JP2006289522A5 - - Google Patents

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JP2006289522A5
JP2006289522A5 JP2005109990A JP2005109990A JP2006289522A5 JP 2006289522 A5 JP2006289522 A5 JP 2006289522A5 JP 2005109990 A JP2005109990 A JP 2005109990A JP 2005109990 A JP2005109990 A JP 2005109990A JP 2006289522 A5 JP2006289522 A5 JP 2006289522A5
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Japan
Prior art keywords
surface plate
pad
roller
roller body
polishing
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JP2005109990A
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Japanese (ja)
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JP2006289522A (en
JP4584755B2 (en
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Priority to JP2005109990A priority Critical patent/JP4584755B2/en
Priority claimed from JP2005109990A external-priority patent/JP4584755B2/en
Publication of JP2006289522A publication Critical patent/JP2006289522A/en
Publication of JP2006289522A5 publication Critical patent/JP2006289522A5/ja
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キャリヤに保持されたワークを両側から挟んで研磨する上定盤及び下定盤と、上記キャリヤを駆動するためのサンギヤ及びインターナルギヤとを備えた両面研磨装置において用いられ、上記上定盤及び/又は下定盤の円環状をしたパッド貼着面に円環状の研磨パッドを貼着するための加圧ローラであって、
該加圧ローラが、上記パッド貼着面の幅と同等以上の長さを有する円柱形のローラ本体と、該ローラ本体を回転自在に支持するローラ軸と、該ローラ軸の両端にそれぞれ形成された係止部とを有していて、これらの係止部が、上記ローラ軸の両端に個別に取り付けられた互いに独立するブロック形の部材により、上記研磨装置における下定盤の内外周側に設けられた係止受部にそれぞれ係止可能なるように形成され、これらの係止部を上記係止受部に係止させることにより、該研磨装置に対し、上記ローラ本体が定盤の半径方向に位置して研磨パッドに全幅にわたり当接するように取付可能であることを特徴とする両面研磨装置における研磨パッド貼着用加圧ローラ。
Used in a double-side polishing apparatus comprising an upper surface plate and a lower surface plate for sandwiching a work held by a carrier from both sides, and a sun gear and an internal gear for driving the carrier. Or a pressure roller for adhering an annular polishing pad to the annular pad adhering surface of the lower surface plate,
The pressure roller is formed on a cylindrical roller body having a length equal to or greater than the width of the pad attaching surface, a roller shaft that rotatably supports the roller body, and both ends of the roller shaft. These locking portions are provided on the inner and outer peripheral sides of the lower surface plate in the polishing apparatus by independent block-shaped members individually attached to both ends of the roller shaft. It was being respectively formed so as lockable become lock receiving portion, by these locking portion to be locked in the locking receiving portion, with respect to the polishing apparatus, the radial direction of the roller body plate A pressure roller for adhering a polishing pad in a double-side polishing apparatus, wherein the pressure roller can be mounted so as to be in contact with the polishing pad over the entire width.
キャリヤに保持されたワークを両側から挟んで研磨する上定盤及び下定盤と、上記キャリヤを駆動するためのサンギヤ及びインターナルギヤと、上定盤及び/又は下定盤の円環状をしたパッド貼着面に円環状の研磨パッドを貼着するための加圧ローラとを有し、An upper surface plate and a lower surface plate for polishing by sandwiching the work held by the carrier from both sides, a sun gear and an internal gear for driving the carrier, and an annular pad attachment of the upper surface plate and / or the lower surface plate A pressure roller for attaching an annular polishing pad to the wearing surface;
上記加圧ローラは、上記パッド貼着面の幅と同等以上の長さを有する円柱形のローラ本体と、該ローラ本体を回転自在に支持するローラ軸と、該ローラ軸の両端にそれぞれ形成された係止部とを有していて、これらの係止部が、上記ローラ軸の両端に個別に取り付けられた互いに独立するブロック形の部材により、上記下定盤の内外周側に設けられた係止受部にそれぞれ係止可能なるように形成され、The pressure roller is formed on a cylindrical roller body having a length equal to or greater than the width of the pad adhering surface, a roller shaft that rotatably supports the roller body, and both ends of the roller shaft. Engaging portions provided on the inner and outer peripheral sides of the lower surface plate by independent block-shaped members individually attached to both ends of the roller shaft. It is formed so that it can be locked to the stopper part,
上記上定盤及び/又は下定盤のパッド貼着面に研磨パッドを仮接着したあと、上記加圧ローラを上下の定盤間に半径方向に介在させてローラ本体を研磨パッドに全幅にわたり当接させると共に、ローラ軸の両端の係止部を下定盤の内外周側の係止受部にそれぞれ係止させ、上定盤で荷重を加えた状態にして上下の定盤を互いに逆向きに回転させることにより、上記ローラ本体を定盤の回転に追随させて従動回転させながら、該ローラ本体によって上記研磨パッドをパッド貼着面に圧着させるように構成されていることを特徴とする両面研磨装置。After temporarily bonding the polishing pad to the pad attachment surface of the upper and / or lower surface plate, the pressure roller is interposed between the upper and lower surface plates in the radial direction so that the roller body contacts the polishing pad over the entire width. At the same time, the locking parts at both ends of the roller shaft are locked to the locking receiving parts on the inner and outer circumferences of the lower surface plate, and the upper and lower surface plates are rotated in opposite directions with a load applied on the upper surface plate. The double-side polishing apparatus is configured to press the polishing pad against the pad adhering surface by the roller body while causing the roller body to follow and rotate following the rotation of the surface plate. .
キャリヤに保持されたワークを両側から挟んで研磨する上定盤及び下定盤と、上記キャリヤを駆動するためのサンギヤ及びインターナルギヤとを備えた両面研磨装置において、上記上定盤及び/又は下定盤の円環状をしたパッド貼着面に円環状の研磨パッドを貼着するための方法であって、
上記パッド貼着面の幅と同等以上の長さを有する円柱形のローラ本体と、該ローラ本体を回転自在に支持するローラ軸と、該ローラ軸の両端にそれぞれ形成された係止部とを有し、これらの係止部が上記ローラ軸の両端に個別に取り付けられた互いに独立するブロック形の部材により形成されていて、上記研磨装置に対して着脱自在である複数の加圧ローラを使用し、
上記上定盤及び/又は下定盤のパッド貼着面に研磨パッドを仮接着したあと、上記加圧ローラを上下の定盤間に半径方向に介在させてローラ本体を研磨パッドに全幅にわたり当接させると共に、上記ローラ軸の両端の係止部を下定盤の内外周側に設けられた係止受部にそれぞれ係止させ、上定盤で荷重を加えた状態にして上下の定盤を互いに逆向きに回転させることにより、上記ローラ本体を定盤の回転に追随させて従動回転させながら、該ローラ本体によって上記研磨パッドをパッド貼着面に圧着させることを特徴とする両面研磨装置における研磨パッドの貼着方法。
In a double-side polishing apparatus comprising an upper surface plate and a lower surface plate for sandwiching a work held by a carrier from both sides, and a sun gear and an internal gear for driving the carrier, the upper surface plate and / or the lower surface plate A method for adhering an annular polishing pad to an annular pad adhering surface of a board,
A cylindrical roller body having a length equal to or greater than the width of the pad adhering surface, a roller shaft that rotatably supports the roller body, and a locking portion formed at each end of the roller shaft. These locking parts are formed by mutually independent block-shaped members individually attached to both ends of the roller shaft, and a plurality of pressure rollers that are detachable from the polishing apparatus are used. And
After temporarily bonding the polishing pad to the pad attachment surface of the upper and / or lower surface plate, the pressure roller is interposed between the upper and lower surface plates in the radial direction so that the roller body contacts the polishing pad over the entire width. At the same time , the upper and lower surface plates are brought into contact with each other by engaging the engagement portions at both ends of the roller shaft with the engagement receiving portions provided on the inner and outer peripheral sides of the lower surface plate , and applying a load on the upper surface plate. Polishing in a double-side polishing apparatus characterized in that, by rotating in the reverse direction, the roller body follows the rotation of the surface plate and is driven to rotate, and the polishing pad is pressed against the pad attachment surface by the roller body. How to stick the pad.
JP2005109990A 2005-04-06 2005-04-06 Pressure roller for attaching polishing pad in double-side polishing apparatus, and method for attaching polishing pad with pressure roller Active JP4584755B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005109990A JP4584755B2 (en) 2005-04-06 2005-04-06 Pressure roller for attaching polishing pad in double-side polishing apparatus, and method for attaching polishing pad with pressure roller

