JPH11262855A - Fixed board for polishing device and pasting method for polishing pad - Google Patents
Fixed board for polishing device and pasting method for polishing padInfo
- Publication number
- JPH11262855A JPH11262855A JP8491898A JP8491898A JPH11262855A JP H11262855 A JPH11262855 A JP H11262855A JP 8491898 A JP8491898 A JP 8491898A JP 8491898 A JP8491898 A JP 8491898A JP H11262855 A JPH11262855 A JP H11262855A
- Authority
- JP
- Japan
- Prior art keywords
- pad
- polishing
- polishing pad
- surface plate
- platen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0072—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using adhesives for bonding abrasive particles or grinding elements to a support, e.g. by gluing
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、ウエハ等のワー
クを鏡面研磨するポリッシング装置に用いられるポリッ
シング装置の定盤及び研磨パッド貼着方法に関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface plate of a polishing apparatus used in a polishing apparatus for mirror-polishing a work such as a wafer and a method of attaching a polishing pad.
【０００２】[0002]
【従来の技術】ポリッシング装置は、研磨パッドが貼り
付けられた定盤上にウエハ等のワークを押し付け、定盤
とワークとを回転させることで、ワークの表面を研磨パ
ッドで鏡面研磨する装置である。このようなポリッシン
グ装置では、酸性やアルカリ性のスラリを用いて、ワー
クを化学的機械的に研磨する。したがって、ステンレス
や鋳物で形成された定盤を裸で使用すると、スラリによ
って定盤がさびる等して、ワークを傷付けるおそれがあ
る。例えば、鋳物の定盤の上に弱アルカリ性のスラリを
供給すると、定盤の回転によってこのスラリが定盤の周
面に流れ、この周面にさびが発生し、ワークがこのさび
によって傷付いたり、汚染されたりする。また、ステン
レス製の定盤に酸性のスラリを供給した場合には、この
スラリとステンレスとの反応によって、定盤の周面にニ
ッケル等が溶出して、ワークが汚染される。また、この
ニッケル等がワーク内に入り込んで、ワークが使い物に
ならなくなるおそれもある。そこで、従来は、研磨パッ
ドを貼着する面を除く定盤の表面を塗装し、又はテフロ
ンコーティングして、研磨作業時におけるスラリと定盤
との化学反応を未然に防止する技術を採っていた。2. Description of the Related Art A polishing apparatus is an apparatus that presses a work such as a wafer onto a surface plate on which a polishing pad is stuck, and rotates the surface plate and the work so that the surface of the work is mirror-polished with the polishing pad. is there. In such a polishing apparatus, a workpiece is chemically and mechanically polished using an acidic or alkaline slurry. Therefore, if a surface plate made of stainless steel or casting is used without any treatment, the surface plate may be rusted by the slurry and the work may be damaged. For example, if a weak alkaline slurry is supplied on a casting surface plate, the slurry will flow on the surface of the surface plate due to the rotation of the surface plate, and rust will be generated on this surface, and the work may be damaged by this rust. , Or become contaminated. Further, when an acidic slurry is supplied to a stainless steel platen, nickel or the like is eluted on the peripheral surface of the platen due to a reaction between the slurry and the stainless steel, thereby contaminating the work. Further, the nickel or the like may enter the work, and the work may not be usable. Therefore, conventionally, the surface of the surface plate other than the surface to which the polishing pad is adhered is painted or coated with Teflon, so that a technique for preventing a chemical reaction between the slurry and the surface plate during polishing operation has been adopted. .
