JP2006284591A - 環境条件補正により電気装置の精度を改善するためのシステム及び方法 - Google Patents
環境条件補正により電気装置の精度を改善するためのシステム及び方法 Download PDFInfo
- Publication number
- JP2006284591A JP2006284591A JP2006103085A JP2006103085A JP2006284591A JP 2006284591 A JP2006284591 A JP 2006284591A JP 2006103085 A JP2006103085 A JP 2006103085A JP 2006103085 A JP2006103085 A JP 2006103085A JP 2006284591 A JP2006284591 A JP 2006284591A
- Authority
- JP
- Japan
- Prior art keywords
- signal
- circuit
- measuring
- test
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
- G01R35/005—Calibrating; Standards or reference devices, e.g. voltage or resistance standards, "golden" references
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2836—Fault-finding or characterising
- G01R31/2849—Environmental or reliability testing, e.g. burn-in or validation tests
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/165—Stabilizing, e.g. temperature stabilization
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Measurement Of Resistance Or Impedance (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/098,695 US20060224345A1 (en) | 2005-04-04 | 2005-04-04 | System and method for improving electrical equipment accuracy by environmental condition compensation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006284591A true JP2006284591A (ja) | 2006-10-19 |
| JP2006284591A5 JP2006284591A5 (enExample) | 2009-06-25 |
Family
ID=36999078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006103085A Pending JP2006284591A (ja) | 2005-04-04 | 2006-04-04 | 環境条件補正により電気装置の精度を改善するためのシステム及び方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20060224345A1 (enExample) |
| JP (1) | JP2006284591A (enExample) |
| CN (1) | CN1849055A (enExample) |
| DE (1) | DE102006001476A1 (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE602006020054D1 (de) * | 2006-12-19 | 2011-03-24 | Abb Technology Ag | Vorrichtung und Verfahren zur Präzisionserhöhung bei Messwandlern |
| TW200929680A (en) * | 2007-12-19 | 2009-07-01 | Wistron Neweb Corp | An antenna module and a positioning device thereof |
| CN102096057B (zh) * | 2010-11-16 | 2013-10-02 | 北京航天测控技术有限公司 | 一种电容测量电路的校准方法及装置 |
| US8803505B2 (en) * | 2011-09-29 | 2014-08-12 | Imagine Communications Corp. | Transmitter calibration system |
| CN105487023A (zh) * | 2016-01-21 | 2016-04-13 | 晋江知保企业管理咨询有限公司 | 工频磁场检测装置 |
| CN105629083A (zh) * | 2016-01-21 | 2016-06-01 | 晋江知保企业管理咨询有限公司 | 工频电场检测装置 |
| CN106153173B (zh) * | 2016-06-16 | 2020-01-17 | 北京海卓同创科技有限公司 | 一种水中声速测量方法及装置 |
| CN106546901A (zh) * | 2016-09-23 | 2017-03-29 | 上海为准电子科技有限公司 | 一种针对射频电路湿度性能的功率校准的方法与装置 |
| CN106772187B (zh) * | 2017-03-13 | 2019-05-14 | 郑州云海信息技术有限公司 | 一种用于传输线损耗测试正确性的确定方法 |
| US11209377B2 (en) * | 2019-03-05 | 2021-12-28 | Andrew Wireless Systems Gmbh | Methods and apparatuses for compensating for moisture absorption |
| CN110427631B (zh) * | 2019-03-27 | 2023-03-10 | 贵州电网有限责任公司 | 理论线损计算所需主网线路与变压器参数双重校核方法 |
| CN110261697B (zh) * | 2019-06-20 | 2022-04-15 | 中国电力科学研究院有限公司 | 处于实际运行工况的架空输电线路的线损计算方法及系统 |
| CN113741582B (zh) * | 2021-08-27 | 2022-07-15 | 安徽创谱仪器科技有限公司 | 一种电容温度补偿方法及装置 |
| CN119827818B (zh) * | 2024-12-31 | 2025-11-18 | 科大智能电气技术有限公司 | 一种湿度补偿的交流高压及超高压线路电压在线测量方法 |
| CN120610149B (zh) * | 2025-08-12 | 2025-12-05 | 浪潮计算机科技有限公司 | 一种测试方法、装置、存储介质及电子设备 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62191774A (ja) * | 1986-02-13 | 1987-08-22 | ヴァイサラ オイ | インピ−ダンスの測定方法 |
