JP2006194505A - Solvent removing device, and solvent removing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a solvent removing device and a solvent removing method capable of preventing (or suppressing) drying marks when removing a solvent from a coat of a liquid material provided on a workpiece. <P>SOLUTION: The solvent removing device 1 is provided with a workpiece supporting means for supporting the workpiece provided with the coat 31 of the liquid material, a heating means for heating the workpiece, a gas jetting means having a storage chamber 66 temporarily storing gas and a plurality of nozzles communicated with the storage chamber 66, and a gas supplying means 7 for supplying the gas to the storage chamber 66. It is characterized by that it is composed such that the workpiece is heated by the heating means, the gas is jetted from the plurality of nozzles, and the gas is sprayed on the coat 31 to remove the solvent from the coat 31. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a solvent removal apparatus and a solvent removal method.

2. Description of the Related Art A solvent removal apparatus that heats a workpiece provided with a liquid material coating and removes the solvent from the coating is known.
The conventional solvent removal apparatus introduces gas (processing gas) into the heating chamber from one place on the upstream side of the work, heating means for heating the work installed in the heating chamber, and heats it from one place on the downstream side of the work And a mechanism for exhausting gas to the outside of the chamber (see, for example, Patent Document 1). In this solvent removal apparatus, while heating the workpiece, gas is introduced into the heating chamber from one location on the upstream side of the workpiece, gas is exhausted to the outside of the heating chamber from one location on the downstream side of the workpiece, and the solvent is removed from the coating. (Dry the coating).
However, in such a conventional solvent removal apparatus, the coating film cannot be uniformly dried. For example, drying unevenness (processing unevenness) along the flow of gas in the surface of the dried film formed on the workpiece. Will occur.

JP 2000-55561 A

  An object of the present invention is to provide a solvent removal apparatus and a solvent removal method capable of preventing (or suppressing) drying unevenness when removing a solvent from a film of a liquid material provided on a workpiece.

Such an object is achieved by the present invention described below.
The solvent removal apparatus of the present invention includes a work support means for supporting a work provided with a coating of a liquid material,
Heating means for heating the workpiece;
A gas ejection means having a storage chamber for temporarily storing gas, and a plurality of nozzles communicating with the storage chamber;
Gas supply means for supplying gas to the storage chamber;
While heating the workpiece by the heating means, gas is ejected from the plurality of nozzles, gas is blown onto the coating film, and the solvent is removed from the coating film.

As a result, the gas (processing gas) can be sprayed uniformly on the coating of the liquid material provided on the workpiece, and the drying rate of the coating can be made uniform in the plane (in-plane distribution of the drying rate). Thus, drying unevenness can be prevented (or suppressed).
In addition, regardless of the gas flow rate, the gas can be sprayed uniformly against the coating, and in particular, by increasing the gas flow rate, the drying speed can be greatly improved while preventing uneven drying. Can do.
In addition, by appropriately adjusting (changing) various conditions such as nozzle diameter, number, arrangement, and interval (pitch), the shape of the workpiece, the dimensions of the workpiece, and the material constituting the liquid material forming the coating (film material, Even when the type of the solvent, etc., the pattern of the coating, the thickness of the coating, etc. are changed, it can be easily handled, drying unevenness can be prevented, and a good film (dried film) can be formed. .

In the solvent removal apparatus of the present invention, it is preferable that the gas ejection means is configured so that the gas ejected from the nozzle is sprayed onto the coating from a direction substantially perpendicular to the coating.
Thereby, drying unevenness can be prevented more reliably.
In the solvent removal apparatus of this invention, it is preferable that the said nozzle is arrange | positioned regularly.
Thereby, drying unevenness can be prevented more reliably.

In the solvent removal apparatus of the present invention, it is preferable that the nozzles are arranged substantially uniformly in a two-dimensional direction.
Thereby, drying unevenness can be prevented more reliably.
In the solvent removal apparatus of the present invention, the heating means is preferably an infrared lamp.
For example, heat transfer heating with a hot plate or the like makes point contact with the surface (back surface) of the workpiece, and heat unevenness is likely to occur. In addition, heat distribution improves heat distribution but heat transfer from the surface. Therefore, non-uniformity occurs in the thickness direction of the coating, but by using an infrared lamp as a heating means, infrared rays pass through the coating and are heated from the inside, so that uniform heating is possible.

In the solvent removal apparatus of the present invention, the heating means is provided on the opposite side of the workpiece via the gas ejection means,
It is preferable that at least a part of the gas ejection means has infrared transparency.
Accordingly, the infrared lamp can irradiate the film with infrared rays to heat the film, and since at least a part of the gas jetting means has infrared transparency, the workpiece can be efficiently heated.

In the solvent removal apparatus of the present invention, it is preferable that the gas ejection means is made of quartz.
Thereby, a workpiece | work can be heated more efficiently.
In the solvent removal apparatus of the present invention, the heating means is provided on the opposite side of the workpiece via the gas ejection means,
It is preferable that the gas ejection means has a function of converting the wavelength of infrared rays emitted from the infrared lamp.
Thereby, the infrared rays emitted from the infrared lamp are converted in wavelength and irradiated on the coating, whereby the coating can be heated.
In addition, since the gas ejection means has a function of converting the wavelength of infrared rays emitted from the infrared lamp, it is not necessary to provide a means for converting the wavelength of infrared rays separately, thereby reducing the number of parts. Therefore, the structure of the entire apparatus can be simplified.

