JP2006260670A - Manufacturing method of optical disk and optical disk - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To manufacture an optical disk on which a non-contact type IC chip is mounted in a simple process at low cost. <P>SOLUTION: A spiral antenna coil 4 is formed by blanking or cutting work from a metal plate and both end parts of the antenna coil 4 and respective electrodes of an IC chip module 3 on which the non-contact type IC chip 2 is mounted are electrically connected. An optical disk substrate 1 provided with a recessed part is molded and the antenna coil 4 to which the IC chip module 3 is connected is disposed and enclosed in the recessed part of the optical disk substrate 1. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an optical disc manufacturing method and an optical disc that are recording media capable of reading a recording signal by light irradiation, and more particularly to an optical disc manufacturing method and an optical disc in which a non-contact type IC chip is mounted on an optical disc substrate.

  In recent years, DVD (Digital Versatile Disk) has been widely used as an optical disk medium capable of recording large-capacity data such as video. Recently, development of an optical disc using a blue semiconductor laser as a light source has been promoted for the purpose of recording images with higher image quality and longer time, and Blu-ray Disc (registered trademark) has already been commercialized as one type. ing.

  Thus, as high-quality digital content can be easily stored in a portable recording medium, the importance of protecting the copyright of the digital content is increasing. In a Blu-ray disc, an ID unique to each disc is recorded as a barcode pattern on the innermost circumference of a signal recording area called BCA (Burst Cutting Area), and the player reads this ID, so that an illegal disc is recorded. It is managed not to be played. However, technology for creating illegal discs is becoming more sophisticated year by year, and it is said that more robust copyright protection measures are required.

  On the other hand, in recent years, IC chips called RFID (Radio Frequency Identification), which can exchange information with the outside without contact, have been used for admission cards, traffic tickets, electronic money, and the like. Non-contact type IC chip does not have a built-in battery, receives radio waves or magnetic fields from a reader / writer (R / W) with an antenna and converts them into electromotive force, so it is lightweight, portable and semipermanently used. It has the feature of being possible. In addition to this, there is a feature that replication is very difficult.

  From such a background, it is considered that a non-contact type IC chip is mounted on an optical disc to strengthen copyright protection measures. For example, by mounting a non-contact IC chip in which a disk ID is recorded in a read-only state on an optical disk, the risk of copying an optical disk having the same disk ID is significantly greater than when using the BCA pattern described above. Can be reduced.

  Furthermore, when the storage capacity of the non-contact type IC chip has a margin, an application for providing a benefit to the user can be stored in the remaining storage area to generate a new added value to the optical disc. For example, a non-contact type IC chip is provided on a ROM (Read Only Memory) type optical disk in which game software is stored, and an intermediate state of the game is stored in the non-contact type IC chip, or recorded contents in the optical disk are not stored. For example, it is possible to record on a contact IC chip so that the recorded contents can be known only by holding the optical disk over the R / W without inserting it into the player.

  By the way, when a non-contact type IC chip is mounted on an optical disk, it is necessary to form an antenna for wireless communication and power supply on the optical disk. Since an optical disk is a disk that rotates about its center, it has a high affinity with a coiled antenna (hereinafter referred to as an antenna coil) from the viewpoint of weight balance. For this reason, it is considered that an antenna coil is formed further inside the signal recording area on the optical disc or on the back side of the signal recording area (see, for example, Patent Document 1).

As a method for manufacturing the antenna coil of such a non-contact type IC chip, the following method is mainly used.
(1) Winding method A wire conductor such as a copper wire (conducting wire) is wound several to several thousand times by a winding machine to form a coil, and a non-contact type IC chip is connected to the end point of the machine. Fixed.

(2) Embedding method A non-contact type IC is prepared by preparing a sheet as a coil fixing location and embedding the sheet while fixing a linear conductor such as a copper wire in a designated shape and position. The chip is fixed before or after embedding the conductive wire, and finally the conductive wire and the non-contact type IC chip are connected.

