JP4041577B2 - Surface plate of polishing apparatus and polishing pad attaching method - Google Patents

Surface plate of polishing apparatus and polishing pad attaching method Download PDF

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Publication number
JP4041577B2
JP4041577B2 JP8491898A JP8491898A JP4041577B2 JP 4041577 B2 JP4041577 B2 JP 4041577B2 JP 8491898 A JP8491898 A JP 8491898A JP 8491898 A JP8491898 A JP 8491898A JP 4041577 B2 JP4041577 B2 JP 4041577B2
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pad
surface plate
polishing
protective
plate
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JPH11262855A (en
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駿二 箱守
正文 大西
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SpeedFam Co Ltd
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SpeedFam Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0072—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using adhesives for bonding abrasive particles or grinding elements to a support, e.g. by gluing

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Description

【０００１】
【発明の属する技術分野】
この発明は、ウエハ等のワークを鏡面研磨するポリッシング装置に用いられるポリッシング装置の定盤及び研磨パッド貼着方法に関するものである。
【０００２】
【従来の技術】
ポリッシング装置は、研磨パッドが貼り付けられた定盤上にウエハ等のワークを押し付け、定盤とワークとを回転させることで、ワークの表面を研磨パッドで鏡面研磨する装置である。
このようなポリッシング装置では、酸性やアルカリ性のスラリを用いて、ワークを化学的機械的に研磨する。
したがって、ステンレスや鋳物で形成された定盤を裸で使用すると、スラリによって定盤がさびる等して、ワークを傷付けるおそれがある。
例えば、鋳物の定盤の上に弱アルカリ性のスラリを供給すると、定盤の回転によってこのスラリが定盤の周面に流れ、この周面にさびが発生し、ワークがこのさびによって傷付いたり、汚染されたりする。また、ステンレス製の定盤に酸性のスラリを供給した場合には、このスラリとステンレスとの反応によって、定盤の周面にニッケル等が溶出して、ワークが汚染される。また、このニッケル等がワーク内に入り込んで、ワークが使い物にならなくなるおそれもある。
そこで、従来は、研磨パッドを貼着する面を除く定盤の表面を塗装し、又はテフロンコーティングして、研磨作業時におけるスラリと定盤との化学反応を未然に防止する技術を採っていた。
【０００３】
【発明が解決しようとする課題】
しかし、上記した従来のポリッシング装置の定盤では、次のような問題があった。
図６は、従来の研磨パッド貼着方法を示す断面図であり、図６の（ａ）は原反の研磨パッドを定盤に貼り付けた状態を示し、図６の（ｂ）は研磨パッドを定盤の形状に沿ってカットした状態を示す。
図６の（ａ）において、符号１が定盤であり、この定盤１は両面ポリッシング装置に用いられる定盤であり、全体としてドーナッツ状をなしている。
そしてこの定盤１のパッド貼着面１０を除く表面には、塗装やテフロンコーティングによる保護膜２が形成されている。
このような定盤１のパッド貼着面１０上に研磨パッド３を貼り付ける場合には、定盤１よりも大きな原反の研磨パッド３をパッド貼着面１０上に接着剤等で接着した後、図６の（ｂ）に示すように、カッタナイフ４によって研磨パッド３を定盤１の上外縁１１や上内縁１２に沿って裁断する。
しかしながら、上記裁断作業の際、カッタナイフ４の刃部４０を定盤１のパッド貼着面１０や上外縁１１に押し当てながら、研磨パッド３を切っていくので、保護膜２がカッタナイフ４の刃部４０によって傷付けられ、定盤１が露出する事態が生じるおそれがある。
このため、研磨パッド３を裁断するには、相当の熟練と時間を要し、一般の作業者が研磨パッド３の貼着及び裁断作業を容易且つ短時間に行うことは困難であった。
【０００４】
この発明は上述した課題を解決するためになされたもので、研磨パッドの定盤への貼着及び裁断を熟練者でなくとも容易且つ短時間で行うことができるポリッシング装置の定盤及び研磨パッド貼着方法を提供することを目的とするものである。
【０００５】
【課題を解決するための手段】
上記課題を解決するために、請求項１の発明は、パッド貼着面に研磨パッドが貼り付けられるドーナッツ状のポリッシング装置の定盤において、パッド貼着面を露出させた状態で定盤の外周面，内周面及び底面を覆う保護膜と、パッド貼着面と平行なパッド当接面を有し且つこのパッド当接面がパッド貼着面と面一になるように保護膜の外側から定盤の外周面に嵌着されたスラリ非反応性素材製の大径の保護リングと、パッド貼着面と平行なパッド当接面を有し且つこのパッド当接面がパッド貼着面と面一になるように保護膜の外側から定盤の内周面に嵌着されたスラリ非反応性素材製の小径の保護リングとを具備する構成とした。