In the solvent removal apparatus of the present invention, it is preferable that the gas ejection means has a gas ejection plate in which a plurality of openings are formed, and the plurality of nozzles are configured by the plurality of openings.
Thereby, while being able to simplify the structure of a gas ejection means, a gas ejection means can be reduced in size.
In the solvent removal apparatus of the present invention, it is preferable that the gas jetting means is constituted by a housing having the gas jetting plate as an outer wall facing the workpiece.
Thereby, while being able to simplify the structure of a gas ejection means, a gas ejection means can be reduced in size.

In the solvent removal apparatus of the present invention, the casing further includes the gas ejection plate, and the gas ejection plate and the gas ejection plate constituting the outer wall are arranged apart from each other in the thickness direction. It is preferable.
Thereby, gas can be sprayed more uniformly with respect to a film.
In the solvent removal apparatus of the present invention, it is preferable that the ratio of the opening in the area ratio in a plan view is different between the gas ejection plate in the casing and the gas ejection plate constituting the outer wall.
Thereby, gas can be sprayed more uniformly with respect to a film.

In the solvent removal apparatus of the present invention, it is preferable that the ratio of the opening is larger in the gas ejection plate in the housing than in the gas ejection plate constituting the outer wall.
Thereby, the gas uniformity is improved, and the effect is great particularly when the gas flow rate is relatively small.
In the solvent removal apparatus of the present invention, it is preferable that the ratio of the opening is larger in the gas ejection plate constituting the outer wall than in the gas ejection plate in the housing.
Thereby, the gas uniformity is improved, and the effect is great particularly when the gas flow rate is relatively large.

In the solvent removal apparatus of the present invention, it is preferable that the appearance shape of the gas ejection means is a flat shape.
Thereby, the gas ejection means can be reduced in size (thinned).
In the solvent removal apparatus of the present invention, the gas ejection means has a frame formed by bending, bending or branching a tubular body, and having a plurality of openings penetrating through the tube wall of the tubular body. It is preferable that the plurality of nozzles are configured by the openings.
Thereby, while being able to simplify the structure of a gas ejection means, a gas ejection means can be reduced in size.
Further, since the gas ejection means is constituted by a frame, the heating means can be provided on the opposite side of the workpiece via the gas ejection means without considering the characteristics of the constituent material of the gas ejection means.

In the solvent removal apparatus of the present invention, the heating means is an infrared lamp, and is provided on the opposite side to the workpiece via the gas ejection means,
It is preferable that wavelength conversion means for converting the wavelength of infrared rays emitted from the infrared lamp is provided in a region surrounded by the frame.
Thereby, the infrared rays emitted from the infrared lamp are converted in wavelength and irradiated on the coating, whereby the coating can be heated.
Further, since the wavelength conversion means is supported by the gas ejection means, there is no need to provide a separate means for supporting the wavelength conversion means, thereby reducing the number of parts and simplifying the overall structure of the apparatus. Can be

In the solvent removal apparatus of the present invention, the heating means is an infrared lamp, and is provided on the opposite side to the workpiece via the gas ejection means,
The area surrounded by the frame preferably has infrared transparency.
Accordingly, the infrared lamp can irradiate the coating film with infrared rays to heat the coating film, and the region surrounded by the frame has infrared transparency, so that the workpiece can be efficiently heated.

In the solvent removal apparatus of this invention, it is preferable to convert the wavelength of a near-infrared area | region into the wavelength of a far-infrared area | region by conversion of the wavelength of the said infrared rays.
Thereby, the wavelength of a near-infrared area | region can be converted into the wavelength of a far-infrared area | region, the far infrared rays can be irradiated to a film, and the film can be heated.
In the solvent removal apparatus of the present invention, it is preferable that the workpiece support, the heating unit, and the gas jetting unit are provided in a chamber having an exhaust port for exhausting the gas blown to the workpiece.
Thereby, when removing the solvent from the coating of the liquid material provided on the workpiece, the gas flow (especially, the gas flow after being sprayed on the workpiece) and the atmospheric conditions (for example, temperature, etc.) can be easily and It can be managed reliably.
In this case, it is preferable to provide a plurality of exhaust ports, so that the gas blown to the workpiece can be exhausted in a well-balanced manner, thereby preventing uneven drying more reliably.

The solvent removal method of the present invention includes a step of setting a work provided with a coating of a liquid material at a processing position;
A step of ejecting gas from a plurality of nozzles communicating with a storage chamber for temporarily storing gas while heating the workpiece, spraying gas onto the coating, and removing the solvent from the coating. Features.

As a result, the gas (processing gas) can be sprayed uniformly on the coating of the liquid material provided on the workpiece, and the drying rate of the coating can be made uniform in the plane (in-plane distribution of the drying rate). Thus, drying unevenness can be prevented (or suppressed).
In addition, regardless of the gas flow rate, the gas can be sprayed uniformly against the coating, and in particular, by increasing the gas flow rate, the drying speed can be greatly improved while preventing uneven drying. Can do.
In addition, by appropriately adjusting (changing) various conditions such as nozzle diameter, number, arrangement, and interval (pitch), the shape of the workpiece, the dimensions of the workpiece, and the material constituting the liquid material forming the coating (film material, Even when the type of the solvent, etc., the pattern of the coating, the thickness of the coating, etc. are changed, it can be easily handled, drying unevenness can be prevented, and a good film (dried film) can be formed. .