| JPH02205373A (ja) * | 1989-02-03 | 1990-08-15 | Masatoshi Utaka | ホール素子のオフセット電圧を自己補償する方法 |
| JPH03277961A (ja) * | 1990-03-27 | 1991-12-09 | Matsushita Electric Works Ltd | 電気化学式ガスセンサ |
| JPH08274691A (ja) * | 1994-12-01 | 1996-10-18 | Teledyne Inc | Rf信号自動試験装置のアーキテクチャ |
| JP2000346884A (ja) * | 1999-04-09 | 2000-12-15 | Agilent Technol Inc | ダイオードマイクロ波電力センサ |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5059892A (en) * | 1990-10-15 | 1991-10-22 | Hewlett-Packard Company | Radio frequency signal interface |
| JP3502423B2 (ja) * | 1993-10-08 | 2004-03-02 | リーダー電子株式会社 | 信号処理回路補正装置 |
| US5566088A (en) * | 1994-06-13 | 1996-10-15 | Motorola, Inc. | Modular radio test system and method |
| FR2742232B1 (fr) * | 1995-12-08 | 1998-02-06 | Sextant Avionique | Procede et dispositif pour le test d'instruments de radio-navigation utilisant des appareils de mesure et de generation de signaux standards |
| US6316945B1 (en) * | 1998-09-02 | 2001-11-13 | Anritsu Company | Process for harmonic measurement accuracy enhancement |
| US6396287B1 (en) * | 1998-09-02 | 2002-05-28 | Anritsu Company | Process for measuring output harmonic relative to output fundamental with enhanced accuracy |
| JP2000171504A (ja) * | 1998-12-04 | 2000-06-23 | Nec Corp | 半導体評価装置 |
| FR2790097B1 (fr) * | 1999-02-18 | 2001-04-27 | St Microelectronics Sa | Procede d'etalonnage d'une sonde de circuit integre rf |
| FR2790096B1 (fr) * | 1999-02-18 | 2001-04-13 | St Microelectronics Sa | Structure etalon elementaire a faibles pertes pour l'etalonnage d'une sonde de circuit integre |
| CA2341941C (en) * | 2000-03-22 | 2006-07-04 | Communications Research Laboratory, Ministry Of Public Management, Home Affairs, Posts And Telecommunications | Method and apparatus for measuring harmonic load-pull for frequency multiplication |
| US6815964B2 (en) * | 2000-12-29 | 2004-11-09 | Stmicroelectronics S.R.L. | Test board de-embedding method to improve RF measurements accuracy on an automatic testing equipment for IC wafers |
| JP2003098222A (ja) * | 2001-09-25 | 2003-04-03 | Mitsubishi Electric Corp | 検査用基板、検査装置及び半導体装置の検査方法 |
| US6903542B2 (en) * | 2003-08-29 | 2005-06-07 | Agilent Technologies, Inc. | Systems and method for performing RF power measurements |
-
2005
- 2005-04-04 US US11/098,695 patent/US20060224345A1/en not_active Abandoned
-
2006
- 2006-01-11 DE DE102006001476A patent/DE102006001476A1/de not_active Withdrawn
- 2006-03-31 CN CNA2006100670189A patent/CN1849055A/zh active Pending
- 2006-04-04 JP JP2006103085A patent/JP2006284591A/ja active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62191774A (ja) * | 1986-02-13 | 1987-08-22 | ヴァイサラ オイ | インピ−ダンスの測定方法 |
| JPH02205373A (ja) * | 1989-02-03 | 1990-08-15 | Masatoshi Utaka | ホール素子のオフセット電圧を自己補償する方法 |
| JPH03277961A (ja) * | 1990-03-27 | 1991-12-09 | Matsushita Electric Works Ltd | 電気化学式ガスセンサ |
| JPH08274691A (ja) * | 1994-12-01 | 1996-10-18 | Teledyne Inc | Rf信号自動試験装置のアーキテクチャ |
| JP2000346884A (ja) * | 1999-04-09 | 2000-12-15 | Agilent Technol Inc | ダイオードマイクロ波電力センサ |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102006001476A1 (de) | 2006-10-05 |
| US20060224345A1 (en) | 2006-10-05 |
| CN1849055A (zh) | 2006-10-18 |
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