かかる構成により、定盤のパッド貼着面に貼り付けられた原反の研磨パッドをカッタナイフ等で保護リングの周面に沿って裁断すれば、カッタナイフ等による傷は保護リングにのみ付き、保護膜に付くことはない。
【０００６】
また、請求項２の発明は、請求項１に記載のポリッシング装置の定盤において、各保護リングを、所定の合成樹脂で形成した構成としてある。
なお、保護リングは、スラリと化学反応を生じないスラリ非反応性素材であることを要する。この素材は上記性質を有している限り任意であるが、その好例として、請求項３の発明は、請求項２に記載のポリッシング装置の定盤において、合成樹脂は、エポキシ樹脂，不飽和ポリエステル樹脂，メラミン樹脂，ポリ塩化ビニル，フッ素樹脂，ポリアセタール，ポリアミド，低密度ポリエチレン，ポリエステル樹脂，ポリカーポネート，ポリプロピレン，メタクリル樹脂，及びポリ塩化ビニリデンのいずれかである構成とした。
【０００７】
また、請求項４の発明は、請求項１ないし請求項３のいずれかに記載のポリッシング装置の定盤において、各保護リングのパッド当接面と連続し且つ外方に所定角度で傾斜する斜面を各保護リングの周面に形成した構成としてある。
かかる構成により、保護リングの斜面にカッタナイフ等を当て、この斜面に沿って移動させていくだけで研磨パッドを裁断することができる。
【０００８】
さらに、上記保護リングを利用して研磨パッドを貼着する方法についても発明として捉えることができる。
そこで、請求項５の発明に係る研磨パッド貼着方法は、パッド貼着面を露出させた状態で外周面，内周面及び底面が保護膜で覆われた定盤の外周面に、パッド貼着面と平行なパッド当接面を有するスラリ非反応性素材製の大径の保護リングをパッド当接面がパッド貼着面と面一になるように嵌着させる第１の工程と、定盤の内周面に、パッド貼着面と平行なパッド当接面を有するスラリ非反応性素材製の小径の保護リングをパッド当接面がパッド貼着面と面一になるように嵌着させる第２の工程と、第１及び第２の工程を経た定盤よりも大きい原反の研磨パッドをパッド貼着面及び各保護リングのパッド当接面に貼り付ける第３の工程と、各保護リングの周面に沿って研磨パッドを裁断する第４の工程とを具備する構成とした。
また、請求項６の発明は、請求項５に記載の研磨パッド貼着方法において、第１及び第２の工程における各保護リングは、各保護リングのパッド当接面と連続し且つ外方に所定角度で傾斜する斜面をその周面に有し、第４の工程は、各保護リングの斜面に沿って研磨パッドを裁断するものである構成とした。
【０００９】
【発明の実施の形態】
以下、この発明の実施の形態について図面を参照して説明する。
図１は、この発明の一実施形態に係るポリッシング装置の定盤の研磨パッド非貼着状態を示す斜視図であり、図２は、図１の矢視Ａ−Ａ断面図である。なお、図６に示した部材と同一部材については同一符号を付して説明する。
【００１０】
図１及び図２に示すように、定盤１は、両面ポリッシング装置に用いられる例えば外径２１９０ｍｍの大径の定盤であり、ドーナッツ状に形成されている。
この定盤１の表面には保護膜２が塗装されている。
具体的には、定盤１の外周面１３，内周面１４及び底面１５が保護膜２によって隙間なく覆われ、パッド貼着面１０のみが露出している。
【００１１】
そして、このように保護膜２で覆われた定盤１の外周面１３及び内周面１４の上部には大径の保護リング５と小径の保護リング６とが嵌着されている。
保護リング５，６は共にスラリ非反応性素材であるテフロン（フッ素樹脂）で形成されており、保護リング５の内径は定盤１の外周面１３の径と略等しく、保護リング６の外径は定盤１の内周面１４の径と略等しく設定されている。
これら保護リング５，６は、定盤１のパッド貼着面１０と平行なパッド当接面５０，６０を有しており、これらのパッド当接面５０，６０がパッド貼着面１０と面一になるように位置決めされた状態でビス５１，６１にて定盤１に固定されている。
また、保護リング５の外周面側と保護リング６の内周面側には、パッド当接面５０，６０にそれぞれ連続し、外方に約３０゜で傾斜する斜面５２，６２が形成されている。
【００１２】
上記構造の定盤１に研磨パッドを貼り付ける作業は、次のようにして行う。
図３は、定盤１への研磨パッド貼着方法を示す順工程図である。
まず、図３の（ａ）に示すように、定盤１よりも大きな原反の研磨パッド３を接着剤にてパッド貼着面１０上に貼り付ける。
しかる後、図３の（ｂ）に示すように、カッタナイフ４の刃部４０を研磨パッド３に切り込み、刃部４０を横向きにして保護リング５の斜面５２に当て、刃部４０と斜面５２との当接状態を維持するようにして、研磨パッド３を切っていくことで、図３の（ｃ）に示すように、研磨パッド３の外縁が定盤１の外形に対応した形状に裁断される。
定盤１の中心孔に位置する研磨パッド３の部位を裁断する場合も同様であり、図３の（ｂ）に示すように、カッタナイフ４の刃部４０を保護リング６の斜面６２に当接させながら研磨パッド３を切っていくことで、図３の（ｃ）に示すように、研磨パッド３の中心部分が定盤１の中心孔に対応した形状で裁断される。
【００１３】
ところで、熟練者でない者がこのような裁断作業を行うと、カッタナイフ４の刃部４０を研磨パッド３に切り込む際や斜面５２，６２に沿って研磨パッド３を切っていく際に、刃部４０の刃先を保護膜２に向けた状態で保護膜２側に移動させるような動作が生じることがある。
このような動作が行われると、図６に示した従来の定盤では、カッタナイフ４の刃先が保護膜２に触れて、保護膜２を削り取る等の事態が生じる。このため、刃先の向きに注意を払いながら作業を続けなければならず、作業時間が長くなってしまう。
しかし、この実施形態では保護リング５，６が設けられているので、図４に示すようにカッタナイフ４の刃先の移動を保護リング５，６が受ける。したがって、保護リング５，６にのみ傷が付くだけであるので、作業者が刃先の向きに注意を払う必要がない。