Hereinafter, the solvent removal apparatus and the solvent removal method of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.
FIG. 1 is a cross-sectional view and a block diagram showing a first embodiment of the solvent removal apparatus of the present invention, FIG. 2 is a plan view of a gas ejection portion of the solvent removal apparatus shown in FIG. 1, and FIG. 3 is shown in FIG. FIG. 4 is a perspective view of a substrate support of the solvent removal apparatus shown in FIG. 1.
For convenience of explanation, in FIG. 1, the upper side in the figure is described as “upper” and the lower side is described as “lower”.

  As shown in these drawings, the solvent removal apparatus 1 includes a substrate support (work support means) 4 that supports a substrate 3 as a work, and infrared rays (IR) that heat the substrate 3 supported by the substrate support 4. A gas supply means for supplying (introducing) a gas to a lamp (heating means) 5, a gas ejection portion (gas ejection means) 6 for ejecting gas (processing gas), and a storage chamber (inner cavity) 66 of the gas ejection portion 6. (Gas introduction means) 7, gas exhaust means 8 for exhausting the gas blown onto the substrate 3 (the coating 31 on the substrate 3), and control means 9 for controlling the drive (operation) of each part of the solvent removal apparatus 1. I have. The substrate support 4, the infrared lamp 5, and the gas ejection unit 6 are provided (accommodated) in a chamber 2 in which internal atmospheric conditions (for example, temperature, humidity, pressure (atmospheric pressure), etc.) are managed. ). Hereinafter, each of these components will be described sequentially.

The solvent removal apparatus 1 removes the solvent from the coating 31 by heating the substrate 3 provided with the coating 31 of a liquid material (film forming material) while blowing a gas to the coating 31 (drying the coating 31). Device). In this case, the solvent removal device 1 can remove the solvent from the coating 31 and perform other treatments (for example, oxidation, reduction, etc.).
The material of the substrate 3 targeted by the solvent removal apparatus 1 is not particularly limited, and any material may be used as long as it is a plate-like member, for example, a glass substrate, a silicon substrate, a resin substrate, a ceramic substrate, a metal substrate, or the like. It can be.

Moreover, the workpiece | work made into object by this invention is not limited to a plate-shaped member.
The liquid material (film forming material) includes a film material and a solvent, and the solvent is appropriately selected according to various conditions such as the type of the film material. In addition, a solvent can be used by mixing (combining) 1 type (s) or 2 or more types from conventionally well-known various things etc., for example.

The liquid material coating 31 may be provided on substantially the entire surface of the substrate 3, or may be provided so as to form a predetermined pattern.
Further, the gas (processing gas) to be used is appropriately set according to various conditions such as the type of material (film material, solvent, etc.) constituting the liquid material, the purpose, and the like.
When only the drying of the coating film 31 is intended, for example, nitrogen gas, low-humidity air (dry air) or the like can be used alone or in combination.

Further, when the purpose is to dry and oxidize the coating 31, for example, oxygen gas, gas having high oxygen gas concentration, or the like can be used.
When the purpose is to dry and reduce the coating 31, for example, ammonia gas, a gas having a high ammonia gas concentration, or the like can be used.
The substrate support 4, the gas ejection part 6, and the infrared lamp 5 are each installed (fixed) in the chamber 2. In this case, the substrate support 4, the gas ejection part 6, and the infrared lamp 5 are arranged in this order from the lower side to the upper side in the chamber 2. That is, the infrared lamp 5 is disposed on the opposite side of the substrate support 4 (the substrate 3 supported by the substrate support 4) via the gas ejection part 6.

As the infrared lamp 5, for example, a near-infrared lamp that emits near-infrared light is preferably used.
The infrared lamp 5 is fixedly installed above the chamber 2 by support means (fixing means) (not shown).
In the present invention, an infrared lamp other than the near infrared lamp may be used as the infrared lamp 5.

Moreover, in this invention, you may use things other than an infrared lamp as a heating means.
The substrate support 4 includes a substrate support 41 that detachably supports the substrate 3, a pair of leg frames 42 that are fixed (fixed) to the lower side of the substrate support 41 and support the substrate support 41. It consists of
The substrate support portion 41 has a frame shape (in the illustrated example, a rectangular frame shape) corresponding to the shape of the substrate 3. Further, a step portion (locking portion) 411 is formed inside the substrate support portion 41, and when the substrate 3 is loaded into the substrate support portion 41, the edge portion (end portion) of the substrate 3 has a step difference. Locked to the portion 411 and installed (held) in the substrate support portion 41.

Further, each leg frame 42 is formed by bending both end portions 421 of a linear tubular body substantially at right angles in the same direction. The leg frames 42 are arranged in parallel to each other, and the end portions 421 thereof are leg portions and are fixedly installed below the chamber 2.
The substrate support 4 is made of a material having a relatively high thermal conductivity, and at least a part thereof is preferably configured, and more preferably the whole is configured. Examples of the material having a relatively high thermal conductivity include quartz, and quartz is particularly preferable. Thereby, when the substrate 3 is heated by the infrared lamp 5, it is possible to suppress (or prevent) the occurrence of uneven heating on the substrate 3.
In the present invention, it goes without saying that the structure of the substrate support 4 is not limited to the above.

