JP2006302940A5 - - Google Patents
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- Publication number
- JP2006302940A5 JP2006302940A5 JP2005118223A JP2005118223A JP2006302940A5 JP 2006302940 A5 JP2006302940 A5 JP 2006302940A5 JP 2005118223 A JP2005118223 A JP 2005118223A JP 2005118223 A JP2005118223 A JP 2005118223A JP 2006302940 A5 JP2006302940 A5 JP 2006302940A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005118223A JP4836483B2 (ja) | 2005-04-15 | 2005-04-15 | 半導体装置 |
US11/404,934 US7768102B2 (en) | 2005-04-15 | 2006-04-14 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005118223A JP4836483B2 (ja) | 2005-04-15 | 2005-04-15 | 半導体装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011119228A Division JP2011171766A (ja) | 2011-05-27 | 2011-05-27 | 半導体装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2006302940A JP2006302940A (ja) | 2006-11-02 |
JP2006302940A5 true JP2006302940A5 (ja) | 2008-03-27 |
JP4836483B2 JP4836483B2 (ja) | 2011-12-14 |
Family
ID=37107716
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005118223A Expired - Fee Related JP4836483B2 (ja) | 2005-04-15 | 2005-04-15 | 半導体装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7768102B2 (ja) |
JP (1) | JP4836483B2 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8552543B2 (en) * | 2006-11-13 | 2013-10-08 | International Rectifier Corporation | Semiconductor package |
JP5830958B2 (ja) * | 2011-06-23 | 2015-12-09 | 日産自動車株式会社 | 半導体モジュール |
US9171804B2 (en) | 2012-11-19 | 2015-10-27 | Infineon Technologies Ag | Method for fabricating an electronic component |
DE102014115770B4 (de) | 2014-10-30 | 2018-03-29 | Infineon Technologies Ag | Verfahren zur verbindung eines substrats |
US9496193B1 (en) * | 2015-09-18 | 2016-11-15 | Infineon Technologies Ag | Semiconductor chip with structured sidewalls |
US11251152B2 (en) | 2020-03-12 | 2022-02-15 | Diodes Incorporated | Thinned semiconductor chip with edge support |
US11133246B1 (en) * | 2020-03-24 | 2021-09-28 | Vanguard International Semiconductor Corporation | Semiconductor structure employing conductive paste on lead frame |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04293268A (ja) * | 1991-03-22 | 1992-10-16 | Sharp Corp | 半導体装置とその製造方法 |
US5171703A (en) * | 1991-08-23 | 1992-12-15 | Intel Corporation | Device and substrate orientation for defect reduction and transistor length and width increase |
JPH0620984A (ja) * | 1992-06-29 | 1994-01-28 | Toyota Motor Corp | 半導体装置の裏面電極形成方法 |
US6104062A (en) * | 1998-06-30 | 2000-08-15 | Intersil Corporation | Semiconductor device having reduced effective substrate resistivity and associated methods |
US6335546B1 (en) * | 1998-07-31 | 2002-01-01 | Sharp Kabushiki Kaisha | Nitride semiconductor structure, method for producing a nitride semiconductor structure, and light emitting device |
US6406636B1 (en) * | 1999-06-02 | 2002-06-18 | Megasense, Inc. | Methods for wafer to wafer bonding using microstructures |
JP3215686B2 (ja) * | 1999-08-25 | 2001-10-09 | 株式会社日立製作所 | 半導体装置及びその製造方法 |
JP2002029057A (ja) * | 2000-07-18 | 2002-01-29 | Casio Comput Co Ltd | インクジェットプリントヘッド |
ATE463462T1 (de) * | 2000-10-09 | 2010-04-15 | Imec | Verfahren zur herstellung von mikrobearbeiteten anordnungen |
JP3531613B2 (ja) * | 2001-02-06 | 2004-05-31 | 株式会社デンソー | トレンチゲート型半導体装置及びその製造方法 |
-
2005
- 2005-04-15 JP JP2005118223A patent/JP4836483B2/ja not_active Expired - Fee Related
-
2006
- 2006-04-14 US US11/404,934 patent/US7768102B2/en not_active Expired - Fee Related
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