【００１４】
このように、この実施形態の定盤によれば、保護リング５，６に斜面５２，６２が形成されているので、作業者は保護リング５，６の斜面５２，６２をガイドにして研磨パッド３を切っていくことだけで、研磨パッド３を正確に裁断することができ、裁断作業が非常に楽である。
また、カッタナイフ４の刃先の向きに注意を払うことなく、研磨パッド３を裁断することができるので、熟練者でない者でも容易且つ短時間で研磨パッド３の裁断作業を行うことができる。
【００１５】
最後に、この実施形態の定盤を用いた両面ポリッシング装置の鏡面加工動作について説明する。
図５は、両面ポリッシング装置の断面図である。
図３の（ｃ）に示した研磨パッド３を貼着した２枚の定盤１のうち一方の定盤１（１−１）を上向きにして、図５に示すように、定盤回転体７０上に固定すると共に、他方の定盤１（１−２）を下向きにして回転軸７１に連結させる。
しかる後、ウエハＷを保持したキャリア７２を定盤１−１の研磨パッド３上に載置すると共にその歯部をサンギア７３とインターナルギア７４に噛合させた状態で、サンギア７３，インターナルギア７４を回転させることにより、キャリア７２が自転しながらサンギア７３の周りを公転する。
そして、定盤１−２でウエハＷを押圧すると共に定盤１−１，１−２を互いに逆方向に回転させながらスラリを供給することで、ウエハＷの両面が定盤１−１，１−２の研磨パッド３によって鏡面加工される。
【００１６】
このとき、定盤１−１，１−２の回転によってスラリが定盤１−１，１−２の外周面１３や内周面１４側に流出し、保護リング５，６の表面に付着する。したがって、スラリの保護リング５，６への付着状態が長時間続くとスラリが乾燥して砥粒Ｓが図に示すように保護リング５，６に固着した状態となる。特に、上の定盤１−２の保護リング５，６に砥粒Ｓが固着すると、振動によって砥粒塊が剥がれて定盤１−１，１−２の間に入り込み、ウエハＷに傷を付けるおそれがある。
しかし、この実施形態では、保護リング５，６を表面が滑らかなテフロンで形成したので、スラリが保護リング５，６に付着しても、短時間で保護リング５，６から流れ落ちる。したがって、上記のようにスラリが乾燥して砥粒が保護リング５，６に固着するという事態は生じない。
【００１７】
なお、この発明は、上記実施形態に限定されるものではなく、発明の要旨の範囲内において種々の変形や変更が可能である。
例えば、上記実施形態では、発明をドーナッツ状の定盤１について適用したが、中心孔が円盤状の定盤についても適用することができることは勿論である。
また、定盤１が約２１９０ｍｍという大径の定盤であることから、塗装によって保護膜２を形成したが、小径の定盤の場合には、テフロンコーティングによって保護膜２を形成することができる。
また、上記実施形態では、保護リング５，６をテフロンで形成したが、片面ポリッシング装置のように、下方に１枚の定盤のみを有する装置に定盤１を用いうる場合には、スラリの砥粒の固着という問題は生じないので、保護リング５，６を塩化ビニル等で形成してもよい。
さらに、保護リング５，６に斜面５２，６２を設けたが、斜面５２，６２が無い断面矩形状の保護リング５，６を除外するものではない。
【００１８】
【発明の効果】
以上詳しく説明したように、請求項１ないし請求項３及び請求項５の発明によれば、研磨パッド裁断時におけるカッタナイフ等による傷はスラリ非反応性素材製の保護リングにのみ付き、保護膜に付くことはないので、熟練していない一般の作業者でも容易且つ短時間で研磨パッドの裁断作業を行うことができるという優れた効果がある。
また、請求項４及び請求項６の発明によれば、保護リングの斜面にカッタナイフ等を当てて研磨パッドを裁断することができるので、研磨パッドの裁断を容易且つ正確に行うことができるという効果がある。
【図面の簡単な説明】
【図１】この発明の一実施形態に係るポリッシング装置の定盤の研磨パッド非貼着状態を示す斜視図である。
【図２】図１の矢視Ａ−Ａ断面図である。
【図３】定盤への研磨パッド貼着方法を示す順工程図である。
【図４】カッタナイフの刃先が保護リングに当たった状態を示す断面図である。
【図５】両面ポリッシング装置の断面図である。
【図６】従来の研磨パッド貼着方法を示す断面図である。
【符号の説明】
１…定盤、 ２…保護膜、 ３…研磨パッド、 ４…カッタナイフ、 ５，６…保護リング、 ５０，６０…パッド当接面、 ５２，６２…斜面。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a surface plate of a polishing apparatus used in a polishing apparatus for mirror polishing a workpiece such as a wafer and a polishing pad attaching method.
[0002]
[Prior art]
The polishing apparatus is an apparatus for mirror-polishing the surface of a workpiece with a polishing pad by pressing a workpiece such as a wafer on a surface plate to which a polishing pad is attached and rotating the surface plate and the workpiece.
In such a polishing apparatus, the workpiece is chemically and mechanically polished using an acidic or alkaline slurry.
Therefore, if a surface plate made of stainless steel or casting is used bare, the surface plate may be rusted by the slurry, and the workpiece may be damaged.
