JP2006223994A - Substrate treatment apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus that can easily cope with a change in the number of treatment tanks, can perform the same types of treatment with the same treatment liquid, and can suppress an increase in size and cost of the apparatus in a transport type substrate treatment. <P>SOLUTION: The substrate treatment apparatus serially connects a plurality of treatment units A-E that have, at their upper parts, the treatment tanks 10 having spraying mechanisms for treatment liquid, and applies wet-treatment to a substrate by making the substrate to pass through the respective treatment tanks of the plurality of treatment units A-E. The respective treatment units A-E have transfer piping 40 supplied with treatment liquid from tanks 20 for treatment liquid installed in installation spaces 21 under the treatment tanks 10. The transfer piping 40 are connected by connecting adjacent treatment units, thus forming a tubular shared tank 100 across the plurality of treatment units A-E, and has a supply system 60 for treatment liquid for pumping up the treatment liquid inside the transfer piping 100 to supply to the spraying mechanisms inside the treatment tanks 10. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate processing apparatus used for an etching process, a peeling process, and the like in a liquid crystal manufacturing process, and more particularly to a substrate transport type substrate processing apparatus called a flat-flow type.

  In the manufacture of a liquid crystal panel, an integrated circuit is formed on a substrate surface by repeatedly performing film forming, resist coating, developing, etching, and resist stripping processes on the surface of a large-area glass substrate as a material. One of the typical processing methods is a substrate transport method called flat flow, in which various treatments are repeatedly performed on the surface of the substrate while transporting the substrate in the horizontal direction in a horizontal posture or an inclined posture inclined sideways.

  For example, in the flat-flow etching process, a chemical process using an etchant is performed while the substrate passes through a plurality of processing tanks in order. Each processing tank has a processing liquid spraying mechanism on the substrate transfer line, and the etching liquid is pumped from the processing liquid tank to the spraying mechanism by a pump, whereby the etching liquid is applied to the surface of the substrate passing through the tank. Supply. The etching solution supplied to the surface of the substrate is collected in the tank and circulated. The substrate that has been subjected to the chemical treatment with the etching solution is subsequently rinsed with the cleaning water, but the cleaning water is sprayed in the process of passing through the plurality of treatment tanks in the rinsing line as well as the upstream etching line. The etchant is removed.

  In such a flat-flow type substrate processing apparatus, the following two types are known as methods for supplying a processing solution such as a chemical solution to a plurality of processing tanks. One is a centralized supply method in which a processing liquid tank is shared among a plurality of processing tanks, and the processing liquid in the tank is distributed and supplied to the plurality of processing tanks. The other is an individual supply system in which a plurality of processing tanks have independent processing liquid tanks, and each processing tank forms an independent closed loop of processing liquid (Patent Document 1). In the case of the latter individual supply method, each processing tank is often an independent processing unit for each tank. Incidentally, in the case of the former centralized supply method, one unit is constituted by a plurality of processing tanks.

JP-A-11-216433

  By the way, in the etching process or the peeling process in the liquid crystal manufacturing process, the number of processing tanks is adjusted in accordance with the type of processing, the required degree of processing, and the like. In the case of centralized substrate processing equipment, it is necessary to redesign the equipment every time the number of treatment tanks is changed. Sex worsens.

  Further, when the number of processing tanks increases, the processing liquid tank becomes large. The processing liquid tank is generally disposed under a processing line in which processing tanks are arranged. However, as the processing liquid tank becomes larger, the installation level of the processing line becomes higher and the maintainability and the like are remarkably deteriorated. Furthermore, since the pressure loss of the piping also increases, it is necessary to increase the capacity of the pump more than necessary for the amount of sprayed processing liquid. From this point of view, the increase in the scale of the apparatus and the deterioration of the economy are problematic.

  On the other hand, the substrate processing apparatus of the individual supply method can easily cope with the change in the number of processing tanks by changing the number of connected processing units. For this reason, as the specifications of the processing apparatus increase, the cost merit increases. In addition, when the number of processing tanks increases, the scale of the processing liquid tank does not change and the pump capacity does not change. The individual supply method can also be called a unit combination type. However, one of these advantages has the following fatal drawback.