(3) Screen printing method The conductive pattern of the coil is formed by printing conductive ink (conductive paint) made of conductive polymer containing conductive fine particles (powder) such as silver, copper and carbon on the sheet. In this way, coils of any shape can be printed by changing the printing original.

(4) Etching method A metal foil such as a copper foil with a thickness of about 18 to 70 μm is pasted on an insulating plate or sheet such as a resin, and a resist pattern is printed or applied to protect the remaining portion from the solution. This is a method of dissolving and removing unnecessary patterns of metal parts that are formed by development and removal, but not covered with a resist pattern, with a chemical solution. This method uses printed wiring boards (printed wiring boards) such as printed boards and flexible boards. This is the same as the general manufacturing method.

(5) Plating method In reverse to the removal of the metal by etching, a pattern is formed on the surface of an insulating plate or sheet such as a resin, and a metal is deposited (plated) on a portion not covered with the pattern, In the plating process, after performing electroless plating for forming a metal pattern, electroplating may be performed in order to increase the metal thickness or attach a metal of a different material.

In addition to this, a method of forming a conductive pattern on a substrate by a thin film forming technique such as sputtering is also considered.
JP 11-353714 A (paragraph numbers [0018] to [0023], FIG. 1)

  By the way, although the IC card on which the non-contact type IC chip is mounted by the above-described method has already been widely spread, it cannot be said that the spread of the optical disk on which the non-contact type IC chip is mounted is advanced. One of the factors is that although the price of the non-contact type IC chip itself is gradually decreasing, the manufacturing cost for incorporating the antenna coil and the non-contact type IC chip into the optical disk substrate is high. For example, an antenna coil or a non-contact type IC chip needs to be incorporated into an optical disk, but the antenna coil manufacturing method described above is suitable for an optical disk structure, a substrate material, and the like. As described above, dedicated equipment is required, and the process is complicated and the manufacturing time is increased.

  The present invention has been made in view of such a problem, and an object of the present invention is to provide an optical disc manufacturing method capable of manufacturing an optical disc mounted with a non-contact type IC chip at a low cost by a simple process.

  Another object of the present invention is to provide an optical disc on which a non-contact type IC chip is mounted that is manufactured at a low cost by a simple process.

  In the present invention, in order to solve the above-mentioned problem, in a method of manufacturing an optical disc mounted with a non-contact IC chip, an antenna forming step of forming a circular or spiral antenna coil from a metal plate by punching or cutting; A wiring step for electrically connecting both ends of the antenna coil and the electrodes of the non-contact IC chip, a substrate molding step for molding an optical disc substrate having a recess, and the recess of the optical disc substrate, And a sealing step of placing and sealing the antenna coil to which the non-contact type IC chip is connected.

  According to such an optical disk manufacturing method, the antenna coil is formed by punching or cutting from a metal plate and disposed in the recess on the optical disk substrate. Therefore, the optical disk on which the non-contact type IC chip is mounted is Manufactured inexpensively with a simple process.

  In order to solve the above-described problems, the present invention provides a circular or spiral antenna coil punched or cut from a metal plate in an optical disk on which a non-contact IC chip is mounted, and both ends of the antenna coil. There is provided an optical disc comprising: the non-contact type IC chip to which each electrode is connected; and an optical disc substrate having a recess accommodating the antenna coil to which the non-contact type IC chip is connected. The

  According to such an optical disc, the antenna coil punched or cut from the metal plate is accommodated in the concave portion formed in the optical disc substrate, so that it can be manufactured at a low cost by a simple process.

  According to the optical disk manufacturing method of the present invention, the antenna coil is formed by punching or cutting from a metal plate and disposed in the recess on the optical disk substrate, so that an optical disk mounted with a non-contact type IC chip can be simplified. It can be manufactured inexpensively with a simple process.

  Further, according to the optical disk of the present invention, the antenna coil punched or cut from the metal plate is accommodated in the recess formed on the optical disk substrate, so that the optical disk on which the non-contact type IC chip is mounted can be easily obtained. It can be manufactured inexpensively in the process.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a diagram showing the structure of an optical disc according to the first embodiment. (A) is a plan view and (B) is a side sectional view. Here, an optical disk, which is a recording medium that can be recorded and reproduced by laser light irradiation, will be described.

