JP2006085823A - Method for manufacturing optical disk, and optical disk - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce manufacturing cost for mounting an antenna coil and an IC chip on the optical disk. <P>SOLUTION: A pattern of an antenna which comprises spiral-coil pattern 24 arranged around a central hole 11 of the optical disk 10 and an arch-shaped or circular internal circumference side pattern 21, and an outer circumference side pattern 22 with respect to the center which is connected to an internal circumference edge part and an outer circumference edge part of the coil pattern 24 respectively and arranged in a rotation direction with respect to the center of the optical disc 10 so that at least parts of each of the edge parts are included within the same range at a specified angle, is formed onto a thin film on the same optical disc substrate with conductive materials. An insulating layer 30 is formed into a thin film between the internal circumference side pattern 21 and the outer circumference side pattern 22. On the insulating layer 30, a bridge layer 23 connecting the internal circumference side pattern 21 and the outer circumference side pattern 22 is formed onto a thin film with the conductive materials. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an optical disc manufacturing method and an optical disc thereof, and more particularly to an optical disc manufacturing method for efficiently manufacturing an optical disc on which an RFID (Radio Frequency Identification) tag including an IC chip and an antenna is mounted, and the optical disc.

  In recent years, DVD (Digital Versatile Disk) has been widely used as an optical disk medium capable of recording large-capacity data such as video. Recently, an optical disc using a blue semiconductor laser as a light source has been developed for the purpose of recording a video with a higher image quality and a longer time, and a Blu-ray disc has already been commercialized as one type.

  Thus, as high-quality digital content can be easily stored in a portable recording medium, the importance of protecting the copyright of the digital content is increasing. In a Blu-ray disc, an ID unique to each disc is recorded as a barcode pattern on the innermost circumference of a signal recording area called BCA (Burst Cutting Area), and the player reads this ID, so that an illegal disc is recorded. It is managed not to be played. However, technology for creating illegal discs is becoming more sophisticated year by year, and it is said that more robust copyright protection measures are required.

  On the other hand, in recent years, RFID tags, which are IC chips capable of exchanging information with the outside without contact, have come to be used for admission cards, transportation tickets, electronic money, and the like. An RFID tag does not have a built-in battery, receives a radio wave or magnetic field from a reader / writer (R / W) with an antenna and converts it into an electromotive force, and thus is lightweight, excellent in portability, and semipermanently usable. It has the characteristics. In addition to this, there is a feature that replication is very difficult.

  From such a background, it is considered that an RFID tag is mounted on an optical disc to strengthen copyright protection measures. For example, by mounting an RFID tag having a disc ID recorded in a read-only state on an optical disc, the risk of duplicating an optical disc having the same disc ID is greatly reduced as compared to the case where the above BCA pattern is used. Can do.

  Furthermore, when there is a margin in the storage capacity of the RFID tag, it is possible to store an application that provides a benefit to the user in the remaining storage area and generate a new added value to the optical disc. For example, an RFID tag is provided on a ROM (Read Only Memory) type optical disc in which game software is stored, and the state of the game is stored in the RFID tag, or the recorded content in the optical disc is recorded on the RFID tag, It is conceivable that the recorded contents can be known only by holding the optical disc over the R / W without inserting it into the player.

  By the way, when an RFID tag is mounted on an optical disk, it is necessary to form an antenna for wireless communication and power supply on the optical disk. Since an optical disk is a disk that rotates about its center, it is compatible with a coiled antenna (hereinafter referred to as an antenna coil) from the viewpoint of weight balance. For this reason, it is considered that an antenna coil is formed further inside the signal recording area on the optical disc or on the back side of the signal recording area (see, for example, Patent Document 1).

FIG. 13 is a diagram showing an example of a conventional method for forming an antenna coil on an optical disk.
FIG. 13 shows a case where an antenna coil is formed on the entire back side of the signal recording area of the optical disk as an example. In the case of a read-only DVD, the pits on the stamper are transferred onto the transparent resin substrate by an injection molding method, and a conductor reflection film such as Ag or Al is formed on the recording surface by sputtering or the like. The single-sided optical disk 100 is formed by bonding the disk member for one side formed in this way and the resin substrate having the same thickness as described above with a support material interposed therebetween. Here, as shown in FIG. 13A, the resin substrate surface on the back side of the signal reading surface is provided with an insertion hole 101 for placing an IC chip on which a memory element and the like are integrated, at the time of injection molding.

  Next, as shown in FIG. 13B, a spiral antenna coil 200 is formed into a thin film by printing, sputtering, vapor deposition, or the like. Next, after forming the insulating layer 210 by applying an insulating material by sputtering, printing, or the like over the antenna wiring formed between the end points 201 and 202 of the antenna coil 200 as shown in FIG. 13C. As shown in FIG. 13D, a bridge layer 203 is further formed of a conductive material on the insulating layer 210, and the end points 201 and 202 are connected. Next, as shown in FIG. 13E, the IC chip 300 is installed in the insertion hole 101 and connected to the antenna coil 200 using a conductive adhesive, a lead wire, or the like. Thereafter, a protective layer may be formed on the antenna formation surface.

  In this method, since the antenna coil 200 can be formed by a thin film process, it is relatively easy to manufacture. However, a process for forming the insulating layer 210 and the bridge layer 203 for bridging the end points 201 and 202 of the antenna coil 200, an IC The connection process of the chip 300 was required. On the other hand, a method is conceivable in which an IC chip module in which the insulating layer 210 for the bridge connection, the connection terminals with the end points 201 and 202, the IC chip 300, and the like are integrated is created in advance (for example, a patent) Reference 2).