The gas ejection part 6 is comprised by the housing | casing whose external appearance shape (overall shape) makes flat shape. That is, the gas ejection part 6 includes a gas ejection plate 61 provided on the substrate 3 side as an outer wall facing (opposing) the substrate 3 supported by the substrate support 4, and a bottom plate 62 provided on the opposite side of the substrate 3. And four side plates 63. A storage chamber 66 that stores gas temporarily (for an extremely short time) is configured by the lumen (hollow portion) of the gas ejection portion 6 (housing).
This gas ejection part 6 is illustrated between the infrared lamp 5 in the chamber 2 and the substrate support 4 so that the gas ejection plate 61 and the substrate 3 supported by the substrate support 4 are substantially parallel to each other. It is fixedly installed by non-supporting means (fixing means). Further, the substrate 3 supported by the substrate support 4 in a plan view is covered with the gas ejection part 6.

The gas ejection plate 61 has a plurality of (many) openings (gas ejection ports) 64. Each of these openings 64 constitutes a nozzle that communicates with the storage chamber 66.
With such a configuration, the gas ejected from each opening 64 is sprayed on substantially the entire surface of the coating 31 from a direction substantially perpendicular to the coating 31 (substrate 3). That is, the gas becomes a shower and is sprayed on substantially the entire surface of the coating 31.

  Various conditions such as the shape, size (diameter), number, arrangement, interval (pitch) of each opening 64, and the ratio of the opening 64 in the area ratio in plan view (the ratio occupied by the entire opening 64) are not particularly limited. For example, various conditions such as the shape and dimensions of the substrate 3, the type of material (film material, solvent, etc.) constituting the liquid material forming the film 31, the pattern of the film 31, the thickness of the film 31 (hereinafter simply “ It is set as appropriate according to the "conditions") and application.

  In the illustrated example, all the openings 64 have a circular shape, have the same diameter, and are arranged in a matrix (matrix shape) at equal intervals (equal pitch). That is, the openings 64 are arranged substantially uniformly and regularly in the two-dimensional direction. Thereby, the gas can be sprayed uniformly on the entire coating 31, the drying speed of the coating 31 can be made uniform in the plane (the in-plane distribution of the drying speed can be improved), and thereby Unevenness of drying can be prevented (or suppressed).

Here, the number of openings 64 is appropriately set according to various conditions and applications, but is preferably about 100 to 250,000, more preferably about 1000 to 4000 per 1 m ² .
Thereby, drying unevenness can be prevented more reliably.
Further, the diameter (diameter) of the opening 64 is appropriately set according to various conditions and applications, but is preferably about 20 μm to 15 mm, and more preferably about 0.5 to 5 mm.
Thereby, drying unevenness can be prevented more reliably.
The ratio of the opening 64 in the area ratio in plan view of the gas ejection plate 61 is appropriately set according to various conditions and applications, but is preferably about 0.01 to 20%. More preferably, it is about 1 to 5%.
Thereby, drying unevenness can be prevented more reliably.

  As another configuration example of the gas ejection plate 61, for example, the diameter of the opening 64 is gradually increased from the center of the gas ejection plate 61 toward the edge (outside) in a radial manner. As a result, the flow rate of the gas sprayed onto the coating 31 (substrate 3) gradually increases from the center of the substrate 3 toward the edge (outside) in a radial manner. This configuration is effective when the coating 31 is harder to dry on the edge side than the center of the substrate 3.

Further, an opening (gas introduction port) 65 is formed in the side plate 63 on the right side in FIG.
In the present invention, a plurality of openings 65 may be provided in a single side plate 63, or may be provided in a plurality of side plates 63, for example.
It is preferable that at least a part of the gas ejection portion 6 is configured to have infrared transparency. That is, it is preferable that at least a part of the gas ejection part 6 is made of a material having infrared transparency (a material having a relatively high infrared transmittance), and it is more preferred that the gas ejection part 6 is entirely constituted. Examples of the material having infrared transparency include quartz, and quartz is particularly preferable. Thereby, when heating the board | substrate 3 with the infrared lamp 5, the influence by the gas ejection part 6 can be decreased (or eliminated).

Here, the distance L1 between the substrate 3 supported by the substrate support 4 and the gas ejection plate 61 of the gas ejection section 6 is appropriately set according to various conditions, applications, and the like. About 40 mm is preferable, and about 5 to 10 mm is more preferable.
Thereby, drying unevenness can be prevented more reliably.
Moreover, although the distance L2 between the board | substrate 3 supported by the board | substrate support tool 4 and the infrared lamp 5 is suitably set according to various conditions, a use, etc., about 20-500 mm is preferable, for example, 50- About 90 mm is more preferable.
Thereby, drying unevenness can be prevented more reliably.