【０００３】[0003]
【発明が解決しようとする課題】しかし、上記した従来
のポリッシング装置の定盤では、次のような問題があっ
た。図６は、従来の研磨パッド貼着方法を示す断面図で
あり、図６の（ａ）は原反の研磨パッドを定盤に貼り付
けた状態を示し、図６の（ｂ）は研磨パッドを定盤の形
状に沿ってカットした状態を示す。図６の（ａ）におい
て、符号１が定盤であり、この定盤１は両面ポリッシン
グ装置に用いられる定盤であり、全体としてドーナッツ
状をなしている。そしてこの定盤１のパッド貼着面１０
を除く表面には、塗装やテフロンコーティングによる保
護膜２が形成されている。このような定盤１のパッド貼
着面１０上に研磨パッド３を貼り付ける場合には、定盤
１よりも大きな原反の研磨パッド３をパッド貼着面１０
上に接着剤等で接着した後、図６の（ｂ）に示すよう
に、カッタナイフ４によって研磨パッド３を定盤１の上
外縁１１や上内縁１２に沿って裁断する。しかしなが
ら、上記裁断作業の際、カッタナイフ４の刃部４０を定
盤１のパッド貼着面１０や上外縁１１に押し当てなが
ら、研磨パッド３を切っていくので、保護膜２がカッタ
ナイフ４の刃部４０によって傷付けられ、定盤１が露出
する事態が生じるおそれがある。このため、研磨パッド
３を裁断するには、相当の熟練と時間を要し、一般の作
業者が研磨パッド３の貼着及び裁断作業を容易且つ短時
間に行うことは困難であった。However, the above-mentioned conventional polishing apparatus surface plate has the following problems. 6A and 6B are cross-sectional views showing a conventional polishing pad attaching method. FIG. 6A shows a state in which a raw material polishing pad is attached to a surface plate, and FIG. 6B shows a polishing pad. Shows a state cut along the shape of the surface plate. In FIG. 6A, reference numeral 1 denotes a platen, and the platen 1 is a platen used for a double-side polishing apparatus, and has a donut shape as a whole. And the pad attaching surface 10 of this surface plate 1
A protective film 2 formed by painting or Teflon coating is formed on the surface excluding. When the polishing pad 3 is attached on the pad attaching surface 10 of the surface plate 1 as described above, the original polishing pad 3 larger than the surface plate 1 is attached to the pad attaching surface 10.
After being adhered to the upper surface with an adhesive or the like, as shown in FIG. 6B, the polishing pad 3 is cut along the upper outer edge 11 and the upper inner edge 12 by the cutter knife 4. However, during the above cutting operation, the polishing pad 3 is cut while the blade portion 40 of the cutter knife 4 is pressed against the pad attaching surface 10 and the upper outer edge 11 of the surface plate 1. There is a possibility that a situation where the surface plate 1 is exposed due to being damaged by the blade portion 40 may occur. For this reason, cutting the polishing pad 3 requires considerable skill and time, and it is difficult for an ordinary worker to perform the attaching and cutting work of the polishing pad 3 easily and in a short time.
【０００４】この発明は上述した課題を解決するために
なされたもので、研磨パッドの定盤への貼着及び裁断を
熟練者でなくとも容易且つ短時間で行うことができるポ
リッシング装置の定盤及び研磨パッド貼着方法を提供す
ることを目的とするものである。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and a polishing machine base plate capable of attaching and cutting a polishing pad to a base plate easily and in a short time without a skilled person. And a method for attaching a polishing pad.
【０００５】[0005]
【課題を解決するための手段】上記課題を解決するため
に、請求項１の発明は、パッド貼着面に研磨パッドが貼
り付けられる円盤状又はドーナッツ状のポリッシング装
置の定盤において、パッド貼着面以外の定盤の表面を覆
う保護膜と、パッド貼着面と平行なパッド当接面を有し
且つこのパッド当接面がパッド貼着面と略面一になるよ
うに保護膜の外側から定盤の周面に嵌着されたスラリ非
反応性素材製の保護リングとを具備する構成とした。か
かる構成により、定盤のパッド貼着面に貼り付けられた
原反の研磨パッドをカッタナイフ等で保護リングの周面
に沿って裁断すれば、カッタナイフ等による傷は保護リ
ングにのみ付き、保護膜に付くことはない。In order to solve the above-mentioned problems, the invention according to claim 1 is directed to a disk-shaped or donut-shaped polishing table on which a polishing pad is bonded to a pad-bonding surface. A protective film that covers the surface of the surface plate other than the contact surface, and a pad contact surface that is parallel to the pad attaching surface, and that the pad contact surface is substantially flush with the pad attaching surface. A protective ring made of a slurry non-reactive material fitted to the peripheral surface of the surface plate from the outside is provided. With such a configuration, if the raw material polishing pad attached to the pad attaching surface of the surface plate is cut along the peripheral surface of the protection ring with a cutter knife or the like, scratches due to the cutter knife or the like are attached only to the protection ring, It does not stick to the protective film.
【０００６】また、請求項２の発明は、請求項１に記載
のポリッシング装置の定盤において、保護リングを、所
定の合成樹脂で形成した構成としてある。なお、保護リ
ングは、スラリと化学反応を生じないスラリ非反応性素
材であることを要する。この素材は上記性質を有してい
る限り任意であるが、その好例として、請求項３の発明
は、請求項２に記載のポリッシング装置の定盤におい
て、合成樹脂は、エポキシ樹脂，不飽和ポリエステル樹
脂，メラミン樹脂，ポリ塩化ビニル，フッ素樹脂，ポリ
アセタール，ポリアミド，低密度ポリエチレン，ポリエ
ステル樹脂，ポリカーポネート，ポリプロピレン，メタ
クリル樹脂，及びポリ塩化ビニリデンのいずれかである
構成とした。According to a second aspect of the present invention, in the surface plate of the polishing apparatus according to the first aspect, the protection ring is formed of a predetermined synthetic resin. The protection ring needs to be a slurry non-reactive material that does not cause a chemical reaction with the slurry. This material is arbitrary as long as it has the above-mentioned properties. As a good example, the invention of claim 3 is a polishing machine according to claim 2, wherein the synthetic resin is epoxy resin, unsaturated polyester. Resin, melamine resin, polyvinyl chloride, fluorine resin, polyacetal, polyamide, low density polyethylene, polyester resin, polycarbonate, polypropylene, methacrylic resin, and polyvinylidene chloride.