  As an example, the optical disk of the present embodiment is a single-sided, dual-layer DVD manufactured by a double-sided bonding method of resin substrates. An IC chip obtained by modularizing an electromagnetic induction type (inductive coupling type, magnetic field type) non-contact type IC chip 2 (hereinafter simply referred to as an IC chip) on the optical disk substrate 1 on the side opposite to the signal reading side. Module 3 is mounted. The IC chip 2 is capable of non-contact communication using a frequency of, for example, 120 kHz to 135 kHz, or 13.56 MHz or less, and is joined to a spiral antenna coil 4 for receiving signal transmission and reception and power supply. Has been. The basic structure of this optical disc conforms to the DVD standard, the outer diameter D is 120 mm, the height (thickness) H is 1.2 mm, and the distance L between the first and second recording layers is 55 μm. Yes.

  The optical disk substrate 1 includes a recess in which the IC chip module 3 bonded to the antenna coil 4 is disposed, and an enclosing portion for enclosing the IC chip module 3 bonded to the antenna coil 4. The spiral antenna coil 4 is formed by punching or cutting from a metal plate, and the IC chip module 3 has both ends on the inner and outer peripheral parts of the spiral antenna coil 4. The electrode is electrically connected to the vicinity of the portion.

FIG. 2 is a diagram showing a manufacturing process of the optical disk having the above structure.
The above-described optical disc manufacturing process is roughly divided into three steps: a process of assembling the IC chip module 3, a process of forming the optical disc substrate 1, and a process of encapsulating the IC chip module 3 in the optical disc substrate 1. However, a method in which these steps are performed consistently may be used, or a method in which the IC chip module 3 is separately assembled and a series of processes from formation to completion of the optical disk may be performed.

  That is, in the process of forming the IC chip module 3, the spiral antenna coil 4 is cut out from the metal plate by punching or cutting (step S1a), and both ends of the spiral antenna coil 4 at the inner peripheral portion and the outer peripheral portion are formed. The electrode of the IC chip module 3 is joined to the vicinity of the part (step S2a). Next, a release sheet for transportation and storage is attached (step S3a), the outer frame (frame) and the dam bar (tie bar) are cut out and trimmed (step S4a), and then the release sheet for transportation and storage is removed. (Step S5a).

  On the other hand, in the assembling process of the optical disk substrate 1, an optical disk substrate having a recess is formed by, for example, injection molding (process S1b), and processing on the recording layer side such as a reflective film and a protective layer is performed (process S2b). Then, the IC chip module 3 to which the antenna coil 4 is bonded is disposed in the concave portion of the optical disk substrate 1 (step S6) and encapsulated with an encapsulant (step S7).

  As described above, in the optical disk of the present embodiment, the antenna coil 4 of the non-contact type IC chip 2 is cut out from a metal plate by punching or cutting, and the antenna coil 4 is disposed in the recess of the optical disk substrate 1. Therefore, the optical disk on which the IC chip 2 is mounted can be manufactured at low cost by a simple process, and the manufacturing process can be simplified and the price can be reduced. That is, the conventional method requires a complicated apparatus and process, and the cost of materials and equipment becomes expensive, and the processing time becomes long, so that the manufacturing cost of the optical disc as a whole becomes high. Further, for example, when the antenna coil pattern is formed as a thin film, it is difficult to obtain sufficient reception intensity, and the cost is increased as described above.

Next, the above steps will be described in detail.
FIG. 3 is a diagram showing the structure and processing method of the antenna coil 4. (A) is a plan view and (B) is a side sectional view.

  As shown in this figure, the antenna coil 4 shown in FIG. 1 is formed by punching or cutting a metal plate having a thickness t of 50 μm to 125 μm. At this time, until the IC chip module 3 is attached, the outer frame (frame) 5 and the dam bar (tie bar) 6 of the metal plate are left so that the antenna coil 4 is not separated. It becomes easy to hold the shape.

