JP2006278407A5 - - Google Patents
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- Publication number
- JP2006278407A5 JP2006278407A5 JP2005091023A JP2005091023A JP2006278407A5 JP 2006278407 A5 JP2006278407 A5 JP 2006278407A5 JP 2005091023 A JP2005091023 A JP 2005091023A JP 2005091023 A JP2005091023 A JP 2005091023A JP 2006278407 A5 JP2006278407 A5 JP 2006278407A5
- Authority
- JP
- Japan
- Prior art keywords
- capillary
- wire
- pads
- forming
- bump electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 210000001736 Capillaries Anatomy 0.000 claims 30
- 239000002184 metal Substances 0.000 claims 8
- 238000004519 manufacturing process Methods 0.000 claims 6
- 239000004065 semiconductor Substances 0.000 claims 6
- 238000007599 discharging Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005091023A JP2006278407A (ja) | 2005-03-28 | 2005-03-28 | 半導体装置の製造方法 |
| US11/347,231 US20060216863A1 (en) | 2005-03-28 | 2006-02-06 | Method of manufacturing semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005091023A JP2006278407A (ja) | 2005-03-28 | 2005-03-28 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006278407A JP2006278407A (ja) | 2006-10-12 |
| JP2006278407A5 true JP2006278407A5 (US08063081-20111122-C00115.png) | 2008-05-15 |
Family
ID=37035733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005091023A Pending JP2006278407A (ja) | 2005-03-28 | 2005-03-28 | 半導体装置の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20060216863A1 (US08063081-20111122-C00115.png) |
| JP (1) | JP2006278407A (US08063081-20111122-C00115.png) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4679427B2 (ja) * | 2006-04-24 | 2011-04-27 | 株式会社新川 | ボンディング装置のテールワイヤ切断方法及びプログラム |
| US20100320592A1 (en) * | 2006-12-29 | 2010-12-23 | Sanyo Electric Co., Ltd. | Semiconductor device and method for manufacturing the same |
| JP2009158750A (ja) * | 2007-12-27 | 2009-07-16 | Fujifilm Corp | ワイヤボンディング方法及び半導体装置 |
| EP2133915A1 (de) * | 2008-06-09 | 2009-12-16 | Micronas GmbH | Halbleiteranordnung mit besonders gestalteten Bondleitungen und Verfahren zum Herstellen einer solchen Anordnung |
| MY152355A (en) | 2011-04-11 | 2014-09-15 | Carsem M Sdn Bhd | Short and low loop wire bonding |
| MY181180A (en) * | 2011-09-09 | 2020-12-21 | Carsem M Sdn Bhd | Low loop wire bonding |
| US9093515B2 (en) * | 2013-07-17 | 2015-07-28 | Freescale Semiconductor, Inc. | Wire bonding capillary with working tip protrusion |
| US9087815B2 (en) * | 2013-11-12 | 2015-07-21 | Invensas Corporation | Off substrate kinking of bond wire |
| US9082753B2 (en) * | 2013-11-12 | 2015-07-14 | Invensas Corporation | Severing bond wire by kinking and twisting |
| JP5686912B1 (ja) * | 2014-02-20 | 2015-03-18 | 株式会社新川 | バンプ形成方法、バンプ形成装置及び半導体装置の製造方法 |
| JP2018137342A (ja) | 2017-02-22 | 2018-08-30 | 株式会社村田製作所 | 半導体装置及びその製造方法 |
| WO2018152647A1 (en) * | 2017-02-24 | 2018-08-30 | Reflex Photonics Inc. | Wirebonding for side-packaged optical engine |
| WO2022013955A1 (ja) * | 2020-07-15 | 2022-01-20 | 株式会社新川 | ワイヤボンディング装置及び半導体装置の製造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09312375A (ja) * | 1996-03-18 | 1997-12-02 | Hitachi Ltd | リードフレーム、半導体装置及び半導体装置の製造方法 |
| JP3620213B2 (ja) * | 1997-02-28 | 2005-02-16 | ソニー株式会社 | バンプ形成装置 |
| JP3765952B2 (ja) * | 1999-10-19 | 2006-04-12 | 富士通株式会社 | 半導体装置 |
| JP3913134B2 (ja) * | 2002-08-08 | 2007-05-09 | 株式会社カイジョー | バンプの形成方法及びバンプ |
| JP2003059961A (ja) * | 2001-08-16 | 2003-02-28 | Mitsubishi Electric Corp | ワイヤボンディング方法、および半導体装置 |
| JP3902640B2 (ja) * | 2002-07-23 | 2007-04-11 | シャープタカヤ電子工業株式会社 | ワイヤボンディング方法 |
| US7229906B2 (en) * | 2002-09-19 | 2007-06-12 | Kulicke And Soffa Industries, Inc. | Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine |
| JP4605996B2 (ja) * | 2003-05-29 | 2011-01-05 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置の製造方法 |
-
2005
- 2005-03-28 JP JP2005091023A patent/JP2006278407A/ja active Pending
-
2006
- 2006-02-06 US US11/347,231 patent/US20060216863A1/en not_active Abandoned