For example, when a weak alkaline slurry is supplied onto a casting surface plate, the slurry flows to the surface of the surface plate due to the rotation of the surface plate, rust is generated on the surface, and the workpiece is damaged by the surface rust. Or become contaminated. When acidic slurry is supplied to a stainless steel platen, nickel and the like are eluted on the peripheral surface of the platen due to the reaction between the slurry and stainless steel, and the work is contaminated. Further, the nickel or the like may enter the work and the work may not be usable.
Therefore, conventionally, the surface of the surface plate excluding the surface to which the polishing pad is attached has been painted or Teflon coated to prevent a chemical reaction between the slurry and the surface plate during polishing work. .
[0003]
[Problems to be solved by the invention]
However, the above-described conventional polishing machine surface plate has the following problems.
6A and 6B are cross-sectional views showing a conventional polishing pad adhering method. FIG. 6A shows a state where an original polishing pad is attached to a surface plate, and FIG. 6B shows a polishing pad. The state which cut | disconnected along the shape of the surface plate is shown.
In FIG. 6A, reference numeral 1 denotes a surface plate. The surface plate 1 is a surface plate used for a double-side polishing apparatus, and has a donut shape as a whole.
A protective film 2 by coating or Teflon coating is formed on the surface of the surface plate 1 excluding the pad attachment surface 10.
When the polishing pad 3 is attached on the pad attaching surface 10 of the surface plate 1, the raw polishing pad 3 larger than the surface plate 1 is adhered to the pad attaching surface 10 with an adhesive or the like. Thereafter, as shown in FIG. 6B, the polishing pad 3 is cut along the upper outer edge 11 and the upper inner edge 12 of the surface plate 1 by the cutter knife 4.
However, since the polishing pad 3 is cut while pressing the blade portion 40 of the cutter knife 4 against the pad adhering surface 10 and the upper outer edge 11 of the surface plate 1 during the cutting operation, the protective film 2 is applied to the cutter knife 4. There is a risk that the surface plate 1 may be exposed due to being scratched by the blade portion 40.
For this reason, it takes considerable skill and time to cut the polishing pad 3, and it has been difficult for a general worker to perform the attaching and cutting work of the polishing pad 3 easily and in a short time.