  For example, in the case of an etching line in which three treatment tanks A tank, B tank and C tank are connected, the etching solution used in the A tank returns to the A tank and is used again in the A tank. Similarly, in the B tank and the C tank, the etching solution is circulated and used for each tank. For this reason, a difference occurs in the degree of deterioration of the etching solution in each tank, and the quality of the etching solution is not the same. As a result, the substrate passing through the etching line is subjected to a different etching process each time the tank is changed. In an etching line, it is indispensable to process a substrate with the same etching solution from the beginning to the end, but an individual supply type substrate processing apparatus cannot satisfy this requirement.

  Also, in recent etching lines, a standby tank is often equipped. The standby tank is a spare tank that is used instead of the original etching solution in the tank when it reaches the usage limit. By installing this, the etching solution in use has reached the usage limit. Sometimes, processing can continue. When there is a request for installing a standby tank, in the case of an individual supply type substrate processing apparatus, it is necessary to install a standby tank outside the original apparatus, which considerably increases the scale of the apparatus. In addition, the cost increase associated with the installation of the standby tank is a considerable burden.

  The object of the present invention can easily cope with the change in the number of treatment tanks, can suppress the increase in the scale of the apparatus and the increase in cost due to the change in the number as much as possible, and can perform the same kind of treatment with the same treatment liquid, An object of the present invention is to provide a substrate processing apparatus capable of suppressing the increase in apparatus scale and cost accompanying the installation of a standby tank as much as possible.

  In order to achieve the above object, a substrate processing apparatus according to the present invention includes a plurality of processing units having a processing tank provided with a processing liquid spraying mechanism at an upper portion connected in series. In the unit combination type substrate processing apparatus that receives wet processing with the processing liquid by sequentially passing the substrates, each processing unit has a processing liquid tank installation space for storing the processing liquid under the processing tank, The processing liquid is introduced from the processing liquid tank installed in the installation space, and has a connecting pipe that forms a tubular common tank that spans a plurality of processing units by being connected between adjacent processing units, Further, each processing unit has a processing liquid supply system that pumps up the processing liquid in the transfer pipe by a pump and supplies it to the spraying mechanism in the processing tank.

  When three processing units A, B, and C are connected, for example, a processing liquid tank is installed only in the B unit. On the other hand, in the three processing units A, B, and C, the respective connecting pipes are connected to form a tubular shared tank that extends over these, and the shared tank that extends from the processing liquid tank in the B unit to the respective units. Treatment liquid is supplied to the tank. In the processing units A, B, and C, the common processing liquid in the common tank is sent to each processing tank by the processing liquid supply system in each unit. When a standby tank is required, it is installed in the C unit, for example.

  When connecting five processing units A, B, C, D, and E, for example, processing liquid tanks are installed in the B unit and the C unit. In the five processing units A, B, C, D, and E, the respective connecting pipes are connected to form a common tubular tank that extends over them. The processing liquid is supplied to a shared tank that straddles the unit. In the processing units A, B, C, D, and E, the common processing liquid in the common tank is sent to each processing tank by the processing liquid supply system in each unit. When a standby tank is required, it is installed in the D unit and the E unit, for example.

  As described above, in the substrate processing apparatus of the present invention, the scale of the apparatus can be easily changed by changing the number of units, and the design cost can be greatly reduced when there are many apparatus specifications. Even if the number of units increases and the apparatus scale increases, the processing liquid tank does not increase in size. Further, the number of processing tanks can be reduced with respect to the number of units. An increase in the scale of the equipment due to the installation of a standby tank can also be avoided. Above all, the same processing solution can be used in each processing tank despite the unit combination.

  In order to realize these functions, the capacity of the treatment liquid tank is preferably a capacity that can cover 2 to 4 units, and a capacity that can cover 2.5 to 3.5 units is particularly preferable. When the capacity of the processing liquid tank is one unit, it is necessary to install the processing liquid tanks in all units, and the number of tanks cannot be reduced, resulting in an increase in equipment cost. Moreover, the space for installing the standby tank cannot be secured. If the capacity of the processing liquid tank becomes too large, the number of tanks decreases, but problems such as an increase in the size of individual tanks and an increase in the substrate processing line occur, and the meaning of unitization is diminished. When the scale of the treatment liquid tank is 2.5 to 3.5 units, even if a standby tank is installed, the number of tanks n is (N-1) at the maximum, where N is the number of units. it can. Needless to say, the minimum number of tanks is one.