  The thickness t of the metal plate to be punched or cut is such that the shape can be maintained by the rigidity of the metal plate alone even if a part of the metal plate is lifted, and the material cost can be reduced. Therefore, it is desirable to be thin, for example, 50 μm, 80 μm, 100 μm, 125 μm or the like.

  Further, as a material of the metal plate, Fe-Ni (Fe-42% Ni, 42 alloy), Fe-Ni-Co, Fe-Ni-Cr, Fe-Ni-Mn- whose main component is iron (Fe). Si—C—P—S or the like is preferable. Or, since iron is a magnetic material, the higher the frequency of the signal excited in the coil, the more likely the deterioration of transfer characteristics with increasing magnetic susceptibility. Cu—Fe—Zn—P, Cu—Ni—Si—Zn, Cu—Ni—Si—Mg, Cu—Ni—Si—Sn—Zn, Cu—Cr, which are mainly composed of copper (Cu), which is a magnetic material. -Sn-Zn, Cu-Ni-Si-Zn-Ag, and the like are preferable.

  4 and 5 are diagrams showing an example of the structure of the IC chip module 3 joined to the antenna coil 4 described above. Each of a1 and b1 is a perspective view, a2 and b2 are plan views, and a3 and b3 are side views.

  In the IC chip module 3 shown in FIGS. 4A and 4B, the module substrate is made of an insulating material, and electrodes (not shown) of the IC chip 2 and electrodes 31a and 31b to the antenna coil 4 are They are connected by a conductor 33 covered with an insulating material 32. The distance between the electrodes 31a and 31b is set so as to be connected to both ends of the antenna coil 4, respectively, between the antenna coil 4 disposed between the electrodes 31a and 31b and the wiring conductor 33, and between the electrodes 31a and 31b. Both of them are reliably electrically insulated by the insulating material 32. Further, as shown in FIG. 4B, it is desirable to provide an adhesive layer 34 between the electrodes 31a and 31b in order to hold a rotating portion that is not both ends of the antenna coil 4.

  The IC chip module 3 shown in FIGS. 5A and 5B has a structure in which the electrodes 35 a and 35 b to the antenna coil 4 are directly connected to the electrodes of the IC chip 2. In this structure, an insulating portion 36 is provided between the electrodes 35a and 35b so that the surrounding portions that are not both ends of the antenna coil 4 do not contact the electrodes 35a and 35b.

  By forming the IC chip module 3 as described above separately from the process of forming the antenna coil 4 and the like, the wiring connection work between the IC chip 2 and the antenna coil 4 can be made efficient. It should be noted that the IC chip module 3 having any configuration shown in FIGS. 4 and 5 can be applied to the following embodiments.

  FIG. 6 is a view showing a state in which the IC chip module 3 is attached to the antenna coil 4. Here, as an example, a state in which the IC chip module 3 shown in FIG. 4B is attached to the antenna coil 4 shown in FIG. 3 is shown. (A) is a plan view and (B) is a side sectional view.

  As shown in FIG. 6, the electrodes at both ends of the IC chip module 3 are joined to the inner and outer peripheral portions of the antenna coil 4 by electrical connection and mechanical fixing by soldering or welding, respectively. To do. Thereby, the IC chip 2 and the antenna coil 4 are wired. Further, the shape of the antenna coil 4 is maintained by mechanically fixing it to the middle part of the antenna coil 4 by the adhesive layer on the bottom surface of the IC chip module 3. In this example, the outer frame 5 and the dam bar 6 are left as semi-finished products, and can be transported and stored in this state until they are mounted on the optical disc substrate 1.

  In this example, the antenna coil 4 is formed such that both ends of the antenna coil 4 are not on the same straight line extending in the radial direction from the center, and the terminal position is shifted by about 90 degrees from the center. By forming the antenna coil 4 in such a shape, when joining the antenna coil 4 of the IC chip module 3, it is only necessary to align the position within a range of 90 degrees with respect to the disk rotation direction, thus simplifying the work. This can reduce the manufacturing cost.