[0004]
SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems. A polishing apparatus surface plate and polishing pad capable of easily and quickly attaching and cutting a polishing pad to a surface plate without being an expert. The object is to provide a sticking method.
[0005]
[Means for Solving the Problems]
In order to solve the above problems, the invention of claim 1 is directed to a dough-shaped polishing machine surface plate in which a polishing pad is attached to a pad attachment surface, and the outer periphery of the surface plate with the pad attachment surface exposed. face, outside of the inner peripheral surface and a coercive Mamorumaku covering the bottom surface, having a pad stuck surface parallel to the pad contact surface and the protective film as the pad contacting surface is pad adhered surface flush Has a large-diameter protective ring made of a slurry non-reactive material fitted to the outer peripheral surface of the surface plate, a pad contact surface parallel to the pad attachment surface, and this pad contact surface is the pad attachment surface And a small-diameter protective ring made of a slurry non-reactive material fitted on the inner peripheral surface of the surface plate from the outer side of the protective film .
With this configuration, if the original polishing pad attached to the pad attaching surface of the surface plate is cut along the peripheral surface of the protective ring with a cutter knife or the like, scratches due to the cutter knife or the like are attached only to the protective ring, It does not stick to the protective film.
[0006]
According to a second aspect of the present invention, in the surface plate of the polishing apparatus according to the first aspect, each protection ring is formed of a predetermined synthetic resin.
The protective ring needs to be a slurry non-reactive material that does not chemically react with the slurry. This material is optional as long as it has the above properties. As a good example, the invention of claim 3 is the surface plate of the polishing apparatus according to claim 2, wherein the synthetic resin is an epoxy resin, an unsaturated polyester. The resin, melamine resin, polyvinyl chloride, fluororesin, polyacetal, polyamide, low density polyethylene, polyester resin, polycarbonate, polypropylene, methacrylic resin, and polyvinylidene chloride were used.
[0007]
According to a fourth aspect of the invention, in the surface plate of the polishing apparatus according to any one of the first to third aspects, a slope that is continuous with the pad contact surface of each protective ring and is inclined outward at a predetermined angle. Is formed on the peripheral surface of each protection ring .
With this configuration, it is possible to cut the polishing pad simply by applying a cutter knife or the like to the slope of the protective ring and moving it along the slope.
[0008]
Furthermore, the method of sticking the polishing pad using the protective ring can also be regarded as an invention.
Therefore, in the polishing pad adhering method according to the invention of claim 5, the pad adhering surface is exposed on the outer peripheral surface of the surface plate whose outer peripheral surface, inner peripheral surface and bottom surface are covered with a protective film with the pad adhering surface exposed. A first step of fitting a large-diameter protective ring made of a slurry non-reactive material having a pad contact surface parallel to the contact surface so that the pad contact surface is flush with the pad attachment surface; A small diameter protective ring made of a slurry non-reactive material with a pad contact surface parallel to the pad attachment surface is fitted on the inner peripheral surface of the panel so that the pad contact surface is flush with the pad attachment surface. a second step of a third step of attaching the raw polishing pad is greater than the surface plate that has passed through the first and second step to the pad contact surface of the pad adhering surface and the protective rings, each And a fourth step of cutting the polishing pad along the peripheral surface of the protective ring .
The invention of claim 6 is the polishing pad sticking method according to claim 5, wherein each protection ring in the first and second steps is continuous with the pad contact surface of each protection ring and outward. The peripheral surface has a slope inclined at a predetermined angle, and the fourth step is configured to cut the polishing pad along the slope of each protective ring .
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a perspective view showing a polishing pad non-adhered state of a surface plate of a polishing apparatus according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line AA in FIG. The same members as those shown in FIG. 6 will be described with the same reference numerals.
[0010]
As shown in FIGS. 1 and 2, the surface plate 1 is a large surface plate having an outer diameter of 2190 mm, for example, used in a double-side polishing apparatus, and is formed in a donut shape.
A protective film 2 is painted on the surface of the surface plate 1.
Specifically, the outer peripheral surface 13, the inner peripheral surface 14, and the bottom surface 15 of the surface plate 1 are covered with the protective film 2 without a gap, and only the pad attachment surface 10 is exposed.
[0011]
A large-diameter protective ring 5 and a small-diameter protective ring 6 are fitted on the outer peripheral surface 13 and the inner peripheral surface 14 of the surface plate 1 covered with the protective film 2 in this way.
The protective rings 5 and 6 are both made of Teflon (fluorine resin) which is a slurry non-reactive material. The inner diameter of the protective ring 5 is substantially equal to the diameter of the outer peripheral surface 13 of the surface plate 1, and the outer diameter of the protective ring 6. Is set to be approximately equal to the diameter of the inner peripheral surface 14 of the surface plate 1.