In the chamber 2, a temperature sensor (temperature detection means) 11 that detects the temperature of the substrate 3 supported by the substrate support 4 or the vicinity (ambient) of the substrate 3 (hereinafter simply referred to as “temperature of the substrate 3”). Is provided. In the present embodiment, the temperature sensor 11 is installed in the vicinity of the substrate 3 of the substrate support 4.
A signal (temperature information) from the temperature sensor 11 is input to the control means 9, and the control means 9 controls driving of the infrared lamp 5 based on the signal from the temperature sensor 11 (detection result of the temperature sensor 11). To do. That is, the control means 9 adjusts the output of the infrared lamp 5 so that the temperature of the substrate 3 becomes the target temperature and the target temperature is maintained.
As this temperature sensor 11, a thermocouple, a thermistor, etc. can be used, for example.

The target temperature, that is, the processing temperature (the temperature of the substrate 3) when removing the solvent from the coating 31 (when drying the coating 31) is appropriately set according to various conditions, applications, and the like. About 280 degreeC is preferable and about 70-150 degreeC is more preferable.
Thereby, drying unevenness can be prevented more reliably.
In addition, an inlet 21 for introducing gas is provided on the side wall of the chamber 2 (the right side wall in FIG. 1).

Further, two exhaust ports 22 for exhausting the gas in the chamber 2 sprayed onto the substrate 3 (coating 31) are provided in the bottom wall (lower wall portion in FIG. 1) of the chamber 2. Each exhaust port 22 is arranged so that the gas blown from the gas ejection part 6 to the substrate 3 flows in a well-balanced manner. As a result, the gas blown onto the substrate 3 can be exhausted by these exhaust ports 22 in a well-balanced manner, and thereby drying unevenness can be more reliably prevented.
In addition, the number of the exhaust ports 22 is not limited to two, but may be one, for example, or three or more, but two or more (plural) are preferable.

  The gas supply means (gas introduction means) 7 is inserted through the introduction port 21 of the chamber 2, and is connected to the introduction pipe 12 having one end connected to the opening 65 of the gas ejection part 6, and to the other end of the introduction pipe 12. A gas cylinder (gas supply source) 13, a pump (gas transfer means) 14 for feeding gas, and a valve 15 provided in the middle of the introduction pipe 12 are provided. The opening of the valve 15 can be adjusted, and is arranged between the gas ejection part 6, the gas cylinder 13 and the pump 14. The pump 14 may be omitted.

By adjusting the opening degree of the valve 15 and the output of the pump 14, the flow rate of the gas supplied (introduced) to the storage chamber 66 of the gas ejection part 6 can be adjusted.
The flow rate of the gas supplied to the storage chamber 66 of the gas ejection unit 6 is appropriately set according to various conditions, applications, and the like, but is preferably about 10 ccm to 20 Lm, and more preferably about 100 to 1000 ccm.
Thereby, drying unevenness can be prevented more reliably.

The gas supply unit 7 may include a gas heating unit (not shown) that heats the gas, and may be configured to heat the gas and supply it to the storage chamber 66 of the gas ejection unit 6.
The gas exhaust means 8 includes an exhaust pipe 16 that branches into two via a branch portion 161, an exhaust pump (gas transfer means) 17 that sucks gas, and two valves 18 provided in the middle of the exhaust pipe 16. And 19. Two end sides of the exhaust pipe 16 are respectively connected to the two exhaust ports 22 of the chamber 2, and an exhaust pump (gas transfer means) 17 is connected to the other end side of the exhaust pipe 16.

  Each valve 18 and 19 can adjust its opening degree, and is disposed between the two exhaust ports 22 of the chamber 2 and the branching portion 161. Thereby, the flow volume of the gas exhausted from the two exhaust ports 22 of the chamber 2 can be adjusted independently. The opening degree of each of the valves 18 and 19 is adjusted so that the gas blown from the gas ejection part 6 to the substrate 3 flows in a well-balanced manner.

  The control means 9 controls the operation (operation) of each part of the solvent removal apparatus 1, and includes various programs such as a CPU (Central Processing Unit) and a program for executing the control operation of the solvent removal apparatus 1, and various types A storage unit (not shown) for storing (storing) data. The control means 9 can be constituted by a personal computer or the like, for example.

Next, a solvent removal method using the solvent removal apparatus 1 (operation of the solvent removal apparatus 1) will be described.
The solvent removal method using the solvent removal apparatus 1 includes a step of installing the substrate 3 provided with the liquid material coating 31 at the processing position, and the gas ejection unit 6 while heating the substrate 3 installed at the processing position. A step of ejecting gas from the plurality of openings 64, blowing gas to the coating 31, and removing the solvent from the coating 31 (drying the coating 31). Details will be described below.

[1] Step of Placing the Substrate 3 at a Processing Position First, a predetermined liquid material is applied to the surface of the substrate 3 to form a coating 31 of the liquid material.
The method for applying the liquid material is not particularly limited, and examples thereof include a spin coating method, a dipping method, a roll coating method, and a spray coating method.
The liquid material can be applied to the surface of the substrate 3 by using a predetermined device (not shown).

Next, an unillustrated opening / closing door (shutter) of the chamber 2 is opened, and from there, the substrate 3 is put into the chamber 2, installed on the substrate support portion 41 of the substrate support 4, and the opening / closing door is closed. Thereby, the substrate 3 is supported by the substrate support 4. The operation of installing the substrate 3 on the substrate support portion 41 of the substrate support 4 can be performed by a robot (not shown), for example.
This step is finished and the next step is performed.