FIG. 14 is a diagram showing another example of a conventional method for forming an antenna coil on an optical disk.
As shown in FIG. 14A, the IC chip module 400 includes connection terminals 401 and 402 for connecting both end portions of the antenna coil 200, an insulating portion 403 therebetween, and an IC chip 300. The connection terminal of the IC chip 300 is connected to the connection terminals 401 and 402 inside the insulating part 403. For example, the insulating part 403 is formed by covering the periphery of the wiring for the connection with an insulating film or the like. .

On the other hand, as shown in FIG. 14B, on the back surface of the reading surface of the optical disc 100, a spiral antenna coil 200 is formed as a thin film. The IC chip module 400 is formed so that the distance between the connection terminals 401 and 402 is the same as that between the end points 201 and 202 of the antenna coil 200. Then, as shown in FIG. 14C, the connection terminals 401 and 402 and the end points 201 and 202 of the antenna coil 200 are joined with, for example, a conductive adhesive, so that the bridge connection of the end points 201 and 202 and the IC chip are connected. 300 and the antenna coil 200 are connected together.
JP 11-353714 A (paragraph numbers [0018] to [0023], FIG. 1) JP-A-8-287208 (paragraph numbers [0017] to [0018], FIG. 1)

  However, any of the methods shown in FIG. 13 and FIG. 14 requires a precise alignment with respect to the rotation direction of the optical disc 100, and thus has a problem that the manufacturing cost cannot be reduced. For example, in the method shown in FIG. 13, since the insertion hole 101 is formed in advance at the mounting position of the IC chip 300, the positions of the insertion hole 101 and the terminals provided in the intermediate portion of the antenna coil 200 are accurately determined. It is necessary to match. Further, the formation position of the insulating layer 210 and the bridge layer 203 for the bridge connection in FIG. 13 or the joining position of the IC chip module 400 in FIG. 14 needs to be accurately matched with the end points 201 and 202 of the antenna coil 200. is there.

  Furthermore, in order to join the IC chip module 400 to the antenna coil 200, a bonding process using a conductive adhesive or the like is necessary, and in such a case, care must be taken to prevent the adhesive from protruding. In addition, it has been a problem that the manufacturing cost increases.

  The present invention has been made in view of these points, and an object of the present invention is to provide an optical disc manufacturing method capable of reducing manufacturing costs for mounting an antenna coil and an IC chip on an optical disc.

  Another object of the present invention is to provide an optical disc on which an antenna coil and an IC chip are mounted with reduced manufacturing costs.

  In the present invention, in order to solve the above-mentioned problem, in an optical disk manufacturing method for manufacturing an optical disk on which an RFID tag including an IC chip and an antenna is mounted, a spiral coil pattern disposed around the center hole of the optical disk Are connected to the inner and outer ends of the coil pattern, respectively, and are arranged so that at least some of them are included in the same range of a predetermined angle in the rotation direction with respect to the center of the optical disc. An antenna forming step of forming a thin film of a conductive material on the same optical disc substrate, the antenna pattern comprising an arc-shaped or circular inner peripheral side pattern and outer peripheral side pattern with respect to the center; and An insulating layer forming step of forming a thin insulating layer in a region between the side pattern and the outer peripheral side pattern, on the insulating layer, Optical disk manufacturing method characterized by including a bridge layer forming step of forming a thin film of a conductive material bridging layer to connect serial inner circumferential pattern and the outer peripheral side pattern.

  In such an optical disk manufacturing method, the coil pattern functions as an antenna coil for information transmission / reception of the IC chip, and the bridge layer electrically connects both ends of the antenna coil. The inner peripheral pattern and the outer peripheral pattern function as connection terminals for connecting both ends of the antenna coil. And since such a connection terminal is made into circular arc shape or circular shape with respect to the center of an optical disk, when forming a bridge layer, the freedom degree of the alignment with respect to a disk rotation direction becomes high. In particular, when both the inner peripheral pattern and the outer peripheral pattern are circular, it is not necessary to perform alignment with respect to the disk rotation direction in all of the antenna forming process, the insulating layer forming process, and the bridge layer forming process. .

  According to the present invention, in an optical disc manufacturing method for manufacturing an optical disc on which an RFID tag including an IC chip and an antenna is mounted, a spiral coil pattern disposed around a center hole of the optical disc, and the coil pattern Are connected to the inner circumferential end and the outer circumferential end, respectively, and are arranged so that at least a part of each is included in the same range of a predetermined angle in the rotation direction with respect to the center of the optical disc. Forming an antenna pattern comprising a circular arc-shaped or circular inner peripheral pattern and an outer peripheral pattern on the same optical disk substrate with a conductive material, an antenna forming step, and the inner peripheral pattern and the outer peripheral pattern. Two connection terminals separated by a distance from the side pattern, an insulating portion disposed between the connection terminals, and the insulation The IC chip module comprising the IC chip wired with the connection terminals inside the device is connected so that one of the connection terminals is connected to the inner peripheral pattern and the other is connected to the outer peripheral pattern. An optical disk manufacturing method comprising a module mounting step of bonding onto an optical disk substrate is provided.

  In such an optical disk manufacturing method, the coil pattern functions as an antenna coil for information transmission / reception of the IC chip, and by attaching the IC chip module, wiring between both ends of the antenna coil and the connection terminal of the IC chip is completed. At this time, the inner peripheral pattern and the outer peripheral pattern function as connection terminals for connecting both ends of the antenna coil to the connection terminals of the IC chip, and such connection terminals are arc-shaped or circular with respect to the center of the optical disc. When the IC chip module is attached, the degree of freedom of alignment with respect to the disk rotation direction is increased. In particular, when both the inner peripheral pattern and the outer peripheral pattern are circular, it is not necessary to perform alignment with the disk rotation direction.

