anordnungen
JP3531613B2 (ja) * 2001-02-06 2004-05-31 株式会社デンソー トレンチゲート型半導体装置及びその製造方法

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