These protective rings 5, 6 have pad contact surfaces 50, 60 parallel to the pad attachment surface 10 of the surface plate 1, and these pad contact surfaces 50, 60 are in contact with the pad attachment surface 10. It is fixed to the surface plate 1 with screws 51 and 61 while being positioned so as to be one.
In addition, on the outer peripheral surface side of the protective ring 5 and the inner peripheral surface side of the protective ring 6, slopes 52 and 62 that are continuous with the pad contact surfaces 50 and 60 and are inclined outward by about 30 ° are formed, respectively. Yes.
[0012]
The operation of attaching the polishing pad to the surface plate 1 having the above structure is performed as follows.
FIG. 3 is a sequential process diagram illustrating a method for attaching a polishing pad to the surface plate 1.
First, as shown in FIG. 3A, an original polishing pad 3 larger than the surface plate 1 is affixed onto the pad affixing surface 10 with an adhesive.
After that, as shown in FIG. 3B, the blade portion 40 of the cutter knife 4 is cut into the polishing pad 3, and the blade portion 40 is turned sideways and applied to the inclined surface 52 of the protective ring 5, so that the blade portion 40 and the inclined surface 52 are cut. By cutting the polishing pad 3 in such a way as to maintain the contact state, the outer edge of the polishing pad 3 is cut into a shape corresponding to the outer shape of the surface plate 1 as shown in FIG. Is done.
The same applies to the case where the portion of the polishing pad 3 located in the center hole of the surface plate 1 is cut, and the blade portion 40 of the cutter knife 4 is brought into contact with the inclined surface 62 of the protective ring 6 as shown in FIG. By cutting the polishing pad 3 while making contact, the center portion of the polishing pad 3 is cut into a shape corresponding to the center hole of the surface plate 1 as shown in FIG.
[0013]
By the way, when a person who is not an expert performs such a cutting operation, when cutting the blade portion 40 of the cutter knife 4 into the polishing pad 3 or when cutting the polishing pad 3 along the slopes 52 and 62, the blade portion There is a case in which an operation of moving the 40 cutting edges toward the protective film 2 in a state of facing the protective film 2 may occur.
When such an operation is performed, in the conventional surface plate shown in FIG. 6, the cutting edge of the cutter knife 4 touches the protective film 2 and the protective film 2 is scraped off. For this reason, the work must be continued while paying attention to the direction of the blade edge, and the work time becomes long.
However, since the protective rings 5 and 6 are provided in this embodiment, the protective rings 5 and 6 receive the movement of the cutting edge of the cutter knife 4 as shown in FIG. Therefore, since only the protection rings 5 and 6 are scratched, it is not necessary for the operator to pay attention to the direction of the blade edge.
[0014]
Thus, according to the surface plate of this embodiment, since the inclined surfaces 52 and 62 are formed on the protective rings 5 and 6, the operator uses the inclined surfaces 52 and 62 of the protective rings 5 and 6 as a guide and a polishing pad. Only by cutting 3, the polishing pad 3 can be cut accurately, and the cutting work is very easy.
In addition, since the polishing pad 3 can be cut without paying attention to the direction of the cutting edge of the cutter knife 4, even a non-expert can cut the polishing pad 3 easily and in a short time.
[0015]
Finally, the mirror surface processing operation of the double-side polishing apparatus using the surface plate of this embodiment will be described.
FIG. 5 is a sectional view of the double-side polishing apparatus.
A surface plate rotating body as shown in FIG. 5 with one surface plate 1 (1-1) facing upward of the two surface plates 1 to which the polishing pad 3 shown in FIG. While being fixed on 70, the other surface plate 1 (1-2) is connected downward to the rotary shaft 71.
Thereafter, the carrier 72 holding the wafer W is placed on the polishing pad 3 of the surface plate 1-1 and the sun gear 73 and the internal gear 74 are moved with the teeth engaged with the sun gear 73 and the internal gear 74. By rotating, the carrier 72 revolves around the sun gear 73 while rotating.
Then, by pressing the wafer W with the surface plate 1-2 and supplying the slurry while rotating the surface plates 1-1 and 1-2 in the opposite directions, both surfaces of the wafer W are placed on the surface plates 1-1 and 1. -2 is mirror-finished by the polishing pad 3.