  According to the present invention, an antenna pattern including a coil pattern, an inner peripheral pattern, and an outer peripheral pattern, an insulating layer, and a bridge layer are formed, and the inner peripheral pattern and the outer peripheral pattern are respectively formed in the center of the optical disc. On the other hand, the arc shape or the circular shape increases the degree of freedom in alignment with respect to the disc rotation direction when forming the bridge layer, and strict alignment is not necessary. For this reason, the manufacturing efficiency of the optical disk on which the RFID tag is mounted is increased, and the manufacturing cost is reduced. In particular, when both the inner and outer patterns are circular, the alignment with respect to the disk rotation direction is performed during the formation of the antenna pattern, the insulating layer, and the bridge layer. Therefore, the effect of reducing the manufacturing cost is further enhanced.

  Further, according to the present invention, an IC chip module is used to wire the inner and outer patterns connected to both ends of the coil pattern and the IC chip, and the inner and outer patterns are arranged. Since each of the optical discs has an arc shape or a circular shape with respect to the center of the optical disc, the degree of freedom in alignment with respect to the disc rotation direction when mounting the IC chip module is increased, and strict alignment is not necessary. For this reason, the manufacturing efficiency of the optical disk on which the RFID tag is mounted is increased, and the manufacturing cost is reduced. In particular, when both the inner peripheral pattern and the outer peripheral pattern are circular, it is not necessary to perform alignment with respect to the disk rotation direction, so that the effect of reducing the manufacturing cost is further enhanced.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following embodiments, a DVD will be described as an example of an optical disk.
[First Embodiment]
FIG. 1 is a diagram showing a configuration of an optical disc according to the first embodiment.

  In FIG. 1, an optical disc 10 is provided with a central hole 11 at the center thereof. When the optical disc 10 is inserted into a player, the optical disc 10 is rotated around the central hole 11 and the signal recording surface is irradiated with laser light. Then, a signal is read according to the amount of the reflected light. Further, in the optical disc 10, an RFID tag capable of transferring information in a non-contact manner is provided on the surface opposite to the signal reading surface. The RFID tag includes an IC chip on which elements for storing information and the like are integrated, and an antenna for signal transmission / reception.

  For example, in the case of a read-only single-sided single-layer DVD, the pits on the stamper are transferred onto a transparent resin substrate by an injection molding method, and a conductor reflection film such as Ag or Al is formed on the recording surface by sputtering or the like. The disk member having a thickness of 0.6 mm and the resin substrate having the same thickness as described above are bonded to each other with an adhesive layer interposed therebetween to form one optical disk 10. FIG. 1 shows a state in which the optical disc 10 is viewed from the back side of the signal reading surface.

  As shown in FIG. 1A, on the substrate on the back side of the signal reading surface, an inner peripheral pattern 21 and an outer peripheral pattern 22 that are concentric with respect to the center of the disk, and an area between them are formed. A bridge layer 23 that bridges and connects the insulating layer 30, the inner peripheral pattern 21 and the outer peripheral pattern 22 from above the insulating layer 30 is formed. The inner peripheral side pattern 21, the outer peripheral side pattern 22, and the bridge layer 23 are formed of a conductive material.

  FIG. 1B shows a state where the insulating layer 30 and the bridge layer 23 are removed from FIG. As shown in FIG. 1B, a spiral coil pattern 24 is formed between the inner peripheral pattern 21 and the outer peripheral pattern 22, and the inner and outer peripheral sides of the coil pattern 24 are formed. The end points 24a and 24b are connected to the inner peripheral pattern 21 and the outer peripheral pattern 22, respectively.

  Further, in this example, there is a part where the pattern is separated in the middle part of the coil pattern 24, and the IC chip 40 is provided in that part and connected to the coil pattern 24. The position where the IC chip 40 is disposed is not limited to the middle portion of the coil pattern 24, and may be between the coil pattern 24 and the inner peripheral pattern 21 or the outer peripheral pattern 22, for example.

FIG. 2 is a diagram showing a manufacturing process of the optical disc shown in FIG. FIG. 3 is a diagram showing an example of forming a bridge layer.
First, as shown in FIG. 2A, an antenna layer made up of an inner peripheral pattern 21, an outer peripheral pattern 22, and a coil pattern 24 is formed on a substrate surface formed on the back surface of a signal reading surface with a conductive material such as Ag or Al. A thin film is formed by the material. When the IC chip 40 is arranged in the middle of the coil pattern 24 as in the present embodiment, the insertion hole 12 for arranging the IC chip 40 on the substrate surface is formed in advance before the antenna layer is formed. Form it. Then, when the antenna layer is formed, alignment is performed so that the spaced portions of the coil pattern 24 are accurately formed on both sides of the insertion hole 12.

  Next, as shown in FIG. 2B, the IC chip 40 is inserted into the insertion hole 12 and arranged. At this time, the IC chip 40, the wiring terminal, and the coil patterns 24 on both sides of the insertion hole 12 are connected by bonding with a conductive adhesive. When the IC chip 40 is disposed, it is desirable that the insertion hole 12 has a sufficient depth so that the surface of the IC chip 40 does not protrude from the substrate surface.