【０００７】また、請求項４の発明は、請求項１ないし
請求項３のいずれかに記載のポリッシング装置の定盤に
おいて、保護リングのパッド当接面と連続し且つ外方に
所定角度で傾斜する斜面を保護リングの周面に形成した
構成としてある。かかる構成により、保護リングの斜面
にカッタナイフ等を当て、この斜面に沿って移動させて
いくだけで研磨パッドを裁断することができる。According to a fourth aspect of the present invention, in the surface plate of the polishing apparatus according to any one of the first to third aspects, the polishing apparatus is continuous with the pad contact surface of the protection ring and is inclined outward at a predetermined angle. A slope is formed on the peripheral surface of the protection ring. With such a configuration, the polishing pad can be cut by merely applying a cutter knife or the like to the slope of the protection ring and moving the protection pad along the slope.
【０００８】さらに、上記保護リングを利用して研磨パ
ッドを貼着する方法についても発明として捉えることが
できる。そこで、請求項５の発明に係る研磨パッド貼着
方法は、パッド貼着面以外の表面が保護膜で覆われた定
盤の周面に、パッド貼着面と平行なパッド当接面を有す
るスラリ非反応性素材製の保護リングをパッド当接面が
パッド貼着面と略面一になるように嵌着させる第１の工
程と、第１の工程を経た定盤よりも大きい原反の研磨パ
ッドをパッド貼着面及びパッド当接面に貼り付ける第２
の工程と、保護リングの周面に沿って研磨パッドを裁断
する第３の工程とを具備する構成とした。また、請求項
６の発明は、請求項５に記載の研磨パッド貼着方法にお
いて、第１の工程における保護リングは、保護リングの
パッド当接面と連続し且つ外方に所定角度で傾斜する斜
面をその周面に有し、第３の工程は、保護リングの斜面
に沿って研磨パッドを裁断するものである構成とした。Further, a method of attaching a polishing pad using the above protective ring can be considered as an invention. Therefore, the polishing pad adhering method according to the invention of claim 5 has a pad contact surface parallel to the pad adhering surface on a peripheral surface of the platen whose surface other than the pad adhering surface is covered with the protective film. A first step of fitting a protective ring made of a slurry non-reactive material such that a pad contact surface is substantially flush with a pad attaching surface, and a raw sheet larger than a surface plate having passed through the first step. Second polishing pad is attached to the pad attachment surface and pad contact surface
And a third step of cutting the polishing pad along the peripheral surface of the protection ring. According to a sixth aspect of the present invention, in the polishing pad attaching method according to the fifth aspect, the protection ring in the first step is continuous with the pad contact surface of the protection ring and is inclined outward at a predetermined angle. The third step is to cut the polishing pad along the slope of the protective ring.
【０００９】[0009]
【発明の実施の形態】以下、この発明の実施の形態につ
いて図面を参照して説明する。図１は、この発明の一実
施形態に係るポリッシング装置の定盤の研磨パッド非貼
着状態を示す斜視図であり、図２は、図１の矢視Ａ−Ａ
断面図である。なお、図６に示した部材と同一部材につ
いては同一符号を付して説明する。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing a polishing table according to an embodiment of the present invention in a state where a polishing pad is not adhered to a surface plate, and FIG.
It is sectional drawing. The same members as those shown in FIG. 6 will be described with the same reference numerals.
【００１０】図１及び図２に示すように、定盤１は、両
面ポリッシング装置に用いられる例えば外径２１９０ｍ
ｍの大径の定盤であり、ドーナッツ状に形成されてい
る。この定盤１の表面には保護膜２が塗装されている。
具体的には、定盤１の外周面１３，内周面１４及び底面
１５が保護膜２によって隙間なく覆われ、パッド貼着面
１０のみが露出している。As shown in FIGS. 1 and 2, the surface plate 1 has an outer diameter of 2190 m used for a double-side polishing apparatus.
The platen has a large diameter of m and is formed in a donut shape. The surface of the surface plate 1 is coated with a protective film 2.
