JP2006196548A5 - - Google Patents

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Publication number
JP2006196548A5
JP2006196548A5 JP2005004383A JP2005004383A JP2006196548A5 JP 2006196548 A5 JP2006196548 A5 JP 2006196548A5 JP 2005004383 A JP2005004383 A JP 2005004383A JP 2005004383 A JP2005004383 A JP 2005004383A JP 2006196548 A5 JP2006196548 A5 JP 2006196548A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005004383A
Other languages
Japanese (ja)
Other versions
JP2006196548A (ja
JP4162659B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005004383A priority Critical patent/JP4162659B2/ja
Priority claimed from JP2005004383A external-priority patent/JP4162659B2/ja
Priority to TW094144455A priority patent/TWI306726B/zh
Priority to KR1020060002492A priority patent/KR100750019B1/ko
Priority to CN200610000573XA priority patent/CN1805652B/zh
Publication of JP2006196548A publication Critical patent/JP2006196548A/ja
Publication of JP2006196548A5 publication Critical patent/JP2006196548A5/ja
Application granted granted Critical
Publication of JP4162659B2 publication Critical patent/JP4162659B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2005004383A 2005-01-11 2005-01-11 フレキシブルプリント配線板及び多層フレキシブルプリント配線板、前記多層フレキシブルプリント配線板を用いた携帯電話端末 Expired - Lifetime JP4162659B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005004383A JP4162659B2 (ja) 2005-01-11 2005-01-11 フレキシブルプリント配線板及び多層フレキシブルプリント配線板、前記多層フレキシブルプリント配線板を用いた携帯電話端末
TW094144455A TWI306726B (en) 2005-01-11 2005-12-15 Flexible printed wiring board, multilayer flexible printed wiring board and portable telephone terminal using the multilayer flexible printed wiring board
KR1020060002492A KR100750019B1 (ko) 2005-01-11 2006-01-10 가요성 프린트 배선판 및 다층 가요성 프린트 배선판, 상기다층 가요성 프린트 배선판을 이용한 휴대 전화 단말
CN200610000573XA CN1805652B (zh) 2005-01-11 2006-01-11 软性印刷电路板和多层软性印刷电路板及便携式电话终端

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005004383A JP4162659B2 (ja) 2005-01-11 2005-01-11 フレキシブルプリント配線板及び多層フレキシブルプリント配線板、前記多層フレキシブルプリント配線板を用いた携帯電話端末

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008035730A Division JP4954111B2 (ja) 2008-02-18 2008-02-18 フレキシブルプリント配線板及び金属張積層板、前記フレキシブルプリント配線板に使用されるカバーレイ

Publications (3)

Publication Number Publication Date
JP2006196548A JP2006196548A (ja) 2006-07-27
JP2006196548A5 true JP2006196548A5 (enExample) 2007-03-01
JP4162659B2 JP4162659B2 (ja) 2008-10-08

Family

ID=36802402

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005004383A Expired - Lifetime JP4162659B2 (ja) 2005-01-11 2005-01-11 フレキシブルプリント配線板及び多層フレキシブルプリント配線板、前記多層フレキシブルプリント配線板を用いた携帯電話端末

Country Status (4)

Country Link
JP (1) JP4162659B2 (enExample)
KR (1) KR100750019B1 (enExample)
CN (1) CN1805652B (enExample)
TW (1) TWI306726B (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200821943A (en) 2006-07-19 2008-05-16 B Core Inc Optical symbol, article attached it, method for attaching optical symbol to article and method for recognizing optical recognition code
JP2008041960A (ja) * 2006-08-07 2008-02-21 Nissan Chem Ind Ltd 電子回路部品の製造方法
JP4845705B2 (ja) * 2006-12-19 2011-12-28 日東電工株式会社 プリント配線基板、その製造方法および電子機器
CN101617575B (zh) * 2007-02-20 2011-06-22 日立化成工业株式会社 挠性多层配线板
JP2008282352A (ja) 2007-05-14 2008-11-20 B-Core Inc 遮蔽によるマーキング方法及び除去によるマーキング方法及び変色によるマーキング方法
US8383230B2 (en) 2007-05-24 2013-02-26 Arisawa Mfg. Co., Ltd. Flexible printed wiring board, multilayered flexible printed wiring board, and mobile telephone terminal employing multilayered flexible printed wiring board
CN101801156B (zh) * 2009-02-06 2013-02-27 周伯如 软性印刷电路板的制造方法及其结构
CN102186304A (zh) * 2011-03-15 2011-09-14 珠海元盛电子科技股份有限公司 用于翻盖/滑盖手机的分层fpc及制作方法
CN102529271B (zh) * 2011-12-23 2014-12-24 云南云天化股份有限公司 用于柔性电路板的聚酰亚胺薄膜及其制备方法
DE102013202037A1 (de) * 2013-02-07 2014-08-07 Olympus Winter & Ibe Gmbh Hermetische Durchführung, Verfahren zur Herstellung einer hermetischen Durchführung, Leiterplatte und chirurgisches Instrument
KR20140148111A (ko) * 2013-06-21 2014-12-31 삼성전기주식회사 경연성 인쇄회로기판 및 그 제조방법
US9962936B2 (en) 2014-01-30 2018-05-08 Hewlett-Packard Development Company, L.P. Printed circuit board fluid ejection apparatus
TWI607677B (zh) 2016-11-21 2017-12-01 同泰電子科技股份有限公司 可撓性線路板結構
JP7784067B2 (ja) * 2022-04-18 2025-12-11 大日本印刷株式会社 配線基板、画像表示装置用積層体及び画像表示装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07312469A (ja) * 1994-05-16 1995-11-28 Nippon Mektron Ltd 多層フレキシブル回路基板の屈曲部構造
JP2002261450A (ja) 2001-02-28 2002-09-13 Shin Etsu Chem Co Ltd 多層フレキシブル印刷配線板
KR100828520B1 (ko) * 2001-11-23 2008-05-13 삼성전자주식회사 액정 표시 모듈
JP4411544B2 (ja) 2003-03-04 2010-02-10 日本ゼオン株式会社 多層プリント配線板の製造方法および多層プリント配線板
KR100477378B1 (ko) * 2003-03-21 2005-03-18 주식회사 에스아이 플렉스 다층 연성 인쇄회로기판의 제조방법

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