  Next, as shown in FIG. 2C, a thin insulating layer 30 is formed of an insulating material so as to cover the coil pattern 24 in a region between the inner peripheral pattern 21 and the outer peripheral pattern 22. Next, as shown in FIG. 2D, a bridge layer 23 is formed on the insulating layer 30 with a conductive material so as to connect the inner peripheral pattern 21 and the outer peripheral pattern 22. Thereby, each edge part of the inner peripheral side and outer peripheral side of the coil pattern 24 is connected.

  Note that each of the above layers can be formed, for example, by sputtering using a mask, printing without using a mask by an inkjet method, or by attaching a conductive material formed in a thin film in advance.

  In the optical disc 10 described above, the coil pattern 24 functions as an antenna coil for information transmission / reception of the IC chip 40, and the bridge layer 23 electrically connects both ends of the antenna coil. The inner peripheral pattern 21 and the outer peripheral pattern 22 function as connection terminals for connecting both ends of the antenna coil. Since such connection terminals are circular, as shown in FIGS. 3A and 3B, the bridge layer 23 is formed at any angle with respect to the disk rotation direction. It will be better. That is, when the bridge layer 23 is formed, it is not necessary to perform the alignment in the rotation direction, so that the manufacturing efficiency can be improved and the manufacturing cost can be reduced. In addition, when forming the insulating layer 30, it is not necessary to perform alignment in the rotational direction in the same manner, so that the manufacturing efficiency is further improved.

[Second Embodiment]
In the first embodiment described above, both the inner peripheral pattern and the outer peripheral pattern for connecting both ends of the antenna coil have a circular shape. An effect of reducing the manufacturing cost can be obtained.

  FIG. 4 is a diagram showing a manufacturing process of the optical disc according to the second embodiment. In FIG. 4, (A) to (D) show the configuration of the optical disc for each manufacturing process, and (E) to (G) show the shape of the mask used during manufacturing.

  In the present embodiment, the inner peripheral pattern 21a and the outer peripheral pattern 22a are both semicircular. These patterns are formed in the same range that forms an angle of 180 ° in the rotation direction with respect to the center of the disk. The inner peripheral pattern 21a and the outer peripheral pattern 22a are connected to end points on the inner peripheral side and the outer peripheral side of the coil pattern 24, respectively. In FIG. 4, as an example, the end point on the outer peripheral side of the coil pattern 24 and the outer peripheral side pattern 22a are separated from each other, and the IC chip 40 is disposed in the separated portion so as to be connected to each pattern. .

  Also in this embodiment, each pattern can be formed by a thin film formation method, as in the first embodiment. That is, as shown in FIG. 4A, an antenna layer including the inner peripheral pattern 21a, the outer peripheral pattern 22a, and the coil pattern 24 is formed at the same time, and then, as shown in FIG. 4B, the inner peripheral pattern 21a. An insulating layer 30 is formed in a region between the outer peripheral pattern 22a and the outer peripheral pattern 22a. Next, the bridge layer 23 is formed on the insulating layer 30 with a conductive material, and the inner peripheral side pattern 21a and the outer peripheral side pattern 22a are connected. Further, when the end point of the coil pattern 24 and the outer peripheral side pattern 22a (or the inner peripheral side pattern 21a) are separated as in this example, the separation is performed after the insulating layer 30 and the bridge layer 23 are formed. What is necessary is just to arrange | position and join the IC chip 40 to a part, and to make it connect with a pattern.

  Note that sputtering, printing, pasting, and the like can be applied to the formation of each layer, as in the first embodiment. For example, when sputtering is used, three types of masks shown in FIGS. 4E, 4F, and 4G may be used to form the antenna layer, the insulating layer 30, and the bridge layer 23, respectively.

  Here, since both the inner peripheral side pattern 21a and the outer peripheral side pattern 22a are formed in an arc shape, in the step of forming the bridge layer 23, a degree of freedom is generated with respect to the alignment accuracy in the rotation direction, and the alignment is performed. Need not be performed with high accuracy. For example, when the bridge layer 23 is formed by sputtering, the rotation direction of the mask shown in FIG. 4G used at that time and the mask shown in FIGS. It is not necessary to make the positional relationship exactly the same. On the contrary, for example, when shifting to the step of forming the bridge layer 23, it is not necessary to completely fix the optical disc 10 in the rotation direction.

  In order to increase the degree of freedom in alignment accuracy, it is desirable that the inner peripheral side pattern 21a and the outer peripheral side pattern 22a have an arc shape included in a range of an angle R as large as possible with respect to the rotation direction. Thus, also when each said pattern is made into circular arc shape, compared with the past, manufacturing efficiency can be improved and manufacturing cost can be reduced.

[Third Embodiment]
By the way, in the first and second embodiments described above, a step of forming an insulating layer and a bridge layer is necessary in order to connect both ends of the antenna coil. Further, an IC chip placement step is further required, and the placement position is determined in advance, so that the IC chip position and the antenna layer formation position must be matched with high accuracy.

On the other hand, in this embodiment, the manufacturing efficiency is further improved by using an IC chip module having the functions of an insulating layer and a bridge layer.
FIG. 5 is a diagram illustrating a configuration example of an IC chip module.

  As shown in FIG. 5, the IC chip module 50 includes connection terminals 51 and 52 for connecting to both end portions of the antenna coil, an insulating portion 53 provided therebetween, and an IC chip 40. The distance between the connection terminals 51 and 52 is set to be the same as the distance in the disk radial direction between an inner peripheral pattern and an outer peripheral pattern of the optical disk described later. Further, the connection terminal for the antenna coil of the IC chip 40 is connected to the connection terminals 51 and 52 inside the insulating portion 53. For example, the insulating portion 53 is covered by covering the periphery of the wiring for the connection with an insulating film or the like. Is formed. Actually, it is desirable that the IC chip 40 itself is also coated with an insulating film.