Specifically, the outer peripheral surface 13, the inner peripheral surface 14, and the bottom surface 15 of the surface plate 1 are completely covered by the protective film 2, and only the pad attaching surface 10 is exposed.
【００１１】そして、このように保護膜２で覆われた定
盤１の外周面１３及び内周面１４の上部には大径の保護
リング５と小径の保護リング６とが嵌着されている。保
護リング５，６は共にスラリ非反応性素材であるテフロ
ン（フッ素樹脂）で形成されており、保護リング５の内
径は定盤１の外周面１３の径と略等しく、保護リング６
の外径は定盤１の内周面１４の径と略等しく設定されて
いる。これら保護リング５，６は、定盤１のパッド貼着
面１０と平行なパッド当接面５０，６０を有しており、
これらのパッド当接面５０，６０がパッド貼着面１０と
面一になるように位置決めされた状態でビス５１，６１
にて定盤１に固定されている。また、保護リング５の外
周面側と保護リング６の内周面側には、パッド当接面５
０，６０にそれぞれ連続し、外方に約３０゜で傾斜する
斜面５２，６２が形成されている。A large-diameter protective ring 5 and a small-diameter protective ring 6 are fitted over the outer peripheral surface 13 and the inner peripheral surface 14 of the surface plate 1 covered with the protective film 2 as described above. . The protection rings 5 and 6 are both formed of Teflon (fluorine resin), which is a non-reactive slurry material. The inner diameter of the protection ring 5 is substantially equal to the diameter of the outer peripheral surface 13 of the platen 1.
Is set substantially equal to the diameter of the inner peripheral surface 14 of the surface plate 1. These protective rings 5 and 6 have pad contact surfaces 50 and 60 parallel to the pad attaching surface 10 of the surface plate 1,
The screws 51, 61 are positioned in such a manner that the pad contact surfaces 50, 60 are positioned so as to be flush with the pad attaching surface 10.
Is fixed to the platen 1. A pad contact surface 5 is provided on the outer peripheral surface side of the protection ring 5 and the inner peripheral surface side of the protection ring 6.
Slope surfaces 52 and 62 are formed continuously from 0 and 60, respectively, and are inclined outward at about 30 °.
【００１２】上記構造の定盤１に研磨パッドを貼り付け
る作業は、次のようにして行う。図３は、定盤１への研
磨パッド貼着方法を示す順工程図である。まず、図３の
（ａ）に示すように、定盤１よりも大きな原反の研磨パ
ッド３を接着剤にてパッド貼着面１０上に貼り付ける。
しかる後、図３の（ｂ）に示すように、カッタナイフ４
の刃部４０を研磨パッド３に切り込み、刃部４０を横向
きにして保護リング５の斜面５２に当て、刃部４０と斜
面５２との当接状態を維持するようにして、研磨パッド
３を切っていくことで、図３の（ｃ）に示すように、研
磨パッド３の外縁が定盤１の外形に対応した形状に裁断
される。定盤１の中心孔に位置する研磨パッド３の部位
を裁断する場合も同様であり、図３の（ｂ）に示すよう
に、カッタナイフ４の刃部４０を保護リング６の斜面６
２に当接させながら研磨パッド３を切っていくことで、
図３の（ｃ）に示すように、研磨パッド３の中心部分が
定盤１の中心孔に対応した形状で裁断される。The operation of attaching a polishing pad to the surface plate 1 having the above structure is performed as follows. FIG. 3 is a sequential process diagram showing a method of attaching a polishing pad to the surface plate 1. First, as shown in FIG. 3A, a polishing pad 3 of a raw material larger than the surface plate 1 is attached on the pad attaching surface 10 with an adhesive.
Thereafter, as shown in FIG.
The blade 40 is cut into the polishing pad 3, and the blade 40 is turned sideways on the slope 52 of the protection ring 5, so that the blade 40 and the slope 52 are maintained in contact with each other. As a result, the outer edge of the polishing pad 3 is cut into a shape corresponding to the outer shape of the platen 1 as shown in FIG. The same applies to the case where the portion of the polishing pad 3 located at the center hole of the surface plate 1 is cut. As shown in FIG. 3B, the blade 40 of the cutter knife 4 is attached to the slope 6 of the protection ring 6.
By cutting the polishing pad 3 while making contact with 2,
As shown in FIG. 3C, the central portion of the polishing pad 3 is cut into a shape corresponding to the central hole of the platen 1.