  About a some processing unit, the structure which the installation space in which a process liquid tank is installed in the same position in each unit is preferable. This standardization of the design further reduces device manufacturing costs.

  For a plurality of processing units, it is also preferable to configure the tank bottom so that the sprayed processing liquid moves between adjacent processing tanks, while the processing liquid tanks selectively installed in the plurality of processing units Is preferably equipped with a return pipe with a valve for returning the sprayed processing liquid from the bottom of the tank to each processing liquid tank. As a result, the used processing liquid generated in each processing tank can be returned to the processing liquid tank when the processing liquid tank is installed in any unit.

  The transfer pipe in the processing unit should be placed below the liquid level in the tank so that the processing liquid flows in from the processing liquid tank installed in the installation space in the unit. preferable. This eliminates the need for a pump for supplying the processing liquid from the processing liquid tank to the delivery pipe, further reducing the equipment cost.

  The substrate processing apparatus of the present invention is a unit combination type substrate processing apparatus which receives wet processing with a processing liquid by sequentially passing through a plurality of processing units connected in series. The processing liquid tank has an installation space, further forms a tubular common tank that extends over a plurality of processing units, and has a delivery pipe through which the processing liquid is introduced from the processing liquid tank in each processing unit. It is possible to easily cope with a change in the number of tanks, and to suppress as much as possible the increase in the scale of the apparatus and the increase in cost due to the change in the number. Above all, the same kind of treatment can be performed with the same treatment liquid, regardless of the unit combination type. Furthermore, it is possible to suppress as much as possible the increase in the scale of the apparatus and the increase in cost accompanying the installation of the standby tank.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a configuration diagram of an etching line showing an embodiment of the present invention.

  The substrate processing apparatus of this embodiment is an etching apparatus for a large glass substrate for use in a liquid crystal panel, and particularly employs a characteristic configuration for the etching line shown in FIG. A rinse line (not shown) continues downstream of the etching line.

  The etching line is a unit combination type in which a plurality of processing units (here, five processing units A to E) are connected in series. Each processing unit has substantially the same configuration. The configuration of these processing units A, B, C, and D will be described below.

  Each processing unit is a square box type, and a processing tank 10 is provided at the top of the box. The processing tank 10 has a roller-type transport mechanism (not shown) that horizontally supports the substrate from below with a roller and transports the substrate in the horizontal direction (from right to left in the figure). Above the substrate transfer line L, there is provided a shower mechanism 11 for spraying an etching solution on the surface of the substrate passing through the lower side, and a slit nozzle located upstream of the shower mechanism 11 (upstream side in the substrate transfer direction). 12 is provided.

  The shower mechanism 11 includes a large number of spray nozzles arranged in a matrix, and supplies an etching solution to a two-dimensional region in both the vertical and horizontal directions on the substrate surface. The slit nozzle 12 on the upstream side forms a vertical liquid film, and the substrate passes thereunder, so that the etchant is uniformly supplied to the entire surface of the substrate before the shower process. By this liquid film treatment in advance, processing unevenness due to the scattering of the etching solution is prevented.

  The bottom of the processing tank 10 is a tray for temporarily storing the etching liquid after being supplied to the surface of the substrate. The processing liquid passes through the flow path 13 between the processing tanks 10 and 10 in the adjacent processing units. It is structured so that you can come and go freely.

  A tank installation space 21 in which the processing liquid tank 20 is installed is formed below the processing tank 10 in each processing unit. The processing liquid tank 20 is a main tank that stores the etching liquid, and can be installed in the tank installation space 21 in the processing unit as necessary. The bottom of the processing tank 10 and the lower processing liquid tank 20 are connected by a return pipe 30 with a valve.

  A horizontal transfer pipe 40 penetrating each unit in the connecting direction is also provided below the processing tank 10 in each processing unit. The delivery pipe 40 is a large-diameter pipe and is installed below the tank installation space 21 in the figure, but in actuality, in order to suppress the unit height, the side of the treatment liquid tank 20 installed by being displaced laterally is provided. Are disposed below the liquid level in the processing liquid tank 20. The end of the transfer pipe 40 is a flange type so that the pipe ends can be easily coupled between adjacent processing units.