FIG. 6 is a diagram showing a configuration of an optical disc according to the third embodiment.
As shown in FIG. 6, on the substrate on the back side of the signal reading surface of the optical disc 10, as in the first embodiment, the inner peripheral side pattern 21 and the outer peripheral side pattern 22 that are circular with respect to the center of the disc are provided. The coil pattern 24 having both ends connected thereto is formed into a thin film. Then, the IC chip module 50 is arranged on the antenna coil formed in this way so that the connection terminals 51 and 52 are connected to the inner peripheral pattern 21 and the outer peripheral pattern 22, respectively.

  The connection terminals 51 and 52 and each pattern are bonded together by, for example, a conductive adhesive, and thereby the IC chip module 50 is fixed on the optical disc 10. Alternatively, bumps may be provided on the bottoms of the connection terminals 51 and 52, and bonding may be performed using ACF (Anisotropic Conductive Film) or ultrasonic bonding technology.

  Thus, by attaching the IC chip module 50, both ends of the antenna coil are connected in a bridged state on the middle part of the coil, and at the same time, the wiring between the IC chip 40 and the antenna coil is completed. In addition to this, the inner peripheral pattern 21 and the outer peripheral pattern 22 that are contact points for bridge connection are formed in concentric circles, and as shown in FIGS. 6A and 6B, an IC chip module The mounting position of the 50 optical disks 10 in the rotation direction is free, and it is not necessary to align the positions. Further, it is not necessary to align the rotational direction when the IC chip 40 is arranged on the optical disc 10. Therefore, it is possible to improve the manufacturing efficiency of the optical disc on which the RFID tag is mounted and to reduce the manufacturing cost.

  In addition, the inner peripheral side pattern 21 and the outer peripheral side pattern 22 as contact points for connecting both ends of the antenna coil may be arcuate as in the second embodiment. Also in this case, a degree of freedom is generated in the alignment accuracy in the rotation direction when the IC chip module 50 is arranged on the optical disc 10, so that the effect of improving the manufacturing efficiency can be obtained.

  In addition, when the inner peripheral pattern 21 and the outer peripheral pattern 22 have a circular shape or an arc shape, the inductance of the antenna coil changes according to the angle in the rotation direction when the IC chip module 50 is attached. . For this reason, it is necessary to design the IC chip 40 so that it can communicate both when the inductance is maximized and when the inductance is minimized within the range of the attachable angle.

[Fourth Embodiment]
FIG. 7 is a diagram showing a configuration of an optical disc according to the fourth embodiment.
When the IC chip module 50 is used as in the third embodiment, if the inner peripheral pattern 21 and the outer peripheral pattern 22 are circular, depending on the arrangement angle of the IC chip module 50 with respect to the rotation direction, the inner periphery A part of the side pattern 21 and the outer peripheral side pattern 22 functions as an antenna coil wound in a direction opposite to the coil pattern 24. For this reason, transmission / reception performance deteriorates and is not preferable.

  In order to avoid such a situation, in this embodiment, as shown in FIG. 7A, slit-shaped gaps G1 and a part of circular inner peripheral pattern 21b and outer peripheral pattern 22b are provided. G2 is provided. The gap G1 is provided at a position adjacent to the end point 24a on the inner peripheral side of the coil pattern 24, and the inner peripheral pattern 21b is in the same winding direction as the coil pattern 24 (in the figure, the counterclockwise direction from the inner peripheral side toward the outer peripheral side). To function as a coil. Similarly, the gap G <b> 2 is provided at a position adjacent to the end point 24 b on the outer peripheral side of the coil pattern 24 so that the outer peripheral side pattern 22 b functions as a coil in the same winding direction as the coil pattern 24.

  Thereby, both the inner peripheral side pattern 21b and the outer peripheral side pattern 22b constitute an antenna coil integrated with the coil pattern 24. For this reason, for example, at the time of signal reception, an electromotive force in the reverse direction generated by a part of the antenna coil functioning as a coil having a reverse winding direction is suppressed, and transmission / reception performance can be improved.

  Here, it is desirable that the IC chip module 50 be mounted on the optical disk 10 without performing alignment in the disk rotation direction. In this case, if the widths W1 and W2 of the gaps G1 and G2 are too large, the IC chip module There is a possibility that the 50 connection terminals 51 and 52 are not connected to the inner peripheral pattern 21b and the outer peripheral pattern 22b, respectively. For this reason, it is necessary to make the widths W1 and W2 of the gaps G1 and G2 smaller than the width W of the connection terminals 51 and 52.

  Further, as shown in FIG. 7B, by forming the gaps G1 and G2 on the same straight line from the center of the disk toward the outer peripheral direction, the connection terminals 51 and 52 of the IC chip module 50 are connected to the gaps G1 and G2. The possibility of being mounted on can be reduced.

[Fifth Embodiment]
By the way, when the IC chip module 50 is used as in the third and fourth embodiments described above, a step of bonding the IC chip module 50 onto the substrate of the optical disk 10 with a conductive adhesive or the like is necessary. .

FIG. 8 is a diagram for explaining a process of bonding the IC chip module to the optical disk.
FIG. 8 schematically shows a cross section passing through the center of rotation of the optical disk 10. As shown in FIG. 8A, the inner peripheral side pattern 21, the outer peripheral side pattern 22 and the coil pattern 24 are formed as a thin film on the surface of the substrate 14. The substrate 14 is bonded to the back surface of the substrate 13 on which the signal recording surface 13a is formed via an adhesive layer (not shown). After the formation of each pattern, the conductive adhesive 60 is applied to the respective surfaces of the inner peripheral pattern 21 and the outer peripheral pattern 22, and then the connection terminals 51 and 52 of the IC chip module 50 are joined. Then, after the conductive adhesive 60 is cured by, for example, ultraviolet irradiation, the protective layer 15 is formed so as to cover the entire IC chip module 50 as shown in FIG. 8B.