【００１３】ところで、熟練者でない者がこのような裁
断作業を行うと、カッタナイフ４の刃部４０を研磨パッ
ド３に切り込む際や斜面５２，６２に沿って研磨パッド
３を切っていく際に、刃部４０の刃先を保護膜２に向け
た状態で保護膜２側に移動させるような動作が生じるこ
とがある。このような動作が行われると、図６に示した
従来の定盤では、カッタナイフ４の刃先が保護膜２に触
れて、保護膜２を削り取る等の事態が生じる。このた
め、刃先の向きに注意を払いながら作業を続けなければ
ならず、作業時間が長くなってしまう。しかし、この実
施形態では保護リング５，６が設けられているので、図
４に示すようにカッタナイフ４の刃先の移動を保護リン
グ５，６が受ける。したがって、保護リング５，６にの
み傷が付くだけであるので、作業者が刃先の向きに注意
を払う必要がない。By the way, if a person who is not an expert performs such a cutting operation, when the blade 40 of the cutter knife 4 is cut into the polishing pad 3 or when the polishing pad 3 is cut along the slopes 52 and 62, In some cases, such an operation as to move the blade edge of the blade portion 40 toward the protective film 2 with the blade edge facing the protective film 2 may occur. When such an operation is performed, in the conventional platen shown in FIG. 6, the cutting edge of the cutter knife 4 comes into contact with the protective film 2 and the protective film 2 is scraped off. For this reason, work must be continued while paying attention to the direction of the cutting edge, and the work time will be lengthened. However, in this embodiment, since the protection rings 5 and 6 are provided, the protection rings 5 and 6 receive the movement of the cutting edge of the cutter knife 4 as shown in FIG. Therefore, since only the protection rings 5 and 6 are damaged, the operator does not need to pay attention to the direction of the cutting edge.
【００１４】このように、この実施形態の定盤によれ
ば、保護リング５，６に斜面５２，６２が形成されてい
るので、作業者は保護リング５，６の斜面５２，６２を
ガイドにして研磨パッド３を切っていくことだけで、研
磨パッド３を正確に裁断することができ、裁断作業が非
常に楽である。また、カッタナイフ４の刃先の向きに注
意を払うことなく、研磨パッド３を裁断することができ
るので、熟練者でない者でも容易且つ短時間で研磨パッ
ド３の裁断作業を行うことができる。As described above, according to the surface plate of this embodiment, since the slopes 52 and 62 are formed on the protection rings 5 and 6, the worker uses the slopes 52 and 62 of the protection rings 5 and 6 as a guide. Only by cutting the polishing pad 3 by cutting, the polishing pad 3 can be cut accurately, and the cutting operation is very easy. Moreover, since the polishing pad 3 can be cut without paying attention to the direction of the blade edge of the cutter knife 4, even a person who is not a skilled person can perform the cutting operation of the polishing pad 3 easily and in a short time.
【００１５】最後に、この実施形態の定盤を用いた両面
ポリッシング装置の鏡面加工動作について説明する。図
５は、両面ポリッシング装置の断面図である。図３の
（ｃ）に示した研磨パッド３を貼着した２枚の定盤１の
うち一方の定盤１（１−１）を上向きにして、図５に示
すように、定盤回転体７０上に固定すると共に、他方の
定盤１（１−２）を下向きにして回転軸７１に連結させ
る。しかる後、ウエハＷを保持したキャリア７２を定盤
１−１の研磨パッド３上に載置すると共にその歯部をサ
ンギア７３とインターナルギア７４に噛合させた状態
で、サンギア７３，インターナルギア７４を回転させる
ことにより、キャリア７２が自転しながらサンギア７３
の周りを公転する。そして、定盤１−２でウエハＷを押
圧すると共に定盤１−１，１−２を互いに逆方向に回転
させながらスラリを供給することで、ウエハＷの両面が
定盤１−１，１−２の研磨パッド３によって鏡面加工さ
れる。Finally, the mirror polishing operation of the double-side polishing apparatus using the surface plate of this embodiment will be described. FIG. 5 is a sectional view of the double-side polishing apparatus. As shown in FIG. 5, one of the surface plates 1 (1-1) of the two surface plates 1 to which the polishing pad 3 shown in FIG. 70, and is connected to the rotating shaft 71 with the other platen 1 (1-2) facing downward. Thereafter, the carrier 72 holding the wafer W is placed on the polishing pad 3 of the surface plate 1-1, and the teeth are meshed with the sun gear 73 and the internal gear 74, and the sun gear 73 and the internal gear 74 are moved. By rotating the carrier 72, the sun gear 73 rotates while the carrier 72 rotates.
Revolves around. Then, by pressing the wafer W with the platen 1-2 and supplying the slurry while rotating the platens 1-1 and 1-2 in directions opposite to each other, both sides of the wafer W are brought into contact with the platens 1-1 and 1. The surface is mirror-finished by the polishing pad 3 of -2.