[0016]
At this time, the slurry flows to the outer peripheral surface 13 and the inner peripheral surface 14 of the surface plates 1-1 and 1-2 by the rotation of the surface plates 1-1 and 1-2, and adheres to the surfaces of the protective rings 5 and 6. . Therefore, when the state of adhesion of the slurry to the protective rings 5 and 6 continues for a long time, the slurry is dried and the abrasive grains S are fixed to the protective rings 5 and 6 as shown in the figure. In particular, when the abrasive grains S adhere to the protective rings 5 and 6 of the upper surface plate 1-2, the abrasive lump is peeled off by vibration and enters between the surface plates 1-1 and 1-2, and the wafer W is scratched. There is a risk of attaching.
However, in this embodiment, since the protective rings 5 and 6 are formed of Teflon having a smooth surface, even if the slurry adheres to the protective rings 5 and 6, it flows down from the protective rings 5 and 6 in a short time. Therefore, the situation that the slurry dries and the abrasive grains adhere to the protective rings 5 and 6 as described above does not occur.
[0017]
In addition, this invention is not limited to the said embodiment, A various deformation | transformation and change are possible within the range of the summary of invention.
For example, in the above embodiment, the invention is applied to the donut-shaped surface plate 1, but it is needless to say that the invention can also be applied to a surface plate having a disk-shaped center hole.
Further, since the surface plate 1 is a large surface plate of about 2190 mm, the protective film 2 is formed by painting. However, in the case of a small diameter surface plate, the protective film 2 can be formed by Teflon coating. .
In the above embodiment, the protective rings 5 and 6 are formed of Teflon. However, when the surface plate 1 can be used in a device having only one surface plate below such as a single-side polishing device, the slurry Since the problem of adhesion of abrasive grains does not occur, the protective rings 5 and 6 may be formed of vinyl chloride or the like.
Further, although the protective rings 5 and 6 are provided with the inclined surfaces 52 and 62, the protective rings 5 and 6 having a rectangular cross section without the inclined surfaces 52 and 62 are not excluded.
[0018]
【The invention's effect】
As described above in detail, according to the inventions of claims 1 to 3 and claim 5, scratches caused by a cutter knife or the like during cutting of the polishing pad are attached only to the protective ring made of a slurry non-reactive material, and the protective film Therefore, even a general unskilled worker can easily cut the polishing pad in a short time.
According to the invention of claim 4 and claim 6, the polishing pad can be cut by applying a cutter knife or the like to the slope of the protective ring, so that the polishing pad can be cut easily and accurately. effective.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a polishing pad non-adhered state of a surface plate of a polishing apparatus according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view taken along the line AA in FIG.
FIG. 3 is a sequential process diagram illustrating a method for attaching a polishing pad to a surface plate.
FIG. 4 is a cross-sectional view showing a state in which a cutting edge of a cutter knife has hit a protective ring.
FIG. 5 is a cross-sectional view of a double-side polishing apparatus.
FIG. 6 is a cross-sectional view showing a conventional polishing pad attaching method.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Surface plate, 2 ... Protective film, 3 ... Polishing pad, 4 ... Cutter knife, 5, 6 ... Protection ring, 50, 60 ... Pad contact surface, 52, 62 ... Slope.

Claims (6)

パッド貼着面に研磨パッドが貼り付けられるドーナッツ状のポリッシング装置の定盤において、
上記パッド貼着面を露出させた状態で上記定盤の外周面，内周面及び底面を覆う保護膜と、
上記パッド貼着面と平行なパッド当接面を有し且つこのパッド当接面が上記パッド貼着面と面一になるように上記保護膜の外側から定盤の外周面に嵌着されたスラリ非反応性素材製の大径の保護リングと、
上記パッド貼着面と平行なパッド当接面を有し且つこのパッド当接面が上記パッド貼着面と面一になるように上記保護膜の外側から定盤の内周面に嵌着されたスラリ非反応性素材製の小径の保護リングと
を具備することを特徴とするポリッシング装置の定盤。In the surface plate of a donut-shaped polishing apparatus in which a polishing pad is attached to the pad attachment surface,
And the coercive Mamorumaku covering the outer peripheral surface, the inner peripheral surface and the bottom surface of the surface plate while exposing the pad adhering surface,
The pad abutting surface is parallel to the pad affixing surface, and the pad abutment surface is fitted to the outer peripheral surface of the surface plate from the outside of the protective film so as to be flush with the pad affixing surface. A large diameter protective ring made of slurry non-reactive material ,
The pad abutting surface is parallel to the pad affixing surface, and the pad abutment surface is fitted to the inner peripheral surface of the surface plate from the outside of the protective film so that it is flush with the pad affixing surface. A polishing machine surface plate comprising a small-diameter protective ring made of a non-slurry reactive material . 請求項１に記載のポリッシング装置の定盤において 、
上記各保護リングを、所定の合成樹脂で形成した、
ことを特徴とするポリッシング装置の定盤。The surface plate of the polishing apparatus according to claim 1,
Each of the protective rings is formed of a predetermined synthetic resin.