  The delivery pipe 40 is connected to the processing liquid tank 20 in the tank installation space 21 by an introduction pipe 50 with a valve that is inclined downward toward the delivery pipe 40 side. The processing liquid supply system 60 is connected to the shower mechanism 11 and the slit nozzle 12 in the processing tank 10 described above. The introduction pipe 50 is set together with the processing liquid tank 20 together with the return pipe 30 described above, and is omitted when the processing liquid tank 20 is not installed in the tank installation space 21.

  The processing liquid supply system 60 includes a supply pipe 61 extending from the transfer pipe 40 toward the shower mechanism 11 and the slit nozzle 12, a pump 62 and a filter 63 interposed in the supply pipe 61, and operating the pump 62. Thus, the etching solution in the transfer pipe 40 is pressurized and supplied to the shower mechanism 11 and the slit nozzle 12. The pump 62 and the filter 63 are also installed beside the processing liquid tank 20 in order to suppress the unit height. Further, the vertical portion of the pipe 61 is disposed along one side wall portion of the unit box, and its upper end portion is connected to the shower mechanism 11 and the slit nozzle 12 from the side.

  A further pump installation space 71 is secured below the processing tank 10. The pump 72 installed here is a circulation pump shared between adjacent processing units. The processing liquids in the two processing liquid tanks 20 and 20 in the adjacent processing units are extracted from the bottom and again from the top. A circulation system 70 to be introduced into the processing liquid tanks 20 and 20 is configured. Similarly to the pump 62 and the filter 63, the circulation pump 70 is also installed beside the processing liquid tank 20 in order to suppress the unit height. Two processing liquid tanks 20 and 20 in adjacent processing units can communicate with each other at the bottom.

  The processing liquid tank 20 is also provided with a drain pipe 80 with a valve. The drain pipe 80 is set together with the treatment liquid tank 20 together with the return pipe 30 and the introduction pipe 50 described above, and is omitted when the treatment liquid tank 20 is not installed in the tank installation space 21.

  The above is the configuration of the processing units A, B, C, D, and E. Here, since the processing liquid tank 20 is not installed in the tank installation space 21 in the final stage processing unit E, the return pipe 30, the introduction pipe 50 and the drain pipe 80 are omitted, and the circulation system 70 is also omitted. Therefore, it looks different from other processing units A, B, C, and D, but the other processing units A, B, C, and D are designed so that these facilities can be installed at the same position. Is the same.

  That is, the processing units A, B, C, D, and E all have the processing tank 10, the transfer pipe 40, and the processing liquid supply system 60, which are standard equipment, at the same position, and are not installed further. The treatment liquid tank 20, the return pipe 30, the introduction pipe 50, the circulation system 70, and the drain pipe 80, which are optional equipment, are designed to be provided at the same position.

  However, as an exception, in the processing unit A at the first stage, the transfer pipe 40 is removed on the upstream side from the place where the introduction pipe 50 and the supply pipe 61 are connected because it is unnecessary. Similarly, even in the final stage processing unit E, an unnecessary portion of the transfer pipe 40, that is, a downstream side from a place where the supply pipe 61 is connected is removed.

  A liquid draining unit 90 is disposed further downstream of the final stage processing unit E in order to remove the etching liquid remaining on the surface of the substrate. The liquid draining unit 90 has a short front and rear length, and has a processing tank 91 for liquid draining at the top corresponding to the processing tank 10. In the processing tank 91, high-pressure air is blown from the upper and lower slit nozzles on both surfaces of the substrate transported through the substrate transport line, and the etching solution is removed from both surfaces. Under the treatment tank 91, a high-pressure air introduction section 92, a filter 93, and the like are installed.

  Next, a method for using the substrate processing apparatus of the present embodiment, particularly a method for using the etching line and a function thereof will be described.

  In the etching line here, five processing units A, B, C, D, and E are arranged in series along the substrate transport direction. Each processing tank 10 is integrated in the substrate transport direction so that the substrate can pass through each processing tank 10 in order, and the tank bottom is integrated so that the etching solution can freely come and go. In addition, a horizontal tubular common tank 100 that extends over the processing units A, B, C, D, and E is formed by connecting the respective transfer pipes 40 in the substrate transport direction.