[2] Step of removing the solvent from the coating 31 The infrared lamp 5 is driven to irradiate the substrate 3 with infrared rays, and the valves 15, 18 and 19 are opened, and the pump 14 and the exhaust pump 17 are turned on. To drive.
As a result, the substrate 3 is heated, and the gas is sent from the gas cylinder 13 through the introduction pipe 12 into the storage chamber 66 of the gas ejection section 6 in the chamber 2, and the gas is discharged from each opening 64 of the gas ejection section 6. The gas is blown out (shown like a shower), and the gas is blown onto the coating 31 of the substrate 3.

The gas blown to the substrate 3 flows toward the end (outside) of the substrate, is discharged from each exhaust port 22 to the outside of the chamber 2, and is exhausted to the outside through the exhaust pipe 16.
In this way, the solvent is removed from the coating 31. That is, the coating 31 is dried.
This step is completed, and a film (dried film) is formed on the surface of the substrate 3.
Finally, the open / close door of the chamber 2 is opened, and the substrate 3 supported by the substrate support 4 is taken out (remove material). The operation of taking out the substrate 3 can be performed by a robot (not shown), for example.

As described above, according to the solvent removal apparatus 1, gas can be sprayed uniformly on the coating 31 made of the liquid material provided on the substrate 3, and the drying speed of the coating 31 can be made uniform in the plane. (It is possible to improve the in-plane distribution of the drying speed), thereby preventing (or suppressing) drying unevenness.
In addition, regardless of the gas flow rate, the gas can be uniformly sprayed on the coating 31. In particular, by increasing the gas flow rate, the drying speed is greatly improved while preventing drying unevenness. be able to.

  In addition, various conditions such as the shape, size (diameter), number, arrangement, interval (pitch) of each opening 64, and the proportion of the opening 64 in the area ratio in plan view (the proportion occupied by the entire opening 64) are appropriately adjusted ( Change), the shape and dimensions of the substrate 3, the type of material (film material, solvent, etc.) constituting the liquid material forming the coating 31, the pattern of the coating 31, the thickness of the coating 31, etc. However, it can be easily dealt with, and drying unevenness can be prevented and a good film (dried film) can be formed.

Next, a second embodiment of the solvent removal apparatus of the present invention will be described. The solvent removal apparatus 1 of the second embodiment will be described mainly with respect to the differences from the first embodiment described above, and the same The explanation of matters is omitted.
In the solvent removal apparatus 1 of the second embodiment, the gas ejection part (gas ejection means) 6 has a function of converting the wavelength of infrared rays emitted from the infrared lamp 5 (hereinafter simply referred to as “infrared wavelength conversion function”). is doing.

That is, the gas ejection part 6 is made of a material having a characteristic for converting the wavelength of infrared rays emitted from the infrared lamp 5 (hereinafter simply referred to as “infrared wavelength conversion characteristic”). Examples of materials having infrared wavelength conversion characteristics include carbon-containing materials.
By configuring the solvent removal apparatus 1 with a material containing carbon, the wavelength in the near infrared region emitted from the infrared lamp 5 can be converted to the wavelength in the far infrared region.

In the present invention, for example, only the bottom plate 62 of the gas ejection part 6 may have an infrared wavelength conversion function. That is, only the bottom plate 62 of the gas ejection part 6 may be made of a material having infrared wavelength conversion characteristics.
According to this solvent removal apparatus 1, the same effect as the solvent removal apparatus 1 of 1st Embodiment mentioned above is acquired.
And in this solvent removal apparatus 1, compared with the case where the wavelength conversion means which converts the wavelength of the infrared rays emitted from the infrared lamp 5 is separately provided between the infrared lamp 5 and the gas ejection part 6, the number of parts is reduced. In addition, the structure of the entire apparatus can be simplified.

Next, a third embodiment of the solvent removal apparatus of the present invention will be described.
FIG. 5 is a cross-sectional view showing a gas ejection portion in the third embodiment of the solvent removal apparatus of the present invention.
For convenience of explanation, in FIG. 5, the upper side in the figure is described as “upper” and the lower side is described as “lower”.

Hereinafter, the solvent removal apparatus 1 according to the third embodiment will be described focusing on the differences from the first embodiment described above, and description of similar matters will be omitted.
As shown in FIG. 5, in the solvent removal device 1 of the third embodiment, the gas ejection part (gas ejection means) 6 is the same as the gas ejection plate 61 described above that further constitutes the outer wall of the housing in the housing. The gas ejection plate 67 is provided. The gas ejection plate 67 and the gas ejection plate 61 are spaced apart from each other in the thickness direction (vertical direction in FIG. 5).

  The opening 64 of the gas ejection plate 67 and the opening 64 of the gas ejection plate 61 are the shape, size (diameter), number, arrangement, interval (pitch), and the proportion of the opening 64 in the area ratio in plan view (opening 64). One or more of various conditions such as the ratio of the whole) may be the same or different from each other. It is preferable to shift the position of the opening 64 of the gas ejection plate 67 from the position of the opening 64 of the gas ejection plate 61. Thereby, gas can be diffused more.

In the solvent removal apparatus 1, gas is supplied (introduced) into the upper storage chamber 66 of the gas ejection section 6, gas is ejected from each opening 64 of the gas ejection plate 67, and the gas is stored in the lower storage chamber 66. The gas is ejected from the openings 64 of the gas ejection plate 61, and the gas is sprayed onto the coating 31 of the substrate 3.
Here, the ratio of the opening 64 in the area ratio in plan view is preferably different between the gas ejection plate 61 and the gas ejection plate 67. Thereby, gas can be sprayed more uniformly with respect to the film 31.

