JP2006253661A5 - - Google Patents
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- Publication number
- JP2006253661A5 JP2006253661A5 JP2006029163A JP2006029163A JP2006253661A5 JP 2006253661 A5 JP2006253661 A5 JP 2006253661A5 JP 2006029163 A JP2006029163 A JP 2006029163A JP 2006029163 A JP2006029163 A JP 2006029163A JP 2006253661 A5 JP2006253661 A5 JP 2006253661A5
- Authority
- JP
- Japan
- Prior art keywords
- conductive layer
- layer
- insulating layer
- semiconductor device
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 14
- 238000000034 method Methods 0.000 claims 7
- 239000011810 insulating material Substances 0.000 claims 6
- 239000007788 liquid Substances 0.000 claims 6
- 238000004519 manufacturing process Methods 0.000 claims 6
- 230000002940 repellent Effects 0.000 claims 6
- 239000005871 repellent Substances 0.000 claims 6
- 239000006087 Silane Coupling Agent Substances 0.000 claims 4
- 239000000126 substance Substances 0.000 claims 4
- 230000009477 glass transition Effects 0.000 claims 3
- 239000000203 mixture Substances 0.000 claims 3
- 125000000217 alkyl group Chemical group 0.000 claims 2
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical group FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims 2
- 239000011368 organic material Substances 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006029163A JP4932268B2 (ja) | 2005-02-10 | 2006-02-07 | 半導体装置、及び半導体装置の作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005035258 | 2005-02-10 | ||
| JP2005035258 | 2005-02-10 | ||
| JP2006029163A JP4932268B2 (ja) | 2005-02-10 | 2006-02-07 | 半導体装置、及び半導体装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006253661A JP2006253661A (ja) | 2006-09-21 |
| JP2006253661A5 true JP2006253661A5 (https=) | 2009-03-26 |
| JP4932268B2 JP4932268B2 (ja) | 2012-05-16 |
Family
ID=37093749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006029163A Expired - Fee Related JP4932268B2 (ja) | 2005-02-10 | 2006-02-07 | 半導体装置、及び半導体装置の作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4932268B2 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101169395B1 (ko) * | 2006-10-13 | 2012-07-30 | 삼성전자주식회사 | 상변화층의 표면처리공정을 포함하는 상변화 메모리 소자의제조방법 |
| JP2019145546A (ja) * | 2018-02-16 | 2019-08-29 | 住友電工デバイス・イノベーション株式会社 | 半導体装置の製造方法 |
| JP6622940B1 (ja) * | 2019-07-02 | 2019-12-18 | 株式会社日立パワーソリューションズ | 両面実装基板、両面実装基板の製造方法、および半導体レーザ |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0722669A (ja) * | 1993-07-01 | 1995-01-24 | Mitsubishi Electric Corp | 可塑性機能素子 |
| JP3104843B2 (ja) * | 1994-08-19 | 2000-10-30 | 川崎製鉄株式会社 | アンチヒューズ型半導体集積回路装置 |
| CN100380596C (zh) * | 2003-04-25 | 2008-04-09 | 株式会社半导体能源研究所 | 液滴排出装置、图案的形成方法及半导体装置的制造方法 |
| JP2005019955A (ja) * | 2003-05-30 | 2005-01-20 | Seiko Epson Corp | 薄膜パターンの形成方法及びデバイスの製造方法、電気光学装置及び電子機器 |
-
2006
- 2006-02-07 JP JP2006029163A patent/JP4932268B2/ja not_active Expired - Fee Related
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