  The terminal position of the antenna coil 4 is not limited to the angle (90 degrees), and may be shifted from the center by an arbitrary angle. However, since the inductance of the antenna coil 4 varies depending on the magnitude of the deviation angle, it is necessary to design the IC chip module 3 so that communication is possible regardless of the angle.

  FIG. 7 is a diagram showing a state in which the IC chip module 3 is attached to the antenna coil 4 as in FIG. Here, the outer frame 5 and the dam bar 6 are cut out. (A) is a plan view and (B) is a side sectional view.

  If the outer frame 5 and the dam bar 6 are cut out as shown in this figure, the antenna coil 4 is likely to be deformed such as distortion or warping during transportation or storage. Therefore, the antenna is placed on the release sheet 7 made of paper or the like. It is desirable to fix the coil 4.

FIG. 8 is a diagram illustrating a structure example of the optical disc substrate 1. (A) is a plan view and (B) is a side sectional view.
In FIG. 8, the concave portion 11 a in which the IC chip module 3 of the optical disk substrate 1 is disposed is molded so as to be similar to the outer shape of the spiral antenna coil 4. The recess 11a may have the same shape as the antenna coil 4.

  9A and 9B are views showing a state in which the IC chip module 3 is disposed in the recess 11a. Here, the state where the IC chip module 3 with the antenna coil 4 shown in FIGS. 6 and 7 is arranged is shown.

  In the example of this figure, the recesses 11a of the optical disk substrate 1 and the spiral antenna coil 4 have the same outer shape, and the antenna coil 4 is dropped into the recess 11a after their orientations are matched. Yes.

FIG. 10 is a diagram showing a manufacturing process in which the IC chip module 3 and the antenna coil 4 are enclosed in the optical disk substrate 1.
In FIG. 10, from the state in which the IC chip module 3 with the antenna coil 4 is disposed in the recess 11a of the optical disk substrate 1 as shown in FIG. 9, a resin 8 such as an ultraviolet curable resin is injected into the recess 11a. The case where the chip module 3 and the antenna coil 4 are enclosed is shown. After pouring the resin 8 into the recess 11a as shown in FIG. 10A, the film 9 is attached to the upper surface of the optical disk substrate 1 as shown in FIG. Finished on a flat surface.

  Here, when covering the surface which was the opening part of the recessed part 11a in order to enclose said IC chip module 3, the sheet | seat of the following materials, a film, and the member of a thin plate can be affixed. That is, as the material, polycarbonate, acrylic, vinyl chloride, polyethylene terephthalate (PET), polyester, polyethylene, polypropylene, polystyrene, nylon, glass, paper, nonwoven fabric, and the like can be used.

  In selecting these materials, the IC chip module 3 is enclosed not on the reading surface of the optical disc but on the so-called label surface side, so it is not necessary to be a transparent material and may be an opaque material. And to meet the shape standard of optical disc, uniformity and flatness not disturbing the center of gravity, flatness and surface smoothness as label surface, when each substrate and each member constituting optical disc are bonded It is desirable to select a material that does not warp the optical disc in consideration of temperature change, humidity change, aging change, and the like.

  In the first embodiment described above, in the double-sided bonded DVD, the recess 11a for mounting the antenna coil 4 and the like is provided on the substrate opposite to the signal readout surface and has an opening on the outside. Formed. However, for example, when a manufacturing method in which two recording layers are laminated on the optical disk substrate on the signal readout surface side, an opening is provided inside the other optical disk substrate (that is, the bonding surface side). A recess may be formed, and the antenna coil 4 or the like may be enclosed in the recess.