In the case of a DVD, the thickness of the substrate 13 including the signal recording surface 13a and the thickness including the substrate 14 and the protective layer 15 on the back surface are actually 0.6 mm.
As described above, in the above configuration, the steps of applying the conductive adhesive 60, disposing the IC chip module 50, and curing the conductive adhesive 60 are required. Further, when the IC chip module 50 is attached, alignment with respect to the disk rotation direction is not required, but high alignment accuracy is required with respect to the disk radial direction. In this case, the conductive adhesive 60 is used. For example, an appropriate amount of the conductive adhesive 60 needs to be applied at an accurate position so as not to protrude and come into contact with the adjacent coil pattern 24.

FIG. 9 is a diagram showing a configuration of an optical disc according to the fifth embodiment.
In the present embodiment, in order to eliminate the above factors, as shown in FIG. 9A, the inner peripheral side pattern 21, the outer peripheral side pattern 22, and the coil pattern 24 are attached after the IC chip module 50 is attached. Form on top. FIG. 9B shows the state of the optical disc 10 before these patterns are formed. As shown in FIG. 9, the insertion for fitting the IC chip module 50 onto the substrate of the optical disc 10 is performed. The holes 16 are provided in advance along the disk radial direction.

FIG. 10 is a diagram showing a manufacturing process of the optical disc.
FIG. 10 schematically shows a cross section passing through the rotation center of the optical disc 10 as in FIG. As shown in FIG. 10A, the insertion hole 16 of the IC chip module 50 is provided in the substrate 14 made of a resin material. For example, the insertion hole 16 is provided at the same time as the injection molding of the substrate 14. Or it may be cut and provided after injection molding.

  The IC chip module 50 prepared in advance is inserted into the insertion hole 16. The size of the insertion hole 16 substantially matches the outer shape of the IC chip module 50, and the upper surface of the IC chip module 50 and the surface of the substrate 14 are the same height after insertion as shown in FIG. Further, at the time of this insertion, the IC chip module 50 and the substrate 14 do not need to be particularly fixed by adhesion or the like.

  Next, as shown in FIG. 10C, the inner peripheral side pattern 21, the outer peripheral side pattern 22, and the coil pattern 24 are formed in a thin film on the surface of the substrate 14. At this time, the inner peripheral pattern 21 and the outer peripheral pattern 22 are formed so as to pass over the connection terminals 51 and 52 of the IC chip module 50, respectively, and are electrically connected to each other. The coil pattern 24 is formed so as to pass over the insulating portion 53 of the IC chip module 50.

  Thereafter, as shown in FIG. 10D, a protective layer 15 is formed on the surface of the substrate 14, thereby protecting each pattern formed on the substrate 14, and the IC chip module 50 is formed on the substrate 14. Fixed.

  10 shows both the substrate 13 on which the signal recording surface 13a is formed, which is bonded to the back surface of the substrate 14. However, the substrates 13 and 14 are actually used in each step shown in FIG. What is necessary is just to paste together after completion.

  Through the steps as described above, the IC chip module 50 is fixed to the substrate 14, the inner peripheral side pattern 21 and the outer peripheral side pattern 22, and the connection terminals of the IC chip module 50 without performing bonding using a conductive adhesive. Connection with 51 and 52 is performed. Accordingly, it is not necessary to accurately apply the adhesive, and the IC chip module 50 is disposed along the disk radial direction, and the inner peripheral pattern 21 and the outer peripheral pattern 22 are formed thereon, In all the steps in FIG. 10 including the pattern formation, it is not necessary to perform alignment in the disk rotation direction.

  The insertion hole 16 of the IC chip module 50 can be easily formed by injection molding or the like. Further, in the step of inserting the IC chip module 50, alignment with the insertion hole 16 is required. However, in this operation, it is only necessary to insert the IC chip module 50, so that the IC chip module 50 described in FIG. Alignment accuracy as high as the process is not required, and fixing work such as bonding is not performed. Therefore, manufacturing efficiency can be improved and manufacturing cost can be reduced.

FIG. 11 is a diagram showing a modification of the optical disk shown in FIG. 10 and a manufacturing process thereof.
In FIG. 11, a taper is provided on the side surface of the insertion hole 16a of the substrate 14, and a taper is also provided at the bottom of the connection terminals 51a and 52a of the IC chip module 50a so as to match the shape of the insertion hole 16a. The manufacturing process is the same as in the case of FIG. 10 described above. After the IC chip module 50a is inserted into the insertion hole 16a, the inner peripheral pattern 21, the outer peripheral pattern 22, and the coil pattern 24 are formed on the surface of the substrate 14. The inner peripheral pattern 21 and the outer peripheral pattern 22 are electrically connected to the connection terminals 51a and 52a of the IC chip module 50a, respectively. Thereafter, the protective layer 15 is formed on the surface of the substrate 14.

  In the case of FIG. 11, the IC chip module 50a is correctly placed in the insertion hole 16a even if the error in alignment accuracy in the disk radial direction is large when the IC chip module 50a is inserted, as compared with the case of FIG. Thus, manufacturing efficiency can be further improved.

[Others]
FIG. 12 is a diagram showing a configuration of an optical disk when an antenna coil is provided at the center of the disk.