In this case, if the ratio of the opening 64 is larger in the gas ejection plate 67 than in the gas ejection plate 61, the gas uniformity is improved, and the effect is particularly great when the gas flow rate is relatively small.
Further, when the ratio of the opening 64 is larger in the gas ejection plate 61 than in the gas ejection plate 67, the gas uniformity is improved, and the effect is particularly great when the gas flow rate is relatively large.
According to this solvent removal apparatus 1, the same effect as the solvent removal apparatus 1 of 1st Embodiment mentioned above is acquired.

And in this solvent removal apparatus 1, gas can be sprayed more uniformly with respect to the film 31, and a drying nonuniformity can be prevented more reliably.
In the present invention, the gas may be supplied (introduced) to both the upper storage chamber 66 and the lower storage chamber 66 of the gas ejection portion 6.
The second embodiment described above may be applied to the third embodiment.

Next, a fourth embodiment of the solvent removal apparatus of the present invention will be described.
FIG. 6 is a bottom view showing a gas ejection part in the fourth embodiment of the solvent removal apparatus of the present invention, and FIG. 7 is a plan view showing the gas ejection part in the fourth embodiment of the solvent removal apparatus of the present invention. In addition, the perspective view of the part enclosed with the broken line of the gas ejection part 6 is also shown by FIG.
Hereinafter, the solvent removal apparatus 1 of 4th Embodiment is demonstrated centering around difference with 1st Embodiment mentioned above, The description is abbreviate | omitted about the same matter.

As shown in these drawings, in the solvent removal apparatus 1 of the fourth embodiment, the gas ejection portion (gas ejection means) 6 is formed by bending, bending, or branching a tubular body, and the tubular wall of the tubular body is formed. It is comprised with the flame | frame in which several opening 64 penetrated was provided. In the illustrated example, the frame has a lattice shape.
The lumen (hollow part) of the gas ejection part 6 (frame) forms a storage chamber 66 that temporarily stores gas (for an extremely short time), and each opening 64 is a nozzle that communicates with the storage chamber 66. Is configured.

Further, a wavelength conversion plate (wavelength conversion unit) 35 is provided in each region 68 surrounded by the frame constituting the gas jetting unit 6 as wavelength conversion means for converting the wavelength of infrared rays emitted from the infrared lamp 5. ing. Each wavelength conversion plate 35 is fixedly installed on the opposite side to the opening 64 of the gas ejection part 6.
The wavelength conversion plate 35 is made of a material having a characteristic for converting the wavelength of infrared rays emitted from the infrared lamp 5 (hereinafter simply referred to as “infrared wavelength conversion characteristic”). Examples of materials having infrared wavelength conversion characteristics include carbon-containing materials. By using the wavelength conversion plate 35 made of a material containing carbon, the wavelength in the near infrared region emitted from the infrared lamp 5 can be converted to the wavelength in the far infrared region.
According to this solvent removal apparatus 1, the same effect as the solvent removal apparatus 1 of 1st Embodiment mentioned above is acquired.
And in this solvent removal apparatus 1, since the wavelength conversion board 35 is supported by the gas ejection part 6, it is not necessary to provide a means to support the wavelength conversion board 35 separately, and, thereby, a number of parts can be reduced. In addition, the entire structure of the apparatus can be simplified.

Next, a fifth embodiment of the solvent removal apparatus of the present invention will be described. The solvent removal apparatus 1 of the fifth embodiment will be described mainly with respect to differences from the fourth embodiment described above, and the same The explanation of matters is omitted.
In the solvent removal apparatus 1 according to the fifth embodiment, each region 68 (see FIGS. 6 and 7) surrounded by a frame constituting the gas ejection part 6 has infrared transparency. Thereby, the board | substrate 3 can be heated efficiently.

In order to configure each region 68 surrounded by the frame so as to have infrared transparency, for example, the region 68 is left open without providing anything in the region 68, or each region 68 is provided with an infrared ray. A plate-like member (infrared transmitting plate) made of a material having transparency (a material having a relatively high infrared transmittance), for example, a quartz plate is provided.
According to this solvent removal apparatus 1, the same effect as the solvent removal apparatus 1 of 1st Embodiment mentioned above is acquired.

As mentioned above, although the solvent removal apparatus and solvent removal method of this invention were demonstrated based on embodiment of illustration, this invention is not limited to this, The structure of each part is arbitrary structures which have the same function Can be substituted. Moreover, other arbitrary structures and processes may be added to the present invention.
Further, the present invention may be a combination of any two or more configurations (features) of the above embodiments.
In addition, the use of the solvent removal apparatus of the present invention is not particularly limited, and for example, a drying step (solvent removal step) in a liquid phase process in the production of various electronic devices such as display bodies and semiconductors and various electronic devices, and drying. It can be used for a step including (solvent removal) (for example, a step of drying and oxidizing or reducing).