FIG. 11 is a diagram showing the structure of an optical disc according to the second embodiment of the present invention. (A) is a plan view and (B) is a side sectional view.
In the present embodiment, a single-sided dual-layer Blu-ray disc is shown as an example of an optical disc. In this optical disc, the width of the concave portion 11b with respect to the radial direction of the optical disc substrate 1 is not less than the maximum width of the antenna coil 4 with respect to the radial direction in a region corresponding to a predetermined angle from the center of the optical disc substrate 1. When the concave portion 11b is molded and the antenna coil 4 is inserted, the concave portion 11b has a degree of freedom in the rotation direction.

  FIG. 12 is a view showing a state in which the IC chip module 3 and the antenna coil 4 are arranged in the concave portion 11b of the optical disc substrate 1 described above. (A) is a plan view and (B) is a side sectional view. Here, as an example, the IC chip module 3 having the structure shown in FIG. 5B is used.

  In this example, the shape of the concave portion 11b of the optical disc substrate 1 is adjusted so as to include the outer shape of the antenna coil 4, and the antenna coil 4 can be dropped into the concave portion 11b in a state where there is a margin in alignment accuracy in the disc rotation direction. It is like that. Thereby, the work efficiency at the time of installation of the antenna coil 4 can be improved.

FIG. 13 is a diagram showing a manufacturing process in which the IC chip module 3 and the antenna coil 4 are enclosed in the optical disc substrate 1 described above. (A) is a plan view and (B) is a side sectional view.
In FIG. 13, the IC chip module 3 and the antenna coil 4 are disposed in the recess 11b of the optical disk substrate 1, and a resin 8 such as an ultraviolet curable resin is poured into the recess 11b. Then, after flattening the surface that was the opening of the recess 11b with a squeegee 42 or a doctor blade, the IC chip module 3 and the antenna coil 4 are sealed by curing the resin 8. A method such as spin coating may be used to flatten the surface that was the opening of the recess 11b.

FIG. 14 is a diagram showing the structure of an optical disc according to the third embodiment of the present invention. (A) is a plan view and (B) is a side sectional view.
In FIG. 14, a concave portion 11c having a different shape is formed on the optical disc substrate 1 of the single-sided dual-layer Blu-ray disc as described above. In the concave portion 11c, the outer peripheral portion and the inner peripheral portion are respectively formed in the same concentric shape as the outermost peripheral portion and the innermost peripheral portion of the antenna coil 4, and the spiral antenna coil 4 can be inserted at any rotation angle. It has become.

FIG. 15 is a view showing a state in which the IC chip module 3 and the antenna coil 4 are arranged in the concave portion 11 c of the optical disk substrate 1. (A) is a plan view and (B) is a side sectional view.
As described above, in this example, the shape of the concave portion 11c of the optical disc substrate 1 is annular, and even if the antenna coil 4 has an arbitrary rotation angle, the concave portion 11c can be dropped into the concave portion 11c. Can be improved.

  Next, a method for cutting out the spiral antenna coil 4 will be described. When the spiral antenna coil 4 is cut out from a metal plate by punching or cutting, one predetermined portion of the metal plate is used as shown in FIGS. A plurality of spiral antenna coils 4 having substantially the same shape are cut out from the region. Thereby, manufacturing cost can be reduced.

16 and 17 are diagrams illustrating an example of a method for cutting out an antenna coil. (A) of each figure is a top view, (B) is side sectional drawing.
FIG. 16 shows a case where two spiral antenna coils 4a and 4b are cut out from one region of the metal plate. FIG. 17 shows a case where four spiral antenna coils 4c, 4d, 4e, and 4f are cut out from one region of the metal plate, and the manufacturing cost can be further reduced.

  As described above, in the optical disk of each of the above embodiments, a metal plate is used as the antenna coil 4 in the same manner as a lead frame that is a terminal of an IC. Therefore, a conventional screen printing method or plating method manufacturing method is used. As compared with the above, the conductivity of the antenna coil 4 can be improved, and as a result, the communicable distance can be increased. In addition, since the process of cutting the antenna coil 4 from the metal plate is used, the metal material is less wasted and the manufacturing cost can be reduced as compared with the conventional process using a mask such as an etching method or a thin film forming method. Furthermore, compared to conventional screen printing and etching methods, a sheet portion serving as a base for a conductor (such as a polyimide film in a flexible substrate corresponding to the etching method) is not essential. Therefore, the antenna coil 4 can be manufactured at a low manufacturing cost. In addition, since the material constituting the finished optical disk is reduced, there are fewer factors that cause warping and deformation of the optical disk during manufacturing and aging.