【００１６】このとき、定盤１−１，１−２の回転によ
ってスラリが定盤１−１，１−２の外周面１３や内周面
１４側に流出し、保護リング５，６の表面に付着する。
したがって、スラリの保護リング５，６への付着状態が
長時間続くとスラリが乾燥して砥粒Ｓが図に示すように
保護リング５，６に固着した状態となる。特に、上の定
盤１−２の保護リング５，６に砥粒Ｓが固着すると、振
動によって砥粒塊が剥がれて定盤１−１，１−２の間に
入り込み、ウエハＷに傷を付けるおそれがある。しか
し、この実施形態では、保護リング５，６を表面が滑ら
かなテフロンで形成したので、スラリが保護リング５，
６に付着しても、短時間で保護リング５，６から流れ落
ちる。したがって、上記のようにスラリが乾燥して砥粒
が保護リング５，６に固着するという事態は生じない。At this time, the slurry flows out to the outer peripheral surface 13 and the inner peripheral surface 14 of the surface plates 1-1 and 1-2 due to the rotation of the surface plates 1-1 and 1-2, and the surface of the protection rings 5 and 6 is rotated. Adheres to
Therefore, when the slurry adheres to the protection rings 5 and 6 for a long time, the slurry dries and the abrasive grains S are fixed to the protection rings 5 and 6 as shown in the figure. In particular, when the abrasive grains S adhere to the protection rings 5 and 6 of the upper surface plate 1-2, the abrasive particles are peeled off by vibration and enter the space between the surface plates 1-1 and 1-2 and damage the wafer W. May be attached. However, in this embodiment, since the protection rings 5 and 6 are formed of Teflon having a smooth surface, the slurry is protected by the protection rings 5 and 6.
Even if it adheres to the protective ring 6, it flows down from the protective rings 5 and 6 in a short time. Therefore, the situation in which the slurry dries and the abrasive grains adhere to the protective rings 5 and 6 does not occur as described above.
【００１７】なお、この発明は、上記実施形態に限定さ
れるものではなく、発明の要旨の範囲内において種々の
変形や変更が可能である。例えば、上記実施形態では、
発明をドーナッツ状の定盤１について適用したが、中心
孔が円盤状の定盤についても適用することができること
は勿論である。また、定盤１が約２１９０ｍｍという大
径の定盤であることから、塗装によって保護膜２を形成
したが、小径の定盤の場合には、テフロンコーティング
によって保護膜２を形成することができる。また、上記
実施形態では、保護リング５，６をテフロンで形成した
が、片面ポリッシング装置のように、下方に１枚の定盤
のみを有する装置に定盤１を用いうる場合には、スラリ
の砥粒の固着という問題は生じないので、保護リング
５，６を塩化ビニル等で形成してもよい。さらに、保護
リング５，６に斜面５２，６２を設けたが、斜面５２，
６２が無い断面矩形状の保護リング５，６を除外するも
のではない。The present invention is not limited to the above-described embodiment, and various modifications and changes can be made within the scope of the present invention. For example, in the above embodiment,
Although the invention is applied to the donut-shaped surface plate 1, it goes without saying that the invention can also be applied to a disk-shaped surface plate having a central hole. Further, since the platen 1 is a large-diameter platen having a diameter of about 2190 mm, the protective film 2 is formed by painting. However, in the case of a small-diameter platen, the protective film 2 can be formed by Teflon coating. . In the above embodiment, the protection rings 5 and 6 are formed of Teflon. However, when the surface plate 1 can be used in an apparatus having only one surface plate below, such as a single-side polishing device, the slurry is not used. Since the problem of the abrasive grains not sticking does not occur, the protection rings 5 and 6 may be formed of vinyl chloride or the like. Further, the slopes 52, 62 are provided on the protection rings 5, 6, but the slopes 52, 62 are provided.
This does not exclude the protective rings 5 and 6 having a rectangular cross section without 62.
【００１８】[0018]
【発明の効果】以上詳しく説明したように、請求項１な
いし請求項３及び請求項５の発明によれば、研磨パッド
裁断時におけるカッタナイフ等による傷はスラリ非反応
性素材製の保護リングにのみ付き、保護膜に付くことは
ないので、熟練していない一般の作業者でも容易且つ短
時間で研磨パッドの裁断作業を行うことができるという
優れた効果がある。また、請求項４及び請求項６の発明
によれば、保護リングの斜面にカッタナイフ等を当てて
研磨パッドを裁断することができるので、研磨パッドの
裁断を容易且つ正確に行うことができるという効果があ
る。As described in detail above, according to the first to third and fifth aspects of the present invention, the scratches caused by the cutter knife or the like at the time of cutting the polishing pad are caused by the protection ring made of the slurry non-reactive material. There is an excellent effect that even an unskilled ordinary worker can easily and quickly cut the polishing pad because it is not attached to the protective film. According to the invention of claims 4 and 6, the polishing pad can be cut by applying a cutter knife or the like to the slope of the protective ring, so that the polishing pad can be cut easily and accurately. effective.