  In the first-stage processing unit A, the processing liquid tank 20 is installed as a standby tank in the tank installation space 21. A return pipe 30 and a drain pipe 80 are provided along with the installation of the treatment liquid tank 20.

  In the second stage processing unit B, the processing liquid tank 20 is installed in the tank installation space 21 as a standby tank. A return pipe 30 and a drain pipe 80 are provided along with the installation of the treatment liquid tank 20. In addition, a circulation pump 72 is installed, and a circulation system 70 straddling the first stage processing unit A is configured.

  In the third stage processing unit C, the processing liquid tank 20 is installed in the tank installation space 21 as a main tank. A return pipe 30 and a drain pipe 80 are provided along with the installation of the treatment liquid tank 20.

  In the fourth stage processing unit D, the processing liquid tank 20 is installed in the tank installation space 21 as a standby tank. A return pipe 30 and a drain pipe 80 are provided along with the installation of the treatment liquid tank 20. In addition, a circulation pump 72 is installed, and a circulation system 70 that extends over the third-stage processing unit C is configured.

  In the fifth-stage processing unit E, as described above, the processing liquid tank 20 and the equipment associated therewith are omitted.

  In operation, the processing units A and B, the processing units C and D, and the processing unit E are different in operation. In the processing units A and B, the valve attached to the return pipe 30 is closed. The valve attached to the introduction pipe 50 is also closed. On the other hand, the pump 62 interposed in the supply pipe 61 in the processing liquid supply system 60 is turned on. On the other hand, the circulation pump 72 in the processing unit B is turned off.

  On the other hand, in the processing units C and D, the valve attached to the return pipe 30 is opened. The valve attached to the introduction pipe 50 is also opened. The pump 62 interposed in the supply pipe 61 in the processing liquid supply system 60 is turned on. The circulation pump 72 in the processing unit B is also turned on.

  In the processing unit E, the pump 62 interposed in the supply pipe 61 in the processing liquid supply system 60 is turned on.

  As a result, the etching liquid is introduced from the processing liquid tanks 20 and 20 in the processing units C and D into the horizontal tubular common tank 100 extending over the processing units A, B, C, D, and E, and is filled. The In this state, in all the processing units, the pump 62 interposed in the supply pipe 61 in the processing liquid supply system 60 is turned on, so that the shower mechanism 11 in each processing tank 10 from the shared tank 100 and An etching solution is supplied to the slit nozzle 12 and discharged from them. As a result, the etching solution is supplied to the surface of the substrate that sequentially passes through the processing tanks 10 of the processing units A, B, C, D, and E, and a predetermined etching process is performed.

  The used etchant used in each of the processing tanks 10 of the processing units A, B, C, D and E and accumulated at the bottom of the tank passes through the return pipes 30 and 30 in the processing units C and D, and the processing liquid tanks 20 and 20. Returned to Thus, the same etching solution is circulated from the processing solution tanks 20 and 20 in the processing units C and D to the processing tanks 10 of all the processing units via the common tank 100. When the circulation pump 70 in the processing unit D is operated, the etching liquid stored in the processing liquid tanks 20 and 20 in the processing units C and D is forcibly circulated for temperature adjustment and the like.

  When the etching liquid stored in the processing liquid tanks 20 and 20 in the processing units C and D deteriorates and reaches the use limit, in the processing units C and D, the valve attached to the return pipe 30 is closed. . The valve attached to the introduction pipe 50 is also closed. The pump 62 interposed in the supply pipe 61 in the processing liquid supply system 60 is turned off. The circulation pump 72 in the processing unit B is also turned off. Instead, in the processing units A and B, the valve attached to the return pipe 30 is opened. The valve attached to the introduction pipe 50 is also opened. The pump 62 interposed in the supply pipe 61 in the processing liquid supply system 60 is turned on. The circulation pump 72 in the processing unit B is also turned on.

  As a result, the processing liquid tanks 20 and 20 provided as standby tanks in the processing units C and D are opened, and the etching liquid is circulated from here through the common tank 100 to the processing tanks 10 of all the processing units. When the circulation pump 70 in the processing unit B is operated, the etching liquid stored in the processing liquid tanks 20 and 20 in the processing units A and B is forcibly circulated for temperature adjustment and the like. Thus, the operation can be continued without stopping the line even when the etching solution in use deteriorates and reaches the use limit.