  Then, after the modularized IC chip 2 is joined to the antenna coil 4 that has such a good transmission / reception performance and can be easily created, it is dropped into the recess formed in the optical disc substrate 1. The recesses on the substrate can be formed in any shape relatively easily by injection molding, and can be easily mounted on the optical disc substrate 1 after the antenna coil 4 and the IC chip 2 are electrically connected. The process can be made efficient, and as a result, the manufacturing cost can be reduced.

  Further, by making the antenna coil 4 into a spiral shape, it can be brought close to a rotationally symmetric shape, and a structure having little influence on the characteristics of the optical disk such as eccentricity can be obtained. When the terminal part of the IC chip module 3 is made of the same metal plate as the lead frame which is the terminal of the IC, it is the same quality as the antenna coil 4, and therefore the joining is easy and the manufacturing cost is reduced. It can be kept inexpensive.

  In addition, in the optical disk manufacturing process, manufacturing is performed with a tact time of several seconds (about 3 seconds to 8 seconds) in the injection molding and reflection film manufacturing processes. In each of the above embodiments, the antenna coil 4 is made of metal. Since the process of cutting out from the plate is used, the same tact time can be achieved even when the antenna coil 4 is manufactured. Further, since the component state of the IC chip module with the antenna coil is rigid, the handling at the time of assembly is simple, and in the process of inserting the IC chip module with the antenna coil into the concave portion of the optical disk substrate 1, the same tact time is obtained. Can be achieved.

It is a figure which shows the structure of the optical disk of the 1st Embodiment of this invention. It is a figure which shows the manufacturing process of the optical disk of 1st Embodiment. It is a figure which shows the structure and processing method of the antenna coil of 1st Embodiment. It is a figure which shows the structural example (the 1) of the IC chip module of 1st Embodiment. It is a figure which shows the structural example (the 2) of the IC chip module of 1st Embodiment. It is a figure which shows the state which attached the IC chip module of 1st Embodiment to the antenna coil. It is a figure which shows the state which attached the IC chip module of 1st Embodiment to the antenna coil. It is a figure which shows the structural example of the optical disk board | substrate of 1st Embodiment. It is a figure which shows the state which has arrange | positioned the IC chip module in the recessed part of the optical disk board | substrate of 1st Embodiment. It is a figure which shows the manufacturing process which encloses an IC chip module and an antenna coil in the optical disk substrate of 1st Embodiment. It is a figure which shows the structure of the optical disk of the 2nd Embodiment of this invention. It is a figure which shows the state which has arrange | positioned the IC chip module and the antenna coil to the optical disk substrate of 2nd Embodiment. It is a figure which shows the manufacturing process which encloses an IC chip module and an antenna coil in the optical disk substrate of 2nd Embodiment. It is a figure which shows the structure of the optical disk of the 3rd Embodiment of this invention. It is a figure which shows the state which has arrange | positioned the IC chip module and the antenna coil to the optical disk board | substrate of FIG. It is a figure which shows the case where two spiral antenna coils are cut out from one area | region of a metal plate. It is a figure which shows the case where four spiral antenna coils are cut out from one area | region of a metal plate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Optical disk substrate, 2 ... Non-contact type IC chip, 3 ... IC chip module, 4 ... Antenna coil, 5 ... Outer frame, 6 ... Dam bar, 7 ... Release sheet, 11a ... Recessed part, 31a, 31b ... Electrode, 32 ... Insulating material, 33 ... Conductor, 34 ... Adhesive layer, 35a, 35b ... Electrode, 36 ... Insulating part

Claims (15)