A surface plate of a polishing apparatus characterized by that. 請求項２に記載のポリッシング装置の定盤において 、
上記合成樹脂は、エポキシ樹脂，不飽和ポリエステル樹脂，メラミン樹脂，ポリ塩化ビニル，フッ素樹脂，ポリアセタール，ポリアミド，低密度ポリエチレン，ポリエステル樹脂，ポリカーポネート，ポリプロピレン，メタクリル樹脂，及びポリ塩化ビニリデンのいずれかである、
ことを特徴とするポリッシング装置の定盤。In the surface plate of the polishing apparatus according to claim 2,
The synthetic resin is one of epoxy resin, unsaturated polyester resin, melamine resin, polyvinyl chloride, fluororesin, polyacetal, polyamide, low density polyethylene, polyester resin, polycarbonate, polypropylene, methacrylic resin, and polyvinylidene chloride. Is,
A surface plate of a polishing apparatus characterized by that. 請求項１ないし請求項３のいずれかに記載のポリッシング装置の定盤において、
上記各保護リングの上記パッド当接面と連続し且つ外方に所定角度で傾斜する斜面を上記各保護リングの周面に形成した、
ことを特徴とするポリッシング装置の定盤。In the surface plate of the polishing apparatus according to any one of claims 1 to 3,
A slope that is continuous with the pad contact surface of each protection ring and is inclined outward at a predetermined angle is formed on the peripheral surface of each protection ring .
A surface plate of a polishing apparatus characterized by that. パッド貼着面を露出させた状態で外周面，内周面及び底面が保護膜で覆われた定盤の外周面に、上記パッド貼着面と平行なパッド当接面を有するスラリ非反応性素材製の大径の保護リングを上記パッド当接面がパッド貼着面と面一になるように嵌着させる第１の工程と、
上記定盤の内周面に、上記パッド貼着面と平行なパッド当接面を有するスラリ非反応性素材製の小径の保護リングを上記パッド当接面がパッド貼着面と面一になるように嵌着させる第２の工程と、
上記第１及び第２の工程を経た定盤よりも大きい原反の研磨パッドを上記パッド貼着面及び上記各保護リングのパッド当接面に貼り付ける第３の工程と、
上記各保護リングの周面に沿って上記研磨パッドを裁断する第４の工程と
を具備することを特徴とする研磨パッド貼着方法。 Slurry non-reactivity having a pad contact surface parallel to the pad attachment surface on the outer peripheral surface of the surface plate whose outer peripheral surface, inner peripheral surface and bottom surface are covered with a protective film with the pad attachment surface exposed. A first step of fitting a large-diameter protective ring made of a material so that the pad contact surface is flush with the pad attaching surface;
A small-diameter protective ring made of a slurry non-reactive material having a pad abutting surface parallel to the pad adhering surface on the inner peripheral surface of the surface plate, the pad abutting surface being flush with the pad adhering surface. A second step of fitting ,
A third step of attaching a polishing pad of an original fabric larger than the surface plate that has undergone the first and second steps to the pad attachment surface and the pad contact surface of each of the protective rings ;
And a fourth step of cutting the polishing pad along the peripheral surface of each of the protective rings . 請求項５に記載の研磨パッド貼着方法において、
上記第１及び第２の工程における上記各保護リングは、上記各保護リングの上記パッド当接面と連続し且つ外方に所定角度で傾斜する斜面をその周面に有し、
上記第４の工程は、上記各保護リングの斜面に沿って上記研磨パッドを裁断するものである、
ことを特徴とする研磨パッド貼着方法。In the polishing pad sticking method according to claim 5,
Each of the protection rings in the first and second steps has a slope on its peripheral surface that is continuous with the pad contact surface of each of the protection rings and is inclined outward at a predetermined angle.
The fourth step is to cut the polishing pad along the slope of each of the protective rings .
A polishing pad adhering method characterized by the above.
JP8491898A 1998-03-16 1998-03-16 Surface plate of polishing apparatus and polishing pad attaching method Expired - Lifetime JP4041577B2 (en)

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EP19990103955 EP0943397A2 (en) 1998-03-16 1999-03-09 Platen of polishing apparatus and method of adhesion of polishing pad

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JP4584755B2 (en) * 2005-04-06 2010-11-24 スピードファム株式会社 Pressure roller for attaching polishing pad in double-side polishing apparatus, and method for attaching polishing pad with pressure roller
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TWI643703B (en) * 2015-07-20 2018-12-11 聯華電子股份有限公司 A polishing platen for chemical mechanical polishing
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