  In each embodiment mentioned above, the case where the inner periphery side pattern 21, the outer periphery side pattern 22, and the coil pattern 24 were formed over the whole area | region of the back surface of a signal reading surface was shown. However, each of these patterns may be provided in a region between the signal recording region 17 and the center hole 11 as shown in FIG. In this case, a double-sided recording type optical disc can be used. In FIG. 12, the case where the IC chip module 50 is used is shown as an example. However, as in the first embodiment, an insulating layer and a bridge layer may be provided.

In each of the above embodiments, the antenna coil is provided on the resin substrate. However, the present invention is not limited to this. For example, the antenna coil may be provided on a paper disk base material.
Further, in addition to the above embodiments, for example, when both ends of an antenna coil are bridge-connected by joining lead wires with solder or the like, or both ends are connected to terminals of an IC chip, both ends of the antenna coil are connected. By making the terminal portions of the inner and outer patterns in a circular or arc shape with respect to the center of the disk, it becomes unnecessary to perform precise alignment with respect to the rotation direction of the optical disk during connection work. The effect of improving can be acquired.

  In the above embodiment, a DVD is assumed as an optical disk. However, the present invention is not limited to this, and can be applied to various optical disks such as a CD (Compact Disc) and a Blu-ray disk.

It is a figure which shows the structure of the optical disk based on 1st Embodiment. It is a figure which shows the manufacturing process of the optical disk based on 1st Embodiment. It is a figure which shows the example of formation of the bridge | bridging layer in the optical disk which concerns on 1st Embodiment. It is a figure which shows the manufacturing process of the optical disk which concerns on 2nd Embodiment. It is a figure which shows the structural example of the IC chip module used by 3rd Embodiment. It is a figure which shows the structure of the optical disk which concerns on 3rd Embodiment. It is a figure which shows the structure of the optical disk which concerns on 4th Embodiment. It is a figure for demonstrating the process of joining an IC chip module to an optical disk. It is a figure which shows the structure of the optical disk based on 5th Embodiment. It is a figure which shows the manufacturing process of the optical disk based on 5th Embodiment. It is a figure which shows the modification of the optical disk shown in FIG. 10, and its manufacturing process. It is a figure which shows the structure of the optical disk at the time of providing an antenna coil in the disk center part. It is a figure which shows an example of the conventional method for forming an antenna coil on an optical disk. It is a figure which shows the other example of the conventional method for forming an antenna coil on an optical disk.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Optical disk, 11 ... Center hole, 12 ... Insertion hole, 21 ... Inner peripheral side pattern, 22 ... Outer peripheral side pattern, 23 ... Bridge layer, 24 ... Coil pattern, 24a, 24b ... End point , 30 ... Insulating layer, 40 ... IC chip, 50 ... IC chip module, 51, 52 ... Connection terminal, 53 ... Insulating part

Claims (14)