【図１】この発明の一実施形態に係るポリッシング装置
の定盤の研磨パッド非貼着状態を示す斜視図である。FIG. 1 is a perspective view showing a polishing plate according to an embodiment of the present invention in a state where a polishing pad is not adhered to a surface plate.
【図２】図１の矢視Ａ−Ａ断面図である。FIG. 2 is a sectional view taken along line AA of FIG.
【図３】定盤への研磨パッド貼着方法を示す順工程図で
ある。FIG. 3 is a sequential process diagram showing a method of attaching a polishing pad to a surface plate.
【図４】カッタナイフの刃先が保護リングに当たった状
態を示す断面図である。FIG. 4 is a cross-sectional view showing a state where the cutting edge of a cutter knife has hit a protection ring.
【図５】両面ポリッシング装置の断面図である。FIG. 5 is a sectional view of a double-side polishing apparatus.
【図６】従来の研磨パッド貼着方法を示す断面図であ
る。FIG. 6 is a cross-sectional view showing a conventional polishing pad attaching method.
１…定盤、 ２…保護膜、 ３…研磨パッド、 ４…カ
ッタナイフ、 ５，６…保護リング、 ５０，６０…パ
ッド当接面、 ５２，６２…斜面。DESCRIPTION OF SYMBOLS 1 ... Surface plate, 2 ... Protective film, 3 ... Polishing pad, 4 ... Cutter knife, 5, 6 ... Protective ring, 50, 60 ... Pad contact surface, 52, 62 ... Slope.
Claims (6)
れる円盤状又はドーナッツ状のポリッシング装置の定盤
において、 上記パッド貼着面以外の定盤の表面を覆う保護膜と、 上記パッド貼着面と平行なパッド当接面を有し且つこの
パッド当接面が上記パッド貼着面と略面一になるように
上記保護膜の外側から定盤の周面に嵌着されたスラリ非
反応性素材製の保護リングとを具備することを特徴とす
るポリッシング装置の定盤。1. A disk-shaped or donut-shaped polishing machine platen to which a polishing pad is stuck on a pad sticking surface, a protective film covering a surface of the platen other than the pad sticking surface, and the pad sticking. A non-reacting slurry that has a pad contact surface parallel to the surface and is fitted to the peripheral surface of the platen from outside the protective film so that the pad contact surface is substantially flush with the pad attachment surface. A surface plate for a polishing apparatus, comprising a protective ring made of a conductive material.
盤において 、 上記保護リングを、所定の合成樹脂で形成した、 ことを特徴とするポリッシング装置の定盤。2. The surface plate of the polishing device according to claim 1, wherein the protective ring is formed of a predetermined synthetic resin.
盤において 、 上記合成樹脂は、エポキシ樹脂，不飽和ポリエステル樹
脂，メラミン樹脂，ポリ塩化ビニル，フッ素樹脂，ポリ
アセタール，ポリアミド，低密度ポリエチレン，ポリエ
ステル樹脂，ポリカーポネート，ポリプロピレン，メタ
クリル樹脂，及びポリ塩化ビニリデンのいずれかであ
る、 ことを特徴とするポリッシング装置の定盤。3. The polishing table according to claim 2, wherein the synthetic resin is an epoxy resin, an unsaturated polyester resin, a melamine resin, a polyvinyl chloride, a fluororesin, a polyacetal, a polyamide, a low-density polyethylene, or a polyester. A platen for a polishing apparatus, wherein the platen is a resin, polycarbonate, polypropylene, methacrylic resin, or polyvinylidene chloride.
載のポリッシング装置の定盤において、 上記保護リングの上記パッド当接面と連続し且つ外方に
所定角度で傾斜する斜面を上記保護リングの周面に形成
した、 ことを特徴とするポリッシング装置の定盤。4. The surface plate of the polishing apparatus according to claim 1, wherein a slope that is continuous with the pad contact surface of the protection ring and is inclined outward at a predetermined angle is protected. A polishing machine surface plate formed on a peripheral surface of a ring.