  The capacity of the processing liquid tank 20 provided in the processing units A, B, C, and D is selected so that one processing unit can cover three processing units 10. Therefore, the processing tanks 10 in the five processing units A, B, C, D, and E can be handled by the two processing liquid tanks 20 and 20.

  In this embodiment, a standby tank is provided, but if this is not necessary, the processing units A and B leave the processing tank 10, the transfer pipe 40, and the processing liquid supply system 60 as standard equipment, and other equipment. (Optional equipment) may be omitted. Further, there are five processing units A, B, C, D, and E. In the case of six processing units, the processing unit E equipped with only the processing tank 10, the transfer pipe 40, and the processing liquid supply system 60, which are standard equipment, is provided. A corresponding processing unit may be added. In the case of seven or more, it is necessary to add a treatment liquid tank. Conversely, when there are three processing units, the processing units A and B may be omitted, the processing liquid tank 20 in the processing unit C may be used as a standby tank, and the processing liquid tank 20 in the processing unit D may be used as a main tank. When the tank is not necessary, the processing tank C, the transfer pipe 40, and the processing liquid supply system 60, which are standard equipment, are left in the processing unit C, and other equipment (optional equipment) may be omitted.

  Thus, the substrate processing apparatus of the present invention can easily cope with the change in the number of processing tanks. The same etching solution can be supplied to the treatment tank. Even if the number of processing tanks increases, the scale of each tank does not change, so that there is no problem that the substrate transfer line becomes high due to the increase in size of the tank. Furthermore, it is easy to install a standby tank, and the installation does not increase the scale of the apparatus. Furthermore, the number of tanks can be reduced as compared with the number of units, which also contributes to the improvement of economy.

  In addition, each processing unit has a common design, the same equipment is arranged at the same position, and as many equipment as possible can be selected and used as optional equipment. A large substrate processing apparatus can be constructed at a low cost in combination with the low cost.

  In addition, although the said embodiment is an etching line in an etching apparatus, this invention can be used for various chemical | medical solution process lines, such as a peeling line in a resist peeling apparatus, and also a washing line.

It is a block diagram of the etching line which shows one Embodiment of this invention.

Explanation of symbols

A to E treatment unit 10 treatment tank 20 treatment liquid tank 21 tank installation space 30 return pipe 40 delivery pipe 50 introduction pipe 60 treatment liquid supply mechanism 61 supply pipe 62 pump 63 filter 70 circulation system 71 pump installation space 72 circulation pump 80 drain pipe 90 Liquid draining unit 100 Common tank

Claims (5)

  A combination in which a plurality of processing units having processing tanks provided with a processing liquid spraying mechanism at the top are connected in series, and a substrate undergoes wet processing with the processing liquid by sequentially passing through each processing tank in the processing units. In the substrate processing apparatus of the type, each processing unit has an installation space for the processing liquid tank for storing the processing liquid under the processing tank, and the processing liquid is introduced from the processing liquid tank installed in the installation space, By connecting between adjacent processing units, it has a delivery pipe that forms a tubular common tank that spans multiple treatment units, and each treatment unit pumps up the treatment liquid in the delivery pipe by a pump. A substrate processing apparatus having a processing liquid supply system for supplying to a spraying mechanism in a processing tank.   The said delivery pipe is installed so that it may be located below the liquid level in the said process liquid tank, in order to make a process liquid flow in with the dead weight from the process liquid tank installed in the said installation space. The substrate processing apparatus as described.   2. The substrate according to claim 1, wherein a processing liquid tank is selectively installed in the plurality of processing units, and the number n of the tanks is 1 ≦ n ≦ (N−1) where N is the number of units. Processing equipment.   The substrate processing apparatus according to claim 1, wherein the plurality of processing units have the installation space at the same position.   The plurality of processing units have a tank bottom configured so that the sprayed processing liquid moves back and forth between adjacent processing tanks, and the processing liquid tank in the processing unit transfers the sprayed processing liquid from the tank bottom. The substrate processing apparatus according to claim 1, further comprising a return pipe with a valve for refluxing to the tank.

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