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005109990A JP4584755B2 (en) 2005-04-06 2005-04-06 Pressure roller for attaching polishing pad in double-side polishing apparatus, and method for attaching polishing pad with pressure roller

Publications (3)

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JP2006289522A JP2006289522A (en) 2006-10-26
JP2006289522A5 true JP2006289522A5 (en) 2008-05-01
JP4584755B2 JP4584755B2 (en) 2010-11-24

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016222063A1 (en) * 2016-11-10 2018-05-17 Siltronic Ag Method for polishing both sides of a semiconductor wafer
JP2021181138A (en) * 2020-05-19 2021-11-25 信越半導体株式会社 Abrasive pad sticking method for double-sided grinding device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5939163U (en) * 1982-09-06 1984-03-13 株式会社東芝 Abrasive cloth cleaning device
JPS62102974A (en) * 1985-10-29 1987-05-13 Hoya Corp Working pad and flattening machine
JPH0642059U (en) * 1992-11-16 1994-06-03 千代田株式会社 Surface plate for attaching polishing cloth of polishing machine
JP4041577B2 (en) * 1998-03-16 2008-01-30 スピードファム株式会社 Surface plate of polishing apparatus and polishing pad attaching method
JPH11300599A (en) * 1998-04-23 1999-11-02 Speedfam-Ipec Co Ltd Method and device for grinding one side of work
JP4023247B2 (en) * 2002-03-27 2007-12-19 住友電気工業株式会社 Attaching the polishing cloth to the surface plate
JP2004017188A (en) * 2002-06-13 2004-01-22 Nikon Corp Sticking device for abrasive block and method for the same, abrasive device using abrasive member produced by the device or the method, production method for semiconductor device using abrasive device and semiconductor device produced by production method for semiconductor device

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