In an optical disc manufacturing method for manufacturing an optical disc mounted with an RFID tag comprising an IC chip and an antenna,
A spiral coil pattern arranged around the center hole of the optical disc;
The coil pattern is connected to the inner peripheral end and the outer peripheral end, respectively, and is arranged so that at least a part of each is included in the same range of a predetermined angle in the rotation direction with respect to the center of the optical disc. Arc-shaped or circular inner peripheral pattern and outer peripheral pattern with respect to the center; and
An antenna forming step of forming a thin film of the antenna pattern comprising a conductive material on the same optical disk substrate;
An insulating layer forming step of forming a thin insulating layer in a region between the inner peripheral side pattern and the outer peripheral side pattern;
On the insulating layer, a bridge layer forming step of forming a bridge layer connecting the inner peripheral side pattern and the outer peripheral side pattern with a conductive material as a thin film;
An optical disc manufacturing method comprising: In the antenna forming step, a separation part is formed in which a pattern made of the conductive material is separated from a part of the coil pattern or between the coil pattern and the inner peripheral pattern or the outer peripheral pattern. And
2. The optical disk according to claim 1, further comprising an IC chip placement step of placing the IC chip on the optical disk substrate so that connection terminals of the IC chip are connected to patterns on both sides of the spacing portion. Production method. In an optical disc manufacturing method for manufacturing an optical disc mounted with an RFID tag comprising an IC chip and an antenna,
A spiral coil pattern arranged around the center hole of the optical disc;
The coil pattern is connected to the inner peripheral end and the outer peripheral end, respectively, and is arranged so that at least a part of each is included in the same range of a predetermined angle in the rotation direction with respect to the center of the optical disc. Arc-shaped or circular inner peripheral pattern and outer peripheral pattern with respect to the center; and
An antenna forming step of forming a thin film of the antenna pattern comprising a conductive material on the same optical disk substrate;
Two connection terminals separated by a distance between the inner peripheral side pattern and the outer peripheral side pattern, an insulating portion disposed between the respective connection terminals, and the respective connection terminals are wired inside the insulating portion. A module mounting step of joining an IC chip module composed of the IC chip onto the optical disk substrate so that one of the connection terminals is connected to the inner peripheral pattern and the other is connected to the outer peripheral pattern. When,
An optical disc manufacturing method comprising:   In the antenna formation step, the inner peripheral side pattern and the outer peripheral side pattern are formed in a circular shape having a gap that is sufficiently shorter than each length and shorter than the width of each connection terminal of the IC chip module. The said inner peripheral side pattern and each of the said outer peripheral side pattern are comprised, and it comprises the same coil | winding direction as the said coil pattern, and comprised the continuous coil which is continuous, The Claim 3 characterized by the above-mentioned. Optical disc manufacturing method.   5. The optical disc manufacturing method according to claim 4, wherein, in the antenna forming step, the gaps of the inner peripheral pattern and the outer peripheral pattern are formed on the same straight line from the center toward the outer peripheral direction. In an optical disc manufacturing method for manufacturing an optical disc mounted with an RFID tag comprising an IC chip and an antenna,
An IC chip module comprising two connection terminals respectively provided at both ends, an insulating part disposed between the connection terminals, and the IC chip wired with the connection terminals inside the insulating part; An insertion hole forming step of forming an insertion hole of substantially the same shape on the optical disk substrate so that the longitudinal direction thereof is along a straight line extending from the center of the optical disk to the outer circumferential direction;
A module insertion step of fitting the IC chip module into the insertion hole;
A spiral coil pattern arranged around the center hole of the optical disc;
The coil pattern is connected to the inner peripheral end and the outer peripheral end, respectively, and is arranged so that at least a part of each is included in the same range of a predetermined angle in the rotation direction with respect to the center of the optical disc. Arc-shaped or circular inner peripheral pattern and outer peripheral pattern with respect to the center; and
The antenna pattern comprising: the inner peripheral pattern and the outer peripheral pattern pass above each connection terminal of the IC chip module, and the coil pattern passes above the insulating portion, An antenna forming step of forming a thin film on the optical disk substrate;
An optical disc manufacturing method comprising: In the insertion hole forming step, a taper is provided on the side of the insertion hole from the surface of the optical disk substrate toward the center of the insertion hole.
The side of the mounting surface of the IC chip module with respect to the optical disc substrate is provided with a taper substantially the same as the shape of the side of the insertion hole, and the IC chip module is inserted into the insertion hole in the module insertion step. The optical disk manufacturing method according to claim 6, wherein the optical disk manufacturing method is adapted to be fitted to the optical disk.   In the antenna forming step, the inner peripheral side pattern and the outer peripheral side pattern are circles having a gap that is sufficiently shorter than the length of each pattern and shorter than the width of each connection terminal of the IC chip module. 7. The inner peripheral side pattern and the outer peripheral side pattern are each formed into a continuous coil having the same winding direction as the coil pattern. The optical disk manufacturing method as described.   9. The optical disc manufacturing method according to claim 8, wherein, in the antenna forming step, the gaps of the inner peripheral pattern and the outer peripheral pattern are formed on the same straight line from the center toward the outer peripheral direction. In an optical disc on which an RFID tag comprising an IC chip and an antenna is mounted,
A spiral coil pattern arranged around the center hole of the optical disc;
The coil pattern is connected to the inner peripheral end and the outer peripheral end, respectively, and is arranged so that at least a part of each is included in the same range of a predetermined angle in the rotation direction with respect to the center of the optical disc. Arc-shaped or circular inner peripheral pattern and outer peripheral pattern with respect to the center; and
The antenna pattern formed of a conductive material on the same optical disk substrate,
In an area between the inner peripheral pattern and the outer peripheral pattern, an insulating layer formed as a thin film on the coil pattern;
On the insulating layer, a bridge layer formed by a thin film of a conductive material so as to connect the inner peripheral side pattern and the outer peripheral side pattern;
An optical disc comprising: In an optical disc on which an RFID tag comprising an IC chip and an antenna is mounted,
A spiral coil pattern arranged around the center hole of the optical disc;
The coil pattern is connected to the inner peripheral end and the outer peripheral end, respectively, and is arranged so that at least a part of each is included in the same range of a predetermined angle in the rotation direction with respect to the center of the optical disc. Arc-shaped or circular inner peripheral pattern and outer peripheral pattern with respect to the center; and
The antenna pattern formed of a conductive material on the same optical disk substrate,
Two connection terminals separated by a distance between the inner peripheral pattern and the outer peripheral pattern, an insulating portion disposed between the respective connection terminals, and the respective connection terminals are wired inside the insulating portion. An IC chip module disposed on the optical disk substrate so that one of the connection terminals is connected to the inner peripheral pattern and the other is connected to the outer peripheral pattern, respectively.
An optical disc comprising:   The inner peripheral side pattern and the outer peripheral side pattern have a circular shape in which a gap that is sufficiently shorter than the length of each pattern and shorter than the width of each connection terminal of the IC chip module is provided in a part thereof. 12. Each of the inner peripheral pattern and the outer peripheral pattern has a winding direction that is the same as that of the coil pattern and constitutes a continuous integral coil. Optical disc.   13. The optical disc according to claim 12, wherein the gaps of the inner peripheral pattern and the outer peripheral pattern are provided on the same straight line from the center toward the outer peripheral direction. In an optical disc on which an RFID tag comprising an IC chip and an antenna is mounted,
An IC chip module comprising two connection terminals provided at both ends, an insulating part disposed between the connection terminals, and the IC chip wired with the connection terminals inside the insulating part. In the insertion hole formed on the optical disk substrate in substantially the same shape as the IC chip module, the longitudinal direction is fitted along a straight line from the center of the optical disk to the outer circumferential direction,
A spiral coil pattern arranged around the center hole of the optical disc;
The coil pattern is connected to the inner peripheral end and the outer peripheral end, respectively, and is arranged so that at least a part of each is included in the same range of a predetermined angle in the rotation direction with respect to the center of the optical disc. Arc-shaped or circular inner peripheral pattern and outer peripheral pattern with respect to the center; and
The antenna pattern is configured such that the inner peripheral side pattern and the outer peripheral side pattern pass on the connection terminals of the IC chip module, respectively, and the coil pattern passes on the insulating portion. An optical disk, wherein a thin film is formed on the optical disk substrate.

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