It is sectional drawing and block diagram which show 1st Embodiment of the solvent removal apparatus of this invention. It is a top view of the gas ejection part of the solvent removal apparatus shown in FIG. It is a perspective view of the gas ejection part of the solvent removal apparatus shown in FIG. It is a perspective view of the board | substrate support tool of the solvent removal apparatus shown in FIG. It is sectional drawing which shows the gas ejection part in 3rd Embodiment of the solvent removal apparatus of this invention. It is a bottom view which shows the gas ejection part in 4th Embodiment of the solvent removal apparatus of this invention. It is a top view which shows the gas ejection part in 4th Embodiment of the solvent removal apparatus of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Solvent removal apparatus 2 ... Chamber 21 ... Inlet port 22 ... Exhaust port 3 ... Substrate 31 ... Coating 4 ... Substrate support 41 ... Substrate support part 411 ... Step part 42 ... Leg part Frame 421 …… End 5 …… Infrared lamp 6 …… Gas ejection part 61 …… Gas ejection plate 62 …… Bottom plate 63 …… Side plate 64, 65 …… Open 66 …… Storage chamber 67 …… Gas ejection plate 68 ... Area 7 ... Gas supply means 8 ... Gas exhaust means 9 ... Control means 11 ... Temperature sensor 12 ... Introduction pipe 13 ... Gas cylinder 14 ... Pump 15 ... Valve 16 ... Exhaust pipe 161 ... Bifurcation 17 ... Exhaust pump 18, 19 ... Valve 35 ... Wavelength conversion plate

Claims (21)

A work support means for supporting a work provided with a coating of a liquid material;
Heating means for heating the workpiece;
A gas ejection means having a storage chamber for temporarily storing gas, and a plurality of nozzles communicating with the storage chamber;
Gas supply means for supplying gas to the storage chamber;
A solvent removal apparatus configured to eject gas from the plurality of nozzles, spray gas to the coating, and remove the solvent from the coating while heating the workpiece by the heating means. .   The solvent removal apparatus according to claim 1, wherein the gas ejection unit is configured such that the gas ejected from the nozzle is sprayed onto the coating from a direction substantially perpendicular to the coating.   The solvent removal apparatus according to claim 1 or 2, wherein the nozzles are regularly arranged.   The solvent removal apparatus according to claim 1, wherein the nozzles are arranged substantially uniformly in a two-dimensional direction.   The solvent removing apparatus according to claim 1, wherein the heating unit is an infrared lamp. The heating means is provided on the side opposite to the workpiece via the gas ejection means,
The solvent removing apparatus according to claim 5, wherein at least a part of the gas ejection means has infrared transparency.   The solvent removing apparatus according to claim 6, wherein the gas ejection means is made of quartz. The heating means is provided on the side opposite to the workpiece via the gas ejection means,
The solvent removing apparatus according to claim 5, wherein the gas ejection unit has a function of converting a wavelength of infrared rays emitted from the infrared lamp.   The solvent removal apparatus according to claim 1, wherein the gas ejection unit includes a gas ejection plate in which a plurality of openings are formed, and the plurality of nozzles are configured by the plurality of openings.   The solvent removal apparatus according to claim 9, wherein the gas ejection unit is configured by a housing having the gas ejection plate as an outer wall facing the workpiece.   11. The gas ejection plate according to claim 10, further comprising the gas ejection plate in the housing, wherein the gas ejection plate and the gas ejection plate constituting the outer wall are arranged apart from each other in the thickness direction. Solvent removal device.   The solvent removal apparatus according to claim 11, wherein a ratio of the opening in an area ratio in a plan view is different between a gas ejection plate in the housing and a gas ejection plate constituting the outer wall.   The solvent removal apparatus according to claim 12, wherein a ratio of the opening is larger in the gas ejection plate in the housing than in the gas ejection plate constituting the outer wall.   The solvent removal apparatus according to claim 12, wherein a ratio of the opening is larger in the gas ejection plate constituting the outer wall than in the gas ejection plate in the housing.   The solvent removal apparatus according to any one of claims 1 to 14, wherein an appearance shape of the gas ejection means is a flat shape.   The gas ejection means has a frame formed by bending, bending, or branching a tubular body, and having a plurality of openings penetrating through the tube wall of the tubular body, and the plurality of openings provide the plurality of nozzles. The solvent removal apparatus according to any one of claims 1 to 3, wherein: The heating means is an infrared lamp, and is provided on the opposite side of the workpiece via the gas ejection means,
The solvent removal apparatus according to claim 16, wherein wavelength conversion means for converting the wavelength of infrared rays emitted from the infrared lamp is provided in an area surrounded by the frame. The heating means is an infrared lamp, and is provided on the opposite side of the workpiece via the gas ejection means,
The solvent removal apparatus according to claim 16, wherein the region surrounded by the frame has infrared transparency.   The solvent removal apparatus of Claim 8 or 17 which converts the wavelength of a near-infrared area | region into the wavelength of a far-infrared area | region by conversion of the said infrared wavelength.   The solvent removal apparatus according to any one of claims 1 to 19, wherein the work support section, the heating means, and the gas ejection means are provided in a chamber having an exhaust port for exhausting a gas blown to the work. . Installing a workpiece provided with a coating of a liquid material at a processing position;
A step of ejecting gas from a plurality of nozzles communicating with a storage chamber for temporarily storing gas while heating the workpiece, spraying gas onto the coating, and removing the solvent from the coating. Solvent removal method characterized.

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