れた定盤の周面に、上記パッド貼着面と平行なパッド当
接面を有するスラリ非反応性素材製の保護リングを上記
パッド当接面がパッド貼着面と略面一になるように嵌着
させる第１の工程と、 上記第１の工程を経た定盤よりも大きい原反の研磨パッ
ドを上記パッド貼着面及びパッド当接面に貼り付ける第
２の工程と、 上記保護リングの周面に沿って上記研磨パッドを裁断す
る第３の工程と を具備することを特徴とする研磨パッド貼着方法。5. A protective ring made of a slurry non-reactive material having a pad contact surface parallel to the pad attaching surface is provided on a peripheral surface of a surface plate whose surface other than the pad attaching surface is covered with a protective film. A first step of fitting the pad contact surface so as to be substantially flush with the pad adhering surface; and polishing the raw material polishing pad larger than the surface plate after the first step to the pad adhering surface. And a third step of cutting the polishing pad along the peripheral surface of the protective ring. 3. A polishing pad adhering method, comprising:
おいて、 上記第１の工程における保護リングは、上記保護リング
の上記パッド当接面と連続し且つ外方に所定角度で傾斜
する斜面をその周面に有し、 上記第３の工程は、上記保護リングの斜面に沿って上記
研磨パッドを裁断するものである、 ことを特徴とする研磨パッド貼着方法。6. The polishing pad attaching method according to claim 5, wherein the protection ring in the first step is a slope that is continuous with the pad contact surface of the protection ring and is inclined outward at a predetermined angle. Wherein the third step is to cut the polishing pad along a slope of the protective ring.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8491898A JP4041577B2 (en) | 1998-03-16 | 1998-03-16 | Surface plate of polishing apparatus and polishing pad attaching method |
| EP19990103955 EP0943397A2 (en) | 1998-03-16 | 1999-03-09 | Platen of polishing apparatus and method of adhesion of polishing pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8491898A JP4041577B2 (en) | 1998-03-16 | 1998-03-16 | Surface plate of polishing apparatus and polishing pad attaching method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11262855A true JPH11262855A (en) | 1999-09-28 |
| JP4041577B2 JP4041577B2 (en) | 2008-01-30 |
Family
ID=13844103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8491898A Expired - Lifetime JP4041577B2 (en) | 1998-03-16 | 1998-03-16 | Surface plate of polishing apparatus and polishing pad attaching method |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP0943397A2 (en) |
| JP (1) | JP4041577B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006289522A (en) * | 2005-04-06 | 2006-10-26 | Speedfam Co Ltd | Pressure roller for applying polishing pad and applying method of polishing pad with pressure roller in double-sided polishing device |
| JP2007083337A (en) * | 2005-09-21 | 2007-04-05 | Speedfam Co Ltd | Surface polishing device |
| CN107584346A (en) * | 2017-08-30 | 2018-01-16 | 浙江凯文磁钢有限公司 | The method for improving the up-to-standard rate of Double face grinding rare-earth permanent magnet ferrite ring magnet periphery |
| WO2019216301A1 (en) * | 2018-05-08 | 2019-11-14 | 丸石産業株式会社 | Polishing pad and polishing method with use of said polishing pad |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI643703B (en) * | 2015-07-20 | 2018-12-11 | 聯華電子股份有限公司 | A polishing platen for chemical mechanical polishing |
-
1998
- 1998-03-16 JP JP8491898A patent/JP4041577B2/en not_active Expired - Lifetime
-
1999
- 1999-03-09 EP EP19990103955 patent/EP0943397A2/en not_active Withdrawn
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006289522A (en) * | 2005-04-06 | 2006-10-26 | Speedfam Co Ltd | Pressure roller for applying polishing pad and applying method of polishing pad with pressure roller in double-sided polishing device |
| JP4584755B2 (en) * | 2005-04-06 | 2010-11-24 | スピードファム株式会社 | Pressure roller for attaching polishing pad in double-side polishing apparatus, and method for attaching polishing pad with pressure roller |
| JP2007083337A (en) * | 2005-09-21 | 2007-04-05 | Speedfam Co Ltd | Surface polishing device |
| JP4614851B2 (en) * | 2005-09-21 | 2011-01-19 | スピードファム株式会社 | Surface polishing equipment |
| CN107584346A (en) * | 2017-08-30 | 2018-01-16 | 浙江凯文磁钢有限公司 | The method for improving the up-to-standard rate of Double face grinding rare-earth permanent magnet ferrite ring magnet periphery |
| WO2019216301A1 (en) * | 2018-05-08 | 2019-11-14 | 丸石産業株式会社 | Polishing pad and polishing method with use of said polishing pad |
| JP2019195855A (en) * | 2018-05-08 | 2019-11-14 | 丸石産業株式会社 | Polishing pad and polishing method using the same |
| KR20210006325A (en) * | 2018-05-08 | 2021-01-18 | 마루이시 산교 가부시키가이샤 | Polishing pad and polishing method using the polishing pad |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4041577B2 (en) | 2008-01-30 |
| EP0943397A2 (en) | 1999-09-22 |
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