In a method of manufacturing an optical disc on which a non-contact type IC chip is mounted,
An antenna forming step of forming a circular or spiral antenna coil by punching or cutting from a metal plate;
A wiring step of electrically connecting both ends of the antenna coil and the electrodes of the non-contact type IC chip;
A substrate molding process for molding an optical disk substrate having a recess;
An enclosing step of placing and enclosing the antenna coil to which the non-contact type IC chip is connected in the recess of the optical disc substrate;
A method of manufacturing an optical disc, comprising: Two connection terminals spaced apart at both ends, an insulating part disposed between the connection terminals, and the non-contact type IC chip wired to the connection terminals inside or on the top of the insulation part; A module manufacturing process for manufacturing an IC chip module comprising:
2. The method of manufacturing an optical disk according to claim 1, wherein, in the wiring step, the connection terminals of the IC chip module are respectively joined to both end portions of the antenna coil.   3. The optical disk according to claim 2, wherein when the antenna coil is spiral, the IC chip module is joined to the antenna coil so that the two connection terminals are along the radial direction of the optical disk substrate. Manufacturing method.   2. The method of manufacturing an optical disk according to claim 1, wherein, in the substrate molding step, molding is performed so that the shape of the opening of the concave portion is similar to the outer shape of the antenna coil. When the antenna coil is spiral,
In the substrate molding step, the width of the opening of the recess with respect to the radial direction of the optical disc substrate is equal to or greater than the maximum width of the antenna coil with respect to the radial direction in a region of a predetermined angle from the center of the optical disc substrate. 2. The method of manufacturing an optical disc according to claim 1, wherein the concave portion is molded, and an angle in a disc rotation direction when the antenna coil is inserted into the concave portion is given a degree of freedom. When the antenna coil is spiral,
In the substrate molding step, the outer peripheral portion and the inner peripheral portion of the opening of the concave portion are both formed concentrically with the optical disc substrate, and the antenna coil is formed in the concave portion at an arbitrary angle with respect to the disc rotation direction. 2. The method of manufacturing an optical disk according to claim 1, wherein insertion is possible. When the antenna coil is spiral,
2. The method of manufacturing an optical disk according to claim 1, wherein, in the antenna forming step, a plurality of the antenna coils having the same shape are formed from one region of the metal plate.   2. The method of manufacturing an optical disc according to claim 1, wherein, in the enclosing step, after the resin is filled in the concave portion, a sheet material is attached to the surface of the optical disc substrate and flattened. For optical discs with non-contact IC chips,
A circular or spiral antenna coil stamped or cut from a metal plate;
The non-contact IC chip in which each electrode is connected to both ends of the antenna coil;
An optical disk substrate having a recess accommodating the antenna coil to which the non-contact type IC chip is connected;
An optical disc comprising:   Two connection terminals spaced apart at both ends, an insulating part disposed between the respective connection terminals, each electrode of the non-contact type IC chip and each connection terminal inside or on the upper surface of the insulation part, The non-contact type IC chip and the antenna coil are wired by bonding each connection terminal of the IC chip module to both ends of the antenna coil. The optical disk according to claim 9. The antenna coil is spiral,
The IC chip module is joined to the antenna coil so that the two connection terminals are along the radial direction of the optical disk substrate.
The optical disk according to claim 10.   The optical disk according to claim 9, wherein the shape of the opening of the recess formed in the optical disk substrate is similar to the outer shape of the antenna coil. The antenna coil is spiral,
The width of the opening of the recess with respect to the radial direction of the optical disc substrate is set to be equal to or greater than the maximum width of the antenna coil with respect to the radial direction in a region of a predetermined angle from the center of the optical disc substrate. 9. The optical disk according to 9. The antenna coil is spiral,
10. The optical disc according to claim 9, wherein the outer peripheral portion and the inner peripheral portion of the opening of the concave portion formed on the optical disc substrate are both concentric with the optical disc substrate. The recess formed in the optical disc substrate is filled with resin, and a sheet material is attached to the surface of the optical disc substrate including the opening of the recess, and the surface is flattened. The optical